Abstract: This invention relates to polyimides having improved thermal-oxidative stability, to the process of preparing said polyimides, and the use of polyimide prepolymers in the preparation of prepregs and composites. The polyimides are particularly useful in the preparation of fiber-reinforced, high-temperature composites for use in various engine parts including inlets, fan ducts, exit flaps and other parts of high speed aircraft.

Abstract: A process for preparing polyamides comprises polymerizing starting monomers in the presence of from 2.3 to 10 mmol, based on 1 mol of carboxamide group of the polyamide, of a chain regulator containing a nitrile group and a functional group capable of forming a carboxamide group.

Abstract: The present invention relates generally to polyimides. It relates particularly to novel polyimides prepared from 2,3,3?,4?-biphenyltetracarboxylic dianhydride and aromatic diamines. These novel polyimides have low color, good solubility, high thermal emissivity, low solar absorptivity and high tensile strength.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from non-rigid rod monomers together with optionally rigid rod monomers where the substrates are cured under low tension. The resulting polyimide materials have been found to provide advantageous properties (e.g. balanced molecular orientation, good dimensional stability, and flatness) particularly useful for electronics type applications.

Abstract: Provided are polyimide and a thin film thereof which have a three-dimensional structure and therefore are excellent in a mechanical strength and a heat resistance as compared with those of conventional linear polyimide. The polyimide is obtained from a salt of multifunctional amine represented by Formula (1): (wherein A represents a tetravalent organic group, and n represents an integer of 0 to 3) and tetracarboxylic diester represented by Formula (2): (wherein B represents a tetravalent organic group having 1 to 20 carbon atoms, and R1 and R2 each represent independently an alkyl group having 1 to 5 carbon atoms).

Abstract: Main chain thermotropic liquid crystal esters, ester-imides, and ester-amides were prepared from AA, BB, and AB type monomeric materials and were end-capped with phenylacetylene, phenylmaleimide, or nadimide reactive end-groups. The resulting reactive end-capped liquid crystal oligomers exhibit a variety of improved and preferred physical properties. The end-capped liquid crystal oligomers are thermotropic and have, preferably, molecular weights in the range of approximately 1000-15,000 grams per mole. The end-capped liquid crystal oligomers have broad liquid crystalline melting ranges and exhibit high melt stability and very low melt viscosities at accessible temperatures. The end-capped liquid crystal oligomers are stable for up to an hour in the melt phase.

Abstract: A curable coating composition which is based on a hydroxyl-functional binder and a blocked polyisocyanate, comprising a suspended finely divided, wax-coated polyamide. This composition exhibits a number of superior properties including having a greatly improved abrasion value.

Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.

Abstract: Polyimide precursors contained in resin compositions of the present invention have a polymer structure unit represented by formula (1) below: wherein chemical structure A2 includes an alicyclic compound but not an aromatic compound such as a benzene ring so that they provide excellent light transmission over a wide wavelength range. The polyimide precursors are imidized at 7.5% or more and 36% or less so that they are less soluble in developing solutions and therefore are not dissolved in the developing solutions at unexposed parts. Thus, the resin compositions of the present invention can be used to form a resin film having a precise pattern by exposure and development.

Abstract: A polyimide excelling in heat resistance, chemical resistance, water repellency, dielectric characteristics, electrical characteristics, and optical characteristics and a polyamide acid useful as the raw material therefor are provided. Specifically, a polyamide acid containing a chlorine atom and a fluorine atom and comprising a repeating unit represented by the following formula (1): (wherein X and X? independently denote a divalent organic group; Y and Y? independently denote a chlorine, bromine, or iodine atom; p and p? denote independently denote the number of fluorine atom {F in the formula (1)} bonded to the relevant benzene ring, representing an integer of 0-3; q and q? independently denote an integer of 0-3; and p+q total 3, and p?+q? total 3).

Abstract: Methods of reducing the amount of undesirable cyclic oligomer by-products in the production of polyetherimides are disclosed. The resulting polyetherimides have enhanced thermomechanical properties.

Abstract: A polyimide composition and a process to prepare polyimide resins with reduced plate out and mold deposits is described. During resin molding operations the low plate out resins show a longer period of operation between cleaning of equipment leading to more efficient operation.

Abstract: A process of preparing a polyimide of the present invention comprises effecting an imidization reaction of a diamine and a tetracarboxylic dianhydride in a solvent containing 50 to 100% by weight of an equimolar composition of a nitrogen-containing cyclic compound indicated by chemical formula (1) below and a phenol indicated by chemical formula (2) below: in formula (1), X represents —CH2— or —N(CH3)—, and in formula (2), R1 and R2 may be the same as, or different from, each other and represent each any one of —H, —OH, —CH3, —C2H5, —C3H7, —C4H9, —C5H11, —C6H13, —C7H15, —C8H17, —C9H19, —C10H21, —OCH3, —O(C6H5), —NO2, —Cl, —Br and —F.

Abstract: A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenylethynyl end-capped bismides blended with PETIs are disclosed. Processes for their production including: 1) modification of PETI-5 oligomer by molecular weight adjustments by blending with reactive low melting phenylethynyl end-capped imide monomers, 2) modification of the PETI-5 backbone structure with other diamine components, and 3) modification of the PETI-5 backbone with bulky fluorinated groups are also disclosed.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.

Abstract: The present invention provides an optical polyimide precursor for use in making a polyimide. The precursor is defined by the following formula: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl, and A is a divalent aromatic or halogenated aromatic moiety. The present invention provides a method of preparing a diamine compound for use as an optical polyimide precursor. The method includes the steps of dissolving 2-chloro-5-nitrobenzotrifluoride and a diol in N,N-dimethylacetamide to form a solution, adding potassium carbonate, tert-butylammonium chloride and copper powder to said solution and heating the resulting mixture, removing the copper, precipitating and recrystallizing a dinitro-compound resulting from heating the mixture, and dissolving the dinitro-compound and reducing the dinitro-compound to yield a diamine compound.

Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).

Abstract: An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250?C and a Young's modulus (storage modulus) at 250?C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270?C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.

Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.

Abstract: A method for the synthesis of poly(etherimide)s comprises the reaction of 4-halotetrahydrophthalic anhydride with an activating primary amine to yield an activated 4-halotetrahydrophthalimide. Activated 4-halotetrahydrophthalimide may then be aromatized and treated with the disodium salt of a bis(phenol) to yield an activated bisimide. The activated bisimide may then be directly treated with a diamine to yield poly(etherimide)s.

Abstract: A method is disclosed for producing a polyamide molding compound which includes the following method steps: addition and dissolving of m-xylylene diamine and dicarboxylic acids, which include adipic acid and aromatic dicarboxylic acids, with water and additives in a dissolving chamber and production of a mixture, the sum of the aromatic dicarboxylic acids added being 2 mol-percent to 15 mol-percent (in relation to the addition of dicarboxylic acids); transfer of the mixture into a reaction vessel and polycondensation of the mixture in this reaction vessel; granulation of the polycondensate; drying of the granulate. This method is distinguished in that the polycondensation is performed at a pressure of at most 10 bar and a temperature of 255° C. to 270° C., the pressure being built up while heating the reaction vessel to 255° C. to 270° C. and—immediately after the mixture has reached the maximum temperature—being reduced to atmospheric conditions while maintaining a temperature of 255° C. to 270° C.

Abstract: A process for producing alkali metal polymaleimide salts by alkaline hydrolysis of maleimide polymers prepared by polymerization of maleimide monomers in the presence of a metal oxide and alcohol initiator or a base. In particular, the process produces alkali metal polymaleimide salts with particular ratios of C—N and C—C connected maleimide-derived monomer units which are dependent on the particular initiator used to synthesize the maleimide polymer. The alkali metal polymaleimide salts, which have chelating and anti-scaling properties, are useful as chelating agents and detergent builders and as such are suitable biodegradable replacements for synthetic polymers and sodium polyaspartate.

Abstract: Polyetherpolyamide elastomer showing a low water absorption, a high stress relaxation, and a high elastic recovery percentage of elongation is obtainable by polymerizing an aminocarboxylic acid compound and/or a lactam compound, a triblock polyetherdiamine compound having the following formula, and a dicarboxylic acid compound: [x is a value of 1 to 20, y is a value of 4 to 50, z is a value of 1 to 20].

Abstract: A polyimide is disclosed of the formula: CG1 and CG2 are independently electron-accepting and/or electron-donating groups; x is an integer from about 3 to about 3000; ODAH is any of a number of known dianhydride residues; ODAM is any of a number of known diamine residues; and m, n, o, and p cumulatively add to 1.0, with the sum of m and n ranging from about 0.05 to about 1.0, the sum of o and p ranging from about 0 to about 0.95, the sum of m and o being about 0.5 and the sum of n and p being about 0.5. In addition, a film structure comprising the polyimide and devices utilizing the film structure are disclosed.

Abstract: Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.

Abstract: In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in which a tetracarboxylic acid dianhydride is dispersed in a dispersion medium is used. According to this, it is possible to directly manufacture a polyamic acid solution having a high concentration of polyamic acid more than or equal to 10% by weight. Especially, even if a tetracarboxylic acid dianhydride having low solubility in the polymerization-use solvent, it is possible to effectively manufacture a polyamic acid solution having high solids content, by a simple process and in a short time.

Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.

Abstract: The polyamide resin of the present invention is produced by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of a C4-C20 ?, ?-straight-chain aliphatic dicarboxylic acid in the presence of at least one phosphorus compound selected from the group consisting of phosphinic acid compounds and phosphonous acid compounds and in the presence of an alkali metal compound of a weak acid. The weak acid has a dissociation constant lower than a first dissociation constant of a dicarboxylic acid mainly constituting the polyamide resin. The polyamide resin satisfies the following requirements (A), (B) and (C): 14000?a?40000??(A) b?1.000??(B) 0.9930?b?1.1a2×10?11+3.2a×10?7?0.9980??(C) wherein a and b are as defined in the disclosure.

Abstract: The present invention provides a polymer lightguide which has a waveguide layer comprising a polyimide having a repeating unit represented by general formula (I): wherein R represents a bivalent organic group.

Abstract: An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 ?m, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2·24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.

Abstract: The invention relates to a randomly branched polyamide comprising at least units derived from: 1. AB monomers, 2. at least one compound I, being a carboxylic acid (Av) having a functionality v≧2 or an amine (Bw) having a functionality w≧2, 3. at least one compound II, being a carboxylic acid (Av) having a functionality v≧3 or an amine (Bw) having a functionality w≧3, compound II being a carboxylic acid if compound I is an amine or compound II being an amine if compound I is a carboxylic acid and the amounts of all units derived from carboxylic acids and amines in the polyamide satisfying conditions as mentioned in claim 1. The composition of the randomly branched polyamide is such that it cannot form a crosslinked polyamide (and thus no gels, either), in particular during the prepolymerization, the polymerization, the post-condensation, the processing and the storage of the randomly branched polyamide, and this at a variety of ambient factors, for instance at elevated temperature and pressure.

Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.

Abstract: A host-guest polymer system including a polymer with an isoimide group and an organic chromophore and capable of converting into a side-chain polymer system, a side-chain nonlinear optical polymer derived from the host-guest polymer system, and a method for synthesizing the side-chain nonlinear optical polymer are provided. The method for synthesizing the side-chain nonlinear optical polymer involves forming a nonlinear optical polymer film based on a host-guest system in which an organic chromophore having a reactive group capable of nucleophilic reaction with an isoimide group is dispersed in a matrix including a polymer with the isoimide group having the following formula: Next, the nonlinear optical film is poled at a first temperature in an electric field; and the organic chromophore is reacted with the polymer while poling at a second temperature which is higher than the first temperature, to synthesize the side-chain nonlinear optical polymer.

Abstract: A polyamide resin composition contains 100 parts by weight of (A) a polyamide resin with a melting point of 270° C. to 340° C.; 0.2 to 20 parts by weight of (B) a compound represented by Formula (I) where R1 and R2 are alkyl groups having at least 9 carbon atoms, and m and n are integers from 1 to 3; and 1 to 100 parts by weight of (C) a bromine-based flame retardant.

Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.

Abstract: A fusible polyimide showing a fusion endothermic peak in a differential scanning calorimeter has a recurring unit of the following formula (1): in which Ar1 is a mixture of residues of tetracarboxylic dianhydrides composed of 12-25 mol. & of a residue of pyromellitic dianhydride, 5-15 mol. % of a residue of 3,3′4,4′-benzophenonetetracarboxylic dianhydride, and a remaining mol. % of a residue of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and Ar2 is an aromatic diamine residue composed of 1,3-bis(4-aminophenoxy)benzene.

Abstract: An antistatic molded resin article based on polyesteramide has a low resistivity even when a substantive amount of electrically conductive additive is not used. The molded article is prepared by copolymerizing (a) a cyclic amide and (b) linear ester selected from polyesterpolyol, polyesteretherpolyol or polycarbonatepolyol. The surface resistivity is less than 1013&OHgr;.

Abstract: New aromatic diamine derivatives and the preparation thereof are disclosed. The diamine derivatives of the present invention can be added to conventional polymerization reactions of tetracarboxylic acids or dianhydrides thereof and diamines to form new polyamic acids. After high-temperature baking, the polyamic acids are cyclized to form polyimides. These polyimides can be used as alignment film materials for liquid crystal display cell and have good alignment property and stability, and are effective in promoting pre-tilt angles.

Abstract: An oriented polyimide film of high strength and a production process therefor. The process basically comprises stretching a gelled film and then imidating the film. The gelled film is formed by introducing a polyamic acid solution into a condensation agent solution. The gelled film is swollen with a solvent at the time of stretching.

Abstract: Aromatic polyethers are prepared by displacement polymerization reaction in the presence of a water-immiscible solvent with boiling point at atmospheric pressure of greater than 110° C. and a density ratio to water of greater than 1.1:1 at 20-25° C. The polyethers are purified by processes comprising aqueous extraction, or filtration, or a combination thereof.

Abstract: The present invention provides a method for easily producing a high-molecular weight polyimide resin at high yield by drying and heating a mixture mixed by material monomers of polyimide.

Abstract: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage. In a representative composition, 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 &mgr;m to approximately 180 &mgr;m and a number average diameter of approximately 0.1 &mgr;m to 15.00 &mgr;m and the average aspect ratio of which is greater than 3:1 is compounded with 100 parts by weight of semi-aromatic polyamide in which the quantity of aromatic monomer in the monomer component that forms the polyamide is greater than 20 mol % and the melting point of which is greater than 280° C.

Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.

Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.

Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.

Abstract: A separating agent that serves as an optical resolution agent is composed of a novel, useful optically active polymer. The separating agent is obtained through anionic polymerization of a novel maleimide and serves to separate optically active compounds.

Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.