Abstract: An epoxy resin molding material comprising an epoxy resin, a phenolic resin and a powder flexibilizer which has a core-shell structure composed of a solid silicone core and an organic polymer shell is a reliable epoxy resin molding material for sealing electronic parts which is excellent in, for example, thermal shock resistance and reflow soldering resistance, and is free from the troublesome deterioration in, for example, the appearance and marking properties of molded products, and to provide a semiconductor sealed by the molding material.

Abstract: A curable composition comprising an aged mixture of tetramethoxysilane with water added in excess of the theoretical amount sufficient for the hydrolysis and condensation of 100% of the silane and a reactive organic compound having at least two functional groups capable of condensing with the product of hydrolysis and condensation of the silane in the above mixture.

Abstract: Solventless, thermoplastic silicone pellets are prepared blending silicone resins (A) of the MQ-type and with predominantly linear silicone fluids (B), such as polydimethylsiloxane liquids and gums, to substantially homogeneity. The blends are heated to a predetermined compression-forming temperature, compression-formed to a densified mass and shaped into a pellet form. The composition of the pellets is balanced such that the pellets exhibit plastic flow at the predetermined compression-forming temperature and resist agglomeration at temperatures at or below a predetermined maximum storage temperature.

Abstract: A silicone-modified water-based coating composition is disclosed wherein a suspension of silicone rubber particles in water is added to a water-based coating composition such that the resulting system is storage-stable and forms a mat film when dried or cured, which film is soft to the touch.

Abstract: Resins having a group reactive with an isocyanate group on a side chain are modified with isocyanatosiloxanes. In one form, the isocyanatosiloxane is a single end isocyanatosiloxane obtained by effecting addition reaction between a single end hydrogenosiloxane and an isocyanate group-containing organic silicon compound having one isocyanate group and at least one aliphatic unsaturated hydrocarbon group. A single end isocyanatosiloxane obtained by introducing an isocyanate group into a single end primary aminosiloxane is also useful. In another form, the isocyanatosiloxane is a polyfunctional isocyanatosiloxane which is obtained by effecting addition reaction between a hydrogenosiloxane having at least two SiH groups and an isocyanate group-containing organic silicon compound having one isocyanate group and one aliphatic unsaturated hydrocarbon group.

Abstract: A heat ablative coating composition is prepared by combining an epoxy silane resin, an epoxy resin, a silicone intermediate, a silicon-modified polyether, an aminosilane, at least one organometallic catalyst, at least one organic solvent, water, at least one filler, optional nonsilicon-containing amine catalyst, and optional pigments and thixotropic agents. The heat ablative coating composition is applied to a substrate to form a film having a build thickness in the range of from about 0.1 to 0.5 inches that is capable of curing at ambient outdoor temperature in about seven days, depending on ambient conditions. The heat ablative film so formed is designed to undergo a slow thermal decomposition when exposed to high temperature conditions without igniting or causing excessive smoke, and is designed to have good thermal conductivity to protect the underlying substrate from thermal decomposition.

Abstract: The present invention provides curable resin compositions containing finely divided particles of a cured organosiloxane material with microparticles of silica bound to the surfaces of the particles. The particle size of the cured organosiloxane material and the particle size and properties of the silica are within specified limits.

Abstract: A modified epoxy resin is prepared by mixing an isocyanate terminated urethane prepolymer with an epoxy resin in reactive conditions. The modified epoxy resin has a low internal stress when it is cured due to the flexible backbone of the urethane prepolymer incorporated therein, and has a high glass transition temperature due to a rigid oxazolidone structure formed via the epoxy ring opening with the isocyanate groups, and thus is useful as an electronic encapsulant.

Abstract: A curable resin composition comprising (a) an oxyalkylene polymer comprising at least one reactive silicon group per molecule and having a number average molecular weight of not less than 3000 and an Mw/Mn ratio of not higher than 1.6, (b) a curing catalyst for the oxyalkylene polymer containing at least one reactive silicon group per molecule, (c) an epoxy resin, and (d) a ketimine; and a curable resin composition further comprises (e) a reactive silicon group-containing silane compound in addition to (a) to (d).

Abstract: The invention relates to a curable coating composition comprising:(a) a hydroxyl-containing polyester resin having a solubility parameter in the range of 10.0 to 12.0,(b) a polyepoxide,(c) a silicon compound having 1 to 20 silicon atoms in one molecule and represented by the rational formulaSiO.sub.(4-(a+b))/2 (OR.sup.1).sub.a (OR.sup.2).sub.b (1)wherein R.sup.1 is an alkyl group having 1 to 3 carbon atoms, or a hydrogen atom, R.sup.2 is an aryl group, an aralkyl group, or a monovalent hydrocarbon group containing an ether linkage and/or ester linkage and having 4 to 24 carbon atoms, a represents a number between 0.10 to 3.95 and b represents a number between 0.05 and 1.95, provided that a+b=4 or less,(d) at least one chelate compound selected from the group consisting of aluminum chelate compounds, titanium chelate compounds, zirconium chelate compounds and tin chelate compounds, and(e) an organic solvent.

Abstract: An epoxy resin composition contains an epoxy resin as a substratal resin and incorporates therein a polyallylphenol curing agent. The composition may also contain a polyphenol compound. The epoxy resin may have a naphthalene skeleton. The epoxy resin composition may also include a blend of two or more epoxy resins.

Abstract: In a method of producing an integrated circuit assembly, an IC device is metallurgically bonded to a supporting substrate. The mounting of the IC device to the substrate also includes a polymeric underfill body adhesively bonding the IC device to the substrate. The polymeric underfill body is formed of a curable underfill composition comprising epoxy resin, anhydride curing agent for the epoxy resin, amine catalyst and a minor amount of an additional component selected from alkyl-substituted imidazole and phenyl-substituted imidazole. Such additional component may act as a catalyst, as used with an amine catalyst known catalyst for the polymerization reaction of the epoxy resin with the anhydride curing agent, may act as a co-catalyst. The polymeric underfill body has improved glass transition temperature values and improved coefficient of thermal expansion values to provide good thermal stress cycling life for the integrated circuit assembly.

Abstract: A polymeric resin for optical fiber strips is formed from a mixture comprising a first base polymer selected from an epoxy acrylate and a urethane acrylate and a copolymer in a proportion of between 0.5% and 20% by weight of said mixture which is compatible with said first polymer and carries polysiloxane chains.

Abstract: A composition containing 100 parts by weight of a soluble polyimidosiloxane obtained by polymerization and imidation of an aromatic tetracarboxylic acid component and a component comprising a diaminopolysiloxane, an aromatic diamine with a hydroxyl group and optionally another aromatic diamine, 1 to 50 parts by weight of an epoxy resin, and optionally, also 2 to 150 parts by weight of an inorganic filler such as mica, silica or barium sulfate, and an organic solvent. The composition is homogeneously soluble in organic solvents, and when formed into a protective film on a flexible wiring board it has high heat resistance, flexing resistance, adhesion and chemical resistance (against soldering flux and tin plating solutions).

Abstract: When a thermosetting composition comprising(A) a resin having hydroxyl group,(B) a hydrolyzable silyl group-containing polymer,(C) a hydrolyzable silicon compound and(D) a curing catalyst is used, coating materials having no problem as to bad-smelling can be obtained and the coating films formed therefrom are improved in physical properties such as adhesion, solvent resistance and hardness.

Abstract: A curable coating composition is described comprising two components that are reactive with one another upon curing to form urethane linkages. The urethane-forming components are an active hydrogen groups-containing component and a polyisocyanate, or a carbamate groups-containing component and a carbamate group-reactive component. The composition further comprises a third component that includes one or more epoxide groups. Coatings prepared with this coating composition can be cured and coated with additional coating(s), providing good intercoat adhesion to the subsequent coating.

Abstract: A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.

Abstract: The compositions of this invention comprise uncrosslinked reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one metal-containing polymer comprising a metal-nitrogen polymer.Preferred compositions of this invention comprise reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one of: silicon-nitrogen polymers, aluminum-nitrogen polymers and boron-nitrogen and polymer combinations thereof comprising a multiplicity of sequentially bonded repeat units the compositions comprising the reaction products of the reaction mixtures, and the compositions obtained by crosslinking the reaction products of the reaction mixtures. The crosslinking may be effected through at least one of thermal-based, radiation-based free radical-based or ionic-based crosslinking mechanisms.

Abstract: A sprayable, trowelable epoxy polysiloxane based coating and flooring composition exhibiting excellent weatherability in sunlight and superior chemical, corrosion and impact resistance after curing is made up of: (a) a resin component which includes a non-aromatic epoxy resin having at least two 1,2-epoxy groups per molecule; a polysiloxane and an organooxysilane; (b) an difunctional aminosilane hardener component; (c) an organotin catalyst; and (d) an aggregate or pigment component. Organic solvents and flow modifying agents may be added to facilitate spray application. The resin component, hardener component, aggregate component and desired catalysts are combined in the presence of a sufficient amount of water to promote the hydrolysis of polysiloxane and/or organooxysilane and the polycondensation of the silanols produced by such hydrolysis. The aminosilane and epoxide resin react to form a cured linear epoxy polymer.

Abstract: A cured product of an epoxy resin composition is integrally and firmly joined to a cured product of an organic peroxide--or addition reaction-curable silicone rubber composition to form an integral composite. The integral composite having practically acceptable adhesion force can be simply and briefly produced without using a primer.

Abstract: The compositions of this invention comprise uncrosslinked reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one metal-containing polymer comprising a metal-nitrogen polymer.Preferred compositions of this invention comprise reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one of: silicon-nitrogen polymers, aluminum-nitrogen polymers and boron-nitrogen and polymer combinations thereof comprising a multiplicity of sequentially bonded repeat units the compositions comprising the reaction products of the reaction mixtures, and the compositions obtained by crosslinking the reaction products of the reaction mixtures. The crosslinking may be effected through at least one of thermal-based, radiation-based free radical-based or ionic-based crosslinking mechanisms.

Abstract: The compositions of this invention comprise uncrosslinked reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one metal-containing polymer.Preferred compositions of this invention comprise reaction mixtures comprising (1) at least one organic monomer, oligomer or polymer comprising a multiplicity of organic, electrophilic substituents, and (2) at least one of: at least one of: a polymer selected from the group consisting of silicon-nitrogen polymers, aluminum-nitrogen polymers and boron-nitrogen polymers comprising a multiplicity of sequentially bonded repeat units.

Abstract: A novel curable organopolysiloxane-epoxy resin composition, which is capable of giving a cured body having excellent mechanical properties without the problem of adhesion to the metal mold, is proposed. The composition comprises: (a) an epoxy resin; (b) an organopolysiloxane containing vinyl groups; (c) an organohydrogenpolysiloxane as the crosslinking agent of the component (b); (d) a platinum compound as a catalyst for the hydrosilation reaction; and (e) a specific organic aluminum compound, such as tris(acetylacetonato) aluminum, each in a specified proportion.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: A resin composition curable through a Michael reaction between (a) a component having a plurality of .alpha., .beta.-unsaturated carbonyl groups and (b) a component having a plurality of activated methylene, activated methyne or hydroxyl groups is disclosed. The curing reaction is catalyzed with a quaternary ammonium, quaternary phosphonium or tertiary sulfonium salt in the presence of an epoxy compound independently added to the composition or covalently attacted to either component (a) or component (b).

Abstract: Disclosed is a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a dimethylpolysiloxane having epoxy groups at its both ends, and (C) a dispersing agent comprising the reaction product of (C-1) a dimethylpolysiloxane having amino groups or carboxyl groups reactive with epoxy resins at its side chains or both ends and having phenyl groups or polyether groups for improving its compatibility with epoxy resins at its side chains, and (C-2) an epoxy resin having the same structure as the component (A). The composition has a reduced internal stress, while maintaining the heat resistance intrinsic to epoxy resins, and has excellent resistance, crack resistance and heat shock resistance.

Abstract: Resin compositions comprising inorganic species selected from the group consisting of siloxanes and phosphazenes in combination with and capable to being bonded to thermoset and/or thermoplastic resin system derivable from cyanate functional monomers and/or oligomers. Reacted resin compositions are found to have enriched areas of the inorganic species. The resin compositions have a variety of improved properties including toughness and improved resistance to oxidation.

Abstract: A nonlinear optical interpenetrating polymer network which can exhibit nonlinear optical properties includes a first polymer, and a second polymer interpenetrating the first polymer. At least one of the polymers includes a nonlinear optical component. A method of forming a nonlinear optical interpenetrating polymer network which can exhibit nonlinear optical properties includes combining a first prepolymer, which can react to form a first polymer, with at least one monomer which can react to form a second polymer. At least one of either the first prepolymer or the monomer include a nonlinear optical component. The nonlinear optical component is poled and the first prepolymer and the monomer, or monomers, of the second prepolymer are reacted while the nonlinear optical component is being poled.

Abstract: Toner fusing members coated with cured epoxy-substituted organopolysiloxane compositions are obtained. Such epoxy-substituted organopolysiloxanes are obtained by hydride-addition of a hydride-substituted organopolysiloxane with an unsaturated epoxy compound.

Abstract: The instant invention pertains to a curable resin composition comprised of A) 100 parts by weight curable resin, and B) 0.1-500 parts by weight of an organopolysiloxane having organic groups that contain epoxy groups, which is expressed by the formula: ##STR1## wherein R.sup.1 is a univalent hydrocarbon group excluding alkenyl groups, R.sup.2 is a hydrogen atom or a univalent hydrocarbon group excluding alkenyl groups, R.sup.3 is an alkoxysilylalkyl group or an organic group that contains epoxy groups, a is 0 or a positive integer, b is a positive integer and c is a positive integer, where a/c has the value of 0 to 4, b/c has the value of 0.05 to 4 and (a+b)/c has the value of 0.2 to 4. The curable resin composition of the instant invention has superior flowability that produces a hardened resin with superior flexibility and adhesion.

Abstract: The present invention relates to a peroxide-curable silicone rubber composition which, when cured, exhibits a reduced modulus and improved tear strength relative to prior art systems without sacrificing other desirable properties, such as high tensile strength of the cured rubber or storage stability of the uncured rubber base, said composition comprising:(A) 100 parts by weight of a diorganopolysiloxane gum;(B) 10 to 75 parts by weight a reinforcing filler;(C) a polybutylene oligomer having a number average molecular weight of 200 to less than 900 and having functionality selected from the group consisting of epoxy, alkoxyphenylene, hydroxyl, carboxyl, anhydride and fully saturated; and, optionally,(D) a hydroxy-terminated diorganopolysiloxane having a degree of polymerization of 2 to 50.

Abstract: There is disclosed a curable resin composition that has an excellent fluidity prior to curing and that cures to form a molding resin that is flexible, highly moisture resistant, and strongly resistant to heat shock, said composition comprising(A) 100 weight parts of a curable resin; and(B) 0.1 to 500 weight parts of an epoxy group-containing silicone resin that has the general formula(R.sup.1 SiO.sub.3/2).sub.a (R.sup.2 R.sup.3 SiO.sub.2/2).sub.b (SiO.sub.4/2).sub.cwherein R.sup.1, R.sup.2 and R.sup.3 each represents a group selected from the group consisting of an epoxy group-containing organic group and a monovalent hydrocarbon group with the proviso that said epoxy group-containing organic groups comprise 0.1 to 40 mole percent of the total silicon-bonded organic groups in said silicone resin (B), a is a positive number, b is zero or a positive number, c is zero or a positive number, b/a has a value of zero to 10, c/(a+b+c) has a value of zero to 0.

Abstract: Disclosed is a method of producing an epoxy-modified silicone, which comprises causing a reaction between (A) 100 parts of an ethylenic unsaturated group-containing epoxide and (B) from 50 to 40,000 parts of an organohydrogenpolysiloxane and/or an organohydrogensilane in the presence of (C) from 0.00001 to 0.5 part by weight, on a platinum basis, of a platinum compound as catalyst and (D) from 0.1 to 1,000 parts by weight of an aliphatic alcohol containing from 1 to 10 carbon atoms.

Abstract: A casting resin system containing epoxyalkylsiloxane is provided for covering optoelectronic components. The casting resin system includes a resin constituent containing a mixture of epoxyalkylsiloxanes and cycloaliphatic epoxy resins. The casting resin system can be hardened with a polycarboxylic acid anhydride as a hardener component to form molding materials that are transparent and color-stable.

Abstract: This invention relates to a polyorganosiloxane comprising a polymethylsilsesquioxane structure as a main structural unit and having a methyl group and a reactive group at the side chains thereof, which is suitable as a polymer modifier; a process for producing the same; a copolymer resin obtained by polymerizing the polyorganosiloxane with a polymerizable monomer or by reacting the polyorganosiloxane with a polymer; a method for crosslinking the copolymer resin; and a coating composition containing the copolymer resin.

Abstract: A cured resin product has a strain energy release rate (GIC) of at least 400 J/m.sup.2, a flexural modulus of at least 300 Kg/mm.sup.2, and a glass transition temperature (Tg) of at least 120.degree. C. The cured resin composition comprises a thermoset resin component (A), optionally including a curing agent (B), and a thermoplastics resin component (C), the thermoplastics resin and thermoset resin components (C) and (A) being present at least partly in respective phases (1) and (2) each being elongate in at least one direction and each preferably having a three dimensionally continuous structure. Phase (1) may contain a silicon containing compound providing a concentration therein of elemental silicon higher than that in any other phase, and/or the cured resin product may additionally include regions where one of the phases (1) and (2) essentially surrounds the other.

Abstract: Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

Abstract: Described herein is a primer composition which comprises a solution or dispersion of: (a) about 2 percent to about 30 percent by weight of a film-forming resin; (b) about 2 percent to about 80 percent by weight of a reaction product of an epoxy silane and an amino silane, wherein the amino silane contains at least two amine groups per molecule, which is prepared by (1) contacting an amino silane and epoxy silane in amounts such that the molar ratio of epoxy silane to amino silane in the reaction mixture is less than about 1.8:1.0 and then (2) adding additional epoxy silane to the reaction mixture so that the molar ratio of epoxy silane to amino silane is at least about 2:1 in a volatile solvent. It has been discovered that the primer of the invention enhances the bonding of a non-porous substrate, such as glass, to a second substrate, particularly when used in conjunction with a "fast cure" adhesive comprised of an isocyanate-functional prepolymer and dimorpholinodiethyl ether.

Abstract: A composition is disclosed, said composition comprising(A) a polydimethylsiloxane having a viscosity greater than about 2 cS at 25.degree. C.; and(B) a polyisobutylene oligomer having a number average molecular weight of about 200 to about 3,000 and having at least one end terminated with an epoxy-containing group, the weight ratio of said polydimethylsiloxane (A) to said polyisobutylene (B) being in the range 1:99 to 99:1.

Abstract: A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).

Abstract: The present invention provides a low viscosity curable resin composition and coating composition containing the same which has a decreased solvent content. The coating composition provides a cured film having not only excellent acid resistance but also good weather resistance and mar resistance without an adverse effect to the environment. The curable resin composition comprises (a) a hydroxyl and carboxyl group containing silicone polymer, (b) a carboxyl and carboxylate group containing polymer, and (c) a hydroxyl and epoxy group containing polymer.

Abstract: A cured, fiber-reinforced composite is prepared by blending an amino-functional silicone resin containing monophenyl siloxy units and amino-functional siloxy units, an epoxy resin, a hardener for the epoxy resin and an aromatic oligomer such as a polyether optionally with reactive primary amine groups, impregnating fibers into said blend, laying up at least two layers of the impregnated fibers, and heating the layed-up laminate at a temperature and time sufficient to cure the epoxy resin.

Abstract: The present invention relates to a modified epoxy resin, a method for the preparation thereof and an epoxy resin composition using the modified epoxy resin. In particular, it relates to a modified epoxy resin of the general formula (I) which is prepared by incorporating a monomaleimide having a carboxy group useful as a heat resistance-improving agent of a resin composition containing an epoxy resin and maleimides into an epoxy resin, and an epoxy resin composition for sealing a semiconductor element having the improved heat resistance and moldability by the modified epoxy resin. ##STR1## wherein, R represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms (C.sub.1 to C.sub.10), andn is 0 to 100, and m is 1 to 100.

Abstract: A polymeric coating agent which comprises a polymer of from 60 to 97 wt. % of one or more (meth)acrylic monomers the polymerization of which can be initiated by free radicals, from 3 to 40 wt. % of at least one .alpha., .omega.-hydroxy-, carboxy-, and/or epoxy-functional polysiloxanes of the formula (I) ##STR1## wherein R' can be the same or different and is C.sub.1-6 alkyl, and R can be the same or different and is ##STR2## wherein Alk and Alk' are C.sub.1-6 alkylene and the alkylene groups in a molecule can be the same or different, n is a cardinal number from 8 to 40, m is a cardinal number from 2 to 30, and p is a cardinal number from 1 to 20 of solids in the monomers.

Abstract: Polyarylene ether-organopolysiloxane copolymers are provided having amine, or ester connecting linkages between blocks resulting from the melt extrusion of epoxy, carboxy or amine functionalized polyarylene ether with epoxy, carboxy or amine functionalized organopolysiloxane.

Abstract: A release agent comprising a resin containing siloxane segments is described. The resin has been modified with a silane coupling agent containing at least one free isocyanate group and contains one or more hydrolyzable silyl groups in side chains of its molecule.

Abstract: Cationically electrodepositable (gelled) fine particles using, as the base, an epoxy resin-amine adduct having hydrolysable alkoxysilane groups, and a cationic electrodeposition paint composition comprising said fine particles. Said fine particles give a paint film having excellent corrosion resistance and are useful as a rheology-controlling agent for cationic electrodeposition paint. Said electrodeposition paint composition has an excellent edge-covering property, and a paint film formed therewith on an article to be coated can give improved corrosion resistance to the edges of said article and has good surface smoothness.

Abstract: A composition useful in the fabrication of fiber-reinforced composites is prepared from a blend of an epoxy resin, a hardener for the epoxy resin, an aromatic oligomer and an aminofunctional silicone resin containing monophenyl siloxy units and aminofunctional siloxy units.

Abstract: An epoxy resin composition comprising (i) an epoxy resin, (ii) a phenolic curing agent, (iii) an organophosphorous curing agent, (iv) alumina, and (v) a separating means for separating the organophosphorous curing agent and the alumina, which may be a coating over the surfaces of the organophosphorous curing agent.

Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.