Polymer Derived From Ethylenic Reactants Only Derived From Unsaturated Hydrocarbon Patents (Class 525/122)
  • Patent number: 6660805
    Abstract: Epoxy-modified, two-part acrylic structural adhesives are disclosed. These adhesives are not inhibited by oxygen. Representative embodiments include 2-part acrylic structural adhesives comprising, in a first package from about 10 to about 90 percent by weight of at least one methacrylate selected from C3-C10 alkyl monosubstituted-, C1-C6 alkyl disubstituted-, C1-C4 alkyl tri-substituted, and F1-C4 alkyl tetra-substituted cyclohexyl methacrylate. The ring substituents are prefereably in the 3, 4, and/or 5 ring position, and linear or branched C4-C10 branched alkyl methacrylates; from about 10 to about 80 percent by weight of a toughener, and an adhesion promotor; and in a second package, a bonding activator, and optional epoxy resin.
    Type: Grant
    Filed: May 16, 2002
    Date of Patent: December 9, 2003
    Assignee: Lord Corporation
    Inventors: Robin F. Righettini, Jeffrey A. Hatcher
  • Publication number: 20030214073
    Abstract: A hardener for an epoxy resin includes an accelerator having a tetraalkylphosphonium salt.
    Type: Application
    Filed: April 30, 2003
    Publication date: November 20, 2003
    Inventors: Klaus Hohn, Wilhelm Hekele
  • Patent number: 6645341
    Abstract: A two-component epoxy-based adhesive comprising a resin component and a curing agent. The resin component comprises an epoxy resin, a polymer polyol, and fumed silica. The curing agent comprises a polyoxyalkyleneamine, an amine terminated butadiene-acrylonitrile polymer, tris(2,4,6-dimethlaminomethyl)phenol, polyamide resin, silane and fumed silica. The adhesive composition is particular useful for bonding of metals, plastics and composites and for functions such as laminating, honeycomb bonding, automotive assembly and construction assembly.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: November 11, 2003
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Terry Gordon
  • Publication number: 20030125464
    Abstract: The present invention provides a composition comprising as essential ingredients (A) 80 to 95 wt % of a noncrystalline cyclic polyolefin and (B) 20 to 5 wt % of an epoxidized diene-based block copolymer. The composition gives a noncrystalline cyclic polyolefin-based sheet which has a degree of heat distortion ratio of 5% or lower at a thermal welding temperature of 95 to 160° C. The sheet is excellent in moldability, dimensional stability, and strength in welding bonding and is excellent also in impact resistance, flexural resistance, and processability for embossing.
    Type: Application
    Filed: November 5, 2002
    Publication date: July 3, 2003
    Inventor: Akihiro Yabui
  • Patent number: 6555622
    Abstract: A composition comprises (A) an exopy resin and (B) a vinyl polymer having a reactive functional group selected from the group consisting of an alcoholic hydroxyl, phenolic hydroxyl, amino, amido and carboxyl group prepared by living radical polymerization, particularly the atom transfer radical polymerization of a vinyl polymer having a halogen atom and conversion of the halogen atom to a reactive functional group.
    Type: Grant
    Filed: April 20, 2001
    Date of Patent: April 29, 2003
    Assignee: Kaneka Corporation
    Inventors: Kenichi Kitano, Yoshiki Nakagawa, Masayuki Fujita
  • Patent number: 6555618
    Abstract: An object of the present invention is to provide a practical compatibilizing agent which makes it possible to convert the resin mixture into a homogeneous resin mixture free from separation and to eliminate defects caused by separation on molding by prevention of the separation between the radical polymerizable unsaturated resin and low profile additive, which could have not been attained by the prior art.
    Type: Grant
    Filed: October 31, 2000
    Date of Patent: April 29, 2003
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Akira Takano, Takashi Yasumura
  • Patent number: 6521706
    Abstract: The present invention provides curable coating compositions including: (a) about 55 to about 99 weight percent of an epoxy-functional polymer containing at least two epoxide groups per molecule; (b) about 1 to about 45 weight percent of a thermoplastic polymer effective to reduce shrinkage of the curable composition upon curing and which is substantially insoluble in the epoxy-functional polymer; (c) about 1 to about 70 weight percent of ground vulcanized rubber particles having an average particle size ranging from about 1 to about 300 microns; (d) a curing agent adapted to cure the epoxy-functional polymer; and, optionally, vinyl chloride polymer.
    Type: Grant
    Filed: January 8, 1999
    Date of Patent: February 18, 2003
    Assignee: PPG Industries ohio, Inc.
    Inventors: Umesh C. Desai, Anthony C. Palermo
  • Publication number: 20030032746
    Abstract: Hetero-telechelic polymers having the formula:
    Type: Application
    Filed: June 21, 2002
    Publication date: February 13, 2003
    Inventors: James A. Schwindeman, Robert J. Letchford, Conrad W. Kamienski, Roderic P. Quirk
  • Patent number: 6498218
    Abstract: An interpenetrating polymer network (IPN) or semi-interpenetrating polymer network (semi-IPN) comprises a first phase which is continuous and comprises a flexible polymer and a second phase which is a fluorescent or nonfluorescent durable dispersed or continuous phase and comprises a dye and a polymer, wherein the polymer enhances durability of the dye. Such networks are particularly useful in fluorescent traffic signs or safety devices or in pavement marking tape or paint.
    Type: Grant
    Filed: March 11, 2002
    Date of Patent: December 24, 2002
    Inventors: Denise A. Barrera, Roberta E. Harelstad, William D. Joseph, Lee A. Pavelka
  • Patent number: 6492462
    Abstract: The rheological properties of a crosslinkable resin system are modified by the presence of a side chain crystalline (SCC) polymer (or a similar crystalline polymer which melts over a narrow temperature range). The polymer dissolves in the curable system at temperatures above the melting point of the crystalline polymer (Tp), but when the system is then cooled to a temperature below Tp, at least partially forms a separate phase in the curable system. Below Tp, this separate phase substantially increases the viscosity of the curable system (i.e. makes it thicker than the same system without the crystalline polymer). This is particularly valuable for sheet molding composites (SMCs) in which the increase in viscosity makes the composites less tacky, and for dry film resists (DFRs). Above Tp, the curable system containing the dissolved crystalline polymer has a viscosity which is substantially less than its viscosity below Tp.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: December 10, 2002
    Assignee: Landec Corporation
    Inventors: Steven P. Bitler, David D. Taft, Ray F. Stewart
  • Patent number: 6489380
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: April 27, 2000
    Date of Patent: December 3, 2002
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 6486256
    Abstract: A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: November 26, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Kent S. Tarbutton, Janis Robins
  • Patent number: 6482530
    Abstract: An adhesive resin composition comprising: (A) At least one component selected from the group consisting of (i) polyolefins having a melt flow rate of 0.1 to 30 g/10 min and (ii) olefinic polymers having at least one functional group capable of reacting with an epoxy group; and (B) an epoxy compound having at least two epoxy groups in the molecule and having a number average molecular weight of 3000 or less, wherein the ratio of the component (B) to the total weight of the components (A) and (B) is 0.01 to 5% by weight, and a laminate of (a) a layer composed of the above-mentioned adhesive resin composition and a substrate contacted therewith.
    Type: Grant
    Filed: January 11, 2001
    Date of Patent: November 19, 2002
    Assignee: Showa Denko K.K.
    Inventors: Koichi Ito, Hiroshi Kasahara, Satoshi Maruyama, Masahiro Ueno, Naoki Minorikawa
  • Patent number: 6476133
    Abstract: A process for preparing a solution of high molecular weight polymers of conjugated dienes in a vinylaromatic hydrocarbon by anionic polymerization of the diene in the presence of an alkyllithium as catalyst and a process for preparing impact-modified polymers of vinylaromatic compounds is described. The first process comprises firstly polymerizing the diene in solution in an aromatic hydrocarbon which is free of ethylenic double bonds to a molecular weight below about 105, then adding a trialkylaluminum in a molar excess relative to the alkyllithium, diluting the solution obtained with the vinylaromatic compound and then coupling the polydiene with a polyepoxide or an alkyl (meth)acrylate to give a high molecular weight polymer. The solution obtained in this way is further processed to give an impact-modified polymer of a vinylaromatic hydrocarbon by polymerizing the solution prepared as described, if desired after addition of further amounts of a vinylaromatic compound, in a manner known per se.
    Type: Grant
    Filed: September 11, 2001
    Date of Patent: November 5, 2002
    Assignee: BASF Aktiengesellschaft
    Inventors: Stephan Jüngling, Hermann Gausepohl, Volker Warzelhan
  • Patent number: 6417272
    Abstract: A process is disclosed for manufacturing coupled radial block copolymers of the S—B—Li type having improved optical properties, which process utilizes coupling agents having from about 3 to about 7 epoxy groups per mole.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: July 9, 2002
    Assignee: Fina Research, S.A.
    Inventors: Emmanuel Lanza, Jean Naveau
  • Patent number: 6395844
    Abstract: An interpenetrating polymer network (IPN) or semi-interpenetrating polymer network (semi-IPN) comprises a first phase which is continuous and comprises a flexible polymer and a second phase which is a fluorescent or nonfluorescent durable dispersed or continuous phase and comprises a dye and a polymer, wherein the polymer enhances durability of the dye. Such networks are particularly useful in fluorescent traffic signs or safety devices or in pavement marking tape or paint.
    Type: Grant
    Filed: September 1, 1999
    Date of Patent: May 28, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Denise A. Barrera, Roberta E. Harelstad, William D. Joseph, Lee A. Pavelka
  • Publication number: 20020052003
    Abstract: One aspect of the present invention relates to compounds, comprising at least two moieties selected from the group consisting of aryl sulfonates and aryl sulfates. A second aspect of the present invention relates to combinatorial libraries of the aforementioned compounds. The present invention also relates to compositions comprising a compound of the present invention. A fourth aspect of the present invention relates to the use of a compound or composition of the present invention in a method for inhibiting bioadhesion to a surface. Another aspect of the present invention relates to the use of a compound or composition of the present invention in a method for enhancing bioadhesion to a surface.
    Type: Application
    Filed: April 3, 2001
    Publication date: May 2, 2002
    Inventors: Randall S. Alberte, Robert D. Smith
  • Patent number: 6322848
    Abstract: A flexible encapsulating material resulting from a mixture that includes at least one epoxy novolak resin and at least two other epoxy compounds wherein the material has a percent hardness change of less than 20% after thermal aging of 504 hours at 140° C. The epoxy novolak resin preferably has less than 3 epoxy groups per molecule. A further embodiment is an electronic component encapsulated with a flexible material resulting from combining a two part system wherein a first part includes an epoxy novolak resin and at least two other epoxy resins and the second part includes at least one amine. An additional embodiment is a method for flexibly encapsulating an electronic component comprising applying to the component a mixture comprising an epoxy novolak resin having less than 3 epoxy groups per molecule and at least one other epoxy compound.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: November 27, 2001
    Assignee: Lord Corporation
    Inventors: Michael T. Phenis, Manny Tavares
  • Patent number: 6312621
    Abstract: A via fill formulation including electrically and/or thermally conductive particulate filler, or non-conductive, electrically conductive polymer and a resin vehicle.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: November 6, 2001
    Assignee: Johnson Matthey Electronics, Inc.
    Inventors: Jesse L. Pedigo, Nancy E. Iwamoto, Alan Grieve, Xiao-Qi Zhou
  • Patent number: 6302951
    Abstract: A paint protecting and reactivating composition comprising a main ingredient selected from: a dicyclopentadiene polymer, soy oil, sunflower oil or corn oil; an organic solvent; alkanoates of cobalt, magnesium, and zirconium; a chelating agent; an epoxy resin; a hindered amine; and a nitrogen heterocyclic compound.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: October 16, 2001
    Inventors: Lynn B. Odland, Marilyn K. Odland
  • Publication number: 20010007000
    Abstract: A process for preparing blends of syndiotactic 1,2-polybutadiene and rubbery elastomers comprising the steps of (1) providing a mixture of high cis-1,4-polybutadiene rubber cement and 1,3-butadiene monomer, and (2) combining (a) an iron-containing compound, (b) a hydrogen phosphite, and (c) an organoaluminum compound to form a catalyst composition outside the presence of the mixture of rubber cement and monomer, and (3) adding the catalyst composition to the mixture and thereby polymerizing the 1,3-butadiene monomer into syndiotactic 1,2-polybutadiene within the rubber cement.
    Type: Application
    Filed: January 23, 2001
    Publication date: July 5, 2001
    Inventor: Steven Luo
  • Patent number: 6255391
    Abstract: A material for producing a building material or a shaped article, wherein said material comprises a melt-mixture of thermoplastic material and rubber material.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: July 3, 2001
    Assignee: Netro-Products GmbH & Co. KG
    Inventor: Rolf Henrich
  • Patent number: 6197891
    Abstract: A process for the preparation of hydrocarbon solutions of monofunctional ether initiators of the following general structure: M—Qn—Z—O—[A(R1R2R3)] wherein M is an alkali metal selected from the group consisting of lithium, sodium and potassium; Q is a saturated or unsaturated hydrocarbyl group derived by incorporation of a compound selected from the group consisting of conjugated diene hydrocarbons, alkenylsubstituted aromatic hydrocarbons, and mixtures thereof into the M—Z linkage; Z is a branched or straight chain hydrocarbon group which contains 3-25 carbon atoms, optionally containing aryl or substituted aryl groups; A is an element selected from carbon and silicon; R1, R2, and R3 are independently selected from hydrogen, alkyl, substituted alkyl groups containing lower alkyl, lower alkylthio, and lower dialkylamino groups, aryl or substituted aryl groups containing lower alkyl, lower alkylthio, and lower dialkylamino groups, and n is an integer from 1 to 5, monof
    Type: Grant
    Filed: September 26, 1996
    Date of Patent: March 6, 2001
    Assignee: FMC Corporation
    Inventors: James Anthony Schwindeman, Eric John Granger, Robert Charles Morrison, Conrad William Kamienski, Robert James Letchford
  • Patent number: 6197888
    Abstract: Blends of syndiotactic 1,2-polybutadiene and rubbery elastomers are prepared by a process that comprises polymerizing 1,3-butadiene monomer into syndiotactic 1,2-polybutadiene within a rubber cement of at least one rubbery elastomer by using an iron-based catalyst composition that is formed by combining an iron-containing compound, a hydrogen phosphite, and an organoaluminum compound.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: March 6, 2001
    Assignee: Bridgestone Corporation
    Inventor: Steven Luo
  • Patent number: 6197898
    Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.
    Type: Grant
    Filed: November 18, 1997
    Date of Patent: March 6, 2001
    Assignee: General Electric Company
    Inventors: Eduard Aarts van den Berg, Christian Maria Emile Bailly, Johannes Everardus Fortuyn, Marinus Cornelis Adriaan van der Ree, Robert Walter Venderbosch, Frits Jan Viersen, Gerrit de Wit, Hua Wang, Sadhan C. Jana, Andrew Jay Salem, Joel Matthew Caraher
  • Patent number: 6160054
    Abstract: Hetero-telechelic polymers having the formula:FG--(Q).sub.d --Z--J--[A(R.sup.1 R.sup.2 R.sup.3)].sub.x (I)wherein FG is a protected or non-protected functional group; Q is a saturated or unsaturated hydrocarbyl group derived by incorporation of a compound selected from the group consisting of conjugated diene hydrocarbons, alkenylsubstituted aromatic hydrocarbons, and mixtures thereof; d is an integer from 10 to 200; Z is a branched or straight chain hydrocarbon group which contains 3-25 carbon atoms, optionally containing aryl or substituted aryl groups; J is oxygen, sulfur, or nitrogen; [A(R.sup.1 R.sup.2 R.sup.3)].sub.x is a protecting group, wherein A is an element selected from Group IVa of the Periodic Table of Elements; R.sup.1, R.sup.2, and R.sup.
    Type: Grant
    Filed: July 18, 1996
    Date of Patent: December 12, 2000
    Assignee: FMC Corporation
    Inventors: James A. Schwindeman, Robert J. Letchford, Conrad W. Kamienski, Roderic P. Quirk
  • Patent number: 6153695
    Abstract: A process is disclosed for manufacturing coupled radial block copolymers of the S-B-Li type having improved optical properties, which process utilizes coupling agents having from about 3 to about 7 epoxy groups per mole.
    Type: Grant
    Filed: April 7, 1999
    Date of Patent: November 28, 2000
    Assignee: Fina Research, S.A.
    Inventors: Emmanuel Lanza, Jean Naveau
  • Patent number: 6075092
    Abstract: The invention provides a rubber composition comprising 100 parts by weight of a diene rubber (i) and 0.1 to 25 parts by weight of a polyether-based polymer (ii).
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: June 13, 2000
    Assignee: Nippon Zeon Co., Ltd.
    Inventors: Masao Nakamura, Yukio Takagishi, Katsumi Inagaki
  • Patent number: 6057402
    Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: May 2, 2000
    Assignee: Johnson Matthey, Inc.
    Inventors: Xiao-Qi Zhou, Henry Wevick, Nancy E. Iwamoto, Shao Wei Li, Alan Grieve
  • Patent number: 6037411
    Abstract: This invention provides an acoustic vibrational material containing various fibers as the reinforcement material and having the epoxy resin as the matrix resin, wherein the epoxy resin is modified by a polybutadiene base elastomer containing not less than 90 mole percent of 1,2-linked units. The epoxy resin modified with the above polybutadiene elastomer exhibits a maximum value of loss coefficient at the temperature region near the room temperature. Thus compatibility between large internal loss and high elastic modulus is achieved.
    Type: Grant
    Filed: May 26, 1995
    Date of Patent: March 14, 2000
    Assignees: Sony Corporation, Mitsui Petrochemical Industries
    Inventors: Kunihiko Tokura, Masaru Uryu, Seiji Matsuura
  • Patent number: 6037048
    Abstract: Fibers having increased strength and small diameters can be produced from compositions comprising long chain branched syndiotactic vinyl aromatic polymers. Due to the increased fiber strength, less strand breakage occurs during processing which increases process productivity and yield.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: March 14, 2000
    Assignee: The Dow Chemical Company
    Inventors: Curtis E. Peterson, Roel H. Vossen, Yi-Bin Huang, Paul J. Moses, Jr.
  • Patent number: 6001936
    Abstract: An interpenetrating polymer network (IPN) or semi-interpenetrating polymer network (semi-IPN) comprises a first phase which is continuous and comprises a flexible polymer and a second phase which is a fluorescent or nonfluorescent durable dispersed or continuous phase and comprises a dye and a polymer, wherein the polymer enhances durability of the dye. Such networks are particularly useful in fluorescent traffic signs or safety devices or in pavement marking tape or paint.
    Type: Grant
    Filed: October 24, 1997
    Date of Patent: December 14, 1999
    Assignee: 3M Innovative Properties Company
    Inventors: Denise A. Barrera, Roberta E. Harelstad, William D. Joseph, Lee A. Pavelka
  • Patent number: 5965682
    Abstract: Fibers having increased strength and small diameters can be produced from compositions comprising long chain branched syndiotactic vinyl aromatic polymers derived from the polymerization of a vinyl aromatic monomer in the presence of from 10 to 1000 ppm, based on the amount of vinyl aromatic monomer, of a multifunctional monomer having more than one olefinic functionality. Due to the increased fiber strength, less strand breakage occurs during processing which increases process productivity and yield.
    Type: Grant
    Filed: March 10, 1998
    Date of Patent: October 12, 1999
    Assignee: The Dow Chemical Company
    Inventors: Curtis E. Peterson, Yi-Bin Huang, Roel H. Vossen, Paul J. Moses, Jr.
  • Patent number: 5940570
    Abstract: A method for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks with a room-temperature curable composition comprising:(1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more;(2) an epoxy-functional compound having an epoxy functionality of 2 or more; and(3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds.
    Type: Grant
    Filed: August 8, 1997
    Date of Patent: August 17, 1999
    Assignee: Uniroyal Chemical Company, Inc.
    Inventors: William Davis Sigworth, Thomas Harald Peter
  • Patent number: 5849818
    Abstract: Solid organic polymers, for example, rubber and plastic particles, which may include coated papers, to especially include as recovered from recycle streams, can be made to have a sulfonated outer layer by treatment with a reactant gas containing sulfur trioxide. A silo apparatus can be employed to make these sulfonated particles, wherein untreated particles fall through the silo which is provided with a reactant gas supply. The sulfonated particles may optionally be neutralized, for example, with moist ammonia. These sulfonated particles can be used in articles of manufacture such as aggregates in cements, organic resins, cellulosics, and so forth, with beneficial properties being imparted to the composite. When used in a Portland cement, for example, increased performance concrete can result. Also, sulfonated sheets may be correspondingly employed for the sulfonated particles.
    Type: Grant
    Filed: June 3, 1993
    Date of Patent: December 15, 1998
    Inventors: Wilhelm E. Walles, Luis C. Mulford
  • Patent number: 5792814
    Abstract: There are herein disclosed a method for preparing a modified resin which comprises thermal/reaction by the use of a norbornenyl group-containing compound typified by norbornenecarboguanamine or its derivative, a method for preparing an epoxy-modified resin which comprises the step of reacting the above-mentioned modified resin and an epoxide, a flame-retarding method, a thermal stabilization method, a compatibilizing method and a surface modification method which comprise utilizing the modified resin, as well as a coating resin composition and an adhesive resin composition containing the modified resin.According to the preparation methods of the present invention, the deterioration of a material scarcely occurs, and a functional group which is excellent in flame retardancy, thermal stability, compatibility and the like can be introduced to the resins.
    Type: Grant
    Filed: August 5, 1997
    Date of Patent: August 11, 1998
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Tetsuya Oishi, Kazuo Sugazaki, Jin Suzuki
  • Patent number: 5728779
    Abstract: A binder composition for thermosetting powder paints comprising (i) a polymer that is capable of reacting with epoxy groups and (ii) a crosslinker that contains epoxy groups, wherein the crosslinker comprises at least one C.sub.5 to C.sub.26 linear or branched aliphatic chain with the proviso that epoxy groups are carried on at least one aliphatic chain. In order to function as a crosslinker the amount of oxirane-oxygen originating from the crosslinker in the binder composition is higher than 0.1 meq/gram. The crosslinker is, for example, an epoxydized oil, a modified epoxydized oil or an epoxydized alkyd resin. A powder paint comprising the binder composition can contain a suitable catalyst and, optionally, an additional curing agent.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: March 17, 1998
    Assignee: DSM N.V.
    Inventors: Adrianus J. van de Werff, Leendert J. Molhoek, Marten Houweling, Robert van den Berg Jeths, Dirk A. W. Stanssens, Robert van der Linde, Tosko A. Misev
  • Patent number: 5703198
    Abstract: The invention relates to a radiation curable binder composition for powder paint formulations. The binder composition comprisesa) a polymer having a degree of unsaturation between 300 and 1800 grams per mole of unsaturated group (WPU), having a molecular weight Mn between 800 and 6800 and a viscosity between 1 dPas and 800 dPas andb) a crosslinking agent having vinyl ether, vinyl ester or (meth)acrylate functional groups.The polymer is an unsaturated polyester and/or an unsaturated polyacrylate.The binder composition can be used in the preparation of powder paint formulations which can be applied to heat-sensitive substrates such as wood and plastic and which can be cured with UV or electron beam radiation.
    Type: Grant
    Filed: July 24, 1995
    Date of Patent: December 30, 1997
    Assignee: DSM N.V.
    Inventors: Freddy Twigt, Robert Van Der Linde
  • Patent number: 5698631
    Abstract: A room-temperature curable composition useful for encapsulating transmission signal devices, comprising:(1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more;(2) an epoxy-functional compound having an epoxy functionality of 2 or more; and(3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds. The composition is useful for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks.
    Type: Grant
    Filed: May 30, 1996
    Date of Patent: December 16, 1997
    Assignee: Uniroyal Chemical Company, Inc.
    Inventors: William Davis Sigworth, Thomas Harald Peter
  • Patent number: 5663220
    Abstract: This invention provides an acoustic vibrational material containing various fibers as the reinforcement material and having the epoxy resin as the matrix resin, wherein the epoxy resin is modified by a polybutadiene base elastomer containing not less than 90 mole percent of 1,2-linked units. The epoxy resin modified with the above polybutadiene elastomer exhibits a maximum value of loss coefficient at the temperature region near the room temperature. This region is much higher than that of the conventional epoxy resin modified with polybutadiene elastomer mainly including 1,4-linked unit. Decrease in elastic modulus of the epoxy resin with increase of temperature is lesser in the epoxy resin of the present invention, whereas larger in the conventional one. Thus compatibility between large internal loss and high elastic modulus is achieved.
    Type: Grant
    Filed: June 23, 1992
    Date of Patent: September 2, 1997
    Assignee: Sony Corporation
    Inventors: Kunihiko Tokura, Masaru Uryu, Seiji Matsuura
  • Patent number: 5654081
    Abstract: In a method of producing an integrated circuit assembly, an IC device is metallurgically bonded to a supporting substrate. The mounting of the IC device to the substrate also includes a polymeric underfill body adhesively bonding the IC device to the substrate. The polymeric underfill body is formed of a curable underfill composition comprising epoxy resin, anhydride curing agent for the epoxy resin, amine catalyst and a minor amount of an additional component selected from alkyl-substituted imidazole and phenyl-substituted imidazole. Such additional component may act as a catalyst, as used with an amine catalyst known catalyst for the polymerization reaction of the epoxy resin with the anhydride curing agent, may act as a co-catalyst. The polymeric underfill body has improved glass transition temperature values and improved coefficient of thermal expansion values to provide good thermal stress cycling life for the integrated circuit assembly.
    Type: Grant
    Filed: July 5, 1995
    Date of Patent: August 5, 1997
    Assignee: Ford Motor Company
    Inventor: Michael G. Todd
  • Patent number: 5635562
    Abstract: The present invention relates to relatively inexpensive multi-purpose expandable vibration damping material compositions particularly useful in constrained layer applications. The composition essentially includes an elastomeric polymer, plasticizer, thermoplastic polymer, foaming agent, adhesion promoters and filler. In addition to the aforementioned, under certain embodiments, the expandable vibration damping material compositions may also employ rheological modifiers such as cross-linking agents and epoxy curing agents.
    Type: Grant
    Filed: April 26, 1995
    Date of Patent: June 3, 1997
    Assignee: Lear Corporation
    Inventor: Collin C. Malcolm
  • Patent number: 5539064
    Abstract: A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: July 23, 1996
    Assignee: Goo Chemical Industries Co., Ltd.
    Inventors: Soichi Hashimoto, Satoshi Miyayama, Toshiaki Nishimura, Toshikazu Oda
  • Patent number: 5504151
    Abstract: This invention is the polycapped oligomer adduct of a long chain fatty acid with a multi hydroxy functional or multi epoxy functional compound. This polycapped oligomer is useful in resin compositions to enhance the performance of thermoplastic low profile additives which improve the surface quality of molded composites such as automotive body panels.
    Type: Grant
    Filed: November 8, 1994
    Date of Patent: April 2, 1996
    Assignee: Ashland Inc.
    Inventors: Dennis H. Fisher, Timothy A. Tufts, C. Timothy Moss
  • Patent number: 5494729
    Abstract: A substantially non-slip, non-abrasive surface which includes a layer of a coating vehicle comprising a polysulfide mixed with a plurality of solid elastomer particles. The particles are preferably at least partially embedded in the coating composition to provide a surface which maintains tractional sufficiency in wet and dry environments such as swimming pools and related areas.
    Type: Grant
    Filed: May 4, 1993
    Date of Patent: February 27, 1996
    Assignee: Impact Coatings, Inc.
    Inventors: Jeffery W. Henry, Blair C. McCaw
  • Patent number: 5476884
    Abstract: Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.
    Type: Grant
    Filed: September 28, 1994
    Date of Patent: December 19, 1995
    Assignee: Toray Industries, Inc.
    Inventors: Keiji Kayaba, Yasushi Sawamura, Masayuki Tanaka
  • Patent number: 5464902
    Abstract: Relatively brittle epoxy resin systems which may be employed as structural film adhesives and matrix resins for fiber-reinforced prepregs are toughened against impact-induced damage by the addition of minor quantities of functionalized elastomer particles having a glass transition temperature of less than 10.degree. C.
    Type: Grant
    Filed: February 4, 1994
    Date of Patent: November 7, 1995
    Assignee: Cytec Technology Corp.
    Inventor: Hans G. Recker
  • Patent number: 5461116
    Abstract: A core functionalized star block copolymer formed of a vinyl aromatic hydrocarbon and/or a conjugated diene and a polyalkenyl aromatic coupling agent wherein the core functionalization is provided by reaction of the star polymer core with an asymmetric bi- or polyfunctional capping agent.
    Type: Grant
    Filed: November 10, 1994
    Date of Patent: October 24, 1995
    Assignee: Shell Oil Company
    Inventors: Ronald J. Hoxmeier, Bridge A. Spence, Jeffrey G. Southwick
  • Patent number: 5447976
    Abstract: An elastic composite is provided having natural rubber and epoxidized natural rubber components. Compared to known composites, the present composition achieves reduced oil swell and absorption, lower permanent set, lower modulus of elasticity, and high tear strength. When formed in a tape, the composition is extremely useful for legbands, straps and contours of swimwear and other garments.
    Type: Grant
    Filed: July 25, 1994
    Date of Patent: September 5, 1995
    Assignee: The Moore Company
    Inventors: Patrick J. Curtin, Timothy M. Lipinski, William E. Russell
  • Patent number: 5432234
    Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.
    Type: Grant
    Filed: August 2, 1994
    Date of Patent: July 11, 1995
    Assignee: Nippon Oil Co., Ltd.
    Inventors: Masami Enomoto, Hitoshi Yuasa, Fumiaki Oshimi, Yutaka Otsuki