Abstract: An epoxysiloxane condensate is modified by means of an in situ reaction with an organic compound, which is di-functional or multifunctional if warranted. By means of the disclosed method, the characteristics of epoxysiloxane condensates, epoxy resin mixtures, epoxy resin formulations and molded bodies manufactured therefrom can be varied easily and economically.

Abstract: A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an organic solvent, wherein if the sum of the epoxy resin and the curing agent is set to 100 parts by weight, the sum of the reactive silicone oil with an epoxy group and the triazinethiol is 2 to 30 parts by weight.

Abstract: There is provided (i) a resin additive able to impart superior thermal shock resistance even in the case of resins that have absorbed moisture, (ii) a curable resin composition capable of forming a cured resin that has superior thermal shock resistance even after absorbing moisture, and (iii) a cured resin that has superior thermal shock resistance even after absorbing moisture. The resin additive consists of a powder with a mean particle size of 0.1 to 100 &mgr;m of silicone rubber. It has a moisture absorption rate of 0.20 weight percent or less after being treated for 20 hours at a temperature of about 121° C., a pressure of two atmospheres, and a relative humidity of 100 percent. The curable resin composition contains the resin additive, and the cured resin is formed by curing the curable resin composition.

Abstract: A thermosetting resin composition obtained by heat treating, under the specified conditions, a mixture of a polyaddition thermosetting resin, a silicic compound (oligomer) having a functional group capable of causing an addition reaction with a curing agent for the polyaddition thermosetting resin, and water, followed by adding of a curing agent for the polyaddition thermosetting resin is useful for producing thermosetting resin molded articles, resin encapsulated semiconductor devices, automobile parts, etc., which are high in heat resistance, small in change of elastic modulus at high temperatures, and resistant to crack and peeling.

Abstract: A polymer composition comprises a polymer matrix and a siloxane-containing additive which is substantially incompatible with the polymer matrix, wherein the siloxane of the additive has a hydroxy, alkoxy or epoxy functionality, and a functionality which is capable of bonding with a silicone elastomer-forming composition which is curable by a hydrosilylation reaction. The polymer matrix preferably comprises polyphenylenesulphide, and the additive preferably comprises hydroxy-terminated methylvinyl siloxane. The composition is capable of forming plastics articles to which cured silicone elastomers can adhere.

Abstract: A stain/topcoat system for non-porous thermoset and/or thermoplastic articles comprises a pigmented stain, and a topcoat comprising one or more non-siloxane film-forming polymers, an emulsion of one or more curable organopolysiloxanes, a weatherability agent having a functional group that is reactive with carboxylate functional sites and water. The topcoat displays exceptional adhesion and weatherability to pigmented stained surfaces.

Abstract: A process for preparing a polymer composition useful as a prepreg comprises (a) melt-mixing at least one thermoplastic polymer above the glass transition temperature or melt temperature of the thermoplastic polymer with either (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst; (b) melt-mixing above the glass transition temperature or melt temperature of the thermoplastic polymer, the other of (i) an uncured epoxy resin or (ii) an epoxy curing agent or a catalyst to form a substantially uncured but essentially curable and/or polymerizable composition; (c) optionally forming a shaped product from the melt-mixed composition of (b); and (d) fast-curing and/or fast-polymerizing the optionally formed shaped product.

Abstract: A resin composition comprising (A) an aromatic polycarbonate resin or aromatic epoxy resin and (B) a minor amount of an organosiloxane containing phenyl and alkoxy radicals is flame retardant and does not emit harmful gases when burned. It can be molded into parts having optical transparency.

Abstract: A curable composition having an epoxy component and an organosilane component. The epoxy component includes at least one epoxy compound having two or more epoxide functional groups. The organosilane component includes at least one organosilane compound having two or more silyl ether groups. An exemplary organosilane compound is a siloxane-modified polyol.

Abstract: A polyether copolymer having a weight-average molecular weight of 10.sup.4 to 10.sup.7, comprising 5 to 40% by mol of a repeating unit derived from epichlorohydrin, 95 to 60% by mol of a repeating unit derived from ethylene oxide, and 0.001 to 15% by mol of a crosslinkable repeating unit derived from a reactive oxirane compound, gives a provide a crosslinked solid polymer electrolyte which is superior in processability, moldability, mechanical strength, flexibility and heat resistance, and has markedly improved ionic conductivity.

Abstract: The invention pertains to a powder lacquer composition containing epoxy-rtive polymers as binders and epoxy-functional siloxane resins as hardeners as well as additives, if required, such as pigments and/or fillers and/or thermal stabilizers and/or additives such as flow-promoting agents and de-gassing agents, whereby the hardener is a compound which is prepared by the hydrolysis and condensation of an organo-silane R.sub.2 SiX.sub.2 of an epoxy-functionalized silane.

Abstract: The present invention relates to a flexible industrial adhesive composition which effectively bonds thermoplastic polymer substrates and substrates having low stiffness such as fabric, rubbers and asphaltic materials, to materials selected from metals, fabrics, rubbers, engineered materials, and concrete, said flexible industrial adhesive composition comprising:(a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule;(b) a liquid amine terminated polyamide prepared by reacting at least one C.sub.18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1;(c) one or more optional polyamine(s); and(d) one or more optional filler(s);wherein the tensile modulus of the flexible industrial adhesive composition is less than 500,000 psi and the tensile elongation of the flexible industrial adhesive composition is greater than 10%.

Abstract: A silicone composition comprising (A) 100 parts by weight of a polydiorganosiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) 75 to 150 parts by weight of an organopolysiloxane resin having a number-average molecular weight of from 2,000 to 5,000 and consisting essentially of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units and SiO.sub.4/2 units wherein each R.sup.3 is independently selected from the group consisting of monovalent hydrocarbon and monovalent halogenated hydrocarbon groups free of aliphatic unsaturation, R.sup.4 is selected from the group consisting of R.sup.3 and alkenyl, the mole ratio of R.sup.3.sub.2 R.sup.4 SiO.sub.1/2 units to SiO.sub.4/2 units is from 0.6:1 to 1.1:1, and the resin contains an average of from 2.5 to 7.

Abstract: An adhesive binder for optical fiber packages is described which comprises a silicone-epoxy IPN (Interpenetrating Polymer Network), with the epoxy cured to give reinforcing domains within the cured silicone. The adhesive binder is prepared by cross-linking and polymerizing a silicone polymer and an epoxy resin, with a cross-linking agent and a catalyst for curing the epoxy and silicone, optionally with the addition of a silane wetting agent, such as methacryloxypropyl trimethoxysilane. In preparing a wound optical fiber package, the adhesive binder is applied in solution to the fiber, during its winding, by passing the fiber through the solution or by brushing the solution on each layer when its winding is completed.

Abstract: Resin composition for powder paints, that has an excellent curability and excellent electrostatic properties (wraparound) and that provides cured coatings having an excellent appearance, weathering resistance, and mechanical properties, comprising (A) epoxy-functional branched organopolysiloxane and (B) a compound bearing a functional group reactive with the epoxy group, wherein the component (A)/component (B) weight ratio is from 2/98 to 98/2, or comprising (A) epoxy-functional branched organopolysiloxane, (3) a compound bearing a functional group reactive with the epoxy group, and (C) a compound bearing a functional group reactive with the functional group in component (B), wherein the component (A)/(component (B)+component (C)) weight ratio is from 2/98 to 98/2.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, there are blended a salt of trimellitic anhydride with 1,8-diazabicyclo(5.4.0)undecene-7 as a curing accelerator and a mercapto-containing silane coupling agent. The composition is shelf stable and smoothly flowing and cures into a product having improved adhesion, moisture resistance and electrical properties. The composition is suitable for the encapsulation of semiconductor devices.

Abstract: This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.

Abstract: Curable compositions containing novel polysiloxanes having various reactive functional groups are disclosed. The curable compositions are useful as both ambient-cured and thermally-cured coating compositions which provide such properties as excellent appearance, mar resistance, acid etch resistance, adhesion, pot life, improved tack time, mar resistance and corrosion resistance.

Abstract: The present invention discloses non-hydrolyzable, block, (AB).sub.n A type, copolymers comprising alternating units of polysiloxane and amino-polyalkyleneoxide and provides a method for the preparation of these copolymers. Also provided is the use of these copolymers as softeners, in particular durable, hydrophilic textile softeners, which improve tactile properties of the textiles substrates treated with the commercial soil release finishes, without substantially detracting from their properties. The copolymers of the present invention have alternating units of polysiloxane [X(C.sub.a H.sub.2a O).sub.b R.sup.2 [(SiO(R.sup.1).sub.2 ].sub.c Si(R.sup.1).sub.2 R.sup.2 (C.sub.a H.sub.2a O).sub.b X] and polyalkyleneoxides [YO(C.sub.a H.sub.2a O).sub.d Y] wherein R.sup.1 is a C.sub.1 to C.sub.4 alkyl, preferably methyl, R.sup.

Abstract: The use of a thermosetting epoxy resin blend as a casting compound for electronic or electrotechnical components. The blend contains a silicone-modified epoxy resin in which organic components containing epoxy groups are chemically bonded to silicone components, and a mineral filler, optionally silanized, that regulates the thermal expansion behavior, in an amount of 40 wt % to 75 wt %, based on the thermosetting epoxy resin blend. The thermosetting epoxy resin blends are used to particular advantage for casting diodes.

Abstract: A non-tacky electrical stress control material comprisinga) about 100 parts of a resin component containing1) from about 20% to about 80% of an epihalohydrin polymer, and2) correspondingly, from about 80% to about 20% of an insulating silicone polymer having a tan .delta. of less than one,b) from about 10 to about 200 parts of a filler, said filler being nonconductive at room temperature, selected from the group consisting of barium titanate and hydrated aluminum silicate, andc) from 0 to 30 parts of a plasticizer.

Abstract: An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is an epoxy resin molding material for sealing electronic parts.

Abstract: This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula:(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.

Abstract: There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.

Abstract: A solvent-soluble siloxane polyimide comprising a copolymer obtained by reaction of a diamine compound mixture comprising a diaminopolysiloxane, an alicyclic diamine and an aromatic diamine with an aromatic tetracarboxylic acid anhydride, followed by polyimidization reaction of the resulting polyamic acid forms a heat-resistant adhesive by adding an epoxy resin, a diamine-based curing agent and an organic solvent thereto, The formed adhesives provides a distinguished curling resistance without any warp when the resulting siloxane polyimide soluble in ordinary organic solvents is used as a main component of the adhesive for bonding between a base material and a copper foil of a flexible printed substrate.

Abstract: Adhesive/adherend systems of this invention comprise a siloxane-modified adhesive component and a siloxane-modified adherend component. The siloxane-modified adhesive component is prepared by combining an epoxy resin with an organosilane ingredient, a polysiloxane resin, an amine hardener, an organometallic catalyst, a base catalyst, and any thickener and extender pigment. The siloxane-modified adherend component is prepared using a polysiloxane resin and may also contain other resins such epoxy, phenolic, polyester, vinyl ester, polyurethane, polyamide, melamine, furan, acrylate, thermoplastic polyvinyl chloride, polyethylene, polycarbonate, ABS, polystyrene, ethylene vinyl acetate, polyvinyl acetate, polyamide, and polypropylene resins.

Abstract: A primer composition contains (A) an organic silicon compound having a group of the formula: --CR.sup.2 R.sup.3 (CH.sub.2).sub.m COOR.sup.1, (B) an organic silane compound of the average compositional formula: R.sup.7.sub.b R.sup.8.sub.c (OR.sup.9).sub.d SiO.sub.(4-b-c-d)/2, (C) an organic silicon compound containing a SiH group, represented by the average compositional formula: R.sup.10.sub.e H.sub.f SiO.sub.(4-e-f)/2 and/or an organic silicon compound containing a SiH group and 1-4 divalent or trivalent aromatic rings or a C.sub.2 -C.sub.30 alkylene group, and (D) an epoxy resin. The primer composition assists in the adhesion of silicone elastomers to metallic and plastic substrates and is useful as adhesive.

Abstract: Disclosed is a blend capable of forming a semi-interpenetrating network when cured of (A) a solution of about 30 to about 50 wt % solids in an organic solvent of a fully imidized polyimidesiloxane and (B) about 5 to about 30 pbw per 100 pbw of the polyimidesiloxane of an epoxy resin which comprises a cycloaliphatic epoxy and an epoxy curing agent. The polyimidesiloxane is the reaction product of an aromatic dianhydride and diamine. The diamine is about 5 to about 80 mole % non-siloxane containing aromatic diamine and the remainder a siloxane diamine, where the siloxane diamine is about 40 to about 80 wt % of the weight of the polyimidesiloxane. The blend is used to bond metal parts to ceramic packages.

Abstract: This invention relates to resin solution compositions for electronic materials consisting of organic solutions of 100 parts by weight of siloxanepolyimidepolyamic acid copolymers composed of imide segments formed by polycondensation of aromatic tetracarboxylic acid dianhydrides and siloxanediamines and amic acid segments formed by polyaddition of aromatic tetracarboxylic acid dianhydrides and aromatic diamines other than siloxanediamines and represented by the following general formula (1) (in which X is the residue of an aromatic tetracarboxylic acid dianhydride, Y is the residue of a siloxanediamine, Z is the residue of an aromatic diamine, l and m are integers independent of each other, and n is an integer of 1 or more) and 1 to 50 parts by weight of epoxy resins. The compositions are storage-stable and curable at relatively low temperature and yield cured products with an excellent balance of heat resistance, high-frequency characteristics, chemical resistance and stress relaxation characteristics.

Abstract: A resin composition for sealing liquid crystal cells which contains as essential components a rubber-modified unsaturated compound obtained by grafting a monomer having at least one polymerizable ethylenically unsaturated bond in a molecule with at least one rubber selected from acrylic rubber, silicone rubber, urethane rubber and conjugated diene rubber, and a coupling agent, a filler and a photopolymerization initiator. The rubber contained in the rubber modified unsaturated compound has a particle diameter of 0.2-5 .mu.m and a number average molecular weight of 1000-100,000, and the rubber content in the compound is 0.5-45% by weight based on the rubber modified unsaturated compound.

Abstract: A curable epoxy resin composition comprising (A) a curable epoxy resin and (B) an organopolysiloxane prepared by equilibrium polymerization and having the average unit formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.din which R.sup.1 is an epoxy-functional monovalent organic group, R.sup.2 is a monovalent hydrocarbon group, R.sup.3 is a hydrogen atom or an alkyl group having no more than 4 carbon atoms, a>0, b>0, d>0 and c.gtoreq.0.

Abstract: A curable resin composition containing (a) an oxyalkylene polymer which comprises at least one silicon-containing group having at least one hydroxyl or hydrolyzable group bonded to a silicon atom, (b) an epoxy resin, (c) a ketimine compound and (d) a carbonyl compound, which has improved storage stability.

Abstract: An image receptor sheet or web material carrying a layer with a polymeric binder on a support wherein the polymeric binder is at least 50% by weight of a polysiloxane modified resin and comprises polymeric moieties derived from polyesters or addition polymers with an acid value or hydroxy value between 2 and 50 mg KOH/g of polymer and the polysiloxane moieties are derived from epoxy-terminated polysiloxanes.

Abstract: A curable composition containing a curable liquid-form organopolysiloxane composition and a curable liquid-form organic resin composition. The organic resin composition is contained as liquid particles in the organopolysiloxane composition. A cured product formed by curing the abovementioned curable liquid composition such that the cured product contains fine particles of a cured organic resin in a cured organopolysiloxane matrix. An electronic part which is covered by the cured product of the abovementioned curable liquid-form composition.

Abstract: A composition of matter comprising:(a) about 60 to about 99 parts by weight of a curable epoxypolyorganosiloxane;(b) about 1 to about 40 parts by weight of a crosslinkable silicone hydride resin having no epoxy functionality; and(c) about 0.1 to about 5 parts by weight of an curing agent, which, upon exposure to actinic radiation is capable of curing components (a) and (b);wherein the total amount of components (a) and (b) is 100 parts by weight and wherein said composition demonstrates surface release properties when coated and cured onto a substrate is provided. The composition is particularly useful in articles of manufacture where release properties are desired.

Abstract: A curable resin composition is provided which insures good curability even without using an aminoplast curing agent and has an excellent high-solid feature. The composition comprises 5 to 80 weight % of a polymer containing free and esterified carboxyl groups and having an acid value of 50 to 300 mg KOH/g (1e), 1 to 80 weight % of a polymer containing hydroxyl and epoxy groups and having an epoxy equivalent of 200 to 1000 and a hydroxyl equivalent of 250 to 1500 (2d), and 1 to 50 weight % of a silicone polymer containing epoxy and/or alkoxyl groups (3a).

Abstract: A catheter and/or balloon for a medical catheter is formed from a blend of polymeric components, including a first crystalline polymeric component and a second softening polymeric component. The polymeric material can also include a third compatibilizing agent to facilitate blending the first two polymeric components together. The first polymeric component can be a polyester or a polyamide, and the second polymeric component can be a polyolefin, or an ethylene copolymer. The third polymeric component is preferably an ethylene copolymer containing a reactive group that forms a covalent bond with the first polymeric component. The polymeric material forming the balloon or catheter also can include a catalyst to catalyze a reaction between the compatibilizing ethylene copolymer and the second polymer component.

Abstract: The disclosed organo-polysiloxane derivative is useful as a dispersing agent for homogeneously dispersing a silicone gel in a curable resin such as an epoxy resin. The organo-polysiloxane derivative is prepared by first reacting an organo-polysiloxane compound A having an active hydrogen-containing group in each of its both terminals and having from 5 to 70 siloxane bonds with a bifunctional organic compound B having two functional groups reactable with active hydrogen. The reaction mixture obtained in the first reaction is reacted with a mixture of a bifunctional organic compound C having two active hydrogens and a bifunctional organic compound D having two functional groups reactable with the active hydrogen.

Abstract: A process for activating double metal cyanide catalysts is disclosed. A polyol starter or starter/catalyst mixture is heated under vacuum under conditions effective to achieve improved stripping compared with that which can be achieved through conventional vacuum stripping. Coupling vacuum stripping with inert gas sparging or stripping in the presence of an organic solvent gives a starter/catalyst mixture that activates rapidly in an epoxide polymerization process. Rapid activation makes process start-ups reliable and reduces cycle time. The process gives polyols with lower viscosity, lower polydispersity, and lower unsaturation for better polyurethanes.

Abstract: Disclosed is a curable resin composition which can be applied for various uses such as top-coating compositions for cars, coating compositions for exterior walls of constructions, heat-resistant coating compositions, adhesives, ink compositions, compositions to be infiltrated into fibers and paper, and surface-treating compositions. The composition comprises (A) a resin obtained by condensation of a polymer having both a hydrolyzable silyl group and a particular functional group except such a hydrolyzable silyl group, and a particular polysiloxane, and (B) a compound capable of reacting with the functional group existing in the resin (A).

Abstract: Novel rubber-modified rigid silicone resins a novel method of making the same are disclosed. The resins are the copolymerized reaction product of (A) an organosilicon composition selected from the group consisting (I) an organosilicone resin, (II) hydrolyzable precursors of (I), and an hydrolyzate of (II) and (B) an silicone rubber. In the method of the invention, the copolymerization step is carried out in an organic solvent, preferably utilizing a relatively weak condensation catalyst. Thereafter, the solution is devolatilized and the composition cured by heating.

Abstract: Condensation-curable coating compositions are prepared from a mixture of and organic resin (A) and a flurosilicone (B). Water or an organic solvent may be used to provide a vehicle for application of the composition. The cured coatings of the invention exhibit superior water and oil repellency.

Abstract: A coating agent composition comprising:(A) an organic resin, and(B) a silicone compound represented by the average composition formula (1):(X).sub.a (Y').sub.b (R.sup.1).sub.c SiO.sub.(4-a-b-c)/2 (1)wherein X is a particular functional group containing organic group, Y' is a hydrolyzable group or an admixture of a hydrolyzable group and the silanol group, R.sup.1 is a monovalent hydrocarbon group, a ranges from 0.05 to 0.90, b 0.12 to 1.88, and c 0.10 to 1.00, a+b+c being in the range of 2.02 to 2.67. The amount of the silicon atoms to which said functional group-containing organic group x is bonded is 5 to 90 mol % based on the entire silicon atoms, and the amount of the T unit of R.sup.1 --SiO.sub.3/2 is 10 to 95 mole % based on the entire siloxane units. This composition is useful to form a coating film excellent in weathering resistance, adhesion, stain resistance, scuffing resistance, water resistance and chemical resistance and therefore suitable for protection of articles exposed outdoors.

Abstract: The present invention discloses non-hydrolyzable, block, (AB).sub.n A type, copolymers comprising alternating units of polysiloxane and amino-polyalkyleneoxide and provides a method for the preparation of these copolymers. Also provided is the use of these copolymers as softeners, in particular durable, hydrophilic textile softeners, which improve tactile properties of the textiles substrates treated with the commercial soil release finishes, without substantially detracting from their properties.The copolymers of the present invention have alternating units of polysiloxane ?X(C.sub.a H.sub.2a O).sub.b R.sup.2 ?(SiO(R.sup.1).sub.2 !.sub.c Si(R.sup.1).sub.2 R.sup.2 (C.sub.a H.sub.2a O).sub.b X!and polyalkyleneoxides ?YO(C.sub.a H.sub.2a O).sub.d Y!wherein R.sup.1 is a C.sub.1 to C.sub.4 alkyl, preferably methyl, R.sup.

Abstract: A non-tacky electrical stress control material comprisinga) about 100 parts of a resin component containing1) from about 20% to about 80% of an epihalohydrin polymer, and2) correspondingly, from about 80% to about 20% of an insulating silicone polymer having a tan .delta. of less than one,b) from about 10 to about 200 parts of a filler, said filler being nonconductive at room temperature, selected from the group consisting of barium titanate and hydrated aluminum silicate, andc) from 0 to 30 parts of a plasticizer.

Abstract: A mold release agent containing (A) a silane compound, (B) a silicon and/or fluorine-containing compound having at least two hydroxyl groups or alkoxy groups in one molecule and (C) a polymer of a perfluoroalkyl group-containing (meth)acrylate ester gives a long mold release life and a good surface finishing property of a molded article, and does not exert a harmful influence on fabricability such as painting and adhesion of the molded article.

Abstract: Polysiloxane-polyoxyethylene-polyoxypropylene triblock copolymers having the general formula: ##STR1## as well as compounds for the defoaming of aqueous dispersion paints that are disclosed contain the copolymers as effective defoaming components.

Abstract: A heat resistant resin composition comprising, as the main components,(A) 100 parts by weight of an organic solvent-soluble polyimide resin having a glass transition temperature of 350.degree. C. or less,(B) 5 to 100 parts by weight of an epoxy compound having at least two epoxy groups in one molecule, and(C) 0.1 to 20 parts by weight of a compound having an active hydrogen group which can react with the epoxy compound (B),a heat resistant film adhesive comprising, as the main components, the above components (A), (B) and (C), and a process for producing a heat resistant film adhesive by casting a solution of the above heat resistant resin composition on one side or both sides of a support.

Abstract: An epoxy resin composition for encapsulating semiconductors containing 5 to 50 parts by weight of a silicone-based flexibility imparting agent, 100 parts by weight of an epoxy resin containing at least two epoxy groups in one molecule thereof, 50 to 150 parts by weight of a curing resin including a phenolic resin, and 200 to 1,000 parts by weight of an inorganic filler.

Abstract: Proposed is a novel organopolysiloxane composition in the form of a water-base emulsion suitable for use as a surface-coating agent on rubber articles such as automobile parts to impart excellent smoothness of the surface, abrasion resistance, adhesion to the rubber surface and so on. The composition comprises: (a) an organopolysiloxane having a viscosity of at least 10000 centipoise at 25.degree. C. and having a molecular structure consisting of the difunctional siloxane units and the trifunctional siloxane units terminated at each molecular chain end with a hydroxy group, in the form of an aqueous emulsion; (b) a hydrolysis-condensation product of an epoxy group-containing dialkoxy silane in the form of an aqueous emulsion; (c) a water-soluble organic amino compound having at least two amino groups in a molecule and containing no silicon atom; and (d) silicone rubber particles in the form of an aqueous dispersion, each in a specified weight proportion.