Abstract: Silicone polyether copolymers are disclosed having the average formula E-B-[AB]n-E where E is an organofunctional endblocking group, B is a diorganopolysiloxane, A is a divalent organic group comprising at least one polyether group, and n is ?1. The silicone polyether copolymers having an amine functional endblocking group are useful in the treatment of textiles and fibers.

Abstract: The present invention relates to biostable gel comprising: (a) at least one silicon-containing polyol, polyamine, polyepoxy or polyisocyanate having 1 or more functional groups and a molecular weight of at least 20,000 which is cured in the presence of: (b) at least one diol, diamine or diisocyanate having a molecular weight of less than 10,000; and/or (c) an initiator, processes for their preparation and their use in the manufacture and repair of biomaterials and medical devices, articles or implants, in particular the manufacture of asoft tissue implant such as breast implants and the repair of orthopaedic joints such as spinal discs.

Abstract: A curable silicone composition comprising at least the following components: (A) a diorganopolysiloxane represented by the following general formula: X—R2—(R12SiO)mR12Si—R2—X {where R1 designates a monovalent hydrocarbon group that has six or fewer carbon atoms and is free of aliphatic unsaturated bonds; R2 designates an alkylene group; and X is an organopolysiloxane residue represented by the following average unit formula: (YR12SiO1/2)a(SiO4/2)b (where R1 is the same as defined above; Y is a single bond, a hydrogen atom, a group represented by aforementioned R1, an epoxy-containing alkyl group, an alkoxysilylalkyl group, or an alkyl group with seven or more carbon atoms; however, in one molecule, at least one Y is a single bond, and at least one Y is an alkyl group with seven or more carbon atoms; “a” is a positive number; “b” is a positive number; and “a/b” is a number in the range of 0.2 to 4.

Abstract: A liquid epoxy resin composition comprising: (A) a liquid epoxy resin; (B) an amine type curing agent; (C) a sulfur-containing phenol compound in an amount of from 1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B); and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

Abstract: The invention relates to preparations based on polymerizable polyether materials and a fluidity improver and to the use thereof in producing dental materials, especially impression materials.

Abstract: A self-adhesive organopolysiloxane composition is provided comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl groups, (B) an organohydrogenpolysiloxane containing at least two SiH groups, (C) a hydrosilylation catalyst, and (D) an adhesive component obtained by previously mixing (i) a titanium chelate catalyst and/or a tetraorganoxytitanium and (ii) a silane coupling agent and aging the mixture. The composition cures at room temperature or lower temperature while it is fully adhesive to metal and plastic substrates.

Abstract: The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle properties. According to the present invention, there is provided an epoxy resin composition for semiconductor encapsulation which comprises, as essential components, (A) a spherical alumina, (B) an ultrafine silica having a specific surface area of 120-280 m2/g, (C) a silicone compound, (D) an epoxy resin, (E) a phenolic resin as a curing agent, and (F) a curing accelerator, in which said ultrafine silica is contained in an amount of 0.2-0.8% by weight based on the total weight of the resin composition, and said silicone compound is a polyorganosiloxane and is contained in an amount of 0.3-2.0% by weight based on the total weight of the resin composition.

Abstract: The present invention provides a liquid resin composition for electronic components, which is excellent in migration resistance and also superior in formability and reliability, as well as an electronic component device sealed therewith, and relates to a liquid resin composition for electronic components, which comprises (A) an epoxy resin, (B) a cyclic acid anhydride which is liquid at ordinary temperature and has an acid anhydride equivalent of 200 or more, and (C) a coupling agent.

Abstract: The present invention describes novel non-hydrolyzable, linear, random block copolymers comprising units of polysiloxanes and polyalkyleneoxides linked by bis-aminofunctional groups. These copolymers have been successfully applied as textile enhancers as well as conditioning agents for hair and skin care products.

Abstract: Metallized nanostructured chemicals are incorporated at the molecular level as alloying agents for the reinforcement of polymer microstructures, including polymer coils, domains, chains, and segments. Direct blending processes are effective because of the tailorable compatibility of the metallized nanostructured chemicals with polymers.

Abstract: A composite material includes a polymer matrix, a polymerizer, and a plurality of capsules containing a corresponding activator for the polymerizer. The composite material can also include an adhesion promoter, and the polymerizer can be phase separated from the polymer matrix. The composite material can be made by dispersing the polymerizer and capsules into the polymer matrix. These composite materials can exhibit improved environmental stability, and can be used with a wider variety of activators.

Abstract: An epoxy/silicone hybrid resin composition is provided comprising (A) an organosilicon compound having at least one silicon-bonded hydroxyl group, (B) a modified epoxy resin which is free of a phenylene ether skeleton and has reactive hydroxyl groups wherein some or all of the hydrogen atoms of the reactive hydroxyl groups are substituted by monovalent hydrocarbon groups or silyl groups, and (C) an aluminum base curing catalyst. The compatibility between silicone and epoxy resins is improved without a need for compatibilizing agent.

Abstract: An organotrisiloxane represented by the following general formula (I), wherein R1 and R2 may be the same or different and designate optionally substituted univalent hydrocarbon groups that do not have aliphatically unsaturated bonds, with the proviso that at least one of R1 or R2 is an aryl group, and R3 designates an organic group that contains a phenolic hydroxyl group, is a novel compound that possesses good reactivity and excellent compatibility and dispersibility with respect to the curable resins, such as epoxy resin.

Abstract: An organopolysiloxane represented by formula (1) shown below and having (3,5-diglycidylisocyanuryl)alkyl groups represented by formula (2) at least at both terminals of the main chain: wherein, each R1 represents, independently, a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R2 is a group represented by formula (2) shown below, X is a group represented by formula (3) shown below, a represents an integer of 0 to 100 and b represents an integer of 0 to 30, provided that 1?a+b, and c represents an integer of 0 to 10. wherein, R3 represents an alkylene group of 2 to 12 carbon atoms. wherein, R1 and R2 are as defined above, d represents an integer of 0 to 30, and e represents an integer of 0 to 30.

Abstract: An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate comprises an organic or inorganic polymer comprising a covalently bound polyhedral silsesquioxane (POSS). The substrate may further comprise an additional dispersed POSS, any other fillers including fibrous webs. Use of covalently bound POSS allows for flame retardancy in compositions having acceptable dielectric constants and dissipation factors.

Abstract: A composition comprising (A) an epoxy resin, (B) an epoxy resin curing agent in such an amount that an equivalent ratio of a functional group of the epoxy resin curing agent (B) to the epoxy group of the epoxy resin (A) ranges from 0.8 to 1.25, (C) thermoplastic resin particles which are solid at 25° C. in an amount of from 3 to 60 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B), and (D) an epoxy resin curing promoter in an amount of from 0.1 to 10 parts by weight per total 100 parts by weight of the epoxy resin (A) and the epoxy resin curing agent (B). The composition is stable in B-stage and forms a curing product with no void.

Abstract: Provided are a non-halogen flame retardant epoxy resin composition comprising (A) a silicon-containing, phosphorus-modified epoxy resin, (B) a multifunctional epoxy resin, (C) a mixed curing agent of an amine curing agent and a phenolic curing agent and (D) a metal hydrate inorganic flame retardant, and a prepreg and copper-clad laminate using the same. The epoxy resin composition in accordance with the present invention exhibits excellent flame retardancy without use of a halogen flame retardant, and also advantageously provides well-balanced various physical properties which are to be required in copper-clad laminates, such as higher heat resistance and copper peel strength, and lead heat-resistant characteristics after moisture absorption.

Abstract: An epoxy/silicone mixed resin composition comprising (A?) an organosilicon compound containing at least one aliphatic unsaturated monovalent hydrocarbon group and at least one silicon atom-bonded hydroxyl group, (B) an epoxy resin containing at least one epoxy group, (C) an organohydrogenpolysiloxane, (D) a platinum group metal-based catalyst, and (E) an aluminum-based curing catalyst is used to encapsulate a light-emitting semiconductor member. The light-emitting semiconductor device undergoes little discoloration in a heat test, and has a high emission efficiency, a long life and reduced energy consumption.

Abstract: A curable resin which exhibits excellent heat resistance while including an extremely smaller amount of volatile component is disclosed, and an electronic component device having excellent reliability in heat resistance and the like which contains the above curable resin is provided. A curable resin obtained in reaction of at least one compound (a) selected from the group consisting of the silane compounds represented by the following Formula (I-1) and the partial condensates thereof with a phenol compound (b), comprising a remaining volatile component in an amount of 10 wt % or less with respect to the total weight of the curable resin is used as a curing agent.

Abstract: The present invention provides ?-polylysine represented by formula (1), having a polyorganosiloxane group introduced into the molecule, and a process for production of the ?-polylysine, in which the formula (1) is defined in the specification. The invention further provides an antimicrobial agent comprising an amino group-containing antimicrobial polymer having a polyorganosiloxane group introduced into the molecule, and an antimicrobial resin composition comprising an antimicrobial agent above and a resin.

Abstract: An firmly bonded composite of a silicone resin and an epoxy resin comprising: (A) a curable silicone resin composition comprising: (A1) an organopolysiloxane resin that has a refractory index of above 1.45 but below 1.60 and contains at least two silicon-bonded alkenyl groups having 2 to 12 carbon atoms, and no less than 30 mole percent of total siloxane units is phenylsiloxane units represented by the following formula: C6H5—SiO3/2, (A2) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms and (A3) hydrosilylation catalyst, and (B) a curable epoxy resin composition comprising: (B1) an epoxy resin that contains at least two epoxy groups in one molecule, (B2) a curing agent, and (B3) a curing catalyst. The firmly bonded composite is obtained only by curing composition (A) and composition (B) in tight contact with each other.

Abstract: A casting compound based on a resin which cures by a chemical reaction. The casting compound is suitable for insulation of electric components and contains an epoxy resin component, a silicone-containing component, a filler, and a thermal initiator. This casting compound is processible as a single-component system.

Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.

Abstract: Disclosed is an optical waveguide-forming curable resin composition and optical waveguide-forming curable dry film which are capable of forming cured resin articles that have high heat resistance, excellent mechanical strength and high transparency, and possess properties required for forming optical waveguides, such as low thermal expansion, low transmission loss, etc. The present invention provides a curable resin composition for forming an optical waveguide, the composition comprising a hydrolyzable silyl-containing silane-modified epoxy resin (A) having an average of at least one hydrolyzable silyl group and an average of at least one epoxy group per molecule; and a resin (B) having, per molecule, an average of at least one functional group that is reactive with an epoxy group; and an optical waveguide-forming curable dry film formed using the resin composition.

Abstract: A copolymer and a process of making the copolymer are disclosed. The copolymer is produced from reacting a glycidyl ester and/or ether with a polyol comprising a functionality of at least 2 wherein at least 50% by weight of the copolymer comprises a minimum of 3n+X repeating units, wherein n is a monomer unit and X is a monomer unit and/or other reactant. The copolymer may also include less than 50% of the polymeric units having the same molecular weight. The present invention is further directed to processes for preparing the copolymer and to coating compositions employing the copolymer.

Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Abstract: Disclosed herein are light diffusing films, methods of making the same and articles using the same. In one embodiment, a method for producing a film, comprising: combining, to form a combination, a polycarbonate having a yellowness index of about 0.8 to about 1.5 as measured in accordance with ASTM E313-73 (D1925), a phosphite stabilizer, an epoxy stabilizer, and light diffusing; forming the combination into the film; wherein the film comprises a hiding power of 0 to about 0.5.

Abstract: A paint composition has a resin constituent which includes (i) a non-aromatic epoxy resin, (ii) a polysiloxane and (iii) an epoxysilane. The paint composition has an anti-corrosive effect.

Abstract: An adhesion promoter comprising a silane compound and at least one of (1) a release agent, or (2) an adhesive, and methods of applying the adhesion promoter.

Abstract: This invention relates to epoxy-based compositions useful as adhesives and sealants, and more particularly to underfill sealant, compositions with improved impact resistance.

Abstract: A coolant-resistant and thermally stable primer composition comprising an organic-functional silane, preferably the reaction product of at least one amino-functional silane and at least one isocyanato-functional silane, is provided. The primer composition may additionally comprise a phenoxy resin, a phenolic resin and talc. A method for bonding an elastomer to a metal also is provided.

Abstract: A semiconductor device which is not a light emitting semiconductor device is provided. This device is encapsulated with a silicone resin composition which is solid at room temperature and liquid at molding temperature, and which cures into a transparent article having a hardness measured by Type D durometer according to JIS K 6253 of at least 30 and an elongation in a tensile test of at least 5%.

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: This invention relates to a primer composition having a low VOC content useful in the manufacture of automobiles and trucks in which the film forming binder contains: a) a cycloaliphatic or polycycloaliphatic epoxy compound; b) an alkoxy silane or silicate reactive diluent; and, c) a curing catalyst to catalyze the reaction between (a) and (b). These primers are characterized in that the curing or crosslinking reaction is presumably based, at least in part, on a ring opening polymerization reaction between the epoxy structures of (a) and silanol groups formed on (b) in the presence of atmospheric moisture and acid. Curing chiefly utilizing a ring opening reaction of the forgoing epoxy structures with the forgoing reactive diluents not only avoids volatile compounds from being generated and released into the atmosphere during the curing process, but also keeps the viscosity low enough for practical application such as by spraying.

Abstract: An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.

Abstract: The invention provides for the use of hydroxyl-functional polyalkylorganosiloxanes of the general formula (IV) as solvents for cationic photoinitiators and for the use of these solutions in cationically curable silicones.

Abstract: An epoxy-silicone mixed resin composition to give a transparent cured product which comprises [I] 100 parts by weight of a curable resin composition containing an organosilicon compound and an epoxy resin as essential components, and [II] 0.1 to 50 parts by weight of a silicone elastomer having a refractive index within 10% of that of a cured product of the curable resin composition. It is suitable for use as an encapsulator for light-emitting semiconductors.

Abstract: A toner fuser member has a substrate, on which is formed a toner release surface layer from a composition that includes: about 95 wt. % to about 99.9 wt. % of a cross-linked, glycidyl end-capped bisphenolic polymer having the formula where R1 and R2 are each independently H or an alkyl group containing 1 to about 4 carbon atoms, and R3 and R4 are each independently H, F, or an alkyl group containing 1 to about 4 carbon atoms, Z is a carbonyl cross-linking group, and x is an integer from 1 to about 10; and about 0.01 wt. % to about 5 wt. % of a perfluoroalkylsubstituted glycidyl-reactive compound having the formula where R5 is H or F, Q is OH or SiR6R7R8, R6, R7, and R8 being independently selected from the group consisting of Cl, OH, an alkyl group containing 1 to about 4 carbon atoms, an alkoxy group containing 1 to about 4 carbon atoms, an acyloxy group containing 2 to about 4 carbon atoms, and an amino group containing 0 to about 4 carbon atoms; and n is an integer from 1 to about 15.

Abstract: Bulk-modified potting composition based on a curable epoxy resin or on a mixture of these resins, where the resin or the mixture is composed of an epoxy resin, a hardener, where appropriate an accelerator, and also other additives, such as fillers, flexibilizers, and colorants, which potting composition (a) comprises a three-dimensionally crosslinked polysiloxane in disperse form and with a particle size in the range from 0.02 ?m to 50 ?m, which, where appropriate, has reactive groups which can react chemically with the epoxy resin and/or the hardener, (b) a selected linear or branched siloxane compound which has reactive groups which can react chemically with the epoxy resin and/or the hardener, and also, where appropriate, (c) a low-molecular-weight oligomeric siloxane compound, the use of the potting composition as an engineering material or as an insulating material, and the moldings and insulation produced therefrom.

Abstract: Coating compositions, articles, and methods of coating articles are provided. The coating compositions and methods provide abrasion resistant formable coatings when cured on a substrate. The articles can be formed after the coating compositions are applied to a substrate and cured. Abrasion resistant, tintable coatings are also provided.

Abstract: Heat curable silicone compositions comprising (A) an alkenyl-containing organopolysiloxane with 0.5-10 wt % of hydroxyl groups, (B) an organohydrogenpolysiloxane, (C) an addition reaction catalyst, and (D) an epoxy and/or alkoxy group-containing organohydrogenpolysiloxane, epoxy and/or alkoxy group-containing organosilane, or non-siliceous epoxy compound cure into products which have a high hardness, transparency, heat resistance and light resistance, and do not turn white turbid even when held in a hot humid atmosphere.

Abstract: Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80° C. of not more than 10,000 Pa·s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80° C. to (T+50)° C., exhibits a melt viscosity at a temperature of 100° C. to (T+30)° C. that is within a range from 100 to 10,000 Pa·s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

Abstract: The invention relates to the use of block copolymers as leveling agents for surface coatings, having a weight-average molecular weight of from 1000 to 100000. The leveling agent is a linear or branched block copolymer composed of a polysiloxane block and one or more blocks prepared from ethylenically unsaturated monomers by controlled free-radical addition polymerization. The invention also relates to coating compositions which comprise the leveling agent.

Abstract: To provide a two-pack type curable resin composition capable of securing a sufficient working life and having excellent curing property, in particular, deep curing property. The two-pack type curable resin composition includes: a first liquid containing a silyl group-denatured urethane prepolymer having an isocyanate group and an alkoxysilyl group in one molecule thereof and a weight average molecular weight of 500 or more; and a second liquid containing a curing agent.

Abstract: By using a high viscosity moisture-curable adhesive composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated hydrocarbon polymer, (C) a copolymer of which molecular chain is substantially made of one or more alkyl (meth)acrylate monomer unit(s) and (D) an epoxy resin, it becomes possible to bond an adherend to a substrate without open time and without temporary tacking after application.

Abstract: A resin-based casting compound which cures by a chemical reaction is described; it is suitable in particular for insulation of electric components and it contains an epoxy resin component (A), a silicone-containing component (B), a filler (C), by the choice of which the thermal conductivity of the casting compound is adjustable, and a thermal initiator (D). The casting compound has a thermal conductivity of ?2 W/mK.

Abstract: The curable composition of the present invention contains (A1) a silyl-containing ethylene/?-olefin/non-conjugated polyene random copolymer rubber which has a structural unit derived from a norbornene compound as the non-conjugated polyene with at least one specific vinyl group at the terminal and contains a specific hydrolyzable silyl group, and (B) a compound, other than the rubber (A1), having a hydroxyl group and/or a hydrolyzable group, e.g., (B1) a compound having a silanol group and/or a compound which can react with moisture to form a compound having a silanol group in the molecule. This compound improves elongation of the cured product and residual surface tackiness, and, at the same time, is high in curing speed and capable of giving the cured product of high resistance to weather. It is suitable for, e.g., adhesives, tackifiers, paints, sealants, waterproof materials, spray materials, shaping materials and casting rubber materials.

Abstract: A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130–250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.

Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits improved wetting and adherent properties to solder balls. The epoxy resin composition is used to cover and encapsulate a semiconductor chip, especially as no-flow underfill material, forming a highly reliable semiconductor device.

Abstract: A process for producing a silicone polymer comprising a step of subjecting, to hydrolysis and polycondensation reaction, a silane compound mixture containing 35 to 100% by mol of a silane compound represented by the general formula (I): R?m(H)kSiX4?(m+k)??(I) (wherein X is a hydrolysable and polycondensable group, e.g., a halogen atom (e.g., chlorine or bromine) or —OR; R is an alkyl group of 1 to 4 carbon atoms or an alkyl carbonyl group of 1 to 4 carbon atoms; R? is a non-reactive group, e.g., an alkyl group of 1 to 4 carbon atoms or an aryl group (e.g., a phenyl group); “k” is 1 or 2; “m” is 0 or 1; and “m+k” is 1 or 2), and further subjecting the resultant product to hydrosilylation reaction with a hydrosilylation agent.