Abstract: When a polishing target film on a wafer is pressed against and contacted with a polishing pad to be subjected to CMP polishing, the wafer is supported by a backing plate through a contact pressure adjusting section. The surface of the adjusting section is worked to have a high region corresponding to a high region of the polished surface of the polishing target film and to have a low region corresponding to a low region of the polished surface thereof in order to adjust the contact pressure for contacting the polished surface with the polishing pad in accordance with the difference in the height of the polished surface. Accordingly, the polished surface of the polishing target film can uniformly planarized.

Abstract: The invention concerns a coating for a smoothing and/or polishing element, particularly a flexible grinding wheel, provided with a flexible abrasive insert, for smoothing and polishing stone material, comprising an epoxidic, comprising an epoxidic resin with poli-sulphuric polymers in a percentage between 34 and 52%, a product to make the mixture thixotropic, in percentage between 12 and 19%, primary amines, in percentage between 9 and 18%, and synthetic diamond, treated by a polyvinyl-formal primer.

Abstract: An object of the present invention is to provide a polishing apparatus which is capable of configuring a surface of a polishing tool without damaging the polishing tool. In order to solve the above-mentioned problem, the present invention provide a rotary machining apparatus comprising a polishing tool for polishing a sample; a rotary disk for holding the polishing tool; a tool for configuring a surface of the polishing tool; and a position adjusting mechanism for adjusting a gap between the tool and the polishing tool, which comprises a rotating mechanism for rotating the tool; and a sensor for sensing a change in the rotation of the rotating mechanism, a height at starting to configure the polishing tool using the tool being determined based on the change in the rotation obtained by the sensor.

Abstract: The invention concerns a grinding spindle, comprising a spindle housing and two coaxial shafts which are driven by a drive motor. A concentric grinding disk is fixed to each of said shafts. The shafts can be moved in an axial direction in relation to each other with a lifting or lowering movement in order to engage one grinding disk or the other. The inner shaft is connected to the drive motor as a main shaft (1), the outer shaft (8) is coupled to said main shaft (1) by a carrier device (10). In addition, a bush (4) is coaxially semimounted on the spindle housing (3), the outer shaft (8) is pivotably mounted on the bush (4) with a pivot bearing (9), and the bush (4) is provided with an actuator (13) which executes the lifting or lowering movement.

Abstract: A grinding machine comprises a frame having a rotary casing that bears rotary holders for grinding discs, as well as a drive motor which is mounted on the frame and interacts with the casing and the holders to drive the machine. The drive motor is connected by means of a continuous flexible or articulated element to the holders for driving the latter in the direction of rotation, wherein at least one of the holders is coupled to the frame by means of a gear transmission, in order to bring the casing into rotation when said holder is driven.

Abstract: A method and apparatus for automatically re-pointing twist drill bits includes a drill support mechanism including means for rotatably and axially translatably holding the shank of a drill bit, and a fluted portion receiver for supporting the fluted front cutting portion of the drill bit. The apparatus also includes an optical sensor unit which views the tip and blade part of the drill bit with the drill support mechanism in an off-line position, i.e., rotated away from a grinding wheel station. Responsive to error correction servo command signals received from a comparison of the actual orientation of drill bit cutting lips with a desired pre-determined template position, rotary and linear actuators in the drill support mechanism rotate the drill bit to the proper angular orientation, and advance the bit axially to a pre-determined protrusion length.

Abstract: An outer edge ring of a semiconductor wafer is polished to prevent delamination and peeling-off of at least one layer of material deposited near the outer edge of the semiconductor wafer during fabrication of integrated circuits. The semiconductor wafer is mounted on a wafer chuck, and the wafer chuck holding the semiconductor wafer is rotated such that the semiconductor wafer rotates. A polishing pad is moved toward the semiconductor wafer as the semiconductor wafer is rotating. The polishing pad has a polishing surface that faces and contacts the outer edge ring of the semiconductor wafer as the polishing pad is moved toward the semiconductor wafer to polish the outer edge ring of the semiconductor wafer. The outer edge ring has the at least one layer of material that is polished off by the polishing surface of the polishing pad.

Abstract: Methods and apparatuses for planarizing microelectronic substrate assemblies on fixed-abrasive polishing pads with non-abrasive lubricating planarizing solutions. One aspect of the invention is to deposit a lubricating planarizing solution without abrasive particles onto a fixed-abrasive polishing pad having a body, a planarizing surface on the body, and a plurality of abrasive particles fixedly attached to the body at the planarizing surface. The front face of a substrate assembly is pressed against the lubricating planarizing solution and at least a portion of the fixed abrasive particles on the planarizing surface of the polishing pad. At least one of the polishing pad or the substrate assembly is then moved with respect to the other to impart relative motion therebetween. As the substrate assembly moves relative to the polishing pad, regions of the front face are separated from the abrasive particles in the polishing pad by a lubricant-additive in the lubricating planarizing solution.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

Abstract: A polishing pad conditioning apparatus in a chemical mechanical polishing apparatus, wherein the conditioning apparatus includes a conditioning plate which maintains a predetermined relative velocity with respect to the polishing pad, extends from a center region near a rotation center of the polishing pad to a peripheral region near the edge thereof, and has a polishing portion with polishing particles embedded into its bottom surface, a force generating portion for applying a force to the conditioning plate so that the conditioning plate presses against the polishing pad with pressure varying with position on the polishing pad, conditions the polishing pad by relative linear velocity and pressure with respect to the polishing pad, and a supporting portion for supporting the force generating portion. Therefore, fast and uniform conditioning of a polishing pad can be achieved.

Abstract: A sample suck pad (chuck) made of resin is stuck and fixed onto the entirety of the lower surface of a chuck base, with an adhesive layer (rubber adhesive double coated tape). The adhesive layer includes a rubber-based adhesive material and has the shearing adhesive strength of 1.96 MPa (20 kgf/cm2). The outer periphery of the adhesive layer is covered with a sealing layer so that the contact of the adhesive layer with the outside is blocked off. A sample is sucked and held on the lower surface of the sample suck pad and this sample is pressed onto a polishing pad, which is fixed on a platen, so as to be polished.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

Abstract: A polishing tool can produce a flat and mirror polish surface in an object by pressing and sliding against the surface of the object. The polishing tool has a base section, and a plurality of segments of grinding plate pieces fixed on the base section. The grinding plate pieces are separated by given distance. The grinding plate pieces are preferably bounded to a bounding surface of a base section using an adhesive agent.

Abstract: A workpiece receiving hole 60a for fittingly receiving a workpiece 17 is formed in the center of a rotary disk 60 which is thinner than the workpiece 17. A workpiece drive section 60b which engages a notch 17a formed for the purpose of orienting the workpiece 17 relative to crystal orientation is formed along the brim of the hole 60a. A gear 59 is rotated by a gear 62 of a motor 61, thereby rotating the rotary disk 60 and imparting torque to the workpiece 17. Accordingly, both surfaces of the workpiece are ground by means of a double disc surface grinder.

Abstract: A crown forming method of forming a crown on a floating type magnetic head which includes the steps of placing an approximately rectangular-prism-shaped bar, which has magnetic head elements of not less than 1 formed on a side wall thereof in a row, on the convex surface of a jig whose radius of curvature is R1 through an elastic sheet while facing the surface to be processed of the bar to a lapping surface plate having a concave processing surface whose radius of curvature is R2 with the relationship between the radius of curvatures set to R1≧R2, deforming the bar to an arc shape along the longitudinal direction thereof and bonding it on the convex surface together with the elastic sheet, and lapping the surface to be processed by abutting it against the processing surface and moving the surface to be processed relative to the processing surface.

Abstract: A versatile ultrahoned sharpener includes a stop assembly which contains an inner hardened structure such as being made from metal or ceramic to serve as a positive limiting stop if the knife being sharpened cuts excessively into the plastic stop assembly of the sharpener. The sharpener also includes a manually actuated abrasive surfaced unit for cleaning or shaping the surface of at least one of the sharpening wheels in the sharpener. The sharpener further includes various bearing structures for effectively mounting the motor driven shaft which rotates the abrasive coated disks of the sharpener.

Abstract: The present invention is directed to a method for manufacturing semiconductor devices. The method generally comprises forming a plurality of process layers on a wafer 14. The wafer has an edge region 20 with a number of defects 26 existing thereon. Thereafter, the method comprises removing all or a substantial portion of the defects 26 on the edge region 20 of the wafer 14.

Abstract: An apparatus for planarizing a semiconductor wafer having a polishing endpoint layer that includes a catalyst material is disclosed. The apparatus is operable to detect the endpoint based upon the chemical slurry whether a catalytic reaction has occurred due to the polishing platen removing a portion of the catalyst material from the wafer.

Abstract: A lapping or polishing machine which processes the surface of silicon wafer or other work piece by rotating a platen with constant supply of lapping or polishing compound. Said platen of the lapping or polishing machine is connected directly to a direct drive motor and driven by the direct drive motor, and the point to point control of said platen is carried out by a rotary encoder.

Abstract: An apparatus for multiple component slurry distribution during semiconductor wafer polishing operations. Concurrent polishing pad conditioning is obtained by means of a novel polishing pad design where polishing pads are mounted in a cylindrical configuration as opposed to the conventional flat surface configuration. A polishing pad conditioner is provided to refurbish the polishing pad.

Abstract: A grinding body for on-line roll grinding has a grindstone of a cup shape. The grindstone is on a surface portion, and near a peripheral edge, of a circular support base plate, so that a peripheral edge portion of the circular support base plate has on a surface side thereof a two-layer structure. This two-layered structure includes a flat ring-shaped portion jutting toward an inner periphery so as to define a groove opening inward. The grindstone is mounted on the flat ring-shaped portion; and a damping material is filled and mounted into the groove. This grinding body can effectively prevent the formation of a spiral mark and a pitching surface mark, improve the grinding power and grinding accuracy, and prolong the life of the grindstone.

Abstract: An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary lapping table, a lapping head attachment frame, an adjuster ring resiliently supported by the frame, a lapping head attached to the adjuster ring, a tilting assembly attached to the lapping head, and an up and down movable back plate pivotally attached to the lapping head. The apparatus further comprises first actuators or cylinders for correcting balance by applying forces on right and left sides of the pivotal point of the back plate, and second actuators or cylinders for correcting bow of the workpiece by applying operating forces on a plurality of predetermined locations of the tool so that the moving directions of movable parts of the second actuator means are substantially parallel with the directions of the operating forces.

Abstract: A lapping assembly for lapping a group of workpieces including a pair of lapping discs and a cassette for positioning the workpieces between the lapping discs. The lapping discs are provided with two-component translational oscillations at the appropriate cutting speed, parallel to their working planes. This motion is effected using crank pins rotating about a coaxially positioned axis and elastic members (or swivel-supporting) members coupled to the body of the lapping machine to prevent the lapping discs from rotating. The cassette has an opening having a curvilinear shape for holding the workpieces, and protrusions which extend into the opening. The cassette is mounted on a support element and equipped with a drive to rotate it about a stationary axis. Alternatively, the cassette can be fixed during treatment and the lapping discs can be rotated at a speed less than the cutting speed.

Abstract: The invention relates to a grinding wheel for machining metal circular-saw blades at relatively high rotational speeds, which have machining areas which contain in particular hard materials, such as for example diamond or cubic boron nitride. The grinding wheels according to the invention are intended in particular to improve the centring at relatively high rotational speeds, and consequently to prevent true running problems as far as possible. The base body of the grinding wheel is of contoured design, at least on one side, in the radially outer area of a tool-mounting bore, and at least one centring element can be designed to engage in a formfitting manner in the correspondingly designed contours, so that the grinding wheel and a centring element on a tool spindle of a grinding machine are held together in a force-fitting manner.

Abstract: A dresser for a grinder having at least one rotatable platen and at least one grinding stone includes a frame and at least one abrasive block for contacting the grinding stone. The grinding stone is mounted to the platen which rotates about a vertical axis. The abrasive block extends across the grinding stone. The frame of the dresser is mounted proximate the platen and remains stationary while the grinding stone rotates. The abrasive block contacts the rotating grinding stone, thereby dressing the grinding stone.

Abstract: A diamond coated drill capable of drilling large holes in composite materials and then reaming the holes to their correct size includes a pair of prongs extending from a shank. Each of the prongs has a tip, a grinder, and a reamer. The tips initiate a hole, the grinders gradually grind the hole to the proper size, and the reamers control the final diameter of the hole. The tips have a coarse grit diamond coating. The grinders also have a coarse grit diamond coating and are axially tapered toward the tips. The reamers have a fine grit diamond coating and are disposed axially above the grinders and the shank of the drill. The grinders apply a radial load to the composite material resulting in no fiber breakout or splintering. The composite material drilled by the drill naturally falls out of the drill during drilling.

Abstract: A sharpener assembly for a rotating circular knife blade on a food product slicing machine has an elongate frame mounted at one of its ends for pivotal movement about an axis being substantially in the plane of the knife blade. The elongate frame has mounted for rotation thereon a grinding stone and a deburring stone. The grinding face of the grinding stone is inclined to the knife blade at an angle so as to grind a required angle on the edge of the obverse face of the knife blade. The grinding stone and the deburring stone arc mounted so that in use the obverse and reverse faces of the knife blade are respectively engaged.

Abstract: The present invention is directed to polishing the surface of an airplane part to an improved specularity by adding the additional step of sanding prior to the polishing step.

Abstract: A double face abrading machine for simultaneous removal of material from two plane-parallel surfaces of a work piece, and incorporating a first and a second tool (1, 2) forming between them a machining gap (3), the first tool (1) being attached to a first shaft (5) and the second tool (2) being attached to a second shaft (7), means (11) for rotating at least one of said first and second shafts (5, 7) and displacement means (13, 14) for individual axial displacement of said first and second shafts (5, 7) for varying the axial size and/or position of the machining gap (3), and means provided for feeding work pieces into the machining gap, wherein the first shaft (5) is designed as a tubular shaft, supporting at one end the said first tool (1), which is designed with an opening (1a) having a diameter at least corresponding to the diameter of the tubular shaft (5), whereas the second shaft (7) is arranged to extend through the tubular first shaft (5) and through the opening (1a) in the first tool, and to project

Abstract: A set of supports are advantageously disposed on a top plate having a polishing surface useful for polishing workpieces, thereby applying substantially uniform pressure to the top plate. In a preferred embodiment, the supports are non-isosceles triangular elements distributed evenly at 45 degree increments around a ring-shaped top plate. This structure effectively compensates for radial stress variations arising from non-optimum positioning of support points with respect to the inner and outer diameters of the polishing surface.

Abstract: An apparatus for closed loop slurry distribution during semiconductor wafer polishing operations. The traditional peristaltic pump for slurry supply is eliminated thus eliminating irregularities in the conventional slurry supply. Common platform mounting of the slurry reservoir and the polishing apparatus resulting in concurrent and identical motion of the slurry supply reservoir and the polishing apparatus. The polishing medium is mounted on the outside of a cylinder as opposed to the conventional table mounting, the polishing medium rotates around the axis of the cylinder on which this polishing medium is mounted. The polishing pads are in direct physical contact with the slurry supply without the intervention of any slurry pumping arrangement.

Abstract: A polishing apparatus 70 is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus includes a turntable 73 with a polishing 74 cloth mounted on an upper surface thereof, a top ring 75 for supporting the workpiece to be polished and pressing the workpiece against the polishing cloth, and a dressing tool 79 for dressing the polishing cloth on the turntable. The polishing apparatus further includes a cover 10 which covers an upper surface of the turntable for preventing liquid on the turntable from being scattered, and inserting holes 17 and 21 formed in an upper wall of the cover for inserting the top ring and the dressing tool therethrough.

Abstract: A surface treating article including a hub. The surface treating article and hub provide an improved mechanical interlock to each other. Preferably, the unitary surface treating article is molded to the hub.

Abstract: A plunger tool for producing a special prophylactic is disclosed. The special features of the plunger tool reside in the special curvatures in its shaped section. The shaped section of the plunger tool exhibits an extreme narrowing, at the deepest point of which there may be at least one annular groove. Unlike prior art transitions, the transition from the large diameter to the reservoir section is not steep and straight but takes the form of an S-shaped curve. An exact contour of the annular grooves on the surface of the plunger tool is essential for their production and can be done only by the use of a precision diamond abrasive point.

Abstract: A universal grinding machine, particularly for the grinding of tools, having a tool magazine in which a plurality of grinding tools, together with coolant supply devices which are matched thereto, are disposed in holders and can be supplied according to choice to the grinding spindle, where the grinding tool and its coolant supply device are introduced into their receivers; simultaneously by an axial movement of the grinding spindle and of the grinding spindle slide and are withdrawn by a movement of the grinding spindle and of its grinding spindle slide perpendicular to the grinding spindle axis so that the grinding tool and the coolant supply device are always in a position in relation to each other which is correct for machining.

Abstract: Employed is a crown forming method of forming a crown on a floating type magnetic head which includes the steps of placing an approximately rectangular-prism-shaped bar, which has magnetic head elements of not less than 1 formed on a side wall thereof in a row, on the convex surface of a jig whose radius of curvature is R.sub.1 through an elastic sheet while facing the upper surface (surface to be processed) of the bar to a lapping surface plate having a concave processing surface whose radius of curvature is R.sub.2 with the relationship between the radius of curvatures set to R.sub.1 .gtoreq.R.sub.2, deforming the bar to an arc shape along the longitudinal direction thereof and bonding it on the convex surface together with the elastic sheet, and lapping the upper surface (surface to be processed) by abutting it against the processing surface and moving the upper surface (surface to be processed) relative to a processing surface.

Abstract: A low profile gimbal system is provided to greatly reduce the generation of moments about a pivot point of the gimbal system during polishing processes. The gimbal system is adjustable so that a preferred balance between stiffness and friction may be selected as appropriate for a variety of different polishing conditions. A locking feature ensures that the adjustment setting is maintained during polishing.

Abstract: A versatile ultrahoned sharpener includes a stop assembly which contains an inner hardened structure such as being made from metal or ceramic to serve as a positive limiting stop if the knife being sharpened cuts excessively into the plastic stop assembly of the sharpener. The sharpener also includes a manually actuated abrasive surfaced unit for cleaning or shaping the surface of at least one of the sharpening wheels in the sharpener. The sharpener further includes various bearing structures for effectively mounting the motor driven shaft which rotates the abrasive coated disks of the sharpener.

Abstract: A polishing pad having a wear level indicator and a polishing system employing the same is provided. A polishing pad, in accordance with one embodiment of the invention, includes a pad structure and an indicator, disposed in the pad structure, indicating the wear level of the pad structure. The pad structure may, for example, include a top pad and a bottom pad with the indicator being disposed in the top pad. The wear level may, for example, be a critical thickness of the polishing pad which indicates the end of the pad lifetime or which indicates the need to change polishing processing. The use of a wear level indicator allows for efficient and reliable pad wear level indication.

Abstract: An improved chemical mechanical polishing apparatus for polishing a semiconductor wafer used in the fabrication of silicon-based semiconductor devices is provided so as to eliminate an air pocket bubble from being formed underneath a polishing pad without the need for cutting the same. This is achieved by a CMP platen plug which is disposed in a recess formed in a top cover plate member so as to completely fill the recess in order to displace the air pocket. The polishing pad is then secured over the platen plug and the top cover plate member. As a result, the useful life of the polishing pad has been prolonged.

Abstract: A tool for removing adhesive residues, films or the like from a metal surface contains a shank, which can be rotated by a drive mechanism. A disk made from rubber or a plastics material is clamped in non-rotary manner to the shank.

Abstract: An apparatus for polishing a semiconductor wafer includes a polishing pad to be in contact with the semiconductor wafer; a turn table which rotates the polishing pad; and an elastic member which is arranged between the turn table and the polishing pad. The polishing pad includes a polishing layer which is made of a material having a good characteristic of slurry holding; and a support layer which is made of a rigid material having an optimum thickness to prevent the polishing layer from loosening. The polishing pad is attached to the turn table by a stretch-holding technique without adhesive bonding.

Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

Abstract: A household appliance of the type in which a cleaning, polishing, or massaging effect is obtained by a rotating head or tool is improved by splitting the cleaning, polishing, or massaging head or tool into concentric or parallel multiple heads or tools arranged for coaxial or side-by-side differential motion.

Abstract: A polishing apparatus is provided with a turn table, on which an air passage is formed, and a polishing pad mount plate, on which a polishing pad is stuck. The polishing pad mount plate is detachably attached on the turn table. When the polishing pad mount plate is detached from the turn table, a separation fluid supplying part supplies air as separation fluid between the turn table and the polishing pad mount plate through the air passage.

Abstract: A device for lapping a bar of the type which carries a plurality of sliders used in magnetic storage systems includes first, second and third actuators adapted to couple to the bar, and impart a first, second and third controllable force in response to a first, second and third control signal, respectively. An arm couples to the first, second and third actuators and applies a lapping force to the bar which presses the bar against a lapping surface thereby causing material to be removed from the bar. A controller provides the first, second and third control signals to the first, second and third actuators, respectively, to impart a plurality of forces onto the bar. The actuators are controlled to obtain a desired profile of the bar and to obtain a desired distribution of the lapping force across the profile of the bar.

Abstract: A method and an apparatus, for polishing a thin plate. The method comprises the steps of: rotating a holding plate on one surface of which the thin plate is held to adhere; and bringing the thin plate held on the rotating holding plate into contact with a polishing pad mounted on a surface of a rotating turn table, to polish the thin plate. The step of polishing the one surface of the holding plate is carried out by using the polishing pad for polishing the thin plate before the thin plate is held to adhere on the one surface of the holding plate.

Abstract: A lapping assembly is described wherein a lapping process is performed to provide a flat headbox apron floor. The lapping assembly includes an eight-legged fly-style plate and a spring loaded floating driver. The lapping assembly and operation consists of attaching a spring loaded floating driver to a machine spindle of a milling machine. A lapping fly wheel is attached to the spring loaded floating driver. A coated abrasive strip with desired grit size to achieve the desired finished results is clamped in place on the lapping fly wheel. The machine spindle is rotated, thereby rotating the spring loaded floating driver and the lapping fly wheel, and the grinding and lapping of the apron floor can begin.

Abstract: A low profile, low hysteresis force feedback gimbal system is provided to greatly reduce the generation of moments about a pivot point of the gimbal system during polishing processes. A load cell is placed directly above a contact pin of the gimbal system to provide a very accurate feedback measurement of the amount of downward load applied to a substrate during polishing.

Abstract: A soft elastomeric disc for removal of polymeric compositions from an underlying substrate. The disc is useful for removing decorative decals, stripes, graphics, emblems, protective moldings, paint and adhesive and is made from a filled elastomeric composition. The elastomeric composition is filled with a system that combines an organic lubricant and a non-abrasive particulate.