Abstract: An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.

Abstract: A composition comprising a thermoplastic polymer having incorporated therein a crosslinked phase derived from the reaction of: (A) a copolymer made from ethylene and an unsaturated epoxide, a polyolefin grafted with an unsaturated epoxide, or a product having two epoxide groups, (B) a copolymer made from ethylene and an unsaturated carboxylic acid anhydride, and (C) a copolymer made from an unsaturated carboxylic acid or an ?,?-aminocarboxylic acid.

Abstract: The present invention relates to hydrogenated carboxylated nitrile-butadiene rubber (HXNBR), which contain molecularly dispersed triphenylphosphine, and which is useful as a cross-linking agent for elastomers, plastics and/or adhesive systems. The present invention also relates to products which are obtainable from the HXNBR having molecularly dispersed triphenylphosphine and elastomer, plastics and/or adhesive systems, a composition containing a HXNBR having molecularly dispersed triphenylphosphine and further non-molecularly dispersed activators, a process for the preparation of the composition as well as the use of HXNBR having molecularly dispersed triphenylphosphine, as an elasticizing agent for elastomer, plastics and/or adhesive systems.

Abstract: An object of the present invention is to substantially improve the compatibility between a radical copolymerizable unsaturated resin and an addition polymerized polymer (thermoplastic resin) which is added for the purpose of low profile and improvement of physical properties. The present invention provides a compatibilizing agent for compatibilizing a radical copolymerizable unsaturated resin with an addition polymerized polymer, characterized in that said compatibilizing agent is a graft copolymer (A) which contains a styrene monomer as a principal component, and has a principal chain (A1) consisting of a copolymer with a (meth)acrylate monomer and a side chain (A2) selected from a ring-opening polymerized polyether side chain consisting of a polyoxyalkylene ether, a polyester side chain, and a polycarbonate side chain, the side chain (A2) being bonded to the principal chain.

Abstract: A powder coating composition for heat-sensitive substrates curable at a temperature of about 300° F. or below for about 30 minutes or less comprises a) from about 10-90% by weight, relative to a) plus b), of carboxylic acid-functional acrylic resin(s); b) from about 10-90% by weight, relative to a) plus b), of polyepoxy resin(s); c) a catalyst in an amount sufficient to cure the composition at a temperature of about 300° F. or below for about 30 minutes or less; and d) optionally, a flexiblizing agent.

Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.

Abstract: The present invention relates to an isotactic polypropylene obtained by metallocene catalysis, onto which is grafted a functional monomer. The invention also relates to a composition which may form part of the composition of a coextrusion binder. This composition according to the invention comprises isotactic polypropylene obtained by metallocene catalysis, grafted and then optionally diluted with at least one polyolefin (C1) and/or in at least one polymer of elastomeric nature (D). The invention also relates to a multilayer structure comprising a layer (L) comprising the above binder, and, directly attached thereto, a layer (E): which is polar, nitrogenous or oxygenated, such as a layer of polyamide resin, of ethylene/saponified vinyl acetate copolymer (EVOH) or of polyester; or of a mineral oxide deposited on a polymer such as polyethylene (PE), polyethylene terephthalate (PET) or EVOH; or which is metallic or metalloplastic.

Abstract: A coating compound comprising a binder/crosslinking agent system that comprises 20 wt. % to 80 wt. % of one or more carboxyl-functional components A) and 80 wt. % to 20 wt. % of one or more epoxy-functional (meth)acrylic copolymers B).

Abstract: The invention relates to a modular system for the production of coating compositions for coating plastics comprising the following component modules: A) at least one base module containing at least one binder, extenders and/or pigments, optionally together with conventional coating additives, water and/or organic solvents, B) at least one adhesion module containing at least one adhesion-promoting component optionally together with binders, conventional coating additives, extenders, organic solvents and/or water, C) at least one elasticity module containing at least one elasticising component optionally together with conventional coating additives, extenders, organic solvents and/or water and D) at least one binder module containing at least one binder optionally together with additives, organic solvents and/or water.

Abstract: A curable composition comprises a compound having at least one epoxy group and at least one maleimide, styrenic or cinnamyl group per molecule.

Abstract: A photocurable and thermosetting resin composition comprises (A) an actinic energy ray-curable resin having at least one structure represented by the following general formula (1), (B) a photopolymerization initiator, (C) a diluent, and (D) a thermosetting component.

Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.

Abstract: The present invention provides curable coating compositions including: (a) about 55 to about 99 weight percent of an epoxy-functional polymer containing at least two epoxide groups per molecule; (b) about 1 to about 45 weight percent of a thermoplastic polymer effective to reduce shrinkage of the curable composition upon curing and which is substantially insoluble in the epoxy-functional polymer; (c) about 1 to about 70 weight percent of ground vulcanized rubber particles having an average particle size ranging from about 1 to about 300 microns; (d) a curing agent adapted to cure the epoxy-functional polymer; and, optionally, vinyl chloride polymer.

Abstract: A curable melt blended composition and a method of making the composition by melt blending a thermoplastic polymer comprising polyphenylene ether (PPE) polymer and a polystyrene polymer, preferably high impact polystyrene (HIPS), and optionally a compatiblizer, with an uncured epoxy component, comprising a curable epoxy and an epoxy curing agent, at a temperature greater than 150° C. and without addition of solvent wherein the epoxy component of the resulting curable melt blended composition remains substantially uncured.

Abstract: A multi-component coating composition having a hard, glossy, and tack-free finish is described. The coating composition comprises a fatty acid modified glycidyl-containing component and a hydroxy-functional polymer. The coating composition can be used to originally finish or to refinish such articles as farm, industrial, and construction equipment, automobiles, and trucks, and to paint structures such as bridges, buildings, appliances, metal furniture, and the like.

Abstract: An electronic circuit device comprising at least one substrate having a photoimageable covercoat, comprising at least 95 weight percent of at least one epoxy-modified aromatic vinyl-conjugated diene block copolymer and a catalyst comprising an onium salt selected from a triarylsulfonium salt and a diaryliodonium salt, wherein the covercoat is formed by solvent coating or extrusion and then heat laminated onto at least a portion of the substrate.

Abstract: A base-neutralized, water-diluted coating comprises (A) a polyhydroxyl-functional resin of an acrylate resin or an oil-free polyester containing urethane groups, (B) an amino resin partially etherified with an alcohol, (C) a basic neutralizing agent, (D) water, and (E) a water-insoluble crosslinking catalyst of a strong organic or inorganic acid such as p-toluenesulfonic acid blocked with a monoepoxide, diepoxide or lactone.

Abstract: Coating composition suitable for multilayer lacquering, containing, in addition to organic solvent, anti-sagging agents, optionally pigments, extenders and additives, a binder/crosslinkin agent system containing A) from 20 to 80 wt. % of carboxyl-functional (meth)acrylic copolymers and/or carboxyl-functional polyesters having an acid number of from 20 to 300, B) from 20 to 80 wt. % of epoxy-functional crosslinking agents, the percentages by weight of A) and B) adding up to 100 wt. %. C) from 0 to 30 wt. % of polymer polyol C), based on the sum of the weights of A) and B), E) from 0 to 20 wt. % of further crosslinking agents, based on the sum of the weights of A, B, and C), F) from 0 to 10 wt. % of monoepoxides, based on the sum of the weights of A) and B), and D) as anti-sagging agents, from 0.1 to 3 wt.

Abstract: An electronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effective amount of an epoxy curative, the weight percent of the copolymer and epoxy resin being based on the weight of the epoxy bearing material exclusive of curative. The resin composition can be used as an electronic adhesive, covercoat, or encapsulant. The electronic circuit device exhibits superior heat and moisture insensitivity, including the absence of voiding and delamination of the cured resin compostion from its substrate under conditions of 85° C. and 85% relative humidity for 168 hours followed by a temperature of 220° C. for 10 to 40 seconds.

Abstract: The present invention provides a curable coating composition that includes a film-forming polymer, a polymeric additive having at least one bound surface protecting group, and a crosslinker that is reactive with the film-forming polymer. The polymeric additive is substantially free of groups reactive with the crosslinker and has comonomer units with aryl groups, alkyl groups having, on average, four or more carbon atoms, or combinations of the aryl and alkyl groups. When the coating composition is cured to form a cured coating layer, the concentration of the polymeric additive in the upper about 50% of the cured coating layer thickness is at least about 10% higher than the concentration of the polymeric additive in the rest of the cured coating layer.

Abstract: A coated abrasive article comprises a backing, a first binder on the backing, and a plurality of abrasive particles in the first binder. The first binder precursor is an energy-curable preferably, melt-processable resin containing an epoxy resin, an ethylene-vinyl acetate copolymer, and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The above binder precursors of the invention are preferably free of homopolymers and copolymers of olefinic monomers. In another aspect, the invention also describes an energy curable first binder precursor containing an epoxy resin, an ethylene-vinyl acetate copolymer, a polyfunctional acrylate component and a curing agent for crosslinking the epoxy resin that is cured to provide a crosslinked make coating. The invention also relates to a method of producing such coated abrasive articles and a surface-treated backing material.

Abstract: The present invention relates to a blend of polymeric materials comprising; (A) of from about 1 to about 80 percent by weight (based on the combined weights of Components A and B) of at least one substantially random interpolymer; wherein said interpolymer; (1) contains of from about 0.5 to about 50 mole percent of polymer units derived from; a) at least one vinyl or vinylidene aromatic monomer, or b) at least one hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, or c) a combination of at least one vinyl or vinylidene aromatic monomer and at least one hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer; (2) contains of from about 50 to about 99.5 mole percent of polymer units derived from at least one aliphatic &agr;-olefin having from 2 to 20 carbon atoms; (3) has a melt index (I2) of from about 0.01 to about 100 g/10 min; and (4) has a molecular weight distribution (Mw/Mn) of from about 1.

Abstract: Curable coating compositions comprising either a liquid or particulate curable film-forming resinous material, a flow control agent which is a copolymer and optionally a carrier for the liquid resinous material. The copolymer is from at least one non-amino, non-hydroxyl and non-acid functional alkyl acrylate or methacrylate containing from 1 to 20 carbon atoms in the alkyl group, and functional monomer of either (i) amino functional acrylates and methacrylates in an effective amount to give the copolymer an amine value in the range from 2 to 70, or (ii) acid functional acrylate and methacrylate in an effective amount to give the copolymer an acid value in the range of from 10 to 30. Additionally, with either functional monomer (i) or (ii) another functional comonomer (iii) can be present in the copolymer which is hydroxyalkyl acrylate and/or hydroxyalkyl methacrylate and/or caprolactone polyol monomer.

Abstract: An electronic circuit device comprises a resin composition including 90 to 100 weight percent of a curable epoxy-modified aromatic vinyl-conjugated diene block copolymer, optionally up to 10 weight percent of an epoxy resin, and an effective amount of an epoxy curative, the weight percent of the copolymer and epoxy resin being based on the weight of the epoxy bearing material exclusive of curative. The resin composition can be used as an electronic adhesive, covercoat, or encapsulant. The electronic circuit device exhibits superior heat and moisture insensitivity, including the absence of voiding and delamination of the cured resin compostion from its substrate under conditions of 85° C. and 85% relative humidity for 168 hours followed by a temperature of 220° C. for 10 to 40 seconds.

Abstract: A powder coating hardener based on epoxide compounds having a molecular weight of no more than 1500, which is solid at room temperature, the epoxide compounds consisting of 60 to 100% by weight of diglycidyl 1,4-cyclohexanedicarboxylate in the form of the pure trans-isomer or of a cis/-trans-isomer mixture having a melting point (peak maximum of the DSC scan at a heating rate of 10° per minute) of above 70° C., and of 0 to 40% by weight of other epoxide compounds, and wherein 0 to 15% by weight of the entire amount of epoxide compounds can contain aromatic structural elements in the molecule. The powder coating hardeners give powder coatings based on poly(meth)acrylic resins having free carboxyl groups, which have good flow even at low temperatures.

Abstract: Coating compositions which comprise: (i) a hydroxy-functional compound containing in the molecule an average of at least two hydroxyl groups; (ii) an anhydride-functional compound containing in the molecule an average of at least two cyclic carboxylic acid anhydride groups; and (iii) an epoxy-functional compound containing in the molecule an average of at least two cycloaliphatic epoxy groups, provide low temperature cure response and excellent durability.

Abstract: A resin matrix with resistances to alkali and acid such as a fluorene-containing epoxy acrylate and/or a benzocyclobutene resin includes at least any one of insulative organic particles and insulative composite particles having an organic component and an inorganic component with the total amount of these particles being in the range of 5-50% by volume, wherein the insulative organic particles and the organic component of the insulative composite particles are allowed to be corroded by either alkali or acid, and wherein not less than 90% by volume of the insulative organic particles and insulative composite particles have a particle diameter in the range of 1-20 micrometers.

Abstract: A water-dilutable coating after base neutralization comprises a polyhydroxyl-functional resin including a condensation resin such as a polyester or alkyd resin, and/or a polyhydroxyl-functional addition resin such as an acrylate resin or the reaction product of a carboxyl-functional acrylate resin and a hydroxyl-functional acrylate resin, and/or an emulsion copolymer, an at least partially monoalcohol-etherified amino resin, and a strong organic or inorganic acid crosslinking catalyst non-ionically blocked with a monoepoxide, a diepoxide or a lactone.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: The present invention provides a heat-fusion composition for molding into multi-layers containing a block copolymer (a) having epoxy groups, wherein the heat-fusion composition for molding into multi-layers further comprises 20 to 80% by weight of a block copolymer (a) having epoxy groups and 20 to 80% by weight of at least one kind of thermoplastic elastomer (b) selected from styrene elastomer, polyurethane elastomer, polyester elastomer, polyamide elastomer, polyolefin elastomer and polyvinyl chloride elastomer (with a combined content of (a) and (b) of 100% by weight) along with the block copolymer (a) having epoxy groups and thermoplastic elastomer (b). A multi-layer molded body according to the present invention being excellent in the heat-fusion property can be obtained by allowing the heat-fusion composition for forming into multi-layers to heat-fuse with a hard resin.

Abstract: This invention relates to novel room temperature coalescable aqueous fluoropolymer dispersions and a process for their manufacture. These dispersions may be used in a variety of applications including high temperature thermoplastic coatings, polishes, room temperature formable paints and coatings, extrudable or injection moldable resins, and adhesives.

Abstract: The present invention provides a coupled polymer, which is prepared by reacting a living alkali metal-terminated polymer with a particular coupling agent. The coupling agent has the formula ##STR1## where R1, R3 are independently selected from the group consisting of aliphatic alkyl and alkenyl, and hydrogen, and R.sub.2 is alkylene, alkenylene, divalent cycloalkylene, divalent arenyl, or a C.sub.1-17 divalent hydrocarbyl containing ether or ketone group. By means of the particular coupling agent, the coupling efficiency is relatively high, and no harmful materials will be generated to corrode the pipes. The coupled polymer obtained has a coupling number of less than 3, and good rubbery physical properties, transparency, and wear resistance.

Abstract: A novel polyaddition copolymer having repetition units represented by the following general formula: ##STR1## where R: a lower alkyl group, Ar: a bisphenol compound residue, and X: a CH.sub.2 O group or a COO group, is obtained by copolymerization reaction of a bisoxetane compound represented by the following general formula: ##STR2## and a bisphenol compound.

Abstract: This invention provides for a coating composition comprising: (A) at least one polymeric material selected from (i) at least one homopolymer of ethylene having a melt index of at least about 220 grams per ten minutes as determined by ASTM D1238, condition 190/2.16, or (ii) at least one copolymer of ethylene and a second ethylenically unsaturated monomer having a melt index of at least about 20 grams per ten minutes as determined by ASTM D1238, condition 190/2.16, or (iii) at least one thermoplastic acrylic homopolymer or copolymer having a glass transition temperature (Tg) of greater than 0.degree. C. but less than 110.degree. C., or (iv) a mixture of (i), (ii) and/or (iii); and (B) at least one thermoplastic polymeric material different than (A) having a melting point in the range of about 80.degree. C. to about 130.degree. C.

Abstract: A curable composition comprising a polyfunctional oxetane compound and a polyphenol compound or phenol resin, where a quaternary onium salt or Crown ether compound is preferably further contained as a curing catalyst, provides a novel use for reactions of the oxetane compound as a 4-membered cyclic ether compound.

Abstract: A thermoplastic synthetic resin, especially high-density polyethylene, has its diffusion coefficient especially for hydrocarbons, reduced by the addition of 2 to 8% by weight of an additive consisting essentially of at least one phenoxy and/or epoxy resin, and at least one further component selected from the group which consists of at least one radical forming agent and at least one graft coploymerization catalyst, and optional quantities of an antioxidant selected from the group which consists of at least one phenolic antioxidant, at least one phosphitic antioxidant and mixtures thereof, at least one organosilane ester, at least one UV stabilizer, at least one antistatic composition, and polypropylene.

Abstract: Provided by the invention is a thermosetting adhesive composition suitable for use in the preparation of metal foil-laminated base sheets of flexible printed circuit boards and laminated product related thereto such as coverlay films and bonding sheets. The adhesive composition is a uniform blend which comprises: (A) an epoxy resin including a brominated epoxy resin to exhibit flame retardancy; (B) a combination of two or three kinds of different nitrile rubbers distinguishable relative to the iodine value and content of carboxyl groups at the molecular chain ends in a specified weight proportion; (C) a curing agent for the epoxy resin; and (D) a curing accelerator, with optional admixture of (E) an inorganic filler; and/or (F) a vulcanizing agent for the nitrile rubbers.

Abstract: Powder compositions comprising about 5-15 wt % of PVdF-compatible thermoplastic resin, about 50-90 wt % of a thermosetting binder system, about 0-35 wt % of pigments and about 0-3 wt % of leveling agent are disclosed which are particularly suitable for use as primers with a later application of a pigmented PVdF-based top coating. Preferred compositions are based on an epoxy system containing about 8 wt % of PVdF or acrylic thermoplastic resin, 5-25 wt % of pigments and 0.7-1 wt % of leveling agent.

Abstract: This invention provides an acoustic vibrational material containing various fibers as the reinforcement material and having the epoxy resin as the matrix resin, wherein the epoxy resin is modified by a polybutadiene base elastomer containing not less than 90 mole percent of 1,2-linked units. The epoxy resin modified with the above polybutadiene elastomer exhibits a maximum value of loss coefficient at the temperature region near the room temperature. Thus compatibility between large internal loss and high elastic modulus is achieved.

Abstract: A thermoplastic polymer composition contains at least two distinct polymers, characterized in that it comprises at least one polymer P1 containing at least one reactive function and at least one modified polyolefin P2 containing at least one succinimide ring substituted on the nitrogen by a reactive group, the ring being carried either by the main chain or by a side chain, and optionally at least one third polymer P3 selected from the group formed by polymers and copolymers obtained by polymerisation of one or more olefinic compounds. A mixture of polymers comprises at least one composition as defined above and at least one other polymer P5 which is identical to or different from polymer P3 and optionally at least one other polymer P6 which is identical to or different from polymer P1.

Abstract: Curable coating compositions comprising either a liquid or particulate curable film-forming resinous material, a flow control agent which is a copolymer and optionally a carrier for the liquid resinous material. The copolymer is from at least one non-amino, non-hydroxyl and non-acid functional alkyl acrylate or methacrylate containing from 1 to 20 carbon atoms in the alkyl group, and functional monomer of either (i) amino functional acrylates and methacrylates in an effective amount to give the copolymer an amine value in the range from 2 to 70, or (ii) acid functional acrylate and methacrylate in an effective amount to give the copolymer an acid value in the range of from 10 to 30. Additionally, with either functional monomer (i) or (ii) another functional comonomer (iii) can be present in the copolymer which is hydroxyalkyl acrylate and/or hydroxyalkyl methacrylate and/or caprolactone polyol monomer.

Abstract: The present invention provides a primer composition comprising an aliphatic isocyanate-containing compound, a nonhalogenated hydrocarbon polymer containing organic functional groups, a halogenated hydrocarbon polymer optionally containing organic functional groups, and an organic solvent.

Abstract: A method for reacting a methylene-containing component such as an acrylic polymer prepared from acetoacetoxyalkyl (meth)acrylate and an alkene-containing component such as a polyfumarate, polymaleate, a polyester containing both fumarate and maleate groups or a polyacrylate comprises the reaction of a tertiary amine such as triethylene diamine and an epoxide such as a glycidyl-functional (meth)acrylic polymer in the presence of the methylene-containing component and alkene-containing component. The tertiary amine can be incorporated into the alkene-containing component such as the reaction of an unsaturated polyester with a compound having both tertiary amine and primary or secondary amine groups. The tertiary amine can be incorporated into the methylene-containing component such as an acrylic polymer derived from a tertiary amino-functional monmer and acetoacetoxyalkyl (meth)acrylate.

Abstract: An energy beam curable pressure sensitive adhesive composition is disclosed which comprises at least two energy beam curable copolymers having energy beam polymerizable groups in side chains thereof. This energy beam curable pressure sensitive adhesive composition has satisfactory adhesive strength before the irradiation with energy beam and can be cured by the irradiation with energy beam to a degree such that the amount of adhesive residue remaining on an adherend after peeling is extremely small. Further, the above composition ensures excellent expansibility at the expanding step and excellent recognition at the time of pickup. Still further, the above composition exhibits high work efficiency because of very low pickup strength at the bonding step, irrespective of the execution of the expanding step.

Abstract: Powder compositions comprising about 5-15 wt % of PVdF-compatible thermoplastic resin, about 50-90 wt % of a thermosetting binder system, about 0-35 wt % of pigments and about 0-3 wt % of leveling agent are disclosed which are particularly suitable for use as primers with a later application of a pigmented PVdF-based top coating. Preferred compositions are based on an epoxy system containing about 8 wt % of PVdF or acrylic thermoplastic resin, 5-25 wt % of pigments and 0.7-1 wt % of leveling agent.

Abstract: A thermoplastic synthetic resin, especially high-density polyethylene, has its diffusion coefficient especially for hydrocarbons, reduced by the addition of 2 to 8% by weight of an additive consisting essentially of at least one phenoxy resin, and at least one further component selected from the group which consists of at least one radical forming agent and at least one graft coploymerization catalyst, and optional quantities of an antioxidant selected from the group which consists of at least one phenolic antioxidant, at least one phosphitic antioxidant and mixtures thereof, at least one organosilane ester, at least one UV stabilizer, at least one antistatic composition, and polypropylene.

Abstract: A one-part cold crosslinking emulsion composition containing, in an aqueous medium, a double-structure fine grain comprising the following Component (A) 1 and the following Component (B) 2 covering the same, wherein the following Component (C) is contained in Component (B) 2:(A) a copolymer comprising an epoxy group-containing monomer and an ethylenic unsaturated monomer;(B) a copolymer comprising an unsaturated carboxylic acid and an ethylenic unsaturated monomer; and(C) a low molecular weight monofunctional epoxy compound.

Abstract: There is provided a process for making a gel-containing additive concentrate by mixing a reactive polymer such as SAN and a substantially immiscible carrier polymer such as polycarbonate or polystyrene and reactively extruding the reactive polymer and carrier polymer in the presence of a multi-functional crosslinking agent and catalyst

Abstract: The invention relates to binders for self-crosslinkable varnishes and paints comprising one or a number of hydroxylated and/or carboxylated fluorinated copolymers and one or a number of epoxidized and/or alkoxylated acrylic copolymers.

Abstract: Disclosed is a chloropren rubber adhesive composition. The adhesive composition contains a chloroprene rubber; a tackifier resin; a chlorinated polyolefin; a solvent; and a component which is selected from the group consisting of components (A) and (B). The component (A) is combination of an epoxy resin and a curing agent, and the curing agent is selected from dicyandiamide, imidazole, imidazole derivative, onium compound, ketimine compound represented by the formula (I) or a ketimine derivative. The component (B) is a silane compound having at least two reactive groups, and the reactive group is selected from an epoxy group, a vinyl group, a hydroxy group, an acryloxy group, a methacryloxy group and alkoxy groups.