Abstract: Novel siloxane copolymers have a structure as shown below. They can be applied and heat treated at relatively low temperatures into cured resin coatings which have satisfactory solvent resistance, durability, and good adhesion and bond to metal substrates such as copper even under humid conditions.

Abstract: A toner fuser member contains a substrate on which is disposed a toner release surface layer formed from a composition that includes a silsesquioxane and a curable epoxy resin. On curing, the composition forms an interpenetrating polymer network of the silsesquioxane and cured epoxy resin.

Abstract: Elastomer-modified Epoxy-polysiloxane compositions of this invention are prepared by combining a silicone intermediate, with an epoxy resin, an elastomeric resinous intermediate, a polyfunctional amine, an optional organometallic catalyst, and optional fillers, pigments, and processing agents. The composition is prepared using a sufficient amount of water to promote hydrolysis of the polysiloxane and the polycondensation of the silanols produced by such hydrolysis. In its cured form, the epoxy-polysiloxane composition exists as a uniformly dispersed arrangement of linear epoxy chain fragments that are cross-linked with a continuous polysiloxane polymer chain, wherein either or both of the epoxy and/or polysiloxane polymers are elastomer modified to provide coatings and floorings having significantly improved properties of impact resistance, flexibility, crack resistance, and abrasion resistance with compared to conventional epoxy systems.

Abstract: In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: The present invention relates to a silicone resin composition of low melt viscosity and excellent reactivity and dispersibility in organic resins. The present invention also relates to a curable resin composition for forming a cured resin of excellent moldability and superior flame retardant properties while having little adverse impact on the human body and the environment as a result of containing no antimony oxides or halogenated epoxy resins. The present invention also relates to a cured resin having little adverse impact on the human body or the environment and possessing superior flame retardant properties.

Abstract: The present invention relates to an epoxy modified polysiloxane composition obtainable by combining the following ingredients:—a polysiloxane of formula (1), wherein each R1 is independently selected from hydroxy, alkyl, aryl or alkoxy radicals having up to six carbon atoms, each R2 is independently selected from hydrogen, alkyl or aryl radicals having up to six carbon atoms and, wherein n is selected so that the molecular weight for the polysiloxane is in the range of from about 400 to 10,000; with formula (1)—an epoxy resin having more than one 1,2-epoxy groups per molecule with an epoxy equivalent weight in the range of from 100 to about 5,000; and—an amino hardener component having active hydrogens able to react with epoxy groups in the epoxy resin to form polymers containing hydroxyl groups, which are able to react with the silanol groups of hydrolyzed polysiloxane to form a polymer network, wherein the epoxy chain polymers and polysiloxane polymers polymerize to form a cured epoxy modified polysiloxane

Abstract: The present invention relates to an organo-functional polysiloxane of formula (1) wherein each R1 is independently selected from alkyl or aryl radicals, each R2 is independently selected from hydrogen, alkyl or aryl radicals, n is selected so that the molecular weight for the organo-functional polysiloxane is in the range of from 400 to 10,000, R3 is a bivalent radical or —O—W—(X)z is hydroxy or alkoxy, z is 1, 2 or 3 and X is a reactive functional group for reacting with amine radicals and wherein 0 to 90% of —O—R3—(X)z is hydroxy or alkoxy

Abstract: A thermosetting resin composition is produced by heat treating a mixture of a polyaddition thermosetting resin, a silicic compound of the formula wherein R is an organic group containing a functional group that causes an addition reaction with the curing agent and R5 and R6 are independently a methyl group or an ethyl group, and water and adding a curing agent of the polyaddition thermosetting resin to the mixture that has undergone heat treatment.

Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.

Abstract: An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or imidazole compound as a cure accelerator cures into an elastomeric product having a low elasticity, toughness and low dielectric properties.

Abstract: Compositions are provided which contain (a) one or more polysiloxanes comprising at least one reactive functional group; a plurality of particles; and optionally, one or more curing agents comprising at least one functional group that is reactive with any reactive functional group of polysiloxane (a). Additionally, a process for applying the multi-component composite coatings described above to a substrate and coated substrates are provided. A process for preparing the coating compositions also is provided. The multi-component composite coating compositions of the invention provide highly scratch resistant color-plus-clearcoatings capable of retaining scratch resistance after weathering.

Abstract: A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant or a fluorine resin-based surfactant. The ratio of surfactant content is 0.01 to 5.0 wt pts per 100 wt pts resin content in the connecting material.

Abstract: The present invention relates to an air-drying silane coating composition containing an epoxy or acrylic resin, an optional silicic ester or alkyl silicate, an aminoalkylsilane component, an optional organoalkyoxysilane, and possible auxiliaries; methods of use thereof, and articles and substrates coated accordingly.

Abstract: A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additionally comprise a phenoxy resin, a phenolic resin and talc. A method for bonding an elastomer to a metal also is provided.

Abstract: Coating compositions are provided which are formed from components comprising (a) at least one polysiloxane comprising at least one reactive functional group; (b) at least one reactant comprising at least one functional group that is reactive with at least one functional group selected from the at least one reactive functional group of the at least one polysiloxane and at least one functional group of at least one reactant; and (c) a plurality of particles, wherein each component is different, and wherein the at least one reactive functional group of the at least one polysiloxane and the at least one functional group of the at least one reactant are substantially nonreactive with the particles. A multi-component composite coating composition formed from a basecoat and a topcoat deposited from the curable coating composition also is provided.

Abstract: An epoxy composition for application to the surface of a marine vessel. The epoxy composition comprises an epoxy resin and an iron particulate combined with one or more materials, preferably dry materials, which are piped into a feeder and then into a mixer. The dry materials are selected from a group of one or more additives comprising a ceramic material, an amorphous fumed silica such as Cab-O-Sil®, a silicone and a color pigment. The combined mixture is then submitted to a polarizing process so that the iron particulate is magnetized to create a polarized, electromagnetic field. A second mixture comprising an epoxy hardener, a ceramic material and an amorphous fumed silica is produced for ultimately combining with the epoxy resin mixture at the point of application to the marine vessel.

Abstract: The present invention provides low stress non-hermetic conformal coatings for the protection of microelectronic devices, such as a Microelectromechanical system (MEMS) based multichip module from adverse environments. The induced stress from these two coatings due to the thermal cycling and manufacture processing will not cause any influence on sensing accuracy of the piezopressure sensor or similar functional MEMS devices. Furthermore, the conformal coatings have the merits of low glass transition temperature, good elongation, low moisture uptake and mobile ion permeation, room temperature curability and good contamination resistance to the jet fume, which promise a high reliability for the aerospace and avionics application. One conformal coating comprises a composition/formulation containing a rubber, siloxane or urethane oligomer modified epoxy and an organic hardener, and optionally an organic diluent and a curing catalyst.

Abstract: Coating compositions are provided which include a polysiloxane comprising at least one reactive functional group and at least one material comprising at least one reactive functional group. Also provided are multi-layer composite coatings formed from a basecoat deposited from a pigmented coating composition and a topcoat applied over the basecoat, the topcoat deposited from the aforementioned coating composition. A method for improving the scratch resistance of a coated substrate, as well as coated substrates also are provided. The compositions of the invention provide highly scratch resistant coatings, particularly highly scratch resistant color-plus-clearcoatings.

Abstract: Disclosed is a powder coating composition containing a powder coating resin and a polyhedral oligomeric silsesquioxane (“POSS”) compound.

Abstract: This invention provides a one-part, room temperature moisture curable resin composition which comprises a ketimine prepared by reacting a ketone having a substituent at ? position and a polyamine having at least two amino groups within its molecule wherein ? position is methylene, and a main polymer which is an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups in its molecule, and which exhibits good shelf stability and high curing rate once taken out of the container, and which may further exhibit flexibility; a one-part, room temperature moisture curable resin composition which exhibits good shelf stability and curability as well as wet surface adhesion or initial thixotropic properties; a silicon containing compound having ketimine group whose reaction with the epoxy resin during the storage is prevented by the presence of a bulky alkyl group near the ketimine group and which exhibits good shelf stability and curability, and its production method; a one-part, room t

Abstract: A novel adhesive cures quickly at a lower temperature and ensures reliable connection of objects the adhesive connects with each other. The adhesive includes a metal chelate, a silane coupling agent and a thermosetting resin. The silane coupling agent in the adhesive is hydrolyzed at its alkoxy groups to form silanol groups, which in turn react with the metal chelate to produce cations in the adhesive. The resulting cations cause the epoxy resin as a thermosetting resin, to undergo cationic polymerization. The adhesive of the present invention cures at a lower temperature by taking advantage of the cationic polymerization.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: The present invention provides a powder composition for forming a heat stable wrinkle finish coating and the wrinkle finish coatings formed there from. The composition of the present invention comprises a resin consisting essentially of one or more than one silicone resin having a condensable hydroxyl content of from 2% by weight to 7% by weight, a curing agent, preferably an aminoplast, and a wrinkle finish forming catalyst, preferably an amine salt of triflic acid. In another embodiment, the powder composition of the present invention may comprise a hydroxyl functional resin, preferably a polyester, mixed with the said silicone resin to aid in the adhesion of the coating to a substrate. The composition of the present invention may further comprise up to 60 phr of a filler, such as wollastonite, to aid in heat stability. The coatings of the sent invention provide outstanding heat stability at temperatures greater than 350° F. and up to 550° F., preferably up to 650° F.

Abstract: This invention provides high solid paint compositions comprising as the basic components a hydroxyl-containing compound having a weight-average molecular weight of not more than 1,000 and a hydroxyl value of 200-800 mgKOH/g, and a polyisocyanate compound, and a process for forming multi-layered coating film using any of said compositions.

Abstract: An atomic oxygen-resistant film comprising an atomic oxygen-resistant film formed on a polyimide film, wherein the mass reduction rate thereof is no greater than 1.0% when irradiated with atomic oxygen at an irradiation dose of appromixately 3×1020 atoms/cm2 at a speed of about 8 km/sec.

Abstract: The present invention relates to an epoxy resin composition. The epoxy resin composition contains an epoxy resin and a cationic polymerization catalyst. The epoxy resin has at least two alicyclic epoxy groups, at least one perfluoroalkyl group having 6 to 12 carbon atoms, at least one alkylsiloxane group, and at least one cyclic group.

Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.

Abstract: A solvent-free thermosetting resin composition which comprises an epoxy resin (a) and a product (b) of the reaction of an organosilicon compound, represented by the general formula (1) (where R is an organic group containing a functional group reactive with an epoxy resin by addition reaction; and R1 is a methyl or ethyl group), with water, the product (b) containing organosilicon compound polycondensates formed in the epoxy resin (a) and having a degree of polycondensation of 2 or higher, and which has a low viscosity at a room temperature (25° C.) and gives a cured resin having intact material properties, especially intact high-temperature mechanical properties; a process for producing the resin composition; and a product obtained by applying the composition.

Abstract: Coating compositions are provided which are formed from components comprising (a) at least one polysiloxane comprising at least one reactive functional group; (b) at least one reactant comprising at least one functional group that is reactive with at least one functional group selected from the at least one reactive functional group of the at least one polysiloxane and at least one functional group of at least one reactant; and (c) a plurality of particles, wherein each component is different, and wherein the at least one reactive functional group of the at least one polysiloxane and the at least one functional group of the at least one reactant are substantially nonreactive with the particles. A multi-component composite coating composition formed from a basecoat and a topcoat deposited from the curable coating composition also is provided.

Abstract: The present invention includes a novel polyol prepolmer including either an aliphatic amine, cycloaliphatic amine, aromatic amine or a mixture of these with an epoxy functional silicone to produce the novel polyol prepolymer chain extender. In one aspect of the invention, the novel polyol prepolymer chain extender is reacted with an epoxy resin to produce a novel silicone modified epoxy resin having improved adhesion, chemical resistance, UV stability, and decreased shrinkage properties. In another aspect of the invention, the novel polyol prepolymer chain extender is reacted with an acrylic monomer to produce a novel silicone modified acrylic resin having improved adhesion, chemical resistance, UV stability, increased functionality, and decreased shrinkage properties. The present invention also provides for a novel solid surface material composition.

Abstract: Compositions are provided which contain (a) one or more polysiloxanes comprising at least one reactive functional group; a plurality of particles; and, optionally, one or more curing agents comprising at least one functional group that is reactive with any reactive functional group of polysiloxane (a). Additionally, a process for applying the multi-component composite coatings described above to a substrate and coated substrates are provided. A process for preparing the coating compositions also is provided. The multi-component composite coating compositions of the invention provide highly scratch resistant color-plus-clearcoatings capable of retaining scratch resistance after weathering.

Abstract: Compositions are provided which contain (a) one or more polysiloxanes comprising at least one reactive functional group; a plurality of particles; and optionally, one or more curing agents comprising at least one functional group that is reactive with any reactive functional group of polysiloxane (a). Additionally, a process for applying the multi-component composite coatings described above to a substrate and coated substrates are provided. A process for preparing the coating compositions also is provided. The multi-component composite coating compositions of the invention provide highly scratch resistant color-plus-clearcoatings capable of retaining scratch resistance after weathering.

Abstract: There is here disclosed a thermosetting resin composition containing, as essential components, (a) an epoxy resin, (b) a curing agent, and (c) a silicone polymer having a bifunctional siloxane unit represented by the formula R2SiO2/2 (wherein R is the same or a different organic group) in the molecule.

Abstract: A silicone rubber adhesive composition comprising (A) a heat curable organopolysiloxane composition of the addition curing type or peroxide curing type, (B) reinforcing silica fines, and (C) an organic compound or organosilicon compound having an epoxy equivalent of 100-5,000 g/mol and containing at least one aromatic ring in a molecule is easily moldable within a short time by injection molding, suitable in primerless molding, and bondable with various thermoplastic resins. Integrally molded articles in which the silicone rubber adhesive composition is firmly bonded to the thermoplastic resin are obtainable without a need for modification of the resin.

Abstract: A room temperature-setting composition containing a polyoxyalkylene polymer (A) having a molecular weight ranging from 8000 to 50000 and having hydrolyzable silicon groups of the following formula (1): —SiXaR13−a  (1) wherein R1 is a C1-20 substituted or unsubstituted monovalent organic group, X is a hydroxyl group or a hydrolyzable group, a is 1, 2 or 3, provided that when more than one R1 group is present, the R1 groups may be the same or different, and when more than one X group is present, the X groups may be the same or different, the composition comprising, as an essential component, the polyoxyalkylene polymer, having a molecular weight ranging from 8000 to 50000 and having hydrolyzable silicon groups of formula (1), wherein a is 3, or the composition comprises a polyoxyalkylene polymer component as defined above which contains said essential specific polyoxyalkylene polymer component, and a polymer (B) made by polymerization of a polymerizable unsaturated group-containing monom

Abstract: This invention pertains to silicone core-shell or gel particles that contain active ingredients. The silicone particles are produced by emulsifying and reacting a composition comprising a siloxane have a first reactive group, a crosslinker having a second reactive group, at least one emulsion liquid, a surfactant and an active ingredient. The active ingredient is encapsulated in the silicone particle and are useful in personal care products, textiles, auto care products, and laundry products for the delivery of active ingredients.

Abstract: Coating compositions are provided which are formed from components comprising (a) at least one polysiloxane comprising at least one reactive functional group; (b) at least one reactant comprising at least one functional group that is reactive with at least one functional group selected from the at least one reactive functional group of the at least one polysiloxane and at least one functional group of at least one reactant; and (c) a plurality of particles, wherein each component is different, and wherein the at least one reactive functional group of the at least one polysiloxane and the at least one functional group of the at least one reactant are substantially nonreactive with the particles. A multi-component composite coating composition formed from a basecoat and a topcoat deposited from the curable coating composition also is provided.

Abstract: A primer composition comprising (A) a diorganopolysiloxane having an average degree of polymerization of 500-2,000 and alkenyl groups at both ends of its molecular chain in an amount of 0.001-0.005 mol per 100 g of the diorganopolysiloxane, (B) an organohydrogenpolysiloxane having at least two SiH groups in a molecule, (C) a platinum base curing catalyst, and (D) a retarder is effective for improving the adhesion between various plastic films and silicone pressure-sensitive adhesives and thus forming satisfactory pressure-sensitive adhesive tapes.

Abstract: Novel polysilazane-modified polyamine hardeners for epoxy resins, such classes as glycidyl ether epoxy resins and novolac epoxy resins, including reaction mixtures, compositions and reaction products comprising such hardeners, impart enhanced high temperature properties, higher char yields and better adhesion properties to the cured epoxy resins relative to the same epoxy resins cured using unmodified polyamine hardeners.

Abstract: Versatile synthetic methodology has been established for the production of a variety of siloxane and silane-containing radial epoxy resins and intermediates. This chemical approach has been exploited to obtain a variety of hybrid organic/inorganic materials that can be described as epoxysiloxane or epoxysilane radial copolymers. The methodology can be used to access reactive, hydrophobic Si-containing resins with good organic compatibility that are structurally distinct from epoxy-functional siloxanes/silanes known in the prior art.

Abstract: Coating compositions are provided which include a polysiloxane comprising at least one reactive functional group and at least one material comprising at least one reactive functional group. Also provided are multi-layer composite coatings formed from a basecoat deposited from a pigmented coating composition and a topcoat applied over the basecoat, the topcoat deposited from the aforementioned coating composition. A method for improving the scratch resistance of a coated substrate, as well as coated substrates also are provided. The compositions of the invention provide highly scratch resistant coatings, particularly highly scratch resistant color-plus-clearcoatings.

Abstract: This invention provides a clear paint composition suitable for application on base coated surface of a coating object, which is characterized by comprising (a) a hydroxyl- and epoxy-containing acrylic resin, (b) a high acid value polyester resin having an acid value of 120-200 mgKOH/g and a number-average molecular weight of 500-4,000, (c) an alkoxysilyl-containing acrylic resin, and (d) an acrylic resin containing alkoxysilyl groups and dimethylpolysiloxane side chains, and forming a coating which, after being cured, has a glass transition point within a range of 100-120° C.

Abstract: Anti-reflective compositions and methods of using these compositions to form circuits are provided. The compositions comprise a polymer dissolved or dispersed in a solvent system. In a preferred embodiment, the polymers of the composition include recurring units having the formula where X is a light-attenuating moiety, M is a metal, and each R is individually selected from the group consisting of hydrogen, alkyls, aryls, alkoxys, and phenoxys. The resulting compositions are spin bowl compatible (i.e., they do not crosslink prior to the bake stages of the microlithographic processes or during storage at room temperature), are wet developable, and have superior optical properties.

Abstract: The present invention is to provide a curable resin composition comprising (I) a reactive silicon group-containing polyoxyalkylene polymer wherein a introduction rate of a reactive silicon group into molecular chain terminus is not less than 85% as analyzed by 1H-NMR spectrometry and (II) an epoxy resin. The curable resin obtained from this composition reflects improvements in tensile strength and tensile shear bond strength and in adhesion to various substrates.

Abstract: A flame-retardant epoxy resin composition includes an epoxy resin, a curing agent, and a metal hydroxide, wherein the curing agent as a phenolic resin (C) containing, in the molecular chain, structural units derived from a phenol (A) and structural units derived from an aromatic compound (B) other than the phenol (A), or the epoxy resin is a novolac epoxy resin CD) obtained by subjecting the phenolic hydroxyl groups of the phenolic resin (C) to etherification with glycidyl. The composition has a high degree of flame retardancy.

Abstract: Ambient temperature curing coating composition comprising a polysiloxane having the formula: 1