Abstract: An apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.

Abstract: CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear.

Abstract: A reconditioning system for reconditioning a damaged polishing pad is disclosed. The reconditioning system includes a reconditioning disk including a plurality of diamonds for reconditioning the polishing pad, wherein each diamond fluoresces when being exposed to a light energy source.

Abstract: An apparatus (1) for smoothing a product (2), in particular a semi-finished ceramic product, comprises: an abrasive tool (3) in the form of an endless belt (4) which is trained around at least one pair of pulleys (5, 6), at least one of which is power-driven; the belt (4) has an active section (7) and at least one passive section (8); the active section (7) removes material from the product (2), while the passive section (8) receives a regenerating treatment that restores the abrasive capacity of the tool (3); drive means (20) acting on the belt (4) in such a way as to enable the belt (4) itself to move in the space surrounding the product (2); means (10) for spraying a liquid on the belt (4), which has liquid absorption properties, said means (10) being located in the vicinity of the belt (4) itself; and negative pressure means (9) associated with the passive section (8) of the belt (4) and operating in such a way as to extract the liquid and the materials retained by the belt (4) and removed from the produc

Abstract: A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body so as to control pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

Abstract: A system for removing particles from a polishing pad to improve the efficiency of the removal of material by the polishing pad as part of a chemical-mechanical polishing process, the system comprising a polishing pad; a fluid dispenser arranged to dispense a fluid on the polishing pad; and removal means, wherein the removal means include a heater for increasing the temperature of the fluid dispensed on the polishing pad, and/or voltage means for coupling the polishing pad to a voltage source for repelling charged particles from the polishing pad surface while the fluid dispenser is dispensing the fluid on the polishing pad.

Abstract: A method for cleaning a polishing pad is disclosed. In CMP and ECMP, a polishing pad must be conditioned to obtain good and predictable polishing results. During conditioning, debris is generated that must be removed to prevent processing defects. An effective method to clean a polishing pad is disclosed herein. In one embodiment, a washing fluid is directed at the pad to clean debris from the while a second fluid is utilized to remove the washing fluid. In another embodiment, the washing fluid is provided by a high pressure water jet while the second fluid is provided by an air knife.

Abstract: The invention relates to a hard finishing machine (1). The machine has one tool (4) which is arranged on a tool spindle (3) and a rotary table (5) with an axis of rotation (6) which is aligned vertically, and a workpiece spindle (7) arranged on the rotary table (5) which carries the workpiece (2). To increase the flexibility of the machine, the rotary table (5) has a first rotational position (1) in which the workpiece (2) can be machined by the tool (4), a second rotational position (II) where the workpiece is loaded on the workpiece spindle (7) at a first station (8), and a third rotational position (III) where the workpiece is unloaded at a second station (9).

Abstract: Disclosed are a machine with a grinding wheel and a dressing surface and related method. The dressing surface is movable in at least two axes of translation relative to the grinding wheel. The rotational speed of the grinding wheel and dressing surface preferably are under the control of a computer control system, whereby the speed of rotation of the dressing surface may be adjusted as the diameter of the dressing wheel and as the diameter of the grinding wheel is decreased during use. The machine may be used in continuous or intermittent dressing operations.

Abstract: A conditioner disk for use on a polish pad in chemical mechanical polishing process includes a base structure a plurality of curved blades supported by the base structure. The blades radiate outwardly from a center region of the base structure and curve in a common direction.

Abstract: A process for grinding workpieces is obtained which includes attaching honing stones to a tool, each of the honing stones including grinding particles and an electroconductive connection for fixing the grinding particles to each other; grinding the workpieces with the honing stones by applying a honing liquid having substantially no electroconductive property to a region between the workpiece and the honing stones, the workpieces being successively ground during a series of processing periods, while interposing non-processing periods between the processing periods, each of the workpieces being ground in one of the processing periods; and performing an electrolytic dressing with respect to the honing stones by using an electrode provided to face the honing stones with a space therebetween, a voltage being applied between the honing stones and an electrode in the presence of an electroconductive liquid in the space between the honing stones and the electrode, the electrolytic dressing being carried out during t

Abstract: A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.

Abstract: In a first aspect, a first apparatus is provided for a chemical mechanical polishing (CMP) process. The first apparatus includes (1) a rotatable member; (2) an end effector adapted to receive and retain a conditioning disk; and (3) an elastic device disposed between the rotatable member and the end effector. The elastic device is (a) adapted to rotate the end effector via a torque from the rotatable member, and (b) flexibly extensible so as to impart a force to the end effector while permitting the end effector to deviate from a perpendicular alignment with the rotatable member in order for a conditioning surface of the conditioning disk to conform to an irregular polishing surface of a pad being conditioned. Numerous other aspects are provided, including methods and apparatus for using liquid or gas to deter polishing slurry or debris from entering the conditioning head.

Abstract: A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The method and apparatus utilize a vacuum capability to pull waste material out of the conditioning pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port, the apparatus may also include self-contained flushing means and a piezo-electric device for vibrating the pad conditioning apparatus.

Abstract: The present invention relates to a conditioner device for polishing pad and a chemical mechanical polishing (CMP) apparatus having the same. The conditioner device of the present invention comprises a rotable support plate including a support plate surface comprising a center area located about the rotational axis of the support plate, a mid area surrounding the center area, and a peripheral area surrounding the mid area, a plurality of conditioning zones located within a portion of the mid area of the support plate surface. A plurality of hard particles which are densely arranged within the conditioning zones and are attached to the support plate surface. A plurality of passages defined by the conditioning zones within which a slurry flows, the passages occupying a portion of the mid area which is not occupied by the conditioning zones, the center area and the peripheral area.

Abstract: A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alignment/attachment of a conditioning disk to the arm, while also providing a “quick release” mechanism for maintenance operations. The enhanced arm also includes an improved actuator that provides for a static friction (“stiction”)-free movement of the arm and better control of the downforce applied by the conditioning disk to the polishing pad. A dual-drive pulley system is used within the enhanced end effector arm to minimize the tilting of the drive belts within the effector arm as the arm pivots to follow the contour of an “aging” polishing pad.

Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

Abstract: A machine tool for machining a part by on-head and continuous grinding tool profiling includes a part holder support driven into rotation by first driving means around a first axis in a vertical plane, a machining system provided with a grinding tool for machining the part, and a knurl for profiling the grinding tool. The first driving means are incorporated into a cradle driven into rotation by second driving means along a second axis perpendicular to the vertical plane. The machining system includes a bearing structure translationally mobile along three axes equipped with a main spindle for rotating the grinding tool, and a rotating device bound to the bearing structure and provided with a secondary spindle integral with the knurl moving around the axis of rotation of the grinding pool.

Abstract: The invention relates to a machine (1) for grinding the blades of a turbine rotor (2) or a compressor. The inventive machine consists of a rotary head (6) which is provided with two different grinding wheels (7, 7?) for grinding the rotors (2), three carriages (8, 9, 10) of the head which are used for the linear and angular movement thereof, a machine control unit (16) comprising a numerical control (CNC) which is used to calculate the grinding position of each grinding wheel, an optical sensor (19) which is used to measure the radius R of the blades and a device (12, 13) for the individual shaping of each grinding wheel which is supported on a carriage (14, 15) with means for the linear movement thereof (U, C) and which operates automatically during the grinding process without altering the position of the grinding wheel.

Abstract: A method and apparatus are used for truing grindstones. Grinding wheels are arranged in a manner such that the respective grindstone surfaces are disposed apart from each other to define a space therebeween and respective ones of the grindstone surfaces are positioned in respective planes with the planes extending parallel to each other. Each grinding wheel is composed of a conductive grindstone having abrasive grains bound by a conductive binding material. An electrode discharge is applied from an electro-discharge truing electrode disposed in the space between the grindstone surfaces in a non-contacting relationship with the grindstone surfaces. The electrode discharge occurs in respective gaps formed between the electro-discharge truing electrode and the grindstone surfaces. The electro-discharge electrode is moved relative to the grindstone surfaces while applying the electrode discharge so that the grindstone surfaces are trued thereby.

Abstract: A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body so as to control pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

Abstract: An apparatus and method suitable for the pre-conditioning of a polishing pad on a CMP apparatus prior to the polishing of production wafers on the apparatus. The apparatus includes a pre-conditioning arm on which is mounted an ingot of suitable material. In use, the ingot is pressed against the polishing surface of the rotating polishing pad for a selected period of time to increase the temperature of the polishing surface by friction. The pre-conditioned polishing pad facilitates uniform polishing rates of production semiconductor wafers subsequently polished on the apparatus.

Abstract: An apparatus for providing a flat to stepped convex facing for grinding wheels used for the finished machining of parts, the apparatus including dressing wheels located only at the outer diameter of the Cubic-Boron-Nitride wheels to be dressed.

Abstract: Chemical mechanical apparatuses including a polishing pad conditioning unit for improving a conditioning rate and wear uniformity of a polishing pad are provided. In one aspect, a chemical mechanical polishing apparatus includes a polishing pad conditioner including conditioning disks disposed in a radial direction of a planarizing surface of a circular polishing pad and contacted with the planarizing surface of the circular polishing pad during rotation of the circular polishing pad. The conditioning disks are connected to first drive units supported by an arm disposed over the circular polishing pad and extended in a radial direction of a planarizing surface of the circular polishing pad. The arm is connected to second drive units. The second drive units move the arm horizontally and reciprocally in the radial direction of the planarizing surface of the circular polishing pad. Thus, a conditioning rate and wear uniformity of the polishing pad may be improved.

Abstract: To correct the tooth profile error of a ground gear, the wheel angle of a threaded grinding wheel is modified by dressing the threaded grinding wheel by a dressing device. To correct the helix form deviation of a ground gear, namely, to modify the helix angle of the gear, synchronization between the moving motion in the Z-direction of the threaded grinding wheel and the rotary motion of a table for installation of the gear is adjusted. When the helix form deviation is corrected by adjustment of the synchronization, a tooth profile change inevitably occurs. In consideration of the tooth profile change, correction of the tooth profile error by dressing is made.

Abstract: An in-situ measurement of thickness profiles of polishing pads (1) used in chemical mechanical polishing (CMP) is enabled by arranging sensors (7) for measuring distances together with a conditioner (6). The sensors (7) are provided as e.g. laser sensors (7a–c) performing an indirect measurement from a calibrated height level above the pad (1) surface or as e.g. laser (7a–c) or ultrasonic sensors (7e) performing a direct thickness measurement from the pad surface to the pad-platen contact surface. A thickness profile (10) is obtained by co-moving the sensor (7a, 7b) with the conditioner (6) during conditioning or by leading a sensor (7c) along a guide-rail (14) above the pad surface (1) with e.g. a constant distance. A reference distance measurement to the polishing platen (2) can be achieved by a second sensor (7d) mounted at a position, where there is no pad on the platen (2), e.g. a hole or the edge.

Abstract: A method and apparatus for conditioning polishing pads that utilize an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The a method and apparatus utilize a vacuum capability to pull waste material out of the conditioning pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port, the apparatus may also include self-contained flushing means and a piezo-electric device for vibrating the pad conditioning apparatus.

Abstract: In a grinding machine grinding a workpiece W by a grinding wheel G to supply coolant to one of a grinding point P or the workpiece W by way of a relative movement between the grinding wheel W rotatably supported on a wheel slide 11 and the workpiece W supported by a work support device 17, air layer 36 flowing on a circumferential surface Gc of said grinding wheel G by blowing hydraulic jet 35 transversally from one side to the other side of the grinding wheel G along the circumferential surface Gc at an upper stream position of a rotational direction of the grinding wheel G from the grinding point P. Mist of coolant blown by the hydraulic jet 35 through a recovering port 37, 43, 53 mounted on a wheel guard 20 covering a part of the grinding wheel G.

Abstract: A vitrified bond tool including: (a) a support body; (b) a vitrified bond layer which is formed on a working surface of the support body; and (c) a plurality of abrasive grains which are held by the vitrified bond layer so as to be fixed relative to the working surface of the support body and which are spaced apart from each other with spacing between the adjacent ones of the abrasive grains. This vitrified bond tool is advantageously manufactured according to a method including the steps of (i) forming a pattern layer which includes a vitrified bond, in a predetermined pattern on the working surface of the support body; (ii) sprinkling the abrasive grains over the pattern layer before the pattern layer is dried; and (iii) firing the pattern layer and the abrasive grains which are bonded to the pattern layer and are arranged in the predetermined pattern on the working surface of the support body.

Abstract: Systems and methods for conditioning polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a polishing support configured to carry a microfeature workpiece polishing pad, and a conditioner positioned at least proximate to the support to condition a polishing pad carried by the support. The conditioner can include a first portion (e.g., an abrasive portion) having a first hardness and being positioned to contact a polishing pad carried by the support, and a second portion (e.g., a brush portion) having a second hardness less than the first hardness and being positioned proximate to the first portion.

Abstract: A conditioning apparatus for use in a CMP system is provided along with an associated method of operation. The conditioning apparatus includes rotation mechanics and oscillation mechanics. The rotation mechanics are capable of rotating a shaft which causes a holder and a conditioning substrate to be rotated. The oscillation mechanics are capable of moving a position of the shaft within a region defined by a peripheral boundary that is less than and within an outer periphery of the conditioning substrate. A conditioning substrate backing is also included in the conditioning apparatus. The conditioning substrate backing defines a differential pressure distribution that is capable of being applied to the conditioning substrate.

Abstract: A method for conditioning a superabrasive grinding tool having a cutting surface includes truing the grinding tool by moving the cutting surface against a truing device to shape the cutting surface into a preselected profile, and subsequently moving the cutting surface against a sacrificial member so that the binder of the grinding tool is worn down, creating a plurality of spaces between the superabrasive particles. The spaces provide a flowpath for coolant and cutting chips during a subsequent machining process on a workpiece. Localized overheating or “burning” of the workpiece is thus avoided.

Abstract: A workpiece W and a grinding wheel G are relatively moved in Z and X-axis directions perpendicular to each other, the rotational axis of the grinding wheel is inclined relative to the X-axis, and the grinding wheel is composed of a taper section Ga having a generating line parallel to the Z-axis and a spherical section Gb connecting with the generating line at the maximum diameter portion of the taper section Ga. While performing a cam profile generating motion, the grinding wheel is controlled to perform a plunge grinding feed toward the workpiece in the X-axis direction to effect a plunge grinding on the cam of the workpiece and then, while performing the cam profile generating motion, is controlled to perform a traverse grinding feed in the Z-axis direction to effect a traverse grinding on the cam.

Abstract: An apparatus for conditioning a polishing pad of a CMP apparatus for making semiconductor wafers is provided which includes a control arm configured to extend at least partially over a polishing pad. The apparatus also includes at least one cylindrical conditioning piece coupled to the control arm where the control arm is configured to apply the at least one cylindrical conditioning piece to the polishing pad.

Abstract: A pad conditioner of wafer planarization equipment includes a linear driving device for moving a disk holder up and down using a magnetic force. The linear driving device has an electromagnet, a permanent magnet, and a controller. The controller controls the power supplied to the electromagnet such that the electromagnet and permanent magnet produce a force of attraction and/or repulsion used to move the disk holder relative to a polishing pad of the wafer planarization equipment.

Abstract: A method for dressing a grinding worm that is to be used in forming a conical face gear that meshingly engages a conical involute pinion. The method employs true conjugate action between a theoretical conical involute pinion and a conical face gear to accurately position a dressing tool relative to a grinding worm.

Abstract: Embodiments of the present invention are directed to polishing an object with polishing pad conditioning. In one embodiment, a method for polishing an object comprises placing a contact portion of a polishing pad in contact with a target surface of the object to be planarized over a contact area which is smaller in area than the target surface; conditioning a noncontact portion of the polishing pad which is not in contact with the target surface of the object; and moving the polishing pad relative to the target surface of the object to move the noncontact portion in contact with the target surface of the object and move the contact portion out of contact with the target surface of the object.

Abstract: A recycled polishing pad conditioner comprises a base plate and a reversed abrasive disc that is flipped over from its original configuration. The reversed disc comprises an exposed abrasive face having an unused abrasive face comprising abrasive particles. A bond face of the disc is affixed to the base plate, the bond face comprising a used abrasive face that was previously used to condition polishing pads. Also described is a pad conditioner having an abrasive face comprising exposed portions of abrasive particles, with at least about 60% of the abrasive particles having a crystalline structure with substantially the same crystal symmetry.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring, and pressed at a predetermined pressure to polish the workpiece. The polishing apparatus comprises at least two dressing units for dressing the polishing surface by being brought into contact with the ppolishing surface, which is a surface of a polishing cloth.

Abstract: Systems and methods to remove or lessen the size of metal particles that have formed on, and to limit the rate at which metal particles form or grow on, workpiece surface influencing devices used during electrodeposition are presented. According to an exemplary method, the workpiece surface influencing device is occasionally placed in contact with a conditioning substrate coated with an inert material, and the bias applied to the electrodeposition system is reversed. According to another exemplary method, the workpiece surface influencing device is conditioned using mechanical contact members, such as brushes, and conditioning of the workpiece surface influencing device occurs, for example, through physical brushing of the workpiece surface influencing device with the brushes. According to a further exemplary method, the workpiece surface influencing device is rotated in different direction during electrodeposition.

Abstract: A system and method for chemical mechanical polishing of a substrate is disclosed in which a polishing pad is conditioned by directing a fluid jet to the surface of the polishing pad. Thus, the use of expensive consumables, like conditioning pads comprising diamonds, can be avoided. Furthermore, the risk of substrates being scratched by diamonds lost from the conditioning pad is avoided.

Abstract: A dummy process and a polishing-pad conditioning process suitable for a chemical mechanical polishing (CMP) is provided. The CMP apparatus includes a polishing head, a polishing table, and a polishing pad. The polishing head includes a protective hood, a base, a retaining ring and a wafer supporting assembly. The wafer is attached to an attaching surface in the wafer receiving recess. Next, the wafer supporting assembly is moved to make the bottom surface of the retaining ring more protrusive than the bottom surface of the wafer such that the wafer does not contact the surface of the polishing pad. Accordingly, the need for a large number of dummy wafers can be effectively avoided.

Abstract: A method and system for cleaning conditioning devices used in chemical mechanical polishing (CMP) systems is disclosed. The system includes a robotic arm for holding and transporting the conditioning device between the polish pad area of the machine and the conditioning device cleaning area. The cleaning area consists of an ultrasonic tank containing a liquid for the purpose of removing particles, residues and contaminants from the conditioning device and its mounting hardware. Removal of contaminants from the conditioning device leads to reduced defect levels in the CMP process.

Abstract: Embodiments of a conditioning mechanism for a chemical mechanical polishing system have been provided. In one embodiment, a conditioning mechanism includes a rotor assembly and a conditioning element mounting assembly. A seal is disposed between the rotor assembly and conditioning element mounting assembly and bounds one surface of an expandable plenum defined between the rotor assembly and conditioning element mounting assembly. A spring is disposed between the rotor and conditioning element mounting assemblies and is adapted to bias a lower surface of the conditioning element mounting assembly towards the rotor assembly.

Abstract: The invention includes a method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The method includes exposing the pad surface to steam, and the steam can comprise ammonium citrate. The invention also includes an apparatus for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The apparatus includes a conditioning stone, and a steam outlet port proximate the conditioning stone. The steam outlet port is configured to jet steam onto the pad surface during the conditioning of the pad surface.

Abstract: A dressing apparatus dresses a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer in a polishing apparatus. The dressing apparatus comprises a dresser body (31) connected to a dresser drive shaft (23) which is vertically movable, a dresser plate (32) which is vertically movable with respect to the dresser body (31), and a dressing member (22) held by the dresser plate (32) for dressing the polishing surface (1a).

Abstract: A computer controlled grinding machine grinds a cylindrical region and an annular shoulder of a rotatable workpiece. Relative movement is effected between the workpiece and a grinding wheel along a line of action which subtends an angle of approach of less than 90 degrees to the Z axis of rotation of the workpiece. Such an angle of approach enables the wheel to grind the annular shoulder of the workpiece simultaneously with grinding the cylindrical portion.

Abstract: A chemical mechanical polishing (CMP) tool holds a conditioning disk that is used to remove impurities from a polishing disk used to planarize surfaces, such as a semiconductor surface. The tool uses an elastic disk that is positioned between a clamp and a gimbal hub that pivotally overlies a gimbal plate. The elastic disk is a polymer material, such as for example polytetrafluoroethylene (PTFE). The elastic disk has a central opening and is radially solid around the central opening. Alignment holes and drive mechanism holes pierce the elastic disk which functions to rotate the tool with minimal friction and provides a liquid seal from CMP fluids. Access holes in the gimbal plate permit easy installation and removal of the individual components. The PTFE disk is strong and durable enough to withstand high torque and provide lengthy operation without maintenance.

Abstract: A method and system for cleaning conditioning devices used in chemical mechanical polishing (CMP) systems is disclosed. The system includes a robotic arm for holding and transporting the conditioning device between the polish pad area of the machine and the conditioning device cleaning area. The cleaning area consists of an ultrasonic tank containing a liquid for the purpose of removing particles, residues and contaminants from the conditioning device and its mounting hardware. Removal of contaminants from the conditioning device leads to reduced defect levels in the CMP process.

Abstract: A method and apparatus for controlling the coherence of a high-pressure fluid jet directed toward a selected surface. In one embodiment, the coherence is controlled by manipulating a turbulence level of the fluid forming the fluid jet. The turbulence level can be manipulated upstream or downstream of a nozzle orifice through which the fluid passes. For example, in one embodiment, the fluid is a first fluid and a secondary fluid is entrained with the first fluid. The resulting fluid jet, which includes both the primary and secondary fluids, can be directed toward the selected surface so as to cut, mill, roughen, peen, or otherwise treat the selected surface. The characteristics of the secondary fluid can be selected to either increase or decrease the coherence of the fluid jet. In other embodiments, turbulence generators, such as inverted conical channels, upstream orifices, protrusions and other devices can be positioned upstream of the nozzle orifice to control the coherence of the resulting fluid jet.