Abstract: Provided are a method for producing a phosphorus-containing phenolic compound in which reactivity is considerably excellent in the reaction between a phosphorus-containing compound and an aromatic nucleus of a phenol; in the case of using a polyhydric phenol or a phenolic resin as the phenol, a novel phosphorus-containing phenolic compound that serves as a curing agent for an epoxy resin and imparts excellent heat resistance to a cured product; a curable resin composition containing the novel phosphorus-containing phenolic compound; a cured product of the curable resin composition; a printed wiring board; and a semiconductor sealing material. An aromatic aldehyde (a1) having an alkoxy group as a substituent on an aromatic nucleus is allowed to react with an organic phosphorus compound (a2) intramolecularly having a P—H group or a P—OH group. The resultant reaction product is then allowed to react with a phenol (a3).

Abstract: Compositions and methods for forming condensates and resin compositions are provided. In one embodiment, a condensate is formed from a reaction mixture including a triazine monomer, an arylhydroxy monomer, an aldehyde monomer and an acid catalyst having a pKa value of greater than 3.8. The condensates contain up to 28 wt. % of nitrogen and have a melt viscosity of 3,000 cps or less at 175° C. The condensates may have a solubility of at least 80 wt. % solids dissolved in an organic solvent for 120 hours or greater. Also disclosed are methods for the manufacture of the condensate as well as the condensate's use in fire-retardant epoxy resin compositions suitable for the manufacture of laminates for electronic applications. There is also disclosed a glycidylated triazine-arylhydroxy-aldehyde condensate of this invention.

Abstract: Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.

Abstract: A method of preparation for a layer of material for use with a power and/or telecommunications cable includes mixing a composition including a thermoplastic polymer matrix and a phenolic resin. The phenolic resin is selected from the group consisting of novolac phenol-formaldehyde resins and novolac cyanate ester resins. The phenolic resin is hardened within the thermoplastic polymer matrix to obtain nodules of hardened phenolic resin dispersed throughout the material.

Abstract: The present invention relates to modified phenolic resins which contain silicic acid ester units. The modified phenolic resins may, for example, be used as components of a foundry binder system. The invention also relates to a method for producing such modified phenolic resins and to two-component binder systems which contain these modified phenolic resins. The invention furthermore relates to methods for producing foundry molds and foundry cores which contain the modified phenolic resins, and to the foundry molds and foundry cores themselves.

Abstract: The present invention relates to modified phenolic resins which contain silicic acid ester units. The modified phenolic resins may, for example, be used as components of a foundry binder system. The invention also relates to a method for producing such modified phenolic resins and to two-component binder systems which contain these modified phenolic resins. The invention furthermore relates to methods for producing foundry molds and foundry cores which contain the modified phenolic resins, and to the foundry molds and foundry cores themselves.

Abstract: This invention relates to a low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); or the mixture of (B) and (C), and (D) Flame retardant agent, curing agent and accelerating agent solutions. Because all of component (A) DCPD-PN, component (B) DCPD-PNE and component (C) DCPD-BX in this resin varnish composition contain a saturated multi-cyclic structure of dicyclopentadiene, the resin varnish shows lower dipole, dielectric constant (Dk), dissipation factor (Df) and moisture absorption; and via adding a brominated or phosphorus flame retardant, the composition exhibits high thermal stability characteristic.

Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.

Abstract: Disclosed herein are a phenol novolac resin which is used as a raw material for thermosetting resin, a phenol novolac epoxy resin which is obtained therefrom, an epoxy resin composition which utilizes the phenol novolac resin as a curing agent or contains the phenol novolac epoxy resin as a base resin.

Abstract: A composition comprising one or more siloxane cross-linked demulsifiers wherein said siloxane cross-linked demulsifiers are prepared by reacting one or more alkylphenol-formaldehyde resin alkoxylates, one or more polyalkylene glycols, or a mixture thereof, with up to about 1.0 molar equivalents of one or more silicon-based cross-linkers of formula R1R2R3R4Si wherein R1, R2, R3, R5, R6 and R7 are independently selected from H, Cl, C1-C4 alkyl and C1-C4 alkoxy; R4. is selected from H, Cl, C1-C4 alkyl, C1-C4 alkoxy and a group of formula L1SiR5R6R7; L1 is absent or is selected from —O—, arylene and C1-C12 alkylene, optionally interrupted by one or more —O— or —N(R8)—; and R8 is H or C1-C4 alkyl and a method of using the demulsifier composition to resolve water-in-oil emulsions.

Abstract: An adamantane derivative of formula (I), a compound of formula (VII) or (VIII), compositions containing them, and optical electronic members using the resin compositions. In the formulas, W represents, for example, a hydrogen atom, X is bonded to a bridge-head adamantane carbon and represents, for example, a group of represented by the general formula (II), Y represents a group of formula (V) or (VI), R1 represents a methyl group or an ethyl group, R2 represents a C1 to C10 hydrocarbon group which may contain O or S, m is an integer of 2 to 4, k is an integer of 0 to (16?m) and p and q are each an integer of 1 to 5.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an oxetane compound and a cationic initiator.

Abstract: Polymer formulations are disclosed and described herein that comprise: at least one polymer comprising at least one hydroxy functional group, at least one acid source, and at least one acid-activated crosslinker that reacts with the polymer. In contemplated embodiments, these polymer formulations are curable at relatively low temperatures, as compared to those polymer formulations not comprising contemplated crosslinkers. Transparent films formed from these contemplated formulations are also disclosed. Organic transparent film compositions are also disclosed that comprise: at least one at least one phenol-based polymer, at least one solvent; at least one acid-activated crosslinker; and at least one acid source. Methods of forming organic transparent films with improved transmittance by depositing on a substrate the formulations disclosed herein and curing the formulations or compositions at a temperature of less than about 200° C.

Abstract: Yarns, fibers or filaments, in particular based on polyamides, are shaped into a variety of articles, especially ropes and more particularly climbing ropes which have good mechanical properties, especially under both low and relatively high humidity conditions.

Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.

Abstract: The present invention provides a perfluoroelastomer seal material in which adhesive strength, contamination, corrosion and color change of a contacted surface with a seal material are improved, and an amount of an uncrosslinked polymer component is at most 1% by weight, measured under specific conditions, and a process for preparing the same. The present invention relates to a perfluoroelastomer seal material, wherein a rate of weight decrease is at most 1% by weight when the seal material is immersed into perfluoro(tri-n-butyl)amine at 60° C. for 70 hours and is dried at 90° C. for 5 hours, 125° C. for 5 hours and 200° C. for 10 hours after taken out of the emersion. And, the present invention also relates to a process for preparing a perfluoroelastomer seal material comprising a step of treating with a solvent having at least 50 % of a swelling rate based on said molded article, when said molded article is immersed at 60° C. for 70 hours.

Abstract: To provide a novel crosslinking system of fluorine-containing elastomer giving a crosslinked product particularly having improved mechanical strength and compression set at high temperature. A fluorine-containing rubber composition comprising a fluorine-containing elastomer having carboxyl group and/or alkoxycarbonyl group at an end of a trunk chain and/or branched chain as a crosslinkable group.

Abstract: An adhesion promoter for a hot melt adhesive or a pressure sensitive adhesive prepared by admixing a hydrolytic silane compound with an aqueous buffer solution. The adhesive is able to bind at very low surface free energy substrates, such as Xerographic prints contaminated by silicone fuser oil. The hot melt adhesive maintains a substantially stable viscosity at temperature ranging from about 100° C. to about 200° C.

Abstract: A resist solution is discussed. The resist solution includes: a base polymer, a tackifier, a carrier solvent, a printing solvent. The resist solution further includes a methoxy-based silane coupling agent which has a weak affinity for a carrier solvent containing ethanol.

Abstract: This invention relates to alkaline resol phenol-aldehyde binder compositions and their use in the production of articles of bonded particulate material such as foundry moulds, foundry cores, or feeders.

Abstract: The present invention relates to a liquid resin intended more particularly for the sizing of mineral fibers which exhibits a dilutability in water at 20° C. at least equal to 1 000% and a level of free formaldehyde preferably of less than 0.4%, expressed as total weight of liquid, this resin being characterized in that it is composed essentially of condensates obtained from a phenolic compound, from formaldehyde and from an aminoalcohol according to the Mannich reaction. The invention also relates to a sizing composition including said resin, to the mineral fibers sized by means of this composition and to the products formed from the mineral fibers, in particular for thermal and/or sound insulation.

Abstract: A resin composition for semiconductor encapsulation contains an epoxy resin (A); a phenolic compound (B) containing two or more phenolic hydroxyl groups; an inorganic filler (C); and a curing accelerator (D). The epoxy resin (A) contains an epoxy resin (a1) represented by the formula (1) wherein Ar is a C6-C20 aryl group, R1 is a C1-C6 hydrocarbon group, R2 is a C1-C4 hydrocarbon group, W1 is oxygen or sulfur, RO is a C1-C6 hydrocarbon group, a=0-10, g=0-3, 0<m<1, 0<n<1, m+n=1 and m:n=1:10 to 1:1, and the resin composition has a moisture absorption rate of 0.22 weight % or less when the composition is humidified at 85° C. and 85% R.H.

Abstract: A photosensitive compound has two or more structural units, in a molecule, represented by the following general formula (1): wherein R1 to R5 are selected from the group consisting of hydrogen atom, halogen atom, alkyl group, alkoxy group, acetoxy group, phenyl group, naphthyl group, and alkyl group in which a part or all of hydrogen atoms are substituted with fluorine atom; and X is a substituted or unsubstituted phenylene group or a substituted or unsubstituted naphthylene group.

Abstract: Even when a terminal epoxy resin is contained as the epoxy component of a thermosetting epoxy resin composition containing an aluminum chelate/silanol curing catalyst system, the epoxy resin composition can be configured to cure rapidly at low temperatures without termination of polymerization. The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Examples include bisphenol S, bisphenol A, bisphenol F, and 4,4?-dihydroxyphenol ether, and acetic anhydride, propionic anhydride, maleic anhydride and phthalic anhydride. The aluminum chelate/silanol curing catalyst system is composed of an aluminum chelator and a silane-coupling agent.

Abstract: There is provided an anti-reflective coating forming composition for lithography comprising a polymer compound, a crosslinking compound, a crosslinking catalyst, a sulfonate compound and a solvent. The anti-reflective coating obtained from the composition has a high preventive effect for reflected light, causes no intermixing with photoresists, has a higher dry etching rate compared with photoresists, can form a photoresist pattern having no footing at the lower part, and can use in lithography process by use of a light such as ArF excimer laser beam and F2 excimer laser beam, etc.

Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.

Abstract: A redispersible polymer powder including: a polymer to be redispersed; and an ortho-cresol based condensation product or salt thereof; wherein the ortho-cresol based condensation product or salt thereof includes N-containing units derived from a N-based component incorporated into the ortho-cresol based condensation product or salt thereof during polymerisation.

Abstract: There are provided an ink composition for imprint lithography and roll-printing, which is applied to the formation of a pattern using imprint lithography and roll-printing to play the role of a pattern support, can increase the accuracy of pattern formation by minimizing the occurrence of a swelling phenomenon caused by the ink composition, and can improve yield and the efficiency of the process by increasing the transfer rate of a pattern, and a method of forming a pattern of a display or semiconductor by using the same.

Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.

Abstract: A cathode substrate which enables achievement of a battery having a high output voltage and a high energy density, and being superior in charge and discharge cycle characteristics; a secondary cell in which the cathode substrate is used; a resin composition for use in forming the cathode substrate; and a method for producing the cathode substrate are provided. According to cathode substrate 10 including metal film 13 formed on support 11 provided with patterned organic film 12 molded by a thermal imprint process or a photoimprint process, a battery having a high output voltage and a high energy density, and being superior in charge and discharge cycle characteristics can be provided.

Abstract: A positive resist composition that includes a base material component (A) that contains an acid-dissociable, dissolution-inhibiting group and exhibits increased alkali solubility under the action of acid, and an acid generator component (B) that generates acid upon exposure, wherein the base material component (A) contains a compound (A1), in which either a portion of, or all of, hydrogen atoms of phenolic hydroxyl groups within a polyhydric phenol compound, which has two or more phenolic hydroxyl groups, a molecular weight of 300 to 2,500, and is represented by a general formula (I) shown below, have been substituted with an acid-dissociable, dissolution-inhibiting group (II) represented by a general formula (II) shown below.

Abstract: The invention relates to an epoxy resin composition for sealing comprising (A) an epoxy resin, and (B) a curing agent, wherein the following is comprised as the curing agent (B): (C) a compound or compounds represented by the following general formula (I) in which n is or n's are each an integer of 1 to 10, and m is or m's are each an integer of 1 to 10: wherein R1 is selected from a hydrogen atom and substituted or unsubstituted monovalent hydrocarbon groups having 1 to 10 carbon atoms, and R2 is selected from a hydrogen atom and substituted or unsubstituted monovalent hydrocarbon groups having 1 to 10 carbon atoms. This makes it possible to provide a halogen-free and antimony-free epoxy resin composition for sealing which is good in flame retardancy without lowering reliabilities, such as moldability, reflow resistance, humidity resistance and high-temperature-standing property, and an electron component device equipped with an element sealed with this composition.

Abstract: A production method of granular epoxy resin includes an epoxy resin preparing step of preparing an epoxy resin which is solid at ordinary temperature by reaction between a phenol compound and epihalohydrin; a purifying processing step of refining the prepared epoxy resin which is solid at ordinary temperature so that the total content of compounds having a molecular weight of 200 or less is 0.28% by mass or less of the entire epoxy resin; and a pulverizing step of pulverizing the refined epoxy resin obtained by the purifying processing step under conditions so as not to make the total content of compounds having a molecular weight of 200 or less exceeding 0.3% by mass, wherein the epoxy resin which is solid at ordinary temperature prepared by the epoxy resin preparing step is mainly composed of at least one selected from oligomers represented by the following general formula (1) and oligomers represented by the following general formula (2).

Abstract: A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below.

Abstract: Epoxy resins that are suitable for forming epoxy laminates that meet a UL-94 rating of V-0 comprise a hydroxy-terminated oligomeric phosphonate comprising the repeating structure —OP(?O)(R)OArylene-, where R is alkyl, as a flame retardant.

Abstract: The present invention provides a power and/or telecommunications cable including at least one layer of a material obtained from a composition comprising: a thermoplastic polymer matrix; and a phenolic resin; wherein said phenolic resin is selected from novolac phenol-formaldehyde resins and novolac cyanate ester resins, and wherein said material includes nodules of hardened phenolic resin dispersed throughout the material.

Abstract: Low-cure powder coating compositions are disclosed. The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 is an organic radical having 1 to 20 carbon atoms; R3 and R4 are independently alkyl or phenyl groups having 1 to 8 carbon atoms; Z is oxygen or nitrogen, and when Z is oxygen R5 is absent and when Z is nitrogen R5 is hydrogen or is and n is 1 to 4. The material can optionally be reacted with an acidic hydrogen-containing compound. The compositions are curable without the use of crosslinking agents or accelerators. Methods for coating a substrate using these compositions, and substrates coated thereby, are also disclosed, as are additional catalysts useful for the same purpose.

Abstract: A composition for the treatment of metal surfaces and for the deposition of metals or metal alloys on plastics surfaces contains a) at least one polymer as component A, composed of the structural element (1) and at least three structural elements selected from the group consisting of b) water or another solvent which is suitable for dissolving, dispersing, suspending or emulsifying the polymer, as component B; c) if required, surface-active compounds, dispersants, suspending media and/or emulsifiers as component C. In a process for the treatment of a metal surface and a process for the deposition of metals or metal alloys on a plastics surface, the metal or plastics surface is brought into contact with a polymer (component A). Furthermore, polymers (component A) are used for the treatment of metal surfaces and for the deposition of metals or metal alloys on a plastics surface, and polymers composed of special components A?a, A?b and A?c.

Abstract: This invention relates to a one-stage process for the production of polyoxyalkylene containing polyols having equivalent weights of about 150 to about 6000 and functionalities of about 2 to 8. The process comprises (1) mixing (a) an organic compound having a hydroxyl functionality of about 2 to about 8 and an equivalent weight of about 35 to about 575, with (b) a hydroxyl functional compound having an equivalent weight of about 100 to about 6000 and a functionality of about 2 to 8; and (2) alkoxylating the mixture with (c) one or more alkylene oxides, in the presence of (d) one or more double metal cyanide catalysts. Suitable compounds to be used as (a) the organic compound having a hydroxyl functionality of about 2 to about 8 and an equivalent weight of about 35 to about 575 in the present invention include bisphenol-A, Bisphenol TMC, tetrabromobisphenol A, and novolak phenolic resins.

Abstract: To provide a novel crosslinking system of fluorine-containing elastomer giving a crosslinked product particularly having improved mechanical strength and compression set at high temperature. A fluorine-containing rubber composition comprising a fluorine-containing elastomer having carboxyl group and/or alkoxycarbonyl group at an end of a trunk chain and/or branched chain as a crosslinkable group.

Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less.

Abstract: Resins comprising a relatively high-density, low-molecular-weight polyethylene component and a relatively low-density, high-molecular-weight ethylene copolymer component and methods of making the resins are disclosed. The rheological polydispersity of the high-density component exceeds that of either the resin or the low-density component. The resins are valuable for making films, sheets, coatings, pipes, fibers, and molded articles having a favorable balance of good stiffness and excellent environmental stress crack resistance.

Abstract: A phosphoric ester demulsifier composition prepared by reacting one or more alkylphenol-formaldehyde resin alkoxylates or one or more polyalkylene glycols, or a mixture thereof, with about 0.001 to about 1.0 molar equivalents of one or more phosphorous compounds selected from phosphorous oxychloride, phosphorous pentoxide and phosphoric acid and a method of using the demulsifier composition to resolve water-in-oil emulsions.

Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.

Abstract: There is disclosed a novel mixture of polyhydroxy phenolic curing agents, such as novolac resins blended with a mixture of mono, bis and tris hydroxyaryl phosphine oxides for co-curing epoxy resins and imparting flame resistance thereto. A preferred composition includes a mixture of monohydroxyaryl, bishydroxyaryl and trishydroxyaryl phosphine oxide and a benzoguanamine/phenol/formaldehyde terpolymer which is used along with an epoxy resin to produce flame-resistant printed wiring boards without the use of halogens.

Abstract: A solvent-containing coating composition contains at least one hydroxyl-containing saturated copolyester, a phenol-formaldehyde resin, a benzoguanamine-formaldehyde resin and/or a blocked polyisocyanate, a catalyst and at least one solvent, and can further contain aids and additives.

Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.

Abstract: A synthetic resin composition includes at least one synthetic resin and RBC or CRBC particles dispersed in the resin. A method for preparing a synthetic resin composition includes mixing RBC or CRBC particles with a synthetic resin at a temperature near the melting temperature of the synthetic resin. Preferably, the method of includes the step of kneading the mixture.

Abstract: The present invention relates to a process for making a polyester where a dianhydride is reacted with a diol. The resulting polyester can be further reacted with a compound selected from aromatic oxides, aliphatic oxides, alkylene carbonates, alcohols, and mixtures thereof.