Abstract: Epoxy resin compositions for sealing semiconductor elements are disclosed and include an epoxy resin, a maleimide-modified siloxane compound represented by the formula (1) and an allylphenol-novolac resin represented by the formula (2) as a curing agent, and demonstrate low stress, high heat resistance and moldability. ##STR1## wherein, R.sub.1 denotes a methylene group a phenylene group or a substituted phenylene group,R.sub.2 denotes a methyl group, a phenyl group or a substituted phenyl group,n denotes 1 when R.sub.1 denotes phenylene or substituted phenylene groups, or 3 or 4 when R.sub.1 denotes a methylene group,m denotes an integer of from 1 to 100,l denotes an integer of from 1 to 100, and.kappa. denotes an integer of from 1 to 100.

Abstract: A thermosetting resin composition contains (A) a mixture of an imide compound having an allyl-free maleimide group and an imide compound having an allyl-containing imide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organo-polysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having a double bond conjugated with an aromatic ring. The composition is easily workable and well adhesive and cures to products having improved mechanical strength, hot-water resistance, low thermal expansion, and minimized water absorption.

Abstract: Disclosed is a polysilane having a repeating unit represented by general formula (1) given below. Also disclosed is a polysilane composition, comprising a polysilane having a repeating unit represented by general formula (2) given below and a cross linking agent: ##STR1## where, each of R.sup.1 and R.sup.3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms or a substituted or unsubstituted aryl group having 6 to 24 carbon atoms; R.sup.2 is a divalent hydrocarbon group having to 24 carbon atoms which can be substituted; R.sup.4 is a covalent bond, or a substituted or unsubstituted alkylene group having 1 to carbon atoms, or a substituted or unsubstituted arylene group having 6 to 24 carbon atoms; each of R.sup.5 to R.sup.9 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, or hydroxyl group, at least one of R.sup.5 to R.sup.

Abstract: Disclosed is a curable resin composition comprising (a) 100 parts by weight of a siloxane-amide block copolymer of formula (1): ##STR1## where R.sup.1 is a substituted or unsubstituted divalent hydrocarbon group; R.sup.2 may be the same or different and each is a substituted or unsubstituted monovalent hydrocarbon group; R.sup.3 is substituted or unsubstituted divalent aromatic hydrocarbon group; and m and an each are a number of 1 or more; (b) from 1 to 100 parts by weight of a crosslinking agent containing 2 or more epoxy groups in the molecule, and (c) up to 15 parts by weight of a curable catalyst. The composition can be cured at room temperature and in the absence of moisture in a closed system to give a cured product having high oil resistance and mechanical strength.

Abstract: An epoxy resin molding material for sealing of electronic components comprising(A) an epoxy resin;(B) a phenolic compound;(C) a resin mixture obtained bydispersing, in a form of particulates, in a dispersion medium which is a portion or all of at least one of the epoxy resin and the phenolic compound, a mixture of a vinyl group-containing organopolysiloxane and a .tbd.SiH group-containing organopolysiloxane whose total volatile loss after heating at 105.degree. C. for three hours is not more than 3% by weight, and allowing the vinyl group-containing organopolysiloxane and the .tbd.SiH group-containing organopolysiloxane to react with each other and to cure; and(D) an inorganic filleris excellent in thermal shock resistance, soldering resistance, moisture resistance, thermal stability, moldability and marking properties.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.

Abstract: The present invention relates to a process for bonding a molded article of a thermoplastic saturated norbornene resin in which when the molded article is bonded to an adherend widely different from the molded article in coefficient of linear expansion, the adhesion surface of the molded article and that of the adherend are stuck together with an adhesive composed mainly of an epoxy resin which has an elasticity (Shore hardness D: about 40 or less) imparted by modification with a polymer having reactive silyl groups, and then the adhesive is cured. Thus, there is provided such an excellent bonding process that the adhesive strength is hardly deteriorated by a temperature change.

Abstract: An epoxy resin composition for encapsulating a semiconductor device includes a flexibilizer constituted by a pre-reaction product of an epoxy resin and a modified silicone oil having hydroxyphenyl groups, as well as a flexibilizer constituted by a pre-reaction product of a phenol resin and a modified silicone oil having epoxy groups. Furthermore, an epoxy resin is used as a chief material, and a curing agent is added. The epoxy resin composition is heat resistant and moisture resistant, and has a low modulus of elasticity, a low coefficient of expansion, and a high glass transition temperature equivalent to or higher than that of a conventional epoxy resin composition.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer wherein component (B) and/or (C) has a double bond conjugated with an aromatic group and component (B) and/or (C) has a naphthalene ring. The composition is easily workable and cures to products having improved adhesion, heat resistance, low thermal expansion, and low water absorption.

Abstract: An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

Abstract: A curable resin composition has a low viscosity, hence is easy to handle, before curing and, after curing, gives cured products having good tensile characteristics and, in addition, good chemical resistance and water resistance. This composition includes (A) an oxypropylene polymer having at least one silicon atom-containing group having a hydroxyl group or hydrolyzable group bound to the silicon atom and having an Mw/Mn ratio of up to than 1.6 and a number average molecular weight of at least 6,000, and (B) an epoxy resin.

Abstract: There is disclosed a novel epoxy-modified branched epoxy copolymerizate which can be copolymerized with other thermoplastics, such as polycarbonates, to modify melt flow.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.

Abstract: A polysiloxane-modified epoxy-based encapsulation composition comprising an epoxy resin, a curing agent for the epoxy resin, a polylactone-polysiloxane block copolymer, and a filler is described. The powder molding compositions provide a low internal stress epoxy composition without significantly sacrificing T.sub.g.

Abstract: There is disclosed a method for forming a solid, epoxy-functional silicone resin by hydrolyzing and condensing a mixture of at least one organoalkoxysilane and a beta-(3,4-epoxycyclohexyl)-functional trialkoxysilane in the presence of an organotitanate catalyst. The silicone resins prepared according to the instant method find utility in the formulation of powder coatings, either alone or in combination with organic resins.

Abstract: The invention provides a method of producing a controlled release surface for use with a pressure sensitive adhesive by using an epoxy-functional silicone resin in an addition curable silicone release coating composition. More particularly the epoxy-functional silicone resin contains tri- or quadri-functional siloxane units, for use in a vinyl-functional base silicone release coating, thereby providing a thermal and addition curable, controlled release coating composition.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical,n denotes 0 or an integer of 1 above.

Abstract: The invention provides a method for making an epoxysilicone compound through the hydrosilation addition reaction between an ethylenically unsaturated epoxide and an SiH-containing silicon to produce an epoxysilicone product, and catalyzed by a regiospecific hydrosilation catalyst which does not also promote an oxirane ring-opening polymerization reaction in either the ethylenically unsaturated epoxide starting compound or in the epoxysilicone hydrosilation reaction product. The invention also provides a hydrosilation catalyst with the above catalytic properties as well as an epoxysilicone composition made by the above method.

Abstract: The invention provides a process for producing epoxy-functional silicones by a rhodium metal complex-catalyzed hydrosilation reaction between an SiH-containing silane or siloxane and an olefin epoxide, in the presence of a tertiary amine stabilizer. In practicing the invention, RhCl.sub.3 [(CH.sub.3 (CH.sub.2).sub.3).sub.2 S].sub.3 or PtCl.sub.2 [(CH.sub.3 CH.sub.2).sub.2 S].sub.2 are suitable hydrosilation catalysts and methyldicocoamine, CH.sub.3 (C.sub.18 H.sub.37).sub.2 N, is a suitable stabilizer. The invention also provides for a composition including an SiH-functional silane or siloxane, and a tertiary amine, where the composition is not susceptible to gelation during a hydrosilation addition reaction. The invention further provides a method for stabilizing epoxysilicones both during and after the hydrosilation addition reaction used in their production.

Abstract: A polyarylene sulfide resin composition obtainable by mixing and reacting(A) 99 to 60 parts by weight of a polyarylene sulfide resin,(B) 1 to 40 parts by weight of a polyorganosiloxane rubber, in which 0.1 to 20 wt. % of a siloxane compound represented by the following formula (I):HS(CH.sub.2).sub.p --SiR.sub.n (OR').sub.3-n (I)wherein R represents a methyl, ethyl, propyl or phenyl group, R' represents a methyl or ethyl group, n represents an integer of 0, 1 or 2, and p represents an integer of 1 to 6, are copolymerized, having an average particle size of 0.1 to 0.5 .mu.m and a degree of swelling of 3 to 50 measured by immersing in toluene, or a polyorganosiloxane graft copolymer prepared by graft-polymerizing a monomer comprising at least one of an unsaturated carboxylic acid and its anhydride to a polyorganosiloxane rubber having an average particle size of 0.1 to 0.5 .mu.m and a degree of swelling of 3 to 50 measured by immersing in toluene,(C) 0.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, plasticizer and a high performance epoxy resin selected from a group consisting of epoxy resins represented by the formulas (I-a), (I-b) and (I-c) is disclosed.Use of the high performance epoxy resin in an amount of from 0.1 to 20.0% by weight improves the heat and moisture resistance of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 represent independently H or (CH.sub.2) nCH.sub.3 radical, andn represents 0 or an integer of 1 above.

Abstract: A polyimidosiloxane material useful for forming, on a flexible substrate material, a flexible protective coating layer with a high heat resistance, electrical insulating property and curl-resistance, comprises a polymerization-imidization product of an aromatic tetracarboxylic acid component comprising, as a principal ingredient, 2,3,3',4'-biphenyltetracarboxylic dianhydride with a diamine component comprising, as a principal ingredient, a diaminopolysiloxane compound of the formula (I) ##STR1## wherein R.sub.1 is a divalent hydrocarbon residue, R.sub.2 is an C.sub.1-3 alkyl or phenyl group, n is an integer of 3 to 30, and is preferably used, optionally together with an epoxy resin, in the form of a solution or dispersion in an organic solvent to coat a flexible substrate material, for example, a flexible circuit element, therewith.

Abstract: A polyorganosiloxane series thermoplastic resin comprising a graft copolymer obtained from a vinyl monomer and a modified polyorganosiloxane, and a thermoplastic resin composition containing the same. The resin and the composition thereof have excellent slidability, abrasion resistance, weather resistance, cold resistance and impact resistance, and can be applied to new fields such as sliding parts, parts for cold district, outdoor parts, etc.

Abstract: Disclosed herein are polyurethane compositions specifically adapted to produce non-porous membranes exhibiting waterproof and water vapor transmissible characteristics. The membranes can be produced as free standing products or can be produced as coatings on porous substrates to confer similar properties to such substrates. Also disclosed are coated fabrics and fabric laminates utilizing the membranous coatings of the invention and exhibiting waterproof and water vapor transmissible characteristics. Such coated fabrics and fabric laminates find utility in the fabrication of tenting, rainwear and other garments where waterproofness, coupled with breathability, are important features.

Abstract: New silanes containing at least two oxazolidinic moieties can be defined by means of the general formula: ##STR1## wherein X.sub.1, X.sub.2, X.sub.3 and X.sub.4 have the meaning as reported in the specification, and each one of A.sub.1, A.sub.2 and A.sub.3 represents from 0 to a plurality of siloxane radicals--SiO--and are better defined in the text of the specification.These compounds are useful as crosslinking agents for moisture-hardening systems based on polyisocyanates, of acrylate polymers and of polyepoxides in compositions for coatings, sealants and adhesive agents.

Abstract: Novel linear polysiloxane-polyacetone block copolymers are useful as surface modifying additives due in part to their miscibility with a wide variety of base polymers. A particularly preferred polysiloxane-polycaprolactone linear blocked copolymer is miscible with nylon and is useful for forming surface modified nylon products.

Abstract: A curable polyimide resin is blended with (a) an organic silicon compound having a functional group selected from an epoxy group and an amino group or (b) a copolymer of an aromatic polymer and an organic silicon compound. The resulting polyimide resin composition can be cured without inducing a crack. It is suitable for the encapsulation of semiconductor devices as well as for molding and powder coating.

Abstract: The invention concerns a reticulable polymer for use in non-linear optics, the polymer being constituted of a skeleton to which side chains are attached; one chain ensures the amorphous nature of the polymer, the skeleton consisting of polyacrylic, polystyrene or polysiloxane, and a second side chain able to generate non-linear optical effects and terminating in a heat or photochemically reticulable group.

Abstract: A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.

Abstract: A polyarylene sulfide resin composition comprising a compound obtained by mixing 60-99 parts by weight of a polyarylene sulfide resin (A), 40-1 parts by weight of a polyorganosiloxane rubber (B), 0.01-10 parts by weight of an organosilane compound having at least one epoxy group and at least one alkoxy group bonded directly to a silicon atom (C) and 0-300% by weight of a reinforcing filler (D) based on the total weight of the components (A), (B) and (C) where the total amount of the components (A) and (B) is 100 parts by weight. The polyarylene sulfide resin composition is excellent in impact resistance, heat resistance, mechanical strength, moldability and the like.

Abstract: A modified epoxy resin of the general formula (I) is prepared by dissolving an epoxy resin in a solvent, adding the mixture to allyl magnesium halide at -70.degree. C. under a nitrogen atmosphere, and removing the solvent and salts from the resultant product. The modified epoxy resin is useful for epoxy maleimide resin compositions as a heat resistance enhancer. An epoxy resin composition for sealing semiconductor elements comprising the modified epoxy resin as a heat resistance enhancer is an amount of from 0.1 to 30% by weight, based on the total weight of the composition, is also provided. ##STR1## wherein, R represents H or C.sub.1 to C.sub.10 -alkyl group and m represents an integer of 0 to 100 and n represents an integer of 1 to 100.

Abstract: Compounds are prepared which contain both an organosiloxane moiety and either a phenolic hydroxyl group or an epoxide group. Also disclosed are curable and cured compositions.

Abstract: Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R.sup.1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.

Abstract: An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

Abstract: A polylactone-modified organopolysiloxane compound, wherein a polylactone-containing group represented by the formula (I) is bound to a silicon atom located at at least either of the terminal positions and/or intermediate positions to impart excellent properties as a synthetic resin modifier (when Y in (I) is an acetyl group or a hydrogen atom) or as a film former (when Y in (I) is a hydrogen atom): ##STR1## wherein Z represents a trivalent hydrocarbon residue which may contain oxygen, sulfur or/and nitrogen atom(s); X represents a lactone group of the formula, ##STR2## (wherein R represents a hydrogen atom or an alkyl group containing from 1 to 12 carbon atoms; a represents an integer from 4 to 6), k and L each represents an integer of 1 or more; and Y represents a hydrogen atom or an acetyl group.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, and a copolymer mixture comprising a long-chain organopolysiloxane copolymer [I] and a short-chain organopolysiloxane copolymer [II] which are each prepared by the addition reaction of an alkenyl-containing epoxy resin with a long-chain or short-chain organopolysiloxane containing pendant phenyl groups at a weight ratio of [II] to [I] of 0.3 to 0.6 is disclosed. The epoxy resin composition exhibits excellent printability, crack resistance, and moldability properties.

Abstract: An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.

Abstract: A homogeneous composition having improved curability contains an organopolysiloxane having at least two carboxyl group-containing hydrocarbon groups in each molecule, a polymeric compound which contains at least 2 hydroxyl groups and at least one oxyalkylene unit and a catalytic quantity of an esterification reaction catalyst. The curable composition has good standing compatiblity and experiences a high degree of curing. When cured the composition is useful, for example, as an antistatic additive.

Abstract: An epoxy resin composition for encapsulating a semiconductor device comprises a flexibilizer obtained by pre-reaction of an epoxy resin and at least one modified silicone oil having the formula: ##STR1## where R.sub.1, R.sub.3, and R.sub.4 are divalent organic groups; R.sub.21, R.sub.22, R.sub.23, R.sub.24, R.sub.25, R.sub.26, and R.sub.27 are respectively selected from the group consisting of an alkyl group having from 1 to 5 carbon atoms, a hydroxyalkyl group having from 1 to 5 carbon atoms, an alkoxy group having from 1 to 5 carbon atoms, a phenyl group, and a fluorine-substituted alkyl group having from 1 to 5 carbon atoms; a is an integer from 10 to 300; and b is an integer from 2 to 10, in which 0.ltoreq.b/(a+b).ltoreq.0.32, and wherein the equivalent ratio of phenolic hydroxyl groups in said modified silicone oil to epoxy groups of the epoxy resin of the flexibilizer is from 0.001 to 0.4:1; an epoxy resin other than the flexibilizer; and a curing agent.

Abstract: A polyorganosiloxane series thermoplastic resin comprising a graft copolymer obtained from a vinyl monomer and a modified polyorganosiloxane, and a thermoplastic resin composition containing the same. The resin and the composition thereof have excellent slidability, abrasion resistance, weather resistance, cold resistance and impact resistance, and can be applied to new fields such as sliding parts, parts for cold district, outdoor parts, etc.

Abstract: An epoxy resin composition for semiconductor sealing, comprising as essential components:(A) an epoxy resin,(B) a phenolic resin curing agent comprising 30-100% by weight, based on the total amount of the phenolic resin curing agent, of a silicone-modified phenolic resin curing agent obtained by reacting a phenolic resin with at least one of silicone compounds represented by the following formulas [I] and [II] ##STR1## wherein ##STR2## A: --R--COOH, ##STR3## or H, R: a lower alkylene group,10.ltoreq.N=l+m+n+2.ltoreq.200,0.ltoreq.m/N.ltoreq.0.1, and 5.ltoreq.N/n.ltoreq.50,(C) an inorganic filler, and(D) a curing accelerator.

Abstract: This invention relates to certain new high modulus silicones, toughened epoxy thermoset resin systems made from those silicones, and composites that are prepared from the new toughened epoxy resin systems. The silicone resins are specifically monophenyl-containing polysiloxanes.

Abstract: There is provided a curable composition, comprising:A. a heterocyclic compound selected from the group consisting of epoxy-functional silicones, epoxy-functional acrylic polymers, and monomers selected from the group consisting of tetrahydrofurans, oxetanes, lactones, spirocarbonates, spiroesters, cyclic sulfur and cyclic nitrogen compounds;B. an Si-H functional silicon compound; andC. a platinum catalyst.There is further provided a method for polymerizing a heterocyclic compound using a platinum catalyst.

Abstract: A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.

Abstract: A process for preparing a modified resin and an epoxy resin composition for use in semiconductor encapsulation which comprises providing a quantity of epoxy resins, synthetic rubber compounds, and hydroxy modified polysiloxanes, reacting the epoxy resins with the synthetic rubber compounds, and reacting the resultant product of the initial reaction with the hydroxy modified polysiloxanes, the epoxy resin composition comprising 0.1-10% by weight of the modified resin, epoxy resin, curing agent, catalyst, releasing agent, coupling agent, and fibers.

Abstract: A silicone-epoxy resin composition comprising(A) 100 parts by weight of a curable epoxy resin,(B) 1-100 parts by weight of an epoxy resin-modified silicone resin obtained by a condensation reaction of 1-99 mole % of an epoxy resin having at least one hydroxyl group and at least one epoxy group and 1-99 mole % of an organosiloxane or organosilane compound represented by the general formula ##EQU1## wherein R.sup.1 represents a monvalent hydrocarbon group or a halogenated monovalent hydrocarbon group, R.sup.2 represents a hydrogen atom or a monovalent aliphatic hydrocarbon group, is a number ranging from 1 to 1,500; n is a number ranging from 0.9 to 3; and m is a number ranging from 0.05 to 3.1 with a proviso that the sum of m+n is not greater than 4, and(c) 1-100 parts by weight of an epoxy-modified polysiloxane having an epoxy equivalent ranging from 1,000 to 20,000, represented by the general formula ##STR1## wherein R.sup.3, R.sup.4, R.sup.5, R.sup.6, and R.sup.

Abstract: A cross-linked low surface adhesion composition, that can be utilized as either an electrographic toner powder or as an additive for conventional electrographic toner powder, exhibits improved transfer and contributes to an increase in the useful life of the developer. The low surface adhesion composition employs a silicone resin and a polyester resin cross-linked with a polyfunctional epoxy novolac resin.

Abstract: The curable resin composition of the present invention consists of a curable resin having uniformly dispersed therein particles of a cured silicone rubber obtained from an organosiloxane composition curable by a platinum-catalyzed hydrosilation reaction, wherein said organosiloxane composition contains reaction products of an ethylenically unsaturated epoxy compound and an ethylenically unsaturated aromatic compound with the organohydrogenpolysiloxane present in said organosiloxane composition. Either or both of the epoxy compound and the aromatic compound can be prereacted with a portion of the silicon-bonded hydrogen atoms of the organohydrogenpolysiloxane.

Abstract: This invention provides a mold release composition copmrising (1) a compound or a polymer having at least one of perfluoroalkyl groups having 4 to 20 carbon atoms and perfluoroalkenyl groups having 4 to 20 carbon atoms, and (2) a ladder polymer of organosilsesquioxane.