Abstract: Polishing systems, subsystems and pads adapted for use in conjunction with a polisher. A relatively incompressible backing pad is configured to be attached to a drive system of the polisher. The backing pad includes at least one substantially straight backing pad edge along a perimeter thereof. A relatively compressible polishing pad is configured to be attached to the backing pad, to be driven in contact with a surface to be polished. The polishing pad includes at least one substantially straight polishing pad edge along a perimeter thereof corresponding to the at least one substantially straight backing pad edge when the polishing pad is attached to the backing pad.

Abstract: A surface substrate preparation tool system comprised of a flexible foam member, a flexible abrasive member, and an adhesive member being affixed on one side to the foam member and on the other side to the abrasive member, wherein the foam member retains at least one liquid agent therein, and wherein a liquid agent can be delivered to the adhesive member or to the foam member during the surface preparation process.

Abstract: A handheld sanding implement includes an elongated handle resembling a toothbrush handle upon a first end is mounted a sanding pad. The sanding pad is attached to said handle via an affixing means. The sanding pad may be replaced with a spinning head that includes a plurality of sanding pads containing a sanding surface having the same or differing grits.

Abstract: The invention relates to a grinding device, comprising a mounting body which is detachably connected to a grinding element, said detachable connection being designed such that the mounting body has a first adhering arrangement and the grinding element has a second adhering element and the adhering elements correspond in the manner of a Velcro fastener. The aim of the invention is to improve the quality and efficiency of the detachable connection for exchange of the grinding element of the claimed grinding device. Said aim is achieved, wherein the first adhering element (1) and the second adhering element (2) comprise a number of projections (3) each with a cross-sectional widening in the direction of the free end (7) of the projection (3).

Abstract: A structure for a backing plate of an abrasive disk is disclosed. The structure includes layers of abrasive resin interspersed with layers of reinforcing fiberglass. The layers are generally disk shaped and cover certain radial intervals of the entire backing plate between the inner diameter and the outer diameter. For example, a radial stress profile plotting the stress along a radial line from inner to outer diameter can be determined. The amount and radial positioning of reinforcing layers (e.g., reinforcing fiberglass) may then be determined. An appropriate amount of reinforcing layers may then be placed within the radial intervals that experience the highest stress.

Abstract: The intersection of discrete polishing islands staggered in a curvilinear shape with a workpiece maintains a substantially uniform film thickness throughout the polishing operation and also leading to a stable polishing operation due to the substantially invariant pressurization.

Abstract: In a non-conventional lap tool, i.e., not a stiff tool nor a conformable tool, and related method for grinding/polishing a substrate surface, includes a rigid base plate and attached work surface to define a cavity containing a non-Newtonian fluid. The non-Newtonian fluid behaves as a solid when the work surface is subjected to high shear stress, i.e., rapid tool stroke, yet behaves like a liquid when the tool is moved around the substrate surface when the shear stress of the work surface is low. A diaphragm can be used to further define the cavity and to seal within the non-Newtonian fluid therein.

Abstract: A device for chamfering and sanding is disclosed. The device comprises a cylindrical body containing a hollow cone lined with sandpaper attached to the surface of the cone with adhesive. Two corners of the sandpaper are inserted respectively into two slots contained in the sidewall of the cone to further hold the sandpaper in place. The device comprises a shaft attached to the bottom of the device for clutching by a drill press or a three jaw chuck. As the device rotates, objects that require bevelling or sanding are inserted into the cone and pressed against the sandpaper. A sandpaper sleeve is attached to the outer surface of the cylindrical body that may be used for sanding and smoothing.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: Disclosed is a semiconductor wafer polishing method for polishing the surfaces to be polished of semiconductor wafers by use of polishing pads (16, 17) provided on fixing plates by relative movement of the polishing pads and the semiconductor wafers held by carriers. The shaping surfaces (25) of a polishing pad shaping jig (21) are shaped by inverting, with respect to ideal shapes, the shapes of the surfaces to be polished of each semiconductor wafer when the surfaces are polished by use of the polishing pads (16, 17) before shaping, and the shapes of the shaping surfaces of the polishing pad shaping jig are transferred to the pad surfaces (16A and 17A) of the respective polishing pads (16, 17). The surfaces to be polished of each semiconductor wafer are polished by use of the pad surfaces.

Abstract: An improved low pressure low speed concrete polishing apparatus and method of cleaning and polishing a floor is used with a conventional rotary flooring machine. A polishing pad has interchangeable polymer strips that are slideably received within the housing of the pad. The polymer strips have an abrasive material embedded therein which collectively work to polish the floor while cleaning the floor during normal low speed floor cleaning conditions.

Abstract: A device 1 serves for the cleaning and care of mechanical shaving devices 6 having a blade 7 arranged in a head part 9 and a handle 8. The device 1 has two or three processing stations 3, 4, 5 for receiving the head parts 9 of the shaving devices 6. A first processing station 3 serves for cleaning these head parts 9, and a second processing station 4 serves for mechanically processing the blade.

Abstract: A construction of a polishing pad sub plate that is able, while maintaining the fixing strength of the polishing pad to the rotation table, to make possible the easy removal of the polishing pad from the rotation table, and in particular, by preventing injury to the polishing pad when peeling it from the rotation table is offered.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: An abrasive article with an abrasive element fabricated on a flexible foil suspended by a hydrostatic preloader, a gimball mechanism or a soft pad capable of selectively engaging with substrate to remove material while monitoring the contact pressure. A hydrostatic pressure bed is applied to the non-abrasive surface of the tensioned flexible foil to provide a contact pressure to the abrasive surface against the substrate. A series of fluid bearing surfaces are fabricated or imparted onto the abrasive side of the flexible foil to cause controlled interference and pressure with the substrate. A hydrostatic pressure emanating from the preloader supports the non-abrasive side of the flexible foil under tension while the abrasive side of the flexible foil engages a substrate.

Abstract: A method and apparatus for releasably attaching flexible abrasive disks to a flat-surfaced platen that floats in three-point abrading contact with three rigid equal-height flat-surfaced rotatable fixed-position workpiece spindles that are mounted on a precision-flat abrading machine base where the spindle surfaces are in a common plane that is co-planar with the base surface. The three spindles are positioned to form a triangle of platen supports where the rotational-centers of each of the spindles are positioned at the center of the annular width of the platen abrading surface. Flat surfaced workpieces are attached to the spindles and the rotating floating-platen abrasive surface contacts all three rotating workpieces to perform single-sided abrading. The platen abrasive surface can be re-flattened by attaching equal-thickness abrasive disks to the three spindles that are rotated while in abrading contact with the rotating platen abrasive. There is no wear of the abrasive-disk protected platen surface.

Abstract: An attachment system for attaching an abrasive article, such as an abrasive sheet or disc, to a sanding tool includes an article having a first major surface including an attachment region with attachment material for attachment with an associated mating surface on the sanding tool, and a non-attachment region along at least a portion of an edge of the first major surface forming a sufficiently weak attachment with the associated mating surface to allow a user to grasp the abrasive article and separate the abrasive article from the sanding tool.

Abstract: A cleaning element (36) for a cement floor surface mounted to a housing (32). Each cleaning element has a flat flexible abrasive surface (39) that is transversely positioned to the direction of motion to provide flex during cleaning of a cement floor surface.

Abstract: An abrading device features a flexible abrading membrane supported by two supports. The device may be used in either linear or rotary configurations. The device can be used in conjunction with devices that impart continuous or vibratory linear or rotary motion.

Abstract: A sanding device for use with an abrasive sponge includes a base, at least one retaining mechanism, and at least one engaging mechanism. The base has opposite supporting and working surfaces, the working surface being shaped and sized for receiving the abrasive sponge. Each retaining mechanism is mountable onto the base, and is configured for removably securing a first portion of the abrasive sponge against the working surface of the base. Each engaging mechanism is mountable onto the base, and is configured for projecting out from the working surface so as to penetrate a second portion of the abrasive sponge when resting against the working surface of the base, each engaging mechanism being further configured so as to draw the second portion of the abrasive sponge away from the first portion.

Abstract: A back-up assembly for a sanding device, where the back-up assembly includes a driving disk rotating around a rotational axis, rigid segment plates, a flexible pad layer positioned between the rigid segment plates and the driving disk, and semi-flexible wedges located at the bottom of each rigid segment plate. Rigid segment plates are arranged circumferentially and spacedly around the rotational axis of the driving disk and are secured to the bottom surface of the driving disk by the flexible pad layer. Further, adjacent rigid segment plates are allowed to move with respect to each other in a direction parallel to the rotational axis of the driving disk.

Abstract: A rotary tool for surface machining has a disk having an elastomeric outer periphery, an array of angularly spaced elastomeric teeth projecting radially and each having a formation forming a hinge so that the tooth can flex at the hinge.

Abstract: An abrasive mesh for a powered grinding wheel is made by weaving plural twisted warp threads with plural single weft threads. The twisted warp threads construct an even machining surface for grinding the workpiece evenly, avoiding the occurrence of surface scratch. Since the twisted warp threads are connected to the single weft threads by weaving, the structure strength of the abrasive mesh is relatively high, thus extending its service life. Further, the abrasive mesh can be applied to grind the workpiece requiring high grinding fineness.

Abstract: A method for manufacturing a polishing pad that has high level of optical detection accuracy and is prevented from causing slurry leak from between the polishing region and the light-transmitting region includes preparing a cell-dispersed urethane composition by a mechanical foaming method; placing a light-transmitting region at a predetermined position on a face material or a belt conveyor, continuously discharging the cell-dispersed urethane composition onto part of the face material or the belt conveyor where the light-transmitting region is not placed; placing another face material or belt conveyor on the discharged cell-dispersed urethane composition; curing the cell-dispersed urethane composition to form a polishing region including a polyurethane foam, so that a polishing sheet is prepared; applying a coating composition containing an aliphatic and/or alicyclic polyisocyanate to one side of the polishing sheet and curing the coating composition to form water-impermeable film; and cutting the polishing

Abstract: A polishing pad includes polishing elements interdigitated with one another over a surface of the polishing pad. Each of the polishing elements is secured so as to restrict lateral movement thereof with respect to others of the polishing elements, but remains moveable in an axis normal to a polishing surface of the polishing elements. Different densities of the polishing elements may be positioned within different areas of the surface of the polishing pad.

Abstract: A device for chamfering and sanding is disclosed. The device comprises a cylindrical body containing a hollow cone lined with sandpaper attached to the surface of the cone with adhesive. Two corners of the sandpaper are inserted respectively into two slots contained in the sidewall of the cone to further hold the sandpaper in place. The device comprises a shaft attached to the bottom of the device for clutching by a drill press or a three jaw chuck. As the device rotates, objects that require bevelling or sanding are inserted into the cone and pressed against the sandpaper. A sandpaper sleeve is attached to the outer surface of the cylindrical body that may be used for sanding and smoothing.

Abstract: An electric hand-held power tool for performing sanding work, in particular a finishing sander, is provided, that includes a drive plate (16)—which is drivable in a sanding motion using an electric motor—and a sanding plate (21?) attached thereto such that it is removable without the use of a tool, with means for attaching a sanding pad (22?). To create a multifunctional device with which various types of sanding work may be performed in an optimal manner, a tub-like recess (23) with a flat tub bottom (231) for receiving the drive plate (16) in a form-fit manner is formed in the top side of the sanding plate (21?) facing the drive plate (16); the sanding plate (21?) is attached in a manner such that it is removable without the use of tools, preferably via a Velcro attachment between the tub bottom (231) and the surface of the drive plate (16).

Abstract: A surface device includes a rigid holder (11), an elastically compressible interface (12) connected to the rigid holder, a flexible pad (13) adapted to be applied onto the surface to be machined (30) and a flexible belt (14) applied against and partially covering the side surface (18) of the interface (12), an annular portion (21) of the side surface (18) of the interface (12) being free between the belt (14) and the holder (11).

Abstract: A carrier head that has a base assembly, a retaining ring assembly, a carrier ring, and a flexible membrane is described. A carrier ring has an annular upper portion and an annular lower portion having a lower surface with a smaller inner diameter than the upper surface of the annular upper portion, wherein the carrier ring circumferentially surrounds a retaining ring and has a lower surface to contact a polishing pad.

Abstract: In general, a Buffing Pad Centering System (“BPCS”) for centering a back plate having an edge and a front surface is described. In an example of an implementation of the BPCS, the BPCS may include a centering ring having a top boundary and a bottom boundary and a buffing pad attached to the bottom boundary of the centering ring, where the centering ring is centered on the buffing pad. The centering ring may include a cylindrical vertical member extending between the top boundary and bottom boundary, where the cylindrical vertical member has an inner cylindrical surface and an outer cylindrical surface, and where the inner cylindrical surface is capable of snuggly receiving the back plate.

Abstract: A support disc (3) is described for expendable pad (4) for polishing machine (1), having a raised peripheral edge (12). Said disc (3) also provides with a self-centring lower central neck (7) suitable for being coupled with a central hole (8) of the pad (4).

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.

Abstract: A polishing tool comprising a support member, and polishing means fixed to the support member. The polishing means is composed of felt having a density of 0.20 g/cm3 or more and a hardness of 30 or more, and abrasive grains dispersed in the felt. A polishing method and apparatus involving pressing the polishing means against a surface of a workpiece to be polished, while rotating the workpiece and also rotating the polishing tool.

Abstract: An embodiment of a tool includes a tool body. A base is coupled to the tool body and a pad is coupled to the base. The tool includes a working material coupled to the pad.

Abstract: A pad is disclosed comprising a monobloc body (10, 11), traversed by a plurality of peripheral through holes (3) for aspirating dust, wherein channels (4) are formed that extend parallel to the lower surface of the pad connecting a lower central aspiration hole (33) of the pad with peripheral holes (3C). The channels (4) intercept lower internal holes (101) of the pad that do not pass through the monobloc (10, 11) that are suitable for conveying the abraded dust from the central part of the pad to the peripheral holes (3C) through the channels (4).

Abstract: The present invention provides a polishing platen which does not require a large force for removing a polishing pad from an upper surface of the polishing platen and can thus make it relatively easy to remove the polishing pad therefrom. The present invention also provides a polishing apparatus having such polishing platen. The polishing platen (12) according to the present invention includes a surface to which a polishing pad is attached. The surface of the polishing platen (12) includes a combination of a first surface (20) and a second surface (21) having a surface roughness which is different from that of the first surface (20).

Abstract: A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping element includes a first upper clamper and a first lower clamper for clamping a first area of a first polishing pad. The second clamping element includes a second upper clamper and a second lower clamper for clamping a second area of the first polishing pad, the first area and the second area are opposite to each other. When the first polishing pad will be disconnected from the bottom surface of the polishing head and replaced by a second polishing pad, the first clamping element and the second clamping element are released from the first polishing pad.

Abstract: This tool includes: a rigid support (104) having a transverse end surface (113); an elastically compressible interface that is pressed against and covers the end surface; a flexible pad adapted to be pressed against the optical surface, itself pressed against and covering the interface on the opposite side of and in line with the end surface (113); spring return element (115) connecting the support (104) to a peripheral portion of the flexible pad situated transversely beyond the end surface (113); and a flexible flange (131) that is part of a base (130) to which the rigid support (104), which is surrounded by the flange (131), also belongs.

Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.

Abstract: The present invention offers a device for rendering CMP polishing pads easily and temporarily removable from and replaceable upon the platen of a CMP polishing apparatus comprising two sheets, the upper sheet attached to the said CMP polishing pad and the lower attached to the said platen, the said two sheets held together by pegs, pins or protrusions fitted to matching holes in the upper surface of the lower sheet and the lower surface of the upper sheet, said pegs or pins attached to either the upper or lower sheet and able to enter the hold on the adjoining sheet when the sheets are brought together and hold the sheets together by means of the sliding friction attendant upon a tight fit with the said holes. The device allows far easier metrology and storage of CMP polishing pads at different stages of use with no damage to the CMP pad, which may be put back into service at any time.

Abstract: An expandable polishing platen device is disclosed, in which a polishing platen top includes a plurality of separate platen top sections. When the polishing platen device is not in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of a first group of platen top sections. When the polishing platen device is in an expanded configuration, the polishing platen top has a surface constructed from the surfaces of the first group of platen top sections and a second group of platen top sections. Polishing pads are bonded to the surface of each of platen top sections respectively and may include various types. Therefore, the expandable polishing platen device of the present invention may have versatile polishing functions.

Abstract: A chemical-mechanical polishing apparatus is provided that creates a uniform kinematical pattern on the surface of a wafer being polished. The apparatus may have a polishing pad comprising a polishing pad surface having a center point that lies within an axis of motion for the polishing pad and a plurality of grooves entrenched in the polishing pad surface and defining a pattern of shapes. The pattern has an axis of symmetry that is offset from the polishing pad surface center point. The apparatus may be operated in a manner such that the kinematics of the CMP process are uniform across the surface of the wafer.

Abstract: In the manufacture of a brush-shaped grindstone (3), embedding holes (310) are formed in a grinding element holding surface (311) of a holder (31) in mutually separated positions. A base end side of a plurality of wire-shaped grinding elements (32), formed such that a composite yarn composed of inorganic filaments is impregnated and hardened with a resin, is aligned, and rod assemblies (320) are thereafter formed by fixing the base end side of the plurality of wire-shaped grinding elements (32) with adhesive (71) in holes (60) of a die material (6), which is formed to have substantially the same size as the embedding holes (310) of the holder (31). The rod assemblies (320) are thereafter embedded in the embedding holes (310) of the holder (32), and fixed with adhesive (72). Whereby, removing burrs from a precision work component, performing polishing, and the like can be carried out with good efficiency and high precision.

Abstract: A quick change mounting system for grinding and other surface preparation pads provides a simple and effective way for the pads to be mounted and changed on the mounting plate of a large surface preparation machine without removing the mounting plate from the machine. (This method also allows that existing mounting plates and preparation pads may be used with a minimal amount of adaptation.) The new quick-change system makes use of a unique slot design (using countersunk keyhole slots) for mounting the pads on the plate. Studs fixed on the pads fit into slots on the plate and may lock into position. In operation, centrifugal and other forces then help to further seat the pad onto the plate.

Abstract: A polishing apparatus and a pad replacing method thereof are provided. The polishing apparatus includes a first clamping element, a second clamping element and a polishing head. The first clamping element includes a first upper clamper and a first lower clamper for clamping one end of a first polishing pad. The second clamping element includes a second upper clamper and a second lower clamper for clamping another end of the first polishing pad. When the first clamping element and the second clamping element clamp the first polishing pad and are unloaded from the polishing head, the first polishing head slides out from the first clamping element and the second clamping element. Then, a second polishing pad slides into the first clamping element and the second clamping element.

Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for nonadhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.

Abstract: A subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures. The subpad support includes a subpad retention element for non-adhesively securing the subpad thereto. The subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support. Polishing apparatus including the subpad support are also disclosed. The polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad. Methods of removably securing a subpad to the subpad support, removing the subpad from the subpad support, and replacing another subpad on the subpad support, as well as polishing methods, are also disclosed.

Abstract: A flap wheel (1) for satin finishing systems for pipes or for sheet metal, includes a plurality of radial flaps (2) fixed to the hub (3) of the flap wheel (1) by coupling elements integral with the hub (3) of the flap wheel (1) and inserted in seats (8) formed in each flap (2) near the edge (14) thereof adjacent the hub (3). The hub (3) is advantageously hollow and has, in its inside wall, annular grooves (10) which are identical and parallel each other; the flaps (2) are further connected to the hub (3) by gluing, pouring inside the hub (3) an adhesive which flows out through a plurality of rows of through holes (9) formed in the wall of the hub (3) to coinciding with the annular grooves (10). A method of producing the flap wheel is also described.

Abstract: A rotary finishing device including a generally circular hub having an inner periphery and an outer periphery. The outer periphery includes a plurality of slots formed thereabout, which are defined by a pair of side portions. The plurality of slots are generally uniformly spaced about the outer periphery of the hub. Each of the slots has at least one finishing sheet secured therein by an adhesive.