Abstract: The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass % or greater.

Abstract: The present application relates to organosilicones and compositions such as consumer products comprising such organosilicones, as well as processes for making and using such organosilicones and such compositions. Such compositions comprising such organosilicones are easier to formulate, and provide more economical and superior care benefits when compared to current silicone containing compositions.

Abstract: Composition comprising (A) 50-99.5 wt %, based on the total weight, of A, B and C of a reaction resin or reaction resin mixture that is processed into thermosetting materials, said resin or resin mixture being liquid at temperatures in the range of 15 to 100° C. and having an average molecular weight of 200 to 500,000 and with a sufficient number of suitable reactive groups for a curing process and (B) 0.5-50 wt %, relative to the total weight of A, B and C of one or more dispersed polyorganosiloxanes that are contained in the reaction resin or reaction resin mixture homogeneously in finely distributed form as polyorganosiloxane droplets with a diameter of 0.001 to 4 ?m, wherein the organopolysiloxane particle is a polymer of the general formula (R3SiO1/2)w(R2SiO2/2)x- (RSiO3/2)y- (SiO4/2)z, where w=0 to 20 Mol %, x=80 to 99.9 Mol %, y=0.5 to 10 Mol %, z=0 to 10 Mol %, (C) 0.

Abstract: A method for gluing components is provided, forming an adhesive layer which is capable of functioning, at least in a temperature range of ?100° C. to ?160° C., wherein the adhesive layer is obtained from a curable reactive resin system. The reactive resin system includes an epoxy resin component and polymer particles dispersed in the epoxy resin component, the dispersed polymer particles furthermore including addition-crosslinked silicone elastomer. Also provided is the use of a reactive resin system for gluing piezoelectric ceramics and/or permanent magnets including rare earth elements and a component configuration including a piezoelectric ceramic, an impedance matching layer and an adhesive layer in contact with the piezoelectric ceramic and the impedance matching layer.

Abstract: A thermoplastic composition includes a poly(arylene ether) and a poly(arylene ether)-polysiloxane block copolymer. The thermoplastic composition is prepared by a method that includes oxidatively copolymerizing a monohydric phenol and a hydroxyaryl-terminated polysiloxane. The method is simpler than prior methods of preparing poly(arylene ether)-polysiloxane block copolymers by linking pre-formed poly(arylene ether) and polysiloxane blocks. The method is also produces greater incorporation of polysiloxane into the poly(arylene ether)-polysiloxane block copolymer than prior methods of copolymerizing monohydric phenols and hydroxyaryl-terminated polysiloxane.

Abstract: Silicone polyether copolymers are disclosed having the average formula E-B-[AB]n-E where E is an organofunctional endblocking group, B is a diorganopolysiloxane, A is a divalent organic group comprising at least one polyether group, and n is ?1. The silicone polyether copolymers having an amine functional endblocking group are useful in the treatment of textiles and fibers.

Abstract: The present invention relates to a thermosetting resin composition for optical-semiconductor element encapsulation, the thermosetting resin composition including the following ingredients (A) to (D): (A) an epoxy group-containing siloxane compound represented by the following general formula (1) in which R1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, R2 is a divalent hydrocarbon group having 1 to 20 carbon atoms and may contain an oxygen atom for ether formulation or ester formulation inside thereof, and n is an integer of 0 to 20; (B) an acid anhydride curing agent; (C) a thermally condensable organosiloxane; and (D) a curing accelerator.

Abstract: A cationically polymerizable composite coating composition comprising: a) a condensation product of at least one hydrolyzable silane having a fluorine-containing group, b) at least one cationically polymerizable organic resin, and c) a cationic initiator, provides, upon curing, substrates with an alkali-resistant, liquid-repellent coating. The composite coating composition may be used in pattern forming methods.

Abstract: A thermosetting composition containing an aluminosiloxane, a silicone oil containing silanol groups at both ends, an epoxy silicone, and a silicone elastomer. The thermosetting composition of the present invention can be used for, for example, encapsulating materials, coating materials, molding materials, surface-protecting materials, adhesive agents, bonding agents, and the like. Especially, in a case where the thermosetting composition of the present invention is used as an encapsulating material, the thermosetting composition is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

Abstract: An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1?a+b, and c represents an integer of 0 to 10 wherein, R3 represents an alkylene group of 2 to 12 carbon atoms wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.

Abstract: The invention relates to a liquid resin composition for electronic components which is used in sealing of electronic components, comprising a liquid epoxy resin, a curing agent containing a liquid aromatic amine, and an inorganic filler, and further comprising at least one member selected from a hardening accelerator, silicone polymer particles, and a nonionic surfactant. There is thereby provided a liquid resin composition for electronic components, which is excellent in fluidity in narrow gaps, is free of void generation, is excellent in adhesiveness and low-stress characteristic and is excellent in fillet formation, as well as an electronic component device having high reliability (moisture resistance, thermal shock resistance), which is sealed therewith.

Abstract: Polymers having polyolefin segments as the side chain, with a structural unit represented by the following Formula (1): wherein A is an olefin polymer having a weight average molecular weight of 400 to 500,000; R is H, an alkyl group, or an aralkyl group; W and Z are each O, HN, or S; and x and y are each 0 or 1, with the proviso that at least one of them is 1. The polymer can be applied as an antistatic agent, a cosmetic additive, a releasing agent for toner, a pigment dispersant, a lubricant for vinyl chloride resins, a coating material, an emulsion composition and the like.

Abstract: A powder coating composition of the present invention includes, as essential components, an epoxy group-containing vinyl copolymer (A) with a glass transition temperature of 40° C. or higher, an epoxy group-containing vinyl copolymer (B) that contains organosiloxane side chains and has a glass transition temperature of 0° C. or lower, and a polyvalent carboxylic acid (C), and is able to form a coating film with excellent external appearance and scratch resistance.

Abstract: A phosphorus-containing silsesquioxane is represented by the formula [R13SiO1/2]m[R2SiO3/2]n[R3SiO3/2]p[(R4O)2PO(CH2)xSiO3/2]q wherein each of R1, R2, R3, and R4 independently represents a hydrocarbyl group; x represents an integer of from 1 to 8; m is a positive number less than 1.5; n and q are positive numbers greater than 0 and less than 1; and p is a number greater than or equal to 0 and less than 1. Further, (n+p)/q is in a range of from 0.5 to 99, and (n+p+q)=1. Curable and cured compositions comprising the phosphorus-containing silsesquioxane are disclosed.

Abstract: Compositions for golf balls that include organically modified silicates and the golf balls formed using the compositions are described. In particular, the compositions of the invention, which are based on a polyurethane and polysiloxane, polyurea and polysiloxane, and/or epoxy and polysiloxane, and, thus, have the benefits of increased COR, adhesion, and shear and impact resistance. The compositions of the invention may be used in any layer of a golf ball, e.g., an outer cover layer or inner cover layer, or may be used as a coating to be disposed over a structural outer layer of a golf ball.

Abstract: Disclosed herein are some embodiments related to a polymer composition comprising a base polymer and a block copolymer additive. Laminated constructs, methods of preparing the polymer compositions and the laminate constructs, and devices related thereto are also disclosed.

Abstract: A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, a cationic polymerization initiator and a metal oxide fine particle. Furthermore, a lamp of the present invention includes a package equipped with a sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the resin composition for sealing a light-emitting device filled in the sealing member.

Abstract: A curable reaction resin system is described, which is to be processed as a two-component mass and which contains a resin component, a curing agent as well as polymer particles that are dispersed in the resin component, the polymer particles being contained in the reaction resin system at a proportion of more than 25 and up to 50 wt. %.

Abstract: A curable silicone composition containing an organopolysiloxane that contains in one molecule at least one epoxy-containing organic group, has a polystyrene-referenced weight-average molecular weight at least 500, and is expressed by the following general unit formula: (RSiO3/2)x[R1aSiO(4-a)/2]y (where R represents a cycloalkyl group, and R1 represents hydrogen atom or a univalent organic group, except for an aromatic group and a cycloalkyl group, at least one R1 in one molecule being an epoxy-containing univalent organic group, and where the following condition is observed: 0<a?3; x>0; y>0; and x+y=1).

Abstract: The present invention has an object to provide a curable composition for transfer materials. The curable composition is applicable to a UV nanoimprint process capable of forming micropatterns with high throughput, is applicable to a thermal nanoimprint process in some cases, and is capable of forming a micropattern having high selectivity on etching rates regarding a fluorine-based gas and an oxygen gas. The curable composition for transfer materials comprises a silsesquioxane skeleton-containing compound having, in its molecule, a specific silsesquioxane skeleton and a curable functional group.

Abstract: The present invention describes novel non-hydrolyzable, linear, random block copolymers comprising units of polysiloxanes and polyalkyleneoxides linked by bis-aminofunctional groups. These copolymers have been successfully applied as textile enhancers as well as conditioning agents for hair and skin care products.

Abstract: Thermosetting compositions comprising (a) at least a first thermosetting resin, and (b) at least one silicone polyether, methods of making such thermosetting compositions, and thermoset products made from the compositions.

Abstract: The present invention relates to adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to inventive toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.

Abstract: Thermoset polymer systems are toughened without compromising other polymer properties by including 0.5 to 50 weight percent of 0.001 to 0.4 ?m monodisperse core/shell polymers having at least an inner core of a silicone polymer and an outer core of organopolymer.

Abstract: The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: Disclosed are coating compositions that include both (a) an alkoxy-functional and/or silanol-functional silicone; and (b) an epoxy-functional silicone. Also disclosed are substrates at least partially coated with a coating deposited from such a composition and methods for coating substrates with such compositions.

Abstract: This invention is a low-voiding adhesive film prepared from a composition. The composition comprises a toughening polymer, a curable resin, a curing agent for the curable resin, a void reduction compound, and a curing agent for the void reduction compound. The void reduction compound has at least two Si—O moieties contiguous with each other and at least one reactive functionality. Additional embodiments of this invention are described, including a process for producing the low-voiding die attach film, a method for reducing voids in a semiconductor package using the film of this invention, and a semiconductor package assembled with the film of this invention.

Abstract: The present invention generally relates to compositions including linear cycloaliphatic siloxane polymers, and the cyclic cycloaliphatic siloxane oligomers from which they are made. The present invention also generally relates to methods for making cycloaliphatic siloxane polymers, and the cyclic cycloaliphatic siloxane oligomers from which they are made. Some embodiments relate to cationic polymerization of methyl, cyclopentyl, and/or cyclohexyl substituted polysiloxanes. In some embodiments the cationic polymerization is a cationic ring-opening polymerization.

Abstract: Golf equipment having at least one portion formed from amine-adduct modified polyurea compositions, including epoxy-silicone modified polyurea compositions, epoxy modified polyurea compositions, silicone modified polyurea compositions, and polyurea compositions including polyamine/carbonyl adducts and/or amine-modified adducts having backbones based on polyfunctional acrylates or methacrylates or caprolactone monomers or oligomers.

Abstract: Metallized polyhedral oligomeric silsesquioxanes and metallized polyhedral oligomeric silicates are used as cure promoters, catalysts, and alloying agents for the reinforcement of polymer microstructures, including polymer coils, domains, chains, and segments, at the molecular level. Because of their tailorable compatibility with polymers, polyhedral oligomeric metallosesquioxanes (POMS) can be readily and selectively incorporated into polymers by common mixing processes.

Abstract: The present invention provides a curable resin composition which exhibits the following properties : excellent basic performances such as heat resistance; sufficient optical characteristics such as transparency; and excellent demoldability when a molded body of the composition is demolded at the time of molding. The present invention further provides a molded body obtainable by molding the curable resin composition and a production method thereof. A curable resin composition for molded bodies, including a thermocurable resin, wherein the curable resin composition for molded bodies includes at least one compound selected from the group consisting a compound having a boiling point of 260° C. or less at one atmospheric pressure, a silicon compound having a polyoxyalkylene chain, a silicon compound having an aryl group, and a silicon compound having a polyoxyalkylene chain and an aryl group.

Abstract: A semiconductor device which is not a light emitting semiconductor device is provided. This device is encapsulated with a silicone resin composition which is solid at room temperature and liquid at molding temperature, and which cures into a transparent article having a hardness measured by Type D durometer according to JIS K 6253 of at least 30 and an elongation in a tensile test of at least 5%.

Abstract: Branched polyglycols and branched polyether functional organopolysiloxanes are disclosed as is a process for making branched polyether functional organopolysiloxanes by reacting an organohydrogensiloxane and a branched polyglycol having an unsaturated group via a hydrosilylation reaction, as well as coating compositions containing branched polyether functional organopolysiloxanes and a binder are disclosed. Coatings resulting from these compositions were more hydrophilic and had improved dirt release properties as compared to coatings containing similar, but un-branched, polyether functional organopolysiloxanes.

Abstract: Cured products constituted with conventional epoxy compounds have been disadvantageous in heat-resistant and light-resistant transparency, and crack resistance. An object of the present invention is to provide: a modified polyorganosiloxane compound having an epoxy group and/or an oxetanyl group which provides a cured product that is excellent in heat-resistant and light-resistant transparency, and crack resistance; a curable composition thereof; and a cured product obtained by curing the same.

Abstract: A curable epoxy resin composition comprising: (I) a curable epoxy resin; (II) an epoxy-resin curing agent; and (III) a silicone rubber powder obtained by curing a condensation-curable silicone rubber composition in a dispersed state in water, the powder having an epoxy equivalent measured by titration equal to or lower than 3,000 and an average particle size in the range of 0.1 to 100 ?m, possesses excellent flowability and which, when cured, forms a cured product that in spite of low modulus of elasticity possesses high strength.

Abstract: A polyimide silicone resin, characterized in that the polyimide silicone resin comprises repeating units represented by the following formula (1) and has a number average molecular weight of from 5,000 to 200,000 wherein X is a tetravalent organic group, at least one of the tetravalent organic groups being represented by the following formula (2) wherein R1 may be the same with or different from each other and is a monovalent hydrocarbon group having 1 to 8 carbon atoms, R2 may be the same with or different from each other and is a trivalent organic group, and n ranges from 1 to 120 on average, and Y is a divalent organic group, at least one of the divalent organic groups comprising a phenolic hydroxyl group or a carboxyl group bonded to an aromatic ring.

Abstract: A modified polyaluminosiloxane obtained by treating a polyaluminosiloxane with a silane coupling agent represented by the formula (I): wherein each of R1, R2 and R3 is independently an alkyl group or an alkoxy group; X is a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a mercapto group, with proviso that at least two of R1, R2 and R3 are alkoxy groups. The photosemiconductor element encapsulating material of the present invention is suitably used for, for example, photosemiconductor devices mounted with blue or white LED elements (backlights for liquid crystal displays, traffic lights, outdoor big displays, advertisement sign boards, and the like).

Abstract: Film-forming materials include resins and/or crosslinkers having a —Si(OR)3 group. Film-forming resins can include epoxy, acrylic, polyurethane, polycarbonate, polysiloxane, polyvinyl, polyether, aminoplast, and polyester resins. A process to produce a film-forming resin includes reacting various polymers to incorporate a pendent group comprising a —Si(OR)3 group. Film-forming resins can be used in methods of producing coating compositions. Coating compositions can be used to coat a substrate, such as a metal substrate, by electrodeposition. Applied coatings containing the film-forming resins can be cured to form crosslinked films on substrates.

Abstract: A crosslinker for polymerizing a film-forming material including an alkyl or aromatic compound comprising at least two functional groups reactive with a film-forming resin and at least one pendent group having a nonionic metal coordinating structure. Coating compositions can include a film-forming material and the crosslinker. The coating compositions can be used to coat a substrate, such as a metal substrate. Applied coating layers on substrates can be cured to form coating films.

Abstract: Film-forming materials include nonionic metal coordinating structures. Nonionic metal coordinating structures can coordinate metals, such as metal catalysts and metal substrates. Example film-forming materials can be the product of a poly-functional epoxide and a nucleophilic ligand having a nonionic metal coordinating structure, or the product of a poly-functional alcohol and an electrophilic ligand having a nonionic metal coordinating structure.

Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and thermosetting resin formulations having improved fracture toughness using those toughening adducts.

Abstract: The present invention relates to novel adducts useful for improving the toughness and curable compositions using such toughening adducts. In a particular aspect, the present invention relates to novel toughening adducts and curable compositions having improved fracture toughness using those toughening adducts.

Abstract: A method of using metallized polyhedral oligomeric silsesquioxanes as cure promoters and catalysts for polyurethanes.

Abstract: This invention relates to compositions useful as adhesives and more particularly to epoxy-based adhesive compositions with improved impact resistance.

Abstract: An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein R1 may be the same with or different from each other and is a substituted or unsubstituted C1-4 alkyl group, and R2 is a substituted or unsubstituted C1-9 monovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).

Abstract: The invention aims to improve surface tackiness of a curable composition comprising a reactive silicon group-containing polyoxypropylene polymer without decreasing coating workability, strength, adhesion and appearance. As one embodiment of a means for resolution, a curable composition comprising (A) 100 parts by weight of a reactive silicon group-containing polyoxypropylene polymer, (B) from 0.1 to 20 parts by weight of a silane coupling agent, (C) from 0.1 to 80 parts by weight of an epoxy group-containing compound, (D) from 0.1 to 60 parts by weight of a tertiary amine, and (E) from 0.1 to 30 parts by weight of a primary or secondary amine having a melting point of 20° C. or more is mentioned.

Abstract: A primer composition comprising an alkoxysilyl-containing polyamide-imide resin, an epoxy resin, a curing promoter, and an organic solvent forms a cured coating having heat resistance and water resistance through brief low-temperature heating and helps bonding of epoxy resin molding compound to semiconductor members.

Abstract: Golf equipment having at least one portion formed from amine-adduct modified polyurea compositions, including epoxy-silicone modified polyurea compositions, epoxy modified polyurea compositions, silicone modified polyurea compositions, and polyurea compositions including polyamine/carbonyl adducts and/or amine-modified adducts having backbones based on polyfunctional acrylates or methacrylates or caprolactone monomers or oligomers.

Abstract: An epoxy resin composition for photosemiconductor element encapsulation, which is excellent in both light transmissibility and low stress property, as well as light resistance against short wavelength light (for example, 350 to 500 nm), is provided. The epoxy resin composition for photosemiconductor element encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) an acid anhydride curing agent, and (C) a specific silicone resin.