Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Provided herein are methods of formulating and engineering block copolymer (BCP) systems for directed self-assembly (DSA) processes. In some embodiments, the methods involve engineering a BCP material based on the interaction parameter (?) of the material and the surface and/or interaction energies of its constituent blocks. Also provided are novel block BCP materials that can be used in DSA techniques. In some embodiments, the BCP systems described herein have micro-phase separating blocks, with at least one block including multiple types of repeat units. Also provided are structures formed by DSA, including structures having a sub-20 nm dimension. Applications included nanolithography for semiconductor devices, fabrication of cell-based assays, nanoprinting, photovoltaic cells, and surface-conduction electron-emitter displays.

Abstract: The disclosure relates to a composition having at least one radically polymerisable monomer M; at least one radical former, at least one epoxide resin A including an average of more than one epoxide group per molecule, and at least one compound of formula (I). Such compositions are suitable as adhesives, sealants or coatings. Shortly after the application thereof, they have a high initial strength and, after further hardening at room temperature, they reach a high level of final strength.

Abstract: A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1; and (C) a thermosetting or thermoplastic composition.

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.

Abstract: A method of synthesizing a functionalized polymer represented by the structural formula (I) comprising a step of reacting a polymer represented by structural formula (II) with a compound Nu1-M to nucleophilically substitute moiety X1 with moiety Nu1. Values and preferred values of the variables in formulas (I) and (II) are defined herein.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A method of making a filled resin includes the steps of: Providing a wiped film evaporator with an internal evaporator chamber maintained under vacuum and having an internal chamber wall maintained at an elevated temperature; introducing solvent-borne particles and organic matrix into the internal chamber; and compounding the solvent-borne particles and the organic matrix in the internal evaporator chamber by forming a thin film against the internal chamber wall, the thin film including organic matrix and particles, and the vacuum conditions and elevated temperature being sufficient to remove solvent from the particles and organic matrix to provide the filled resin. Less than about 10% of the particles in the resulting filled resin are agglomerated.

Abstract: The adhesive composition of the invention contains (a) organic fine particles comprising at least one selected from the group consisting of alkyl (meth)acrylate ester-butadiene-styrene copolymer or complexes thereof, alkyl (meth)acrylate ester-silicone copolymer or complexes thereof and silicone-(meth)acrylic acid copolymer or complexes thereof.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.

Abstract: Compositions comprising surface-modified nanocalcite particles dispersed in a curable resin, and to coatings and fibrous composites incorporating such compositions are described. The surface-modifying agents include a binding group ionically associated with the calcite and a compatiblizing segment, compatible with the curable resin. The surface-modifying agent may also include a reactive group capable of reacting with the curable resin. Methods of preparing nanocalcite composites and coating a fibrous composites prepared from such nanocalcite composites are also described.

Abstract: A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), R1 and R2 each represents a hydrogen atom or an alkyl group.

Abstract: [Object] To provide a resin composition with excellent mold releasability and blocking resistance. [Solution] A resin composition containing a 4-methyl-1-pentene polymer includes 0.01 to 10 parts by mass of a 4-methyl-1-pentene polymer (B) per 100 parts by mass of at least one resin (A) selected from the group consisting of thermoplastic resins and thermosetting resins, wherein the 4-methyl-1-pentene polymer (B) has (B1) an intrinsic viscosity [?] of 0.01 or more but less than 0.50 dl/g measured at 135° C. in a decalin solvent.

Abstract: A composition including an epoxy resin having at least a difunctional epoxy resin and at least one cross-linking agent for epoxy resin. The difunctional epoxy resin has a viscosity of from 1000 to 5000 mPa·s. The composition may include a low viscosity diluent for modulating the composition viscosity in an amount not higher than 10% by weight.

Abstract: A process to manufacture a reinforcing element provided with a cured adhesive composition, a reinforcing element provided with a cured adhesive composition, and a rubber article including the reinforcing element. The manufacturing process includes the steps of providing a reinforcing element, treating the reinforcing element with a composition that includes an aqueous dispersion of components, optionally drying the treated reinforcing element, and curing at least two of the components.

Abstract: Toughened curable compositions are described. The curable compositions include a curable resin, surface-modified nanoparticles, and rubber nano-domains. Both core-shell rubber nano-domains, and nano-rubber domains arising from self-assembled block co-polymers are disclosed. Toughened, cured resin compositions, and articles comprising such cured compositions are also discussed.

Abstract: Certain brominated polymers compounds are effective FR additives for combustible organic polymers. These FR additives include: i) a copolymer having styrene and 2,3-dibromopropylmaleimide repeating units; ii) a brominated polyester having aliphatically bound bromine; iii) an allyl ether of a ring-brominated novolac resin; iv) a 3-bromo-2-hydroxypropyl ether of a novolac resin; v) a 2,3-dibromopropyl ether of a cresol novolac resin; and vi) a brominated ROMP polymer or copolymer.

Abstract: Disclosed is a toughened film forming agent for use in a fiber sizing, a finish coating or a binder composition, where the toughened film forming agent includes a film fowling polymer and a toughening agent both dispersed in water. The toughening agent may be core shell polymers, rubber, thermoplastic materials, nanomaterials, nanofibers, including any combination or subset thereof. The film forming polymer may be epoxy resins, polyurethane resins, epoxy-polyurethane resins, polyester resins, epoxy-polyester resins, polyvinylacetate resins, polypropylene resins, including any combination or subset thereof.

Abstract: The present invention has an object to provide a conjugated diene-based polymer, subjected to a vulcanization treatment to make a vulcanized rubber, the vulcanized rubber useful as a material for tire treads excellent in the balance among wet skid characteristics, low hysteresis loss, abrasion resistance, breaking strength and rigidity, and to provide its manufacturing process.

Abstract: A block or graft copolymer including a thermoplastic resin segment and as an aliphatic polyester segment is provided. The copolymer can be used as a compatibilizer for a resin alloy comprising polylactic acid, which can reduce the consumption of petroleum raw materials.

Abstract: This invention relates to compositions useful as adhesives and more particularly to epoxy-based adhesive compositions with improved impact resistance.

Abstract: An adhesive for a circuit material, comprises a blend of a cure system; and a solid epoxy resin and a nitrile rubber functionalized with epoxy-reactive groups, wherein the solid epoxy resin and the nitrile rubber are reacted to form an adduct prior to blending with the cure system. The adhesive has low dendritic growth and improved solder resistance.

Abstract: The present invention relates to gels prepared from novel anionic block copolymers of aromatic vinyl compounds and conjugated dienes. The block copolymers include a high molecular weight linear and/or radial block copolymer component (SBC1 and/or SBC2), and a diblock component (E1). The block copolymer may be combined with tackifying resins, oils and other components to form the gels of the present invention.

Abstract: Disclosed herein is a chemical-resistant and impact-resistant thermoplastic resin composition having excellent hydrolysis resistance. The thermoplastic resin composition comprises (A) about 1 to about 97.9% by weight of an epoxy group-containing vinyl copolymer resin; (B) about 1 to about 97.9% by weight of a rubber modified aromatic vinyl copolymer resin; (C) about 1 to about 97.9% by weight of a polyester resin; and (D) about 0.1 to about 97% by weight of an amorphous cycloaliphatic diol modified polyester.

Abstract: A metal-resin composite molding is composed of a metal portion and a resin portion. The surface of the metal portion has silanol groups, and the synthetic resin contains an adhesive modifier having adhesive functional groups interacting with the silanol groups. The metal portion and resin portion are bonded together through the interaction between the silanol group and adhesive functional group. The method for manufacturing the metal-resin composite molding includes a step of applying silanol groups to the surface of the metal portion, a step of adding an adhesive modifier having adhesive functional groups interacting with the silanol groups to the synthetic resin thereby producing a molding material, and a step of arranging the metal portion as an insert in a mold for resin molding, melting and forming the molding material in the mold into a resin portion, and at the same time bonding the resin portion to the metal portion through the interaction between the silanol groups and adhesive functional groups.

Abstract: A thermoplastic composition comprises a polycarbonate, a polysiloxane-polycarbonate, and a gel-type low gloss additive, wherein the 60° gloss is measured to be less than or equal to 90 GU according to ASTM D2457. The thermoplastic composition has excellent impact strength and color capability. A method of making the thermoplastic composition, and an article comprising the thermoplastic composition are also disclosed.

Abstract: A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.

Abstract: A conductive roller or a conductive belt is composed of a conductive elastomer composition including a polymer composition having a plurality of carbon-to-carbon double bonds and containing not less than 40 mol % of ethylene oxide; an organometallic salt containing a fluoro group or/and a sulfonyl group; and an elastomer having a plurality of carbon-to-carbon double bonds.

Abstract: The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.

Abstract: A polymeric composition comprises a thermosetting resin and a polyolefin resin that cures to a semi-interpenetrating polymer network and is useful for producing plastic shipping and storage containers. The containers exhibit one or more friction surfaces, and can include fire resistance and other properties derived from property enhancing agents.

Abstract: The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living-radical polymerization and has a reactive functional group at a main chain terminus. A flexible epoxy resin composition can be obtained using these compounds. The invention further provides an epoxy resin composition-having an epoxy group at a main chain terminus thereof.

Abstract: A polymeric material with antistatic properties, characterised by comprising a dispersion of ions within a polymeric matrix containing heteroatoms.

Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.

Abstract: A two-part acrylic structural adhesive comprises a first package containing from about 10 to about 90 percent by weight of at least one ethylenic unsaturated methacrylic ester selected from the group consisting of 1) an alkyl mono-, di- or tetra-substituted cyclohexyl methacrylate, wherein the substitutions occur in either the 3, 4, and/or 5 ring positions, and 2) a linear or branched C4–C10 alkyl methacrylate; from about 10 to about 80 percent by weight of a toughener, and an adhesion promoter; and a second package containing a bonding activator, and, optionally, an epoxy resin.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention provides a diene rubber composition having excellent processability and being improved in both the balance between low rolling resistance and wet skid resistance, and strength properties. The composition according to the invention is a diene polymer rubber composition comprising (A) 100 parts by weight of a raw material rubber comprising (A-1) a diene rubbery polymer which is a conjugated diene rubbery polymer or a conjugated diene-styrene rubbery copolymer (1) containing a modified component in an amount exceeding 60 wt. %, which modified component is obtained by reacting an active end of the rubbery polymer with a polyfunctional compound having, in its molecule thereof, at least two epoxy groups, (2) having a molecular weight distribution Mw/Mn of 1.05 to 3.

Abstract: An object of the present invention is to provide a practical compatibilizing agent which makes it possible to convert the resin mixture into a homogeneous resin mixture free from separation and to eliminate defects caused by separation on molding by prevention of the separation between the radical polymerizable unsaturated resin and low profile additive, which could have not been attained by the prior art.

Abstract: Improved amine-terminated polybutadienes (ATPBs) having one or two terminal groups of the formula —CHRNH2 wherein R is C1-C20 alkyl, are prepared by aminating a secondary hydroxyl-terminated polybutadiene having no ether groups. The ATPBs may be hydrogenated or partially hydrogenated, either prior to or after the animation, to saturate or partially saturate the polymers. Preferred ATPBs are of the formula H2NCHR-(polybutadiene)-CHRNH2 wherein R is C1-C20 alkyl. Polyureas, polyurethanes, crosslinked epoxies, polyamides, and other derivatives with improved properties can be prepared from the ATPBs. The resultant derivatives are useful in liquid binders for braking systems, electric potting compositions, coatings, adhesives, sealants, and water proofing membranes, for example.

Abstract: An activatable (e.g., heat expandable) material and articles incorporating the same is disclosed. The material includes an epoxy resin; an epoxy/elastomer hybrid or reaction product; a blowing agent; a curing agent; and optionally, a filler. In preferred embodiments, the material includes aramid fiber, nanoclay or both.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A rubber composition for adhering to steel cords, having excellent heat-resistant adhesion and moist heat-resistant adhesion, as well as initial adhesion, and performance at a level comparable to or higher than that of the related art in resistance to rubber fracture, is made from components (A) and (B), which are blended to 100 weight parts of rubber components containing natural rubber and/or diene synthetic rubber, wherein component (A) is a mixture of a compound containing nickel and a compound containing molybdenum; or a compound containing nickel and molybdenum simultaneously, in a metal-converted amount of 0.01 to 10 weight parts; and component (B) is a mixture of (b1), which is 0.2 to 20 weight parts of hexamethylenetetramine or a melamine derivative, and (b2), which is 0.1 to 10 weight parts of at least one selected from the group consisting of phenol resins, resorcin, resorcin derivatives, and cresol resins.

Abstract: An adhesive for use on metal substrates, and particularly on copper substrates, comprises (a) carboxyl benzotriazole, (b) an epoxy resin having a reactive double bond, (c) a radical curing resin, and (d) a radical initiator. The combination of elements (a) and (b) in a radical curing resin system composed of the elements (c) and (d) provides improved adhesion strength to copper metal compared to compositions containing (c) and (d) without (a) and (b).

Abstract: A thermosetting resin composition that is useful as an epoxy resin-based overcoating agent for flexible circuit boards or for film carriers for the TAB method, and the like, providing basic properties required of general insulation protective films, since the cured coated films are excellent in adhesiveness, electric insulation property, chemical resistance, thermal resistance, and the like, reduced in warp caused by cure shrinkage, and excellent in flexibility.

Abstract: A process for preparing a liquid rubber composition comprises: (a) Forming a reaction mixture of (i) from 1.0 to 99.999 weight percent of the reaction mixture of at least one C1-C20 alkyl acrylate monomer; and (ii) from 0.001 to 20 weight percent of the reaction mixture of at least one aromatic-containing initiator; (b) charging the reaction mixture into a reactor maintained at a reaction temperature of up to 400° C.; and (c) polymerizing said monomer with said aromatic-containing initiator to form a liquid rubber with polymer chains having at least one non-functional aromatic end-group.

Abstract: A polymer comprises polymer chains having a glass transition temperature of less than 25° C. and a weight average molecular weight of less than 20,000 wherein the polymer chains contain at least one non-functional aromatic end-group. The polymer is miscible in the uncured state of said thermoset resins and immiscible in the cured state of the thermoset resins.

Abstract: A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a thermally cured mass. The epoxy composition contains an epoxy resin, a phenolic or amine compound as a chain extender, a basic catalyst and a polymeric toughener. The composition can be formulated in two parts wherein part A contains the catalyst and part B has the epoxy resin.

Abstract: Adducts of epoxides and amine terminated polyolefins are provided. The adducts can be chain extended with suitable polyfunctional agents to increase solubility. The resultant adducts are useful in a variety of applications including sealants, coatings, adhesives, composites, and the like.

Abstract: Adducts of an epoxy resin and an &agr;,{overscore (&ohgr;)} functional heterotelechelic polyolefin are provided. The adducts generally have the formula R—E—R, wherein R is an &agr;,{overscore (&ohgr;)} functional heterotelechelic polyolefin moiety and E is a polyhydroxy moiety produced by the reaction of an epoxy resin with an &agr;,{overscore (&ohgr;)} functional heterotelechelic polyolefin thereby opening the epoxide rings of the epoxy resin. The heterotelechelic polyolefin can be a &agr;-hydroxy, {overscore (&ohgr;)}-thiol functional polyolefin or a &agr;-hydroxy,{overscore (&ohgr;)}-amine functional polyolefin. The resultant adducts are useful in various applications such as coatings, adhesives, sealants, and the like.