Abstract: The demulsifying cleaning of metallic surfaces which may be contaminated with oil(s) with at least one further nonpolar organic compound, with fat(s), with soap(s), with particulate dirt or with at least one anionic organic compound using an aqueous, alkaline, surfactant-containing bath solutions.

Abstract: Prepackaged cleaning compositions are described which are suitable for on-site dilution, and for cleaning substrates such as air conditioner coils.

Abstract: Resist stripping agents, useful for fabricating circuits and/or forming electrodes on semiconductor devices for semiconductor integrated circuits with reduced metal etch rates, particularly copper etch rates, are provided with methods for their use. The preferred stripping agents contain low concentrations of a copper or cobalt salt with or without an added amine to improve solubility of the copper or cobalt salt. Further provided are integrated circuit devices and electronic interconnect structures prepared according to these methods.

Abstract: A three-phase liquid polishing and cleaning composition of the invention is suitable for polishing and cleaning a painted exterior surface, and includes an organic phase, an aqueous phase, and a particulate phase. The organic phase comprises a petroleum-based liquid and the aqueous phase comprises water. The particulate phase comprises at least one particulate polishing grade abrasive having a mean particle size of not more than about 2.5 microns, which is selected from the group consisting of an abrasive that is harder than the painted surface to be polished and cleaned, and an abrasive that is softer than the painted surface to be polished and cleaned. The composition comprises at least one surfactant (e.g., an anionic surfactant, an emulsifying agent, and a foaming agent) to emulsify the organic and aqueous phases upon mixing (e.g., shaking) the composition, and to suspend the particulate phase in the emulsified organic and aqueous phases.

Abstract: A method of conditioning the surface of a work piece, in particular of a litho-strip or litho-sheet, consisting of an aluminum alloy enables an increase in manufacturing speed in surface roughening while maintaining a high quality of the electro-chemical grained surface of the work piece with relative low effort related to facility equipment. The method of conditioning comprises at least the step of degreasing the surface of the work piece with a degreasing medium, wherein the degreasing medium contains at least 1.5 to 3% by weight of a composite of 5-40% sodium tripolyphosphate, 3-10% sodium gluconate, 3-8% of a composite of non-ionic and anionic surfactants and optionally 0.5 to 70% soda, wherein sodium hydroxide is added to the degreasing medium such that the concentration of sodium hydroxide in the aqueous degreasing medium is 0.01 to 5% by weight.

Abstract: An exemplary acid pickling solution for treating a surface of a magnesium alloy workpiece. The acid pickling solution consists of 5 g/l to 30 g/l of citric acid, 1.5 g/l to 6 g/l of surface active agent, wherein the surface active agent is a water-soluble and silicone free agent. A method for treating a surface of a magnesium alloy workpiece is also provided.

Abstract: The present invention relates to the preparation of a sample. Preferably, the sample is a sample to be analyzed, for example for ingredient content, etc. Preferred samples include foods, cosmetics, paints, coatings, adhesives, tanning agents, fabrics, chemical compositions, dyestuffs, samples subject to forensic studies, etc. Samples prepared according to the invention method are digested in sulfuric acid, nitric acid, and one or more fluoride salts selected from LiF, NaF, RbF, CsF and KF and then preferably subjected to analysis for metal content, etc, for example using atomic absorption (“AA”) and inductively coupled plasma (“ICP”).

Abstract: The invention relates to compositions and methods that are useful in etching a metal surface. In particular, the invention relates to novel acid compositions and methods of using such compositions in etching a metal surface, preferably an aluminum surface prior to anodizing to dissolve impurities, imperfections, scale, and oxide. The compositions are effective in maintaining their etching capacity and in removing smut produced by the etching of a surface as well as in general cleaning.

Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.

Abstract: Disclosed herein is a phosphate gel for passivation, which is used for the acid washing and phosphate coating of a corroded metal surface. The phosphate gel contains phosphate and gum.

Abstract: A surface treatment process for a metal article includes the following steps. Firstly, a metal article, made of at least one of copper and an alloy thereof, is provided. Secondly, a surface of the metal article is degreased. Thirdly, the surface of the metal article is activated in an acid solution. Finally, the surface of the metal article is deactivated by submersion in an antioxidant agent.

Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.

Abstract: The present invention relates generally to a process and chemical composition for the removal of adherent niobium-rich second-phase particles (SPPs) from pickled niobium-containing zirconium alloys which includes applying to the alloy surface a chemical composition comprising alkaline hydrogen peroxide; an alkali metal meta-silicate; and a magnesium salt.

Abstract: Composition for cleaning surfaces which are susceptible to corrosion in alkaline liquids, comprising at least one alkalinity source, at least one inorganic salt containing at least one cation selected from the elements of the second or third main group of the periodic table of the elements, and whereby the composition is free of any triazole and/or any alkali metal borate, aqueous concentrate comprising the composition, use solutions comprising the composition or the aqueous concentrate and method of cleaning surfaces which are susceptible to corrosion in alkaline liquids using the above aqueous concentrate or any of the above use solutions.

Abstract: A surface treatment composition and method for removing Si and reduced metal salt produced during etching of an aluminum die cast material (“ALDC material”) without generation of nitrogen oxide (NOx) or hydrogen fluoride (HF). In surface treatment of an ALDC material containing Si, Fe, Cu, Mn, Mg, Zn and Ni, the surface treatment composition for removing Si and reduced metal salt from the surface of the ALDC material after etching comprises hydrogen peroxide 300 to 950 g/l, fluorine ion-containing inorganic salt 1 to 300 g/l and balance water. The surface treatment method for removing Si and reduced metal salt from the surface of an ALDC material after etching comprises the step of dipping the ALDC material into the above described surface treatment composition. The aforementioned surface treatment composition effectively removes the Si and reduces metal salt impurities from the surface of the ALDC material without any problems such as NOx or HF gas which is harmful to the human and waste water treatment.

Abstract: An aqueous tire wheel cleaner composition useful for cleaning automobile tires are provided. The aqueous tire wheel cleaner composition contains an alkylene glycol, a salt of dialkyl sulfosuccinate, and as surfactants ethanol amine and an ethoxylate phosphate ester.

Abstract: A process for cleaning (e.g., desmutting) an aluminum surface, using compositions free of nitric acid and chromic acid and comprising, in one embodiment, an oxidant and at least one mineral acid salt. In another embodiment, the process uses a composition free of nitric acid and chromic acid and comprising an oxidant, at least one mineral acid salt, and a complexing agent which is a salt of an organic acid. Due at least in part to the absence of nitric and chromic acids, and in particular, strong mineral acids, the cleaning processes of the present invention remove smut residues from aluminum surfaces without significant etching of the aluminum.

Abstract: An aqueous tire wheel cleaner composition useful for cleaning automobile tires are provided. The aqueous tire wheel cleaner composition contains an alkali and/or alkaline earth metal hydroxycarboxilic acid or a quaternary amine ethoxylate; a salt of an aryl sulfonate, and as surfactants ethanol amine and an ethoxylate phosphate ester.

Abstract: A method for killing, preventing, or inhibiting the growth of microorganisms in an aqueous system or on a substrate capable of supporting a growth of microorganisms is provided by providing lysozyme, alone or in combination with a quaternary ammonium compound to the aqueous system or substrate.

Abstract: A cleaning composition including a metal bisulfate and metal inorganic salt acid package, and at least one surfactant. The cleaning composition can be a one-step wheel cleaner/brightener. The composition preferably contains no HF, no bifluoride, no oxalic acid, or other poisonous and highly toxic materials commonly found in both industrial and consumer wheel cleaners. Further, the wheel cleaner/brightener composition matches or exceeds the performance of those hazardous formulations and does not damage aluminum wheels even when applied to hot metal. The composition can be a foam composition, provided in a foam dispenser. The foam dispenser includes a container and a mechanical foaming head. The container includes a cleaning composition containing a metal bisulfate and metal sulfate acid package, and at least one surfactant, water, and a foam-boosting solvent.

Abstract: Chemical formulations and methods for removing unwanted material, such as unexposed photoresist, metal oxides, CMP residue, and the like, from semiconductor wafers or other substrates. The formulations utilize a supercritical fluid-based cleaning composition, which may further include (I) co-solvent(s), (II) surfactant(s), (III) chelating agent(s), and/or (IV) chemical reactant(s).

Abstract: A sanitizing applicator for applying a liquid sanitizer to a surface. The sanitizer may be a quaternary ammonium compound (QAC)-based or chlorine-based sanitizer containing positively charged ions at an effective concentration level for killing a predefined percentage of microbes present on the surface. The applicator includes a breakable internal reservoir for retaining a quantity of the sanitizer, and a positively charged nonwoven fabric covering the reservoir. The fabric is constructed using a positively charged binder to bind together the strands of the fabric, and is optionally treated with a positively or neutrally charged surfactant. The positive charge of the fabric prevents the fabric from neutralizing the positively charged ions in the sanitizer when the breakable internal reservoir is broken and the sanitizer is applied to the fabric.

Abstract: The present invention relates to cleaning composition comprising a surface substantive polymer for cleaning surfaces, particularly the exterior surfaces of a vehicle.

Abstract: The polishing solution is useful for preferentially removing barrier materials in the presence of nonferrous interconnect metals with limited erosion of dielectrics. The polishing solution comprises 0 to 20 weight percent oxidizer, at least 0.001 weight percent inhibitor for reducing removal rate of the nonferrous interconnect metals, 10 ppb to 4 weight percent complexing agent, 0 to 50 weight percent abrasive and balance water; and the solution having a pH of less than 7.

Abstract: Degreasing compositions that may be used, for example, to degrease substrates such as contaminated surfaces of automobile engines are disclosed. The degreasing compositions comprise a builder, an amphoteric surfactant, and an alkoxylated acetylenic diol having the structure of formula (I) or (II): where: R1 and R4 are, independently, alkyl radicals containing from 3 to 10 carbon atoms; R2 and R3 are, independently, selected from the group consisting of methyl and ethyl; and (x+y)=2 to 50; ?where: r and t are each, independently, 1 or 2; (n+m)=1 to 30; and (p+q)=1 to 30. Certain embodiments of the degreasing composition are non-caustic, low VOC and may be low phosphate or phosphate-free.

Abstract: Surfactant combinations containing: (a) one or more alkyl ether sulfates; (b) at least one quaternary ammonium compound corresponding to formula I: in which EO is ethylene oxide, R and R? are the same or different and represent alkyl groups, n1 is 0–30 n2 is 0–30, and A is a counterion; (c) 0 to 50% of one or more alkyl and/or aryl sulfonates; (d) 0 to 15% of one or more alkyl sulfates; and (e) 0 to 20% of one or more amphoteric surfactants, and water-based cleaning composition containing such surfactant combinations.

Abstract: A composition and method for cleaning surfaces having deposits, such as drink water tanks, supply water wells, water filter systems, and distributor water lines. The composition contains in combination a cleaning solution and a disinfectant, such as hydrogen peroxide or peracidic acid. The cleaning solution can includes hydrochloric acid and/or phosphoric acid in combination with inhibitors, dyes and water. The composition is applied to deposits which have formed on these surfaces.

Abstract: Compositions containing certain organic solvents and a fluorine source are capable of removing photoresist and etching residue.

Abstract: A method for chemical etching is disclosed for taking away oxidized film and removing cut as well as punched edge burs of harden-treated carbon steel (SK3, SK4 and SK5). Thereby, the fillet edge of the cut section is achieved. An oxidized film with a thickness of several micrometers is formed when a cut and punched steel is quenched and tempered at high temperature. Due to high strength and hardness of the steel, the oxidized film and edge burs are difficult to be removed by mechanical grinding. Therefore, a suitable electrolyte composes of only a little chemical reagent and oxidizer in deionized water is used to remove the oxidized film and punched bur simultaneously using chemical etching method.

Abstract: Compositions containing certain organic solvents and a fluorine source are capable of removing photoresist and etching residue.

Abstract: The invention relates to a method for one-bath chemical cleaning and preservation of interior surfaces of hollow steel bodies, without any organic solvents, comprising controlled change of the liquid bath in that in a circuit of hoses running from a mobile tank equipped with a pump unit and steam generator there is circulated a liquid stream to a defined cavity of steel. The composition of the liquid is changed methodically by the addition of fresh chemical additives until the end of the process. Fresh water at 80° C. has added thereto an alkaline degreasing liquid A containing chlorine-free tensides, which is circulated, whereupon cleaning liquid B, consisting of citric acid with added cationic tensides, is added to a pH of 4.5 and is circulated. There is then added a complexing derusting liquid C, with active modified aminocarboxykate made biologically degradable, with adjustment of the pH to 4.5–5.

Abstract: The present invention relates to a facility parts cleaning solution for the processing of (meth)acrylic acid and/or (meth)acrylic esters and a cleaning method using the cleaning solution. An aqueous cleaning composition comprising 5 to 50 wt % of at least one alkali metal hydroxide selected from the group consisting of sodium hydroxide and potassium hydroxide, 0.01 to 1 wt % of a water-soluble amino acid, 0.001 to 0.05 wt % of N,N?-methylene bisacrylamide, and 0.001 to 0.05 wt % of azobisisobutyronitrile is used to clean facility parts for manufacturing (meth)acrylic acid and/or (meth)acrylic esters in order to easily remove polymers and deposits.

Abstract: A descaling composition for use in removing scale deposited on a member made of titanium or a titanium alloy, the descaling composition containing a hydroxycarboxylic acid, a sulfamic acid and ammonium sulfate as effective components and effectively inhibiting titanium ions from dissolving out.

Abstract: Cleaning solutions for removing photoresist resins remaining on the underlying layer patterns formed by photolithography process using the photoresist patterns as etching mask. The cleaning solution for removing photoresist comprises H2O as solvent, amine compounds, hydrazine hydrate, transition metal-removing material and alkali metal-removing material. Photoresist coated on the top portion of underlying layers can be rapidly and effectively removed by the disclosed cleaning solution. In addition, the cleaning solution is environment-friendly because H2O is used as the solvent, and has little effect on metal layers when underlying layers are formed of metals.

Abstract: The invention relates to the use of a composition for cleaning the outside of a means of transport. The composition contains component a) at least one tertiary amino oxide of formula R1 R2 R3 NO, whereby R1 represents an alkylamidoalkyl, alkenylamidoalkyl, alkoxypropylamidoalkyl or alkenylamidoalkyl group having between 8–18 carbon atoms, R2 and R3 represent, independently from each other, low molecular alkyl radicals or hydroxyethyl radicals or hydroxypropyl radicals, and component b) at least one alkali metal salt of polyasparaginic acid having a molecular weight of between 5,000 g/mol–50,000 g/mol, or a polyglutaminic acid having a molecular weight of between 5,000 g/mol–50,000 g/mol, or a mixture of both substances, whereby the weight ratio of the components a:b is between 10:1 and 3000:1. The cleaner of the present invention effectively removes dirt and comprises environmentally friendly corrosion inhibitors.

Abstract: A cleaning composition for treating and removing residue containing hydrocarbons and other flammable substances uses a mixture of one or more cleaning members containing quaternary salts, a chelator and a dispersant, mixed with water. The preferred cleaning members are tetradecyltrimethylammonium bromide, tetrasodium ethylenediaminetetraacetic acid, benzethonium hydrochloride and 2-butoxyethanol. The chelator is tetrasodium salt ethylenediamine of tetraacetic acid, and the dispersant is polyvinyl alcohol. Optionally, the cleaner contains ethanol and isopropyl alcohol.

Abstract: An aqueous solution that has the capacity for removing tarnish and other soil from copper, silver, gold and other noble metals and alloys thereof comprises an acid, thiourea and a transition metal salt. The aqueous material can be used to treat the surfaces of such articles for the purpose of removing tarnish. Such tarnish is removed by the composition and the composition treats the metal surface to retard the re-appearance of tarnish contaminants.

Abstract: An aqueous polishing composition comprises a corrosion inhibitor for limiting removal of an interconnect metal with an acidic pH. The composition includes an organic-containing ammonium salt formed with R1, R2, R3 and R4 are radicals, R1 has a carbon chain length of 2 to 15 carbon atoms. The organic-containing ammonium salt has a concentration that accelerates TEOS removal and decreases removal of at least one coating selected from the group consisting of SiC, SiCN, Si3N4 and SiCO.

Abstract: A composition for removing resist, polymeric material and/or etching residue from a substrate comprising titanium or an alloy thereof, the composition comprising hydroxylamine or a derivative thereof and at least one compound having the general formula (I) wherein: R1 and R3 are each independently selected from H, OH, CO2H, halogen, C1–C3 alkyl, C1–C3 alkoxy or (CH2)nOH wherein n is 1, 2 or 3; and R2 is selected from C9–C16 alkyl, or C9–C16 alkoxy

Abstract: A cured resin dissolving composition comprising a cellulosic gelling agent prepared in n,n-dimethylacetamide, known for its high penetration and solvency to polar resins, with a glycol-ether co-solvent, 1,8-diazabicyclo(5.4.0)undec-7-ene as a soluble amine, and a surfactant. The mixture of components form a gel-form composition while maintaining high dissolution character for cured polysulfide resins. The optimum thickness of the gel form is dependent upon the amount of the cellulose gelling agent present in the mixture. The product may be used to remove coatings and sealants present on vertical and horizontal surfaces and hard to reach areas commonly encountered when performing maintenance on aviation fuel tanks and similar equipment. Once the system has been in contact with the resin and dissolution has been allowed for a period of time, the reacted material may be wiped away or can be easily rinsed with water, an alcohol, or another hydrophilic rinse.

Abstract: A cleaning composition is provided according to the invention. The cleaning composition includes a product of mixing an acid component, a source of phosphoric acid component, and an oxidant component. The molar ratio of oxidant component to phosphoric acid component is preferably between about 2:1 and about 1:2, and the molar ratio of oxidant component to acid component is preferably between about 1:3 and about 1:5. A method of cleaning an aluminum surface is provided. The method includes a step of applying the cleaning composition to an aluminum surface, and rinsing the cleaning composition from the aluminum surface.

Abstract: This invention provides for, inter alia, a cleaning and polishing oil-in-water emulsion which comprises: A. about 0.1 to about 25% of at least one silicone oil with a viscosity ranging between about 20 and about 100,000 mPas.; B. about 0.5 to about 25% of at least one bisquaternary organomodified silicone of the formula: [Z—M—(R?R?)SiO—[(R?R?)SiO]n—Si(R?R?)—M—Z]2+2X? ??(I) ?whereby Z is a quaternary nitrogen radical, R? and R? are independently from each other an alkyl or an aryl radical, M is a divalent hydrocarbon radical having at least 4 carbon atoms which optionally contain at least one hydroxyl group and which may be interrupted by one or more oxygen atoms and/or groups of the type —C(O)—, —C(O)O— or —C(O)N—, n is a number between 1 and 200, X? is a inorganic or organic anion, C. about 0.1 to about 15.0% of at least one nonionic or amphoteric surfactant which has an alkyl chain length between 6 and 14 carbon atoms; D.

Abstract: The invention relates to the use of a surface-active agent and to the use of cleaning agents obtained by dilution of said surface-active agent for removing silicone-containing deposits from surfaces.

Abstract: A restaurant cleaning towel made from a substrate such as a woven, nonwoven, or knit fabric. A sanitizer release polymer composition comprising at least one cationic (or alternatively, nonionic) surfactant is bound to the surface of the towel. Preferably, the cationic surfactant is present in the sanitizer release polymer composition in an amount of about 1 to about 10 weight percent, based on a total weight of the composition. The composition may also include at least one nonionic co-surfactant in combination with the cationic surfactant. The towel also includes a color label on its surface to identify the area of the restaurant in which the cleaning towel is to be utilized. The towel may optionally include an international icon, a tactile label, and/or a label in a plurality of languages identifying the area where the towel is to be utilized.

Abstract: An aqueous solution that has the capacity for removing tarnish and other soil from copper, silver, gold and other noble metals and alloys thereof comprises an acid, thiourea and a transition metal salt. The aqueous material can be used to treat the surfaces of such articles for the purpose of removing tarnish. Such tarnish is removed by the composition and the composition treats the metal surface to retard the re-appearance of tarnish contaminants.

Abstract: An aqueous cleaning composition comprising an alkanolamine, a tetraalkylammonium hydroxide, nonmetallic fluoride salt, a corrosion inhibitor, e.g. ascorbic acid or its derivatives alone or in combination, balance water. Such cleaning compositions are effective to remove residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper and attack of dielectric substrates.

Abstract: In an apparatus, after completion of a CMP (i.e., chemical mechanical polishing) operation of a semiconductor wafer, the thus polished wafer is temporarily stored in a water tank before it is subjected to a post-CMP cleaning operation. During its storage period in the water tank, the wafer is prevented from being chemically attacked by an oxidizing agent contained in an abrasive used in the CMP operation. The apparatus includes: the water tank for storing the wafer therein; a pure water supply pipe for supplying pure water to the water tank; an anticorrosion agent supply pipe for supplying an anticorrosion agent to the pure water; a drain pipe connected with a lower portion of the water tank to discharge the water from the water tank; a return pipe for returning the discharged water to an upper portion of the water tank through a pump and a filter, the return pipe branching-off from the drain pipe; and, valves mounted on these pipes.

Abstract: Brass articles having leachable lead are contacted with an aqueous caustic solution that contains a chelating agent. A brass article can optionally be post-treated by contacting it with an aqueous solution containing anazole.

Abstract: Process for removing deposits from water-carrying systems and devices for water supply, or from their individual parts, in which the deposits are dissolved by means of an aqueous treatment solution and removed in dissolved form from the system or the device or their individual parts, wherein the deposits are dissolved by means of an aqueous treatment solution comprised of a combination of (i) a reducing agent, in particular in the form of a slat-like, reducing sulfur-oxygen compound, nitrogen-oxygen compound or phosphorous-oxygen compound, and (ii) a complexing agent having phosphonic acid groups or phosphonate groups or a complexing agent of the hydroxy acid type at pH values in the range of approximately 4.5 to 9.5, in particular from approximately 6.0 to 8.0.

Abstract: An article for sanitizing a surface with a sanitizing solution while maintaining the concentration level of a sanitizer in the sanitizing solution at an effective concentration level. A substrate that absorbs and holds the sanitizing solution is treated with a sanitizer release polymer composition. The substrate may be a woven, nonwoven, or knit fabric, a foam or sponge, or the like. The sanitizer release polymer composition may include a cationic or nonionic surfactant or binder that is operable to maintain the concentration level of the sanitizer at the effective level during prolonged periods of use.