Abstract: An unsaturated polyester resin composition is described that contains an amine-terminated flexible polymer that can react with the unsaturation in the polyester. A compatible system results that has higher fracture toughness. The preferred amine-terminated flexible polymer is an amine-terminated poly(butadiene-co-acrylonitrile). The resin composition can be extended with fillers and reinforced with fibers. In these applications, the resin is known as a matrix resin.

Abstract: A novel hydroxyphenylated resin having excellent thermal stability, weather resistance, and electrical properties useful as a resin for a printed circuit board, a resin for sealing a semiconductor, an insulating materials, and the like; a process for preparing the resin; and curable epoxy composition comprising the same. Specifically, the present invention provides a novel resin containing a number of phenolic hydroxyl groups and having a high softening point and substantially no double bonds; and a process for preparing the same wherein a butadiene oligomer and a phenol compound are used as starting materials; and a curable epoxy resin composition comprising the same suitable for applications such as a sealing material.

Abstract: A unsaturated polyester resin composition is described that contains an epoxy resin reacted with an amine-terminated flexible polymer while dissolved in the unsaturated polyester resin and its ethylenically unsaturated crosslinking monomer. A compatible system results from the reaction which has a controllable modulus based on the amount of flexible polymer included in the resin. The resin is generally transparent if unfilled and has a higher calculated fracture energy than similar unsaturated polyester resin without modification. The unsaturated polyester resin can be filled with particulate filler or reinforced with fibrous fillers.

Abstract: Disclosed herein is an adhesive composition comprising (A) 100 parts by weight of at least one rubber component selected from the group consisting of unsaturated nitrile-conjugated diene copolymer rubbers prepared by an aqueous suspension polymerization, containing 10-45 wt. % of unsaturated nitrile units in their polymer chains and having a Mooney viscosity (ML.sub.1+4, 100.degree. C.) of 30-100, and hydrogenated unsaturated nitrile-conjugated diene copolymer rubbers obtained by hydrogenating at least part of carbon-carbon double bonds in each of the unsaturated nitrile-conjugated diene copolymer rubbers, and (B) 50-500 parts by weight of at least one thermosetting resin selected from the group consisting of phenolic resins and epoxy resins.

Abstract: A flame-retardant thermoplastic resin composition is disclosed, comprising (A) a thermoplastic resin and (B-1) a halogenated epoxy resin whose epoxy groups are blocked by a long chain aliphatic carboxylic acid or (B-2) a mixture prepared by melt mixing (b1) a halogenated epoxy resin or (b2) a halogenated epoxy resin whose epoxy groups are blocked with (b3) a long chain aliphatic carboxylic acid. The composition has easy release from mold and satisfactory thermal stability during molding.

Abstract: A process is provided for producing improved color acrylonitrile polymer gels involving compounding a composition of an acrylonitrile polymer with an electrophilic reagent to produce acrylonitrile polymer gels, and admixing water with the gels to reduce the yellowness thereof. Improved color, reduced gloss polycarbonate/graft polymer blends are provided by compounding the resultant gels with polycarbonate, a styrene-acrylonitrile copolymer and ABS graft polymer to form reduced gloss PC/ABS/SAN composition. The process provides acrylonitrile gels and reduced gloss compositions exhibiting improved levels of color. The blend compositions are useful as molding resins and the gelled acrylonitrile polymer is useful as a gloss reducing additive.

Abstract: A compatible polymer blend comprising: a curable aromatic epoxy resin, an epoxidized polydiene polymer, and an anhydride or polycarboxylic acid curing agent. The invention also relates to structural adhesive compositions comprising cured compatible polymer blends as described.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.

Abstract: Thermoplastic elastomer compositions comprise a blend of polyester resin and a covalently-crosslinked acrylate rubber. Such compositions can be prepared by dynamic vulcanization of the rubber in admixture with the polyester and can exhibit high temperature dimensional stability and low oil swell.

Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.

Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

Abstract: A unsaturated polyester resin composition is described that contains an epoxy resin reacted with an amine-terminated flexible polymer while dissolved in the unsaturated polyester resin and its ethylenically unsaturated crosslinking monomer. A compatible system results from the reaction which has a controllable modulus based on the amount of flexible polymer included in the resin. The resin is generally transparent if unfilled and has a higher calculated fracture energy than similar unsaturated polyester resin without modification. The unsaturated polyester resin can be filled with particulate filler or reinforced with fibrous fillers.

Abstract: The present invention provides:(1) a polyarylenesulfide resin composition comprising 60 to 99 wt. % of polyarylenesulfide and 40 to 1 wt. % of acrylonitrile-butadiene rubber which has been hydrogenated to the extent that the unsaturation degree is not more than 7 mol % (First Composition);( (2) a polyarylenesulfide resin composition comprising 100 parts by weight of the First Composition and 0.05 to 5 parts by weight of an epoxy resin (Second Composition);(3) a polyarylenesulfide resin composition comprising 100 parts by weight of the First Composition and 5 to 200 parts by weight of a fibrous reinforcing material and/or an inorganic filler (Third Composition); and(4) a polyarylenesulfide resin composition comprising 100 parts by weight of the Second Composition and 5 to 200 parts by weight of a fibrous reinforcing material and/or an inorganic filler (Fourth Composition).

Abstract: Lubricant systems are provided in which a polyolefin or polyolefin/polytetrafluoroethylene blend functions as a lubricant in a polymer matrix material. The resulting polymer composites containing about 1 to 30 weight percent of the novel lubricant or lubricant blend have greatly improved friction and wear properties, including lower coefficients of friction and increased surface wear resistence. The polyolefin does not remain as discrete, identifiable particles after mixing with the polymer matrix, and has an average molecular weight of less than 500,000.

Abstract: The invention deals with a processing aid for polymeric compositions. The processing aid is a terpolymer comprising 10-49% by weight of a vinyl aromatic monomer like styrene, 5-35% by weight of an acrylic nitrile, like acrylonitrile and 21-60% by weight of an alkylacrylate or alkylmethacrylate with a viscosity number of more than four as measured in dimethylformamide at 30.degree. C. at a concentration of 100 mg terpolymer per 100 ml dimethylformamide.

Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120, the ratio by weight of the hydrogenated conjugated diene polymer rubber to the epoxy resin in the adhesive being 35-75 weight % to 65-25 weight %.

Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120.

Abstract: The invention is directed to a process for preparing a sealant and adhesive useful, e.g., in double glazing systems. The sealant comprises 20-80 weight percent epoxidized natural rubber, 5-30 weight percent of at least one further epoxy compound, and, as a crosslinking agent, a polyamine or polymercaptan carrying trialkoxysilyl groups. The crosslinking agent is incorporated into the epoxidized natural rubber in one step.

Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.

Abstract: A process for preparing a modified resin and an epoxy resin composition for use in semiconductor encapsulation which comprises providing a quantity of epoxy resins, synthetic rubber compounds, and hydroxy modified polysiloxanes, reacting the epoxy resins with the synthetic rubber compounds, and reacting the resultant product of the initial reaction with the hydroxy modified polysiloxanes, the epoxy resin composition comprising 0.1-10% by weight of the modified resin, epoxy resin, curing agent, catalyst, releasing agent, coupling agent, and fibers.

Abstract: A method and composition for providing a polymeric membrane in situ for isolating vessels which hold hazardous liquid materials. A liquid polymer composition is applied to at least one of the surfaces defining the area which is to hold the liquid hazardous material. Upon cure, a seamless bladder-like membrane is formed which adheres to the surface, and which can be removed by physically peeling from the surface to which it has been applied. The membrane possesses a unique combination of properties which are substantially maintained while in contact with the hazardous material. The polymeric membrane provides, for an extended period of time, an impermeable barrier which acts as a secondary sealant and prevents the spread, deposition, or migration of contaminants.

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a substituted fluorene unit in the composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.

Abstract: Polymeric reaction products which become water-thinnable on protonation with an acid and are suitable for use in the form of aqueous dispersions as additives in electrocoating baths are formed fromA. a butadiene/acrylonitrile copolymer which contains primary and/or secondary amino groups andB. an epoxy compound having an average molecular weight of from 140 to 10,000 and containing on average from 1.5 to 3 epoxy groups per molecule,the amount of (A) being such that 1.05 moles or more of primary and/or secondary amino groups of component (A) are present per mole of epoxy groups of component (B).

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a 9,9-bis(hydroxphenyl)fluorene composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: Damage tolerant composites comprising high strength filaments in the form of bundles or tows of continuous fiber and a tough phase separated, crosslinked epoxy resin matrix are disclosed. The crosslinked epoxy resin matrix comprises infusible particles that reside primarily between plies of the composite and critically have a median particle size between 10-75 microns. Prepregs for making the damage tolerant composites and methods of making such prepregs and the epoxy resin compositions thereof are also disclosed. The epoxy resin compositions comprise the infusible particles which become segregated as to size on a surface layer of the prepreg during the process of combining the high strength filaments of the prepreg and the resin containing the epoxy resin composition. Alternatively, the infusible particles may be disposed directly on the epoxy resin surface of the prepreg.

Abstract: An epoxy resin comprising an active hydrogen compound having at least three active hydrogen atoms capable of reacting with an epoxy group in its molecule or butadine or isoprene as a main monomer is modified with an oligomer having on average at least 1.5 equivalents of active hydrogen capable of reacting with an epoxy group in its molecule. An epoxy resin modified with a bisphenol and a compound having active hydrogen or acid anhydride groups capable of reacting with an epoxy group is also provided. A toner containing the epoxy resin as a binder is useful in electrostatography.

Abstract: Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.

Abstract: A two component polyurethane coating consisting of a principal component (A) comprising a hydroxyl group containing film-forming resin, crosslinked polymer particles and a solvent for said film-forming resin and a hardener component (B) comprising a polyisocyanate compound, which is characterized by using as the crosslinked polymer particles composite resin particles each comprising a particulate crosslinked polymer core and a number of substantially linear polymer chains coupled with said core by either chemical bonding, semi-interpenetration or both, and containing metal element in either portion of said core, said polymer chains or both of them; the solid weight ratio of said hydroxyl group containing film-forming resin to said composite resin particles being 99/1 to 40/60 and the equivalent ratio of isocyanate groups in the hardener component (B) to hydroxyl groups in the principal component (A) (if the linear polymer chains contain hydroxyl groups, the sum of said hydroxyl groups and those of the film-fo

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a 9,9-bis(hydroxphenyl)fluorene composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: A method of improving epoxy resin compositions to provide a cured resin having improved glass transition temperature and toughness characteristics is provided. The method includes providing in an epoxy resin composition an effective amount of a substituted fluorene unit in the composition. The fluorene component acts as a chain extension agent and provides for increased glass transition temperature and less cross-link density. As a result, improved toughness occurs. In preferred applications a toughening agent is provided in the resin composition, to further enhance toughness. Preferred resin compositions, cured resins and methods of providing improved cured resins are also provided.

Abstract: Preformed carboxylated rubber particles are effective for toughening fiber reinforced composite structures based on thermoset resins such as epoxy resin formulations. The composites are effectively toughened by adding the carboxylated rubber particles to the matrix resin prior to curing the composite.

Abstract: An epoxy resin based powder coating composition is disclosed, comprising an epoxy resin, a reaction product of dicyclopentadiene and maleic anhydride, and a cure accelerator.The coating composition may further comprise an aromatic acid anhydride based curing agent, an impact modifier and a surface smoothing agent.The coating composition has stable powder characteristic and provides good heat resistance and electrical insulation.

Abstract: A process for preparing a sterically stabilized non aqueous dispersion of a polyepoxide of epoxy equivalent weight in the range 350 to infinity, which comprises reacting a sterically stabilized non-aqueous dispersion of a compound with at least two epoxy groups with a diol of formula (1) ##STR1## in which B is a group of formula (2) ##STR2## where D is a methylene group or propane -2, 2-diyl.

Abstract: An end dam nosing material useful for expansion joints and having high levels of bonding strength, tensile strength, compressive strength, flexural capabilities, resiliency, and resistance to chemical action is disclosed. The end dam nosing material of the present invention does not require the addition of external heat for curing. The end dam nosing material of the present invention comprises a mixture of a dipolymerized elastomer, an epoxy resin, a filler material and an amount of a curing agent effective to cure the epoxy resin and generate sufficient heat to cure the dipolymerized elastomer.

Abstract: Disclosed is a polyester composition comprising (a) 100 parts by weight of an aromatic polyester; (b) 0.005-10 parts by weight of an epoxy compound of the formula (I): ##STR1## (wherein Ar means C.sub.6 -C.sub.20 aromatic group or C.sub.6 l-C.sub.20 alicyclic group, n means an integer of 0-20); and (c) 1-70 parts by weight of at least one elastomer which has at least one functional group selected from the group consisting of epoxy groups, carboxyl group, carboxylate ester groups, carboxylic acid amide groups, acid anhydride group, imide groups, carboxylate salt groups, hydroxyl group, amino group and cyano group, the elastomer having a tensile modulus of 1-6,000 kg/cm.sup.2. The polyester resin composition of the present invention can easily be molded and the obtained molded article excells in mechanical properties such as impact strength.

Abstract: An electroconductive coating composition for a plastics substrate, such as a poly(ethylene terephthalate) film, comprises a polymeric electrolyte and a polyepoxy resin. Surface conductivity may be promoted by the inclusion of an enhancer or by treatment with an interactive solvent medium. Substrates coated with the composition exhibit substantially permanent antistatic characteristics when subjected to photographic processing techniques.

Abstract: A coating composition, containing a fluoropolymer, a film-forming adjuvant resin which is different from the fluoropolymer and adapted to react with the group represented by F in the functional organosilane of formula I and which is selected from the group consisting of acrylic resins, polyepoxide resins, polyester resins, aminoplast resins and mixtures thereof; and an amount effective to promote adhesion of a functional organosilane represented by formula I: ##STR1## wherein A represents an organo group containing from 1 to 18 carbon atoms,G represents an organo group containing from 2 to 10 carbon atoms,X represents a hydrolyzable group; andb is an integer from 0 to 2, andF represents amino, polyamino, glycidoxy, mercapto, cyano, allyl, vinyl, urethano, halo, isocyanato, ureido, imidazolinyl, acrylato or methacrylato.

Abstract: The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.

Abstract: A one package, stable curable composition contains:(a) a nonfunctional polydiene;(b) a polyepoxide;(c) a sulfur and zinc containing vulcanization system adapted to cure the polydiene and the polyepoxide; and(d) an anhydride containing material effective to promote adhesion of the curable composition to metal, wherein the anhydride containing material remains essentially unreacted with the epoxide and is combined in a manner to obtain dissolution of the anhydride containing material in the epoxide.The aforesaid curable composition is suitable for use as an adhesive or sealant.

Abstract: Low viscosity polymer polyols having high styrene/acrylonitrile ratios and good stability may be achieved by the use of epoxy resin-modified polyols as the base polyols. The styrene/acrylo-nitrile ratio may be as high as 95/5 and even 100/0 in the polymer polyols. The epoxy resin-modified polyols useful as base polyols may be made by reacting a polyol initiator having an active hydrogen functionality of 3 to 8 and one or more alkylene oxides with an epoxy resin. It is preferred that only a small part of the epoxy resin-modified base polyol be initially charged to the reactor, and that the balance, a relatively larger part, be a part of the monomer feed stream to the reactor.

Abstract: Disclosed is a thermally-curable, one-part epoxy adhesive composition comprising: (1) a glycidyl ether epoxide having a048477475 n epoxy functionality grater than one and a molecular weight between about 150 and 10,000; (2) a catalyst comprising (i) an acid of the formula H.sup.+ SbF.sub.5 X.sup.- wherein X is halogen, hydroxy, or --OR where --OR is the residue of an aliphatic or aromatic alcohol having a molecular weight less than about 10,000 and (ii) N,N-diethyl-o-toluidine; (3) an aliphatic or non-aromatic cyclic polyol having about 2 to 18 carbon atoms, at least two hydroxy groups of which are primary or secondary, and being free of electron-withdrawing substituents, amine substituents, or large substituents that cause steric hindrance in the .alpha.-position in relation to the carbon attached to the methylol group of the polyol; and (4) a toughening agent that does not react with the epoxide during curing and has an epoxide compatible component and an epoxide incompatible component.

Abstract: Polymers of the formula: ##STR1## wherein X is selected from the group consisting of halogen, hydroxyl and alkoxy and n is an integer such that the polymer has a weight average molecular weight within the range of from 5,000 to 30,000 are useful to prepare a wide variety of block copolymer resins such as polycarbonate-polyisobutylene block copolymer.

Abstract: Epoxy and epoxy novolak resins are impact modified by adding an effective amount of an acrylamide diene nitrile rubber terpolymer to the resin. In a preferred embodiment, the acrylamide diene nitrile rubber includes an acid or ester group attached to the acrylamide portion of the polymer generally through a thiol group. The liquid terpolymer is reacted in the presence of acid catalysts with the resin to provide impact modification.

Abstract: A one-can resin composition which contains:(1) a blocked polyisocyanate produced by blocking, with an oxime type blocking agent, .alpha.,.alpha.,.alpha.',.alpha.'-tetra-methylxylylene diisocyanate or a terminal NCO-containing prepolymer formed by reaction of said diisocyanate with an active hydrogen-containing compound,(2) a polyol compound and(3) a monoalcohol.The resin composition, when stored at 40.degree. C., is stable for at least 3 months. It can be cured at temperatures as low as 90.degree.-120.degree. C. Therefore, it can be used advantageously as a baking paint for automotive exterior coating, cationic electro-deposition coating, coating of household electric appliances, and enameled wire manufacture, among others.

Abstract: Compositions comprising a mixture of (A) an epoxy resin composition consisting essentially of (1) at least one epoxy resin which has an average of not more than 2 vicinal epoxy groups per molecule; (2) at least one epoxy resin which has an average of more than 2 vicinal epoxy groups per molecule and (3) at least one rubber or elastomer; and (B) optionally, a low viscosity reactive diluent, are useful in preparing low temperature curable compositions. Also claimed is low temperature curable compositions containing the above components (A) and (B); (C) at least one cycloaliphatic amine hardener and (D) optionally, an accelerator for component (D).

Abstract: For use in sealing semiconductors, an epoxy resin composition is provided which comprises an epoxy resin, a curing agent, a filler and a modifier, wherein the modifier is a diene polymer or acrylic polymer having an iodine number of not more than 120 or both included in an amount of 1 to 50 parts by weight per 100 parts by weight of the epoxy resin.

Abstract: Damage tolerant composites comprising high strength filaments in the form of bundles or tows of continuous fiber and a tough phase separated, crosslinked epoxy resin matrix are disclosed. The crosslinked epoxy resin matrix comprises infusible particles made from a rubber polymer that reside primarily between piles of the composite and critically have a median particle size between 10-75 microns. Prepregs for making the damage tolerant composites and methods of making such prepregs and the epoxy resin compositions thereof are also disclosed. The epoxy resin compositions comprise the infusible particles which become segregated as to size on a surface layer of the prepreg during the process of combining the high strength filaments of the prepreg and the resin containing the epoxy resin composition.

Abstract: Homogeneous thermoset terpolymers which may be used in the preparation of laminates for circuitry boards will comprise a diepoxide of a polyether of a polyphenol, a dicyanate ester of a polyether of a polyphenol and an alkenyl aryl compound. The polymers are prepared by admixing a solution of the diepoxide of a polyether of a polyphenol and an alkenyl aryl compound with a second solution of the dicyanate ester of a polyether of a polyphenol and the alkenyl aryl compound at elevated temperatures. The resulting terpolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.