Abstract: A method of treating a surface of a metal is provided. A source of fluoride ion is mixed with a source of acid to form hydrofluoric acid and, when applied to a metal surface to be treated, the hydrofluoric acid acts as a brightening agent.

Abstract: An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by varying the concentration of the ammonium salt component and the amount of water in the mixture. Also a novel chemical mixture for stripping copper and removing copper contamination is provided. The novel chemical mixture for removing or stripping copper comprises an ammonium salt, an amine, and water. For example, the novel chemical mixture may comprise ammonium fluoride, water, and ethylenediamine in a ratio of 1:1:1.

Abstract: Brass articles having leachable lead are contacted with an aqueous caustic solution having a pH of about 10 to about 14 that contains a chelating agent. During contact, the brass articles can be sonicated. The brass articles can be optionally pretreated by contacting them with an aqueous solution containing an organic carboxylic acid and an inorganic per-salt. The brass article can optionally further be post treated by contacting them with an aqueous solution containing sodium persulfate.

Abstract: Cleaning and deoxidizing aluminum surfaces can be accomplished simultaneously by contacting the surfaces with an aqueous liquid composition that contains as its cleaning active ingredients (i) alcohols and/or ether alcohols, (ii) alkaline builders, and (iii) alkali stable surfactants, and, optionally but preferably, also contains fluoride and chelating agents.

Abstract: Substantially nonaqueous concentrates for use in preparing stable, aqueous cleaner/degreaser compositions in the form of totally water soluble solutions comprise (a) at least one sparingly water soluble organic solvent having certain defined characteristics; (b) a solubilizing additive consisting of from approximately 0.1 to approximately 100 weight percent of a surfactant and from 0 to approximately 99.9 weight percent of a coupler, the solubilizing additive being present in an amount of approximately 3% to approximately 15% by weight excess over that minimally required to form a clear solution when the concentrate is combined with water; and (c) not more than 10.0 weight percent of water; (d) the concentrate forming a barely clear, totally water soluble solution when diluted with water to produce a solution having the desired cleaning/degreasing strength.

Abstract: A chemical delacquering composition, process and system for delacquering substrates such as aluminum scrap in which an aqueous solution containing at least one short-chain organic acid, preferably a mixture of two short-chain organic acids, and optional components such as surfactants, are contacted onto the substrate(s) with application of heat and agitation. The invention embraces the use of one or more organic acids (carboxylic acids) having a total of 2-12 carbons, preferably 3-8 carbons. Concentration of organic acid by weight ranges from about 0.5-8% per at least one organic acid, or preferably 2-4% for each organic acid component assuming two organic acid components are present. In the preferred embodiment of the invention, about 2-4% each of citric and lactic acids are present in the delacquering composition. Processing temperatures range from 160-212° F., preferably 180-212° F., and most preferably 185-212° F.

Abstract: This invention provides an improved composition and process for pretreatment of aluminum prior to electroplating. The invention is an aqueous composition comprised of an acid, an oxidizing agent, and, optionally, a halogenated compound. This composition is useful in a process that effectively removes smut that results from the etching step of the aluminum pretreatment process. Alternatively, the composition can be used in a process which combines the etch and desmut steps in Al pretreatment.

Abstract: An inexpensive and safe copper removal method in the fabrication of integrated circuits is described. Copper is stripped or removed by a chemical mixture comprising an ammonium salt, an amine, and water. The rate of copper stripping can be controlled by varying the concentration of the ammonium salt component and the amount of water in the mixture. Also a novel chemical mixture for stripping copper and removing copper contamination is provided. The novel chemical mixture for removing or stripping copper comprises an ammonium salt, an amine, and water. For example, the novel chemical mixture may comprise ammonium fluoride, water, and ethylenediamine in a ratio of 1:1:1.

Abstract: A dilute composition for use in semiconductor processing includes both phosphoric acid and acetic acid. Each of the acidic components may be at a concentration of less than about 10% by volume of the dilute composition. The dilute composition can be used for cleaning various surfaces, such as, for example, patterned metal layers and vias by exposing the surfaces to the dilute composition.

Abstract: The present invention is directed to an aerosol formulation comprising (A) a composition comprising (i) from about 20 to about 50% by weight of an aromatic alcohol, such as benzyl alcohol, (ii) from about 5 to about 50% by weight of an accelerator, and (iii) from about 0.5 to about 5.0% by weight of water, based upon 100% weight of total composition; and (B) a propellant. The aerosol formulation is useful for removing paints, coatings, grease, and other residues from various substrates. A method of preparing the aerosol formulation is also provided.

Abstract: An aqueous composition comprising ammonium hydroxide in an amount of about 1 to about 30% by weight calculated as NH3 and a surface active agent represented by the formula XF2C(CFY)nSO3A wherein X=F, OH or SO3A; Y=F, H, OH or may be omitted thereby creating a double bond; n=1-12; A=NH4+, H+, Na+, K+, Li+, R+ or organic amine cation and R is 1-4 straight chain alkyl group; and wherein the fluoroalkyl group is a linear group; and wherein the surface active agent is present in an amount of about 5 ppm to about 2000 ppm is useful for cleaning photomasks and especially chromium photomasks.

Abstract: A cleaning composition and method are provided for removing iron stains and scale from the external surfaces of duck decoys. An illustrative composition contains hydrochloric acid, stannous chloride, ammonium bifluoride, and water. The compositions are applied to the duck decoys with a pressurized sprayer to discolor and dislodge the stain and scale and thereafter the decoys are water rinsed with a garden hose or the like to remove the dislodged material.

Abstract: The present invention provides an aqueous dispersion for chemical mechanical polishing suitable for polishing of copper, which has a high polishing speed and a low erosion rate with overpolishing. The aqueous dispersion for chemical mechanical polishing of the invention contains a compound having a heterocycle, a surfactant and an oxidizing agent, wherein the compound having a heterocycle and the surfactant are in a weight ratio of 1:10 to 1:0.03. The aqueous dispersion may also contain abrasive particle. The compound having a heterocycle is preferably quinaldic acid, benzotriazole or the like. The surfactant is preferably a sulfonic acid salt such as potassium dodecylbenzenesulfonate or ammonium dodecylbenzenesulfonate, and the oxidizing agent is preferably ammonium persulfate, hydrogen peroxide or the like. The abrasive particle used may be inorganic particle such as colloidal silica, an organic particle such as polymer particle, or an organic/inorganic composite particle comprising a combination thereof.

Abstract: A method and application of a disinfecting solution which comprises adding to an acid the chemical equivalent of a metal chloride plus a metal compound wherein the metal compound is one of a hydride, oxide or hydroxide and the metal is selected to form a precipitate with said acid. The precipitate is filtered from the solution leaving a deanionated chlorided hydronium complex that is non corrosive to human tissue yet has powerful disinfecting properties. Calcium is the preferred metal.

Abstract: The invention is a cleaning solution for degreasing metal articles which contains water soluble, N-alkyl substituted amides in which the alkyl substituent has from 6 to 22 carbon atoms and at least one of (i) amine oxide surfactants, (ii) non-ionic water soluble nonionic surfactants with molecules containing a polyoxyalkylene block, and (iii) alkali stable anionic, or both anionic and amphoteric, surfactants. Preferred compositions of the invention can replace a vapor degreasing process for cleaning oil, grease, and waxy-type contaminants from metal articles to the level of cleanliness required in the aerospace industry.

Abstract: Non-aqueous cleaning compositions capable of removing cured polyimides and other polymers from a metal circuitry containing substrate such as a semiconductor device for rework and other purposes without any significant adverse affect on the circuitry are provided consisting essentially of alkanolamines, preferably monoethanolamine or monoethanolamine-diethanolamine mixtures and optionally with a solvent such as NMP in an amount less than about 50% by weight. A method is also provided for removing polyimide coatings and other polymers from semiconductor devices using the cleaning compositions of the invention.

Abstract: Cleaning formulations and methods are provided by which solid deposition is inhibited on hydrophobic hard surfaces typically encountered in bathroom and outdoor environments without detrimentally affecting the appearance of such surfaces. The formulations most preferably include an aqueous mixture of an organically solvated nonionic copolymer, a polyacrylic acid homopolymer and a nonionic surfactant. Optionally, a hydrotrope may also be present in the formulation. Most preferably, the formulations of this invention have a pH between about 4.0 to about 7.0, most preferably around neutral (i.e., about 7.0).

Abstract: A general purpose cleaning composition for non-water soluble contaminants is described. The cleaning composition contains a cationic surfactant and a Group IIIa metal salt, and does not require a water treatment chemical to separate the contaminants from an emulsion made with the cleaning composition.

Abstract: Formulations and a process are disclosed for chemically treating a surface of a product made from magnesium alloys. One formulation comprises an acid pickle comprising hydrofluoric acid and a binary alcohol and a second formulation comprises a conversion solution comprising nitric acid, permanganate, and ammonium acid difluoride. The process comprises degreasing the product with alkaline solution, rinsing the product with water, pickling the product with the acid pickle, rinsing the product with water, modifying the product using the modifying solution, rinsing the product with purified water, and drying the product by heating.

Abstract: The invention is directed to a chemical cleaning composition containing a hydroxylated wetting agent, a chelating agent, an emulsifier, optionally a crown ether, and optionally a non-aromatic solvent. The cleaning composition is 100% biodegradable, water-based, and able to remove adhered particles having a particle size of less than 35 micrometers. The invention also relates to a process for cleaning a substrate such as a gas turbine engine.

Abstract: The present invention relates to a process for removing fatty substances. According to this process, the following steps are carried out:1) at least a first degreasing operation is carried out on the article to be treated, in the presence of a solvent mixture comprising at least one compound (a) chosen from C1-C4 dialkyl esters of at least one C4-C6 aliphatic diacid, and at least one compound (b) which is miscible in the compound (a) and which at least partially dissolves the fatty substance contaminating the article, 2) at least a second degreasing operation is optionally carried out, in the presence of a solvent mixture comprising at least one compound (a) and at least one compound (b) as defined above, with a compound (a)/compound (b) volume ratio of greater than or equal to 1, 3) a third degreasing operation is carried out in the presence of compound (a), 4) the article thus treated is rinsed with water.

Abstract: A hydroxylamine-gallic compound composition comprises a hydroxylamine compound, at least one alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound. A process for removing photoresist or other polymeric material or a residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, in accordance with this invention comprises contacting the substrate with a hydroxylamine compound, an alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound for a time and at a temperature sufficient to remove the photoresist, other polymeric material or residue from the substrate. Use of a gallic compound in place of catechol in the composition and process reduces attack on titanium metallurgy by, e.g., about three times.

Abstract: An aqueous liquid composition for cleaning and degreasing metal surfaces consists essentially of water and the following dissolved stably dispersed, or both dissolved and stably dispersed components: A) alkali metal borate salts; B) boric acid in excess of any generated by reaction of anions of component a) with water; C) nonionic surfactant; and D) anionic and/or amphoteric surfactants.

Abstract: A method for the removing of plasma etch residues on a substrate comprising the steps of: (i) contacting the substrate with a cleaning composition, and (ii) contacting the substrate with ozonated water. The preferred cleaning composition has a pH from 2 to 6 and comprises: (A) water; (B) at least one selected hydroxylammonium compound; and (C) at least one basic compound; and optionally (D) a chelating stabilizer; and optionally (E) a surfactant.

Abstract: Aqueous cleaning solution concentrates with elevated levels of N-alkyl-2-pyrrolidone solubilized therein, comprising a surfactant formulation incorporating at least one N-alkyl-2-pyrrolidone, the alkyl group of which has 6 to 12 carbon atoms, and a C6-10 alkane sulfonate hydrotrope for the N-alkyl-2-pyrrolidone in a hydrotrope/pyrrolidone weight ratio of 0.9 to 5.0%.

Abstract: A chemical delacquering composition, process and system for delacquering substrates such as aluminum scrap in which an aqueous solution containing at least one short-chain organic acid, preferably a mixture of two short-chain organic acids, and optional components such as surfactants, are contacted onto the substrate(s) with application of heat and agitation. The invention embraces the use of one or more organic acids (carboxylic acids) having a total of 2-12 carbons, preferably 3-8 carbons. Concentration of organic acid by weight ranges from about 0.5-8% per at least one organic acid, or preferably 2-4% for each organic acid component assuming two organic acid components are present. In the preferred embodiment of the invention, about 2-4% each of citric and lactic acids are present in the delacquering composition. Processing temperatures range from 160-212° F., preferably 180-212° F., and most preferably 185-212° F.

Abstract: A method for treating the surface of a substrate with a surface treatment composition, wherein the surface treatment composition comprises a liquid medium containing a complexing agent as a metal deposition preventive, the complexing agent comprising at least one member selected from Group A complexing agents and at least one member selected from Group B complexing agents defined hereinafter.

Abstract: A cleaning composition that can be dissolved in water to form a cleaning solution for cleaning metal articles, comprises 10% (m/m) iodine, 65% (m/m) tartaric acid, 5% (m/m) sodium lauryl sulphate and 20% (m/m) citric acid. The cleaning solution can be applied to the surface of a metal article for cleaning it. The invention extends to the cleaning solution which includes 20 grams of the chemical composition dissolved in one litre of water.

Abstract: Biocompatible aqueous biocompatible cleaning and deodorizing compositions comprise (i) a biocompatible high osmotic pressure material, (ii) a Polycarboxylic acid salt, (iii) a polyhydric alcohol, (iv) a nonionic surfactant, and (v) an odor elimination agent, in water. The compositions are particularly suitable for cleaning and deodorizing medical devices which are designed for receiving and/or holding human waste. Preferably, the compositions are free of non-biocompatible or toxic components and have a relatively neutral pH, whereby the compositions are not harmful to human skin upon contact.

Abstract: A cleaning solution is provided for cleaning copper-containing microelectronic substrates, particularly for post-CMP or Via formation cleaning. The cleaning solution comprises a quaternary ammonium hydroxide, an organic amine, a corrosion inhibitor, and water. A preferred cleaning solution comprises tetramethylammonium hydroxide, monoethanolamine, gallic acid, and water. The pH of the cleaning solution is greater than 10.

Abstract: Non-corrosive cleaning compositions that are aqueous based and useful for removing photoresist, plasma etch and CMP residues from a substrate. One preferred cleaning composition comprises: (i) a hydroxylamine or a hydroxylamine salt compound; (ii) at least one fluorine-containing compound; and (iii) water. Another cleaning composition comprises: (i) a compound selected from the group consisting of: an amine, a quatenary ammonium hydroxide, and ammonium hydroxide; (ii) at least one fluorine-containing compound; and (iii) water.

Abstract: An alkaline aqueous cleaning composition for cleaning a substrate contaminated with industrial-type soil contaminants contains (i) an aqueous portion and (ii) an active-ingredient portion composed of (A) an alkalinity-providing agent and (B) a surfactant mixture containing (a) an active concentration of an ethoxylated C12-14 alkanol surfactant having an HLB value at 25° C. of from 8 to 12 and (b) an active concentration of at least one aminocarboxylic acid surfactant of the general formula R—N(H)—R′, wherein R is a straight or branched chain aliphatic organic group having from 10 to 20 carbon atoms, and R′ is a straight or branched chain carboxylic acid having from 1 to 7 carbon atoms. At an active-concentration ratio of surfactant (a) to surfactant (b) of about 2.5:1, the surfactants have a synergistic effect on the cleaning composition's ability to remove certain types of industrial-soil contaminants.

Abstract: A hydroxylamine-gallic compound composition comprises a hydroxylamine compound, at least one alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound. A process for removing photoresist or other polymeric material or a residue from a substrate, such as an integrated circuit semiconductor wafer including titanium metallurgy, in accordance with this invention comprises contacting the substrate with a hydroxylamine compound, an alcohol amine compound which is miscible with the hydroxylamine compound and a gallic compound for a time and at a temperature sufficient to remove the photoresist, other polymeric material or residue from the substrate. Use of a gallic compound in place of catechol in the composition and process reduces attack on titanium metallurgy by, e.g., about three times.

Abstract: A cleaning agent concentrate is presented having (a) at least one glycol ether corresponding to the formula: R—O—(CH2—CH(CH3)O)n—H where R is an alkyl group having 1 to 4 carbon atoms or a phenyl group, and n is a number of from 1 to 5; and (b) at least one cationic surfactant, where the weight ratio of (a) to (b) is from 8:1 and 100:1, and where the cleaning agent concentrate comprises less than 0.1 percent by weight of fatty alcohol alkoxylates, amphoteric surfactants, or mixtures thereof. When diluted to 0.5 to 5% by weight with water, a cleaning agent is formed that is low-foaming. The cleaning agent is especially useful for cleaning and passivating metal surfaces using a spray application.

Abstract: A method for decontaminating the copper surfaces (e.g. circuits) of an electronic card from copper salts which can be formed after the soldering of the electronic components onto the substrate employing a water free solution which comprises an alcohol and at least one neutral ammonium salt of an organic acid.

Abstract: Aqueous acidic solutions of hydrogen peroxide used for metal surface treatments suffer from an increased decomposition rate of the hydrogen peroxide, caused by the dissolved metals such as iron, copper or titanium. A method is provided wherein stabilization can be achieved by employing a combination of a) a hydroxybenzoic acid, preferably p-hydroxybenzoic acid; b) a hydrotropic sulphonic acid, preferably p-toluene sulphonic acid; and c) a hydrophobic alkaryl sulphonic acid, preferably dodecylbenzene sulphonic acid.

Abstract: A vehicle cleaning solution is provided including a predetermined amount of mineral spirits and a predetermined amount of jeweler's rouge mixed with the mineral spirits for cleaning various vehicular components.

Abstract: A method for removing thermal grease from an electronic card having plated via holes and including electronic components thereon, the method including the steps of providing a substantially water free solution having an alcohol and at least one compound of a neutral ammonium salt of an organic acid and immersing the electronic card in the solution for a predetermined period of time remove the thermal grease from the electronic card.

Abstract: A cleaning method for a quartz substrate includes mixing a rinsing solution and mixing a cleaning solution such that the solutions are electrically conductive. The rinsing solution is carbonated and is used in more than one step within the method. The cleaning solution includes ammonium hydroxide. As a result of the electrical conductivity of the solutions, the cleaning method is less susceptible to surface damage caused by electrostatic discharge. The sequence of steps includes rinsing the quartz substrate with the carbonated rinsing solution, removing loose contaminants by a high pressure application of the cleaning solution, and removing organic contaminants in a strong oxidation environment using a solution of sulfuric acid and hydrogen peroxide. The carbonated rinsing solution is again applied, followed by another high pressure application of the cleaning solution and a final rinse with the carbonated rinsing solution.

Abstract: The invention relates to a composition useful for cleaning metal surfaces immersed in an aqueous system. The composition comprises as a mixture: an organic carboxylic acid; a non chelating amine; a chelating agent; and preferably a sulfur-containing polymer.

Abstract: Applicant discloses heavy duty degreaser cleaning compositions having reduced alkalinity and reduced corrosion properties for removing grease and/or oil from surfaces, and that contain:(a) about 1 to about 40 wt % of a builder having the following structure or a salt thereof: ##STR1## (b) about 1 to about 40 wt % of an alkaline metal carbonate; (c) about 0 to about 20 wt % of a surfactant;(d) 0 to about 20 wt % of a hydrotropic solvent;(e) 0 to about 10 wt % of a source of alkalinity; and(f) balance water.

Abstract: The process for removing a soap-contaminated conversion layer remaining on a metal workpiece after cold-forming with an aqueous acidic cleaning composition containing water, a surfactant such as an alkyl amine ethoxylate and nitric acid, phosphoric acid and/or amidosulphonic acid includes immersing the contaminated metal workpiece in the aqueous acidic cleaning composition at a temperature above 60.degree. C. until it has a clean bright surface and a fatty acid formed by reaction of the soap in the conversion layer is dispersed in the cleaning composition and then subsequently separating the metal workpiece from the cleaning solution and, after the separating, cooling the recovered aqueous acidic cleaning composition to a temperature below 55.degree. C. until a fatty acid layer including the fatty acid is separated from the aqueous acidic cleaning composition.

Abstract: An etching residue remover for cleaning etching residue from a substrate, derived from a mixture of at least hydroxylamine, an alkanolamine which is miscible with said hydroxylamine, water, and, optionally, a chelating agent, wherein the hydroxylamine and the alkanolamine are present in amounts sufficient to clean etching residue from the substrate.

Abstract: An aqueous metal cleaning composition is provided which comprises an alkalinity providing agent such as alkali metal carbonate and/or bicarbonate salts and a low foaming surfactant. The aqueous cleaning solution has specific foam height and foam collapse characteristics, and provides for substantially complete phase separation of a contaminant phase from the aqueous cleaning composition such that there is substantially no aqueous phase drag out into the contaminant phase; and the contaminant phase can be removed easily, and the aqueous cleaning solution can be recovered and reused.

Abstract: A water free solution for decontaminating copper surfaces (e.g. circuits of an electronic card) from copper salts which includes an alcohol and at least one neutral ammonium salt of an organic acid.

Abstract: Compositions and methods for cleaning, degreasing, stripping, solvating and/or removing residues and contaminants such as oils, grease, dirt, flux, inks, coatings, photoresists, resins and polymers from manufactured articles and hard surfaces such as, but not limited to metals, plastics, textiles, electronic devices, silicon wafers, mechanical devices or manufacturing equipment. The compositions contain at least one 4 carbon cyclic ether solvent mixtures with at least one 3-alkoxy 3-methyl butanol, as well as other optional alkaline materials as well as other optional solvents and additives. The compositions can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.

Abstract: An alkaline, aqueous metal-cleaning composition capable of effectively removing industrial-type soil contaminants from a metal surface at temperatures as low as ambient temperature and in the absence of substantial agitation contains (A) an active-ingredient portion containing (1) an alkalinity-providing component, and (2) a surfactant mixture containing: (a) at least one first non-ionic, ethoxylated linear primary alcohol surfactant having a hydrophobic carbon chain length of from 9 to 11 carbon atoms and being ethoxylated with (i) an average of 2.5 moles of ethylene oxide or (ii) an average of 5.0 moles of ethylene oxide; and (b) at least one second non-ionic, ethoxylated linear primary alcohol surfactant having a hydrophobic carbon chain length of from 9 to 11 carbon atoms and being ethoxylated with an average of 6.0 moles of ethylene oxide; and (B) an aqueous portion.

Abstract: A cleaner composition for removing from within a microelectronic fabrication a copper containing residue layer in the presence of a copper containing conductor layer, and a method for stripping from within a microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer. The cleaner composition comprises: (1) a hydroxyl amine material; (2) an ammonium fluoride material; and (3) a benzotriazole (BTA) material. The cleaner composition contemplates the method for stripping from within the microelectronic fabrication the copper containing residue layer in the presence of the copper containing conductor layer.

Abstract: A non-chrome process for the pretreatment of substrate surfaces to simultaneously clean them and improve their bonding strength for organic coatings such as adhesives, protective primers, sealants, paints, composites and similar materials conventionally bonded to such substrates, including non-chromated or chromated curable organic resin protective coatings applied directly to bare aluminum substrates. The invention involves the use of novel wipe solvent compositions containing a major volume of an environmentally-safe volatile organic solvent which has a low composite vapor pressure or is otherwise exempt from federal, state or local regulations, and a minor volume of a polyfunctional coupling agent, preferably of the silane type.

Abstract: The present invention provides an aqueous cleaning solution for aluminum-based metals which comprises an inorganic acid in an amount to provide a pH value of 2 or less, an oxidized form metal ion and a surfactant represented by the following formula (I)R--O--(EO).sub.n H (I)wherein R represents an alkyl group having on average 10 to 18 carbon atoms per molecule, n represents an integer of 8 or greater, and EO represents an ethyleneoxy group which may contain a small proportion of a propyleneoxy group. The degradation of cleaning properties due to the accumulation of lubricating oil or decomposition of surfactants is lessened even when the cleaning operation is carried out for a long period of time.