Imide-containing Reactant Patents (Class 528/170)
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Publication number: 20020013444Abstract: A curable composition is placed on a candle, and then the composition is exposed to curing conditions such as ultraviolet light, to thereby cure the coating composition and provide a candle having a cured coating. The curable composition may be the reaction product of TMPTA (trimethylolpropanetriacrylate), itself the reaction product of trimethylolpropane and acrylic acid) and oleyl amine (an unsaturated primary amine having eighteen carbons). The candle may be made of wax or a gelled solvent, i.e., a mixture of gellant and solvent, particularly a hydrocarbon or other low polarity solvent. The undiluted coating may be applied by spraying on the oily surface of the candle. Ultraviolet cure of the coating occurs in 1-2 seconds.Type: ApplicationFiled: June 4, 2001Publication date: January 31, 2002Inventors: Raymond H. Jones, Charles D. Moses, Ronald L. Gordon
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Publication number: 20020010306Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C.Type: ApplicationFiled: August 7, 2001Publication date: January 24, 2002Applicant: Ube Industries, Ltd.Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
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Patent number: 6340739Abstract: A polyamide having repeating units represented by formula (1), wherein R1 represents a divalent hydrocarbon residue optionally having in the structure a heteroatom having no active hydrogen. The polyamide has a high refractive index, is biodegradable, and is useful as a material for fibers and plastics.Type: GrantFiled: October 20, 2000Date of Patent: January 22, 2002Assignees: Cosmo Research Institute, Cosmo Oil Co., Ltd.Inventors: Kiyotaka Shigehara, Yoshihiro Katayama, Seiji Nishikawa, Yasushi Hotta
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Publication number: 20020007041Abstract: Polyamides including functional groups and methods of preparing such polyamides. The polyamides are useful, for example, to prepare filaments.Type: ApplicationFiled: January 9, 2001Publication date: January 17, 2002Inventor: George E. Zahr
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Publication number: 20020007040Abstract: A process for increasing the relative viscosity (RV) of a reactant polyamide and to products produced by the process. The process includes contacting the reactant polyamide and a chain extender compound, forming the product, and quenching the product when its RV is near its maximum calculated RV value.Type: ApplicationFiled: January 10, 2001Publication date: January 17, 2002Inventor: George E Zahr
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Publication number: 20020002266Abstract: The invention relates to a method for the hydrolytic polymerisation of &egr;-caprolactam to polyamide-6, comprising a step (a) in which ring opening of part of the &egr;-caprolactam to the corresponding amino caproic acid is effected in the presence of water and a step (b) in which polyaddition and polycondensation are effected under preferably anhydrous reaction conditions, in which at least one of the steps (a) and (b) is carried out in a reactor in which a self-renewing interface between the molten phase and the gas phase with a large surface/volume ratio of the molten phase is effected. The method is preferably effected in an horizontal scraped-surface reactor, since relatively strong mixing of the molten phase can be achieved in these and the molten phase is present in a thin layer, a large gas volume is present having a relatively high partial pressure of the water vapour and the thin layer is constantly renewed by shear forces.Type: ApplicationFiled: June 22, 2001Publication date: January 3, 2002Inventors: Wim Buijs, Ronald J. H. Hoenen
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Patent number: 6335418Abstract: A primary object of the invention is to provide a production technology for functional polyamic acid microfine particles and functional polyimide microfine particles by which the particle shape, size and size distribution can be freely controlled. The invention is concerned with a process for synthesizing polyamic acid particles having functional groups at least on the surface from a tetracarboxylic anhydride and a diamine compound characterized by its comprising (a) a first step which comprises providing a tetracarboxylic anhydride and a diamine compound at least one of which has functional groups and preparing a first solution containing the tetracarboxylic anhydride and a second solution containing the diamine compound and (b) a second step which comprises mixing the first and second solutions under ultrasonic agitation to thereby precipitate polyamic acid microfine particles from the mixed solution.Type: GrantFiled: August 18, 2000Date of Patent: January 1, 2002Assignees: Osaka Prefectural Government, Sumitomo Bakelite Co., Ltd.Inventors: Katsuya Asao, Hitoshi Morita, Hitoshi Onishi, Masaki Kimoto, Yayoi Yoshioka, Hidenori Saito
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Patent number: 6335417Abstract: A novel modified polyimide resin having a polybutadiene sheleton and obtainable by reacting the following three (3) kinds of compounds, i.e., a bifunctional hydroxyl-terminal polybutadiene having a number average molecular weight of 800 to 5,000, a tetrabasic acid dianhydride, and a diisocyanate compound, imparts reduced shrinkage upon setting to a thermosetting resin composition comprising the same and also imparts heat resistance and pliability and the like to a hardened mass or article of such thermosetting resin composition. Therefore, such thermosetting resin composition is an excellent resin composition capable of fully satisfying the requirements with regard to the characteristics of an overcoat agent for a wiring circuit which should be pliable, such as a flexible wiring circuit substrate, a film carrier and the like.Type: GrantFiled: August 17, 2000Date of Patent: January 1, 2002Assignee: Ajinomoto Co., Inc.Inventors: Hiroshi Orikabe, Tadahiko Yokota
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Patent number: 6335416Abstract: A polyimide film, which is produced from polyamide acid prepared through the reaction of p-phenylenebis(trimellitic acid monoester anhydride), oxydiphthalic acid dianhydride, p-phenylenediamine, and 4,4′-diaminodiphenylether in an organic solvent, and which has a high elastic modulus, a high elongation, a low coefficient of linear expansion which is not quite different from that of copper, and a low coefficient of hygroscopic expansion.Type: GrantFiled: April 25, 2000Date of Patent: January 1, 2002Assignee: Kaneka CorporationInventors: Hitoshi Nojiri, Koichiro Tanaka
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Patent number: 6333392Abstract: An object of the invention is to provide thermosetting amic acid microfine particles, thermosetting imide microfine particles and crosslinked imide microfine particles of controlled particle shape and size distribution. The invention provides a production technology which comprises mixing a first solution containing a tetracarboxylic anhydride and a C═C bond-containing acid anhydride with a second solution containing a diamine compound, causing precipitation of thermosetting amic acid microfine particles from the resulting mixture, and further producing thermosetting imide microfine particles and crosslinked imide microfine particles from the thermosetting amic acid microfine particles.Type: GrantFiled: May 5, 2000Date of Patent: December 25, 2001Assignees: Sumitomo Bakelite and Co. Ltd., Osaka Prefectual GovernmentInventors: Katsuya Asao, Hidenori Saito
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Patent number: 6333390Abstract: Branched or hyperbranched polymeric structures which contain at least one etherimide branch point, more specifically from stable A1Bn (where n≧2), AB, AA, and BB monomers; Am end-capping agents (where m=1); Bn cores (where n≧1) and combinations thereof; with controllable degrees of branching (DB=0-1), molecular architectures, end-group compositions, along with methods for their preparation.Type: GrantFiled: November 5, 1999Date of Patent: December 25, 2001Assignee: The Board of Trustees of the University of IllinoisInventors: Jeffrey S. Moore, D. Scott Thompson, Larry J. Markoski
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Patent number: 6333391Abstract: A process for the preparation of an oligomeric polyimide comprises: mixing a tetracarboxylic acid, a dianhydride, a partially hydrolysed dianhydride or a mixture thereof with a diamine in a reaction medium comprising greater than 80% by weight water, and heating mixture in said reaction medium at a temperature above 100° C. for a time sufficient to form said oligomeric polyimide.Type: GrantFiled: April 21, 2000Date of Patent: December 25, 2001Assignees: Commonwealth Scientific and Industrial Research Organisation, The Boeing CompanyInventors: Bronwyn Glenice Laycock, David Geoffrey Hawthorne, Jonathan Howard Hodgkin, Trevor Charles Morton
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Patent number: 6329494Abstract: A 6,6′-dialkyl-3,3′4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern wherein Y is a divalent organic group, R7 and R8 are OH or a monovalent organic group, R9 and R10 are a monovalent hydrocarbon group, R11, R12 and R13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.Type: GrantFiled: November 1, 1999Date of Patent: December 11, 2001Assignees: Hitachi Chemical DuPont MicroSystems Ltd., Hitachi Chemical DuPont MicroSystems L.L.C.Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara
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Patent number: 6323301Abstract: Disclosed is a composition comprising a polymer with a weight average molecular weight of from about 1,000 to about 100,000, said polymer containing at least some monomer repeat units with a first, photosensitivity-imparting substituent which enables crosslinking or chain extension of the polymer upon exposure to actinic radiation, said polymer also containing a second, thermal sensitivity-imparting substituent which enables further crosslinking or chain extension of the polymer upon exposure to temperatures of about 140° C.Type: GrantFiled: August 10, 2000Date of Patent: November 27, 2001Assignee: Xerox CorporationInventors: Thomas W. Smith, Timothy J. Fuller, Ram S. Narang, David J. Luca
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Patent number: 6320019Abstract: A method for preparing polyamic acid and polyimide of three-dimensional molecular structure such that these polymers are superior in adhesive strength and high-temperature stability while maintaining their inherent thermal resistance and mechanical properties, and thus can be effectively used as an adhesive material for high temperature adhesive tapes suitable for semiconductor assembly.Type: GrantFiled: February 25, 2000Date of Patent: November 20, 2001Assignee: Saehan Industries IncorporationInventors: Kyung Rok Lee, Soon Sik Kim, Kyeong Ho Chang, Jeong Min Kweon
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Patent number: 6320017Abstract: The present invention relates to new polyamide oligomers. These oligomers can be conjugated to lipids, nucleic acids, peptides, proteins, etc. The oligomer-lipid conjugates can be used to form liposomes, virusomes, micelles, etc., optionally containing drugs or biological agents. The polyamide oligomers are heterobifunctional allowing the attachment of other suitable ligand compounds (e.g., a targeting moiety). In addition, methods of use for the liposomes, virusomes, micelles, etc., are provided.Type: GrantFiled: December 22, 1998Date of Patent: November 20, 2001Assignee: INEX Pharmaceuticals Corp.Inventor: Steven Michial Ansell
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Patent number: 6316587Abstract: The present invention provides a polyamide composition comprising: a polyamide containing an alkylene oxide group; and a metal salt. The polyamide composition of the present invention has long lasting antistatic properties and a lower surface resistivity than the polyamide alone.Type: GrantFiled: October 29, 1999Date of Patent: November 13, 2001Assignee: Industrial Technology Research InstituteInventors: Yuung-Ching Sheen, Jen-Lien Lin, Jiang-Jen Lin, Meng-Yao Yang
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Patent number: 6316574Abstract: The present invention provides a liquid crystal display element having an adequate pre-tilt angle for preventing the reverse domain, as well as excellent electrical properties by preparation of the polyamic acid composition for the liquid crystal display element which comprises a polyamic acid A that excels in electrical properties and a polyamic acid B that has side chains, mixed in the ratio A/B of 50/50 to 95/5 (by weight).Type: GrantFiled: June 19, 2000Date of Patent: November 13, 2001Assignee: Chisso CorporationInventors: Satoshi Tanioka, Shizuo Murata, Itsuo Shimizu, Kazumi Ito
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Patent number: 6316589Abstract: A polyimide for optical communications, which is expressed by the formula (1) where R1 and R2 are independently selected from the group consisting of CF3, CCl3, unsubstituted aromatic ring group and halogenerated aromatic ring group; R3 and R4 are independently selected from the group consisting of Cl, F, I, Br, CF3, CCl3, unsubstituted aromatic ring group and halogenated aromatic ring group; and n is an integer from 1 to 39. The polyimides have a superior heat resistance, and can avoid the increase in optical absorption loss due to a refractive index increase and deterioration of adhesive and coating properties due to weak surface tension of a polyimide film. In addition, use of the polyimides as a material for a core layer of optical waveguides can expand the selection range of material for the cladding layer of the optical waveguide.Type: GrantFiled: April 11, 2000Date of Patent: November 13, 2001Assignee: SamSung Electronics Co., LtdInventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee
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Publication number: 20010039326Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): 1Type: ApplicationFiled: March 1, 2001Publication date: November 8, 2001Inventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
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Patent number: 6313258Abstract: An aromatic polycarbodiimide having a specified structural unit is disclosed. The aromatic polycarbodiimide can give films, moldings, adhesives and the like each having excellent characteristics such as high heat resistance, high dimensional stability, high moisture resistance or the like, and therefore is suitable for use as a heat resistant covering material in, for example, production of electronic parts.Type: GrantFiled: July 14, 2000Date of Patent: November 6, 2001Assignee: Nitto Denko CorporationInventors: Michie Sakamoto, Amane Mochizuki, Michiharu Yamamoto
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Publication number: 20010037010Abstract: The invention relates to carbodiimide-based block copolymers, a method of preparing them and also their use as hydrolysis stabilizers in ester-group-containing polymers.Type: ApplicationFiled: March 20, 2001Publication date: November 1, 2001Inventors: Heiko Tebbe, Ludger Heiliger, Volker Muller
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Patent number: 6310135Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.Type: GrantFiled: February 20, 1998Date of Patent: October 30, 2001Assignee: Nippon Zeon Co., Ltd.Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
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Patent number: 6307002Abstract: A polyimide represented by the following general formula (1); wherein l, m, and n represent not the order of each repeating unit, but the numbers of each repeating unit existing in the molecule, E1 is a photosensitive group, E2 is a group comprising an alkyl group having 2 to 20 carbon atoms, —A(—E1)—, —A(—E2)—, and B each are a divalent organic group, X and Y each are a tetravalent organic group, X, Y, A, B, E1 and E2 may be identical or different among the repeating units, 1 is an integer of 1 or more, m and n each are an integer of 0 or more. The polyimide and polyimide compositions comprising it has thermoreactivity as well as photoreactivity and photosensitivity.Type: GrantFiled: November 9, 1999Date of Patent: October 23, 2001Assignee: Kaneka CorporationInventors: Kohji Okada, Hitoshi Nojiri
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Patent number: 6303743Abstract: A polyimide for optical communications, which is expressed by the formula (1), a method of preparing the same, and a method of forming multiple polyimide films using the polyimide, wherein the formula (1) is given by X1, X2, X3, A1, A2, B1, B2, B3, D1, D2, E1, E2, Y1, Y2, Y3, Y4, Y5, Y6, Y7, and Y8, are independently selected from the group consisting of hydrogen atom, halogen atom, alkyl group, halogenated alkyl group, aryl group and halogenated aryl group; Z is a simple chemical bond or selected from the group consisting of —O—, —CO—, —SO3—, —S—, —(T)m—, —(OT)m— and —(OTO)m—, wherein T is alkylene or arylene group substituted by at least one of halogen atom and halogenated alkyl group and m is an integer from 1 to 10; and n is an integer from 1 to 39.Type: GrantFiled: November 17, 1999Date of Patent: October 16, 2001Assignee: SamSung Electronics Co., Ltd.Inventors: Kyung-hee You, Kwan-soo Han, Tae-hyung Rhee
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Patent number: 6303742Abstract: The present invention provides a novel polyimide composition which includes a cinnamoyl group or a derived cinnamoyl group and has photo-reactivity and heat-reactivity inherent to the cinnamoyl group. Further, a novel diamine and an acid dianhydride according to the present invention are materials mainly used for preparing a novel polyimide composition having the cinnamoyl group or the derived cinnamoyl group in a main chain or a side chain.Type: GrantFiled: December 1, 1999Date of Patent: October 16, 2001Assignee: Kanekafuchi Kagaku Kogyo Kabushiki KaishaInventors: Kohji Okada, Hitoshi Nojiri
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Patent number: 6297345Abstract: A polyamide with excellent stretching properties is disclosed, which comprises 50 to 99.8 mol % of a unit derived from a lactam and/or an aminocarboxylic acid, 0.1 to 25 mol % of a unit derived from a dicarboxylic acid, and 0.1 to 25 mol % of a unit derived from a diamine component containing 10 to 100 mol % of at least one compound selected from the group consisting of a branched saturated diamine having 6 to 22 carbon atoms, a branched alicyclic diamine having 6 to 16 carbon atoms, and a norbornanediamine.Type: GrantFiled: May 3, 2000Date of Patent: October 2, 2001Assignee: Ube Industries, Ltd.Inventors: Hiroshi Okushita, Shoichi Tanaka
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Patent number: 6294639Abstract: The present invention relates to a treating agent for liquid crystal alignment, which comprises a polyamic acid compound having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C. at a concentration of 0.5 g/dl) and containing repeating units represented by the general formula [I]: (wherein R1 is a tetravalent organic group constituting a tetracarboxylic acid which has an alicyclic structure having from 2 to 5 rings condensed and wherein all the carbonyl groups are directly bonded to the alicyclic structure and said carbonyl groups are not bonded to adjacent carbon atoms in the alicyclic structure, and R2 is a bivalent organic group constituting a diamine), or a polyimide resin obtained by imidizing said polyamic acid compound, and a liquid crystal alignment film and a liquid crystal device employing it.Type: GrantFiled: June 2, 2000Date of Patent: September 25, 2001Assignee: Nissan Chemical Industries, Ltd.Inventors: Kiyoshi Sawahata, Hideyuki Nawata, Takayasu Nihira, Yoshikazu Ohtsuka, Yasuyuki Nakajima
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Patent number: 6291633Abstract: A molding polyamide resin composition with excellent weld strength is disclosed which comprises: 100 parts by weight of a polyamide resin comprising from 95 to 55 wt % crystalline, partly aromatic copolyamide resin containing one kind of aromatic monomer units and/or crystalline aliphatic polyamide resin and from 5 to 45 wt % polyamide resin comprising units derived from a xylylenediamine and units derived from an aliphatic dicarboxylic acid or noncrystalline, partly aromatic copolyamide resin containing at least two kinds of aromatic monomer units; and from 5 to 200 parts by weight of an inorganic filler.Type: GrantFiled: January 7, 2000Date of Patent: September 18, 2001Assignee: UBE Industries, Inc.Inventor: Ken Nakamura
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Patent number: 6288209Abstract: Polyimide copolymers were obtained containing 1,3-bis(3-aminophenoxy)benzene (APB) and other diamines and dianhydrides and terminating with the appropriate amount of reactive endcapper. The reactive endcappers studied include but should not be limited to 4-phenylethynyl phthalic anhydride (PEPA), 3-aminophenoxy-4′-phenylethynylbenzophenone (3-APEB), maleic anhydride (MA) and nadic anhydride (5-norbornene-2,3-dicarboxylic anhydride, NA). Homopolymers containing only other diamines and dianhydrides which are not processable under conditions described previously can be made processable by incorporating various amounts of APB, depending on the chemical structures of the diamines and dianhydrides used. By simply changing the ratio of APB to the other diamine in the polyimide backbone, a material with a unique combination of solubility, Tg, Tm, melt viscosity, toughness and elevated temperature mechanical properties can be prepared.Type: GrantFiled: September 21, 2000Date of Patent: September 11, 2001Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Brian J. Jensen
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Patent number: 6288208Abstract: The present invention relates to a highly branched polyamide oligomer of the general formula (I) as hereinabove defined, to the process for preparing and branched oligomers and to different uses thereof. As well known to the man skilled in the art, the implementations and efficacy of the different polyamide oligomers may vary, depending on their structure and valency (reactive groups composition). Polyamide oligomers may be used, for example, as epoxy hardeners in the preparation of thermosetting compositions, as thermoplastic hot melt adhesives, as adhesion promoters and many other suitable applications. The highly branched oligomers disclosed have been shown to be highly efficient, for example, as epoxy hardeners, inter alia, in the formation of glue, lacquer, enamel or sealant mixtures.Type: GrantFiled: April 20, 1999Date of Patent: September 11, 2001Assignee: Epox, Ltd.Inventor: Leonid Moshinsky
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Patent number: 6281323Abstract: Terminal-modified imide oligomers with an inherent viscosity of 0.05-1 obtained by reacting 2,3,3′,4′-biphenyltetracarboxylic dianhydride, an aromatic diamine compound and 4-(2-phenylethynyl)phthalic anhydride, and their cured products. There are provided highly practical terminal-modified imide oligomers and their cured products, which cured products have satisfactory heat resistance and mechanical properties.Type: GrantFiled: November 19, 1999Date of Patent: August 28, 2001Assignee: Ube Industries, Ltd.Inventors: Rikio Yokota, Masatoshi Hasegawa, Hiroaki Yamaguchi
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Patent number: 6280843Abstract: Aromatic polyamide fibers which have a crystalline structure having (1) crystal size (A) in a (110) plane of 7.5 nm, (2) crystal size (B) in a (200) plane of 8.2 nm and (3) a product A×B of 61.50 to 630.00, and exhibit a thermal linear expansion coefficient of −1.0×10−6/° C. to −7.5×10−6/° C. and thus a high dimensional stability even upon moisture-absorbing and desorbing, are useful for forming a resin-reinforcing fiber sheet, a pre-preg containing the fiber sheet, and a laminate for, for example, an electric insulating material or electric circuit board, having an excellent cutting, shaving, perforating or laser processability and capable of forming a smooth cut, shaved or perforated face.Type: GrantFiled: June 3, 1999Date of Patent: August 28, 2001Assignee: Teijin LimitedInventors: Sadamitsu Murayama, Masanori Wada, Michikage Matsui
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Patent number: 6281324Abstract: A semiconductive belt comprising a polyimide film having a volume resistivity of 109 &OHgr;cm to 1016 &OHgr;cm and a surface resistivity of 1010 &OHgr; to 1017 &OHgr; at 25° C. and 60% RH, wherein the amount of change of the surface resistivity between 30° C. and 85% RH and 10° C. and 15% RH in terms of common logarithm being is 1.0 or smaller.Type: GrantFiled: December 21, 1999Date of Patent: August 28, 2001Assignee: Nitto Denko CorporationInventors: Masao Nakamura, Toshihiko Tomita, Masakazu Sugimoto, Junichi Nakazono, Toshiaki Iwamoto
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Patent number: 6277949Abstract: The invention provides a coating composition for building use, which contains a base polyamide resin coating and charcoal powder. The base polyamide resin coating contains a copolymeric nyron and a solvent therefor.Type: GrantFiled: January 31, 2000Date of Patent: August 21, 2001Inventor: Michiharu Yoshimatsu
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Patent number: 6277950Abstract: The present invention provides polyimides and co-polyimides that are organosoluble. The polyimides and co-polyimides are prepared from an aromatic diamine having ortho-linked phenylene and pendant tert-butyl group, i.e., 1,2-bis(4-aminophenoxy)-4-tert-butyl-benzene, or its mixture with other diamines, and a mixture of dianhydrides that containing at least one dianhydride selected from s-BPDA, DSDA, ODPA, 6FDA and other diether-dianhydrides.Type: GrantFiled: January 26, 2000Date of Patent: August 21, 2001Assignee: National Science CouncilInventors: Chin-Ping Yang, Sheng-Huei Hsiao, Shin-Hung Chen
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Patent number: 6274695Abstract: The present invention relates to a treating agent for liquid crystal alignment, which is an agent for liquid crystal alignment to be used for a method in which polarized ultraviolet rays or electron rays are irradiated on a polymer thin film formed on a substrate in a predetermined direction relative to the substrate plane, and said substrate is used for aligning liquid crystal without rubbing treatment, wherein said agent for liquid crystal alignment contains a polymer compound having photochemically reactive groups in the polymer main chain and a glass transition temperature of at least 200° C.Type: GrantFiled: November 1, 1999Date of Patent: August 14, 2001Assignee: Nissan Chemical Industries, Ltd.Inventors: Hideyuki Endou, Takayasu Nihira, Hiroyoshi Fukuro
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Patent number: 6271335Abstract: A method of making a thermally-removable encapsulant by heating a mixture of at least one bis(maleimide) compound and at least one monomeric tris(furan) or tetrakis(furan) compound at temperatures from above room temperature to less than approximately 90° C. to form a gel and cooling the gel to form the thermally-removable encapsulant. The encapsulant can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C., preferably in a polar solvent. The encapsulant can be used in protecting electronic components that may require subsequent removal of the encapsulant for component repair, modification or quality control.Type: GrantFiled: January 18, 2000Date of Patent: August 7, 2001Assignee: Sandia CorporationInventors: James H. Small, Douglas A. Loy, David R. Wheeler, James R. McElhanon, Randall S. Saunders
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Patent number: 6268465Abstract: An aliphatic polyester amide which is hydrolysis-resistant includes a ternary polycondensation product of monomeric constituents composed of a monomeric constituent A which is at least one diol having a general formula: HO—R1—OH, where R1 is an aliphatic residue having 2-16 carbon atoms; a monomeric constituent B which is at least one dicarboxylic acid having a general formula: HOOC—R2—COOH, where R2 is an aliphatic residue having 1-14 carbon atoms; and a monomeric constituent C which is at least one diamine having a general formula: H2N—R3—NH2, where R3 is an aliphatic residue having 2-16 carbon atoms and is present in an amount of up to about 5% by weight based on total weight of the monomeric constituents, wherein polycondensation proceeds in the presence of a catalyst comprised of constituent D, which is a metal-containing catalyst, in combination with constituent E, which is at least one of an organic phosphorus compound and an inorganic phosphorus compound, and whereiType: GrantFiled: April 12, 1999Date of Patent: July 31, 2001Assignee: BK Giulini Chemie GmbH Co OHGInventors: Gudrun Chomiakow, Hasan Ulubay, Emil Wilding
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Patent number: 6268460Abstract: The present invention provides a process for preparing an optical alignment layer for aligning liquid crystals and liquid crystal displays comprising exposing polyimide layers with polarized light. The invention further describes optical alignment layers, liquid crystal displays incorporating optical alignment layers and novel polymer compositions within the class of polyimide, polyamic acids and esters thereof.Type: GrantFiled: July 18, 2000Date of Patent: July 31, 2001Inventors: Wayne M. Gibbons, Patricia A. Rose, Paul J. Shannon, Hanxing Zheng
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Patent number: 6265521Abstract: Polyether polymers such as polyetherimides are prepared by a two-step reaction. The first step is the reaction between an alkali metal salt of a dihydroxy-substituted aromatic hydrocarbon, such as bisphenol A disodium salt, and a substituted aromatic compound such as 1,3-bis[N-(4-chlorophthalimido)]benzene, the alkali metal salt being employed in an amount less than stoichiometric. The intermediate low molecular weight polymer thus produced then undergoes reaction with additional alkali metal salt. By this method, a polyether polymer of closely controlled molecular weight can be conveniently prepared.Type: GrantFiled: August 7, 2000Date of Patent: July 24, 2001Assignee: General Electric CompanyInventors: Thomas Joseph Fyvie, Peter David Phelps, Paul Edward Howson, Donald Frank Rohr, Ganesh Kailasam, Elliott West Shanklin
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Patent number: 6265520Abstract: Disclosed is a solvent soluble polyimide and a method for making thereof, which characterizes by producing a solvent soluble polyimide with low electric conductivity through the polymerization of an anhydride and a diamine under the condition with or without catalyst.Type: GrantFiled: November 29, 1999Date of Patent: July 24, 2001Assignee: Industrial Technology Research InstituteInventors: Hui-Lung Kuo, Chein-Dhau Lee, Yi-Chun Liu, Shih-Chi Yang
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Patent number: 6262223Abstract: Addition-cured polyimides that contain the reaction product of an aromatic triamine or trianhydride analogue thereof, a reactive end group such as 5-norbornene-2, 3-dicarboxylic acid, ester derivatives of 5-norbornene-2,3-dicarboxylic acid, anhydride derivatives of 5-norbornene-2,3-dicarboxylic acid, or 4-phenylethynylphthalic anhydride, an aromatic diamine, and a dialkyl ester of an aromatic tetracarboxylic acid. The resultant starlike polyimides exhibit lower melt flow viscosity than its linear counterparts, providing for improved processability of the polyimide. Also disclosed are methods for the synthesis of these polyimides as well as composite structures formed using these polyimides.Type: GrantFiled: February 1, 2000Date of Patent: July 17, 2001Assignee: The United States of America as represented by the Administrator of National Aeronautics and Space AdministrationInventors: Michael A. Meador, Baochau N. Nguyen, Ronald K. Eby
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Patent number: 6258927Abstract: A polyamide composition, comprising: (A) 100 parts by weight of a polyamide, (B) from 10 to 200 parts by weight of an aromatic ring-containing bromine compound, and (C) from 0.1 to 100 parts by weight of at least one flame-retardant synergist selected from metal salts of stannic acid and alkaline earth metal salts of boric acid. The polyamide composition has good flame retardancy and heat resistance, and exhibits good thermal stability and continuous moldability when molded in melt, and it can be molded into good moldings having excellent appearances, especially fine color tone, without giving much gas.Type: GrantFiled: January 31, 2000Date of Patent: July 10, 2001Assignee: Kuraray Co., Ltd.Inventors: Hideaki Oka, Toru Kuki, Kozo Tamura
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Patent number: 6252033Abstract: A method for preparing polyamic acid and polyimide, which is suitable for use in adhesives or adhesive tapes for electronic parts. The polymers have such three-dimensional molecular structures that a significant improvement can be brought about in solvent solubility, thermal resistance, mechanical properties, and adhesive properties onto various substrates. The polyamic acid is prepared by reacting at least one tetracarboxylic dianhydride, at least one aromatic diamine, at least one diamine with a siloxane structure, represented by the following general formula I, and at least one polyamino compound represented by the following general formula II or III. The polyamic acid is converted into polyimide through thermal or chemical imidization.Type: GrantFiled: March 20, 2000Date of Patent: June 26, 2001Assignee: Saehan Industries IncorporationInventors: Jeong Min Kweon, Soon Sik Kim, Kyeong Ho Chang, Kyung Rok Lee
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Patent number: 6248857Abstract: An aromatic polycarbodiimide comprising a structure represented by the following formula (1) has excellent low moisture resistance, heat resistance and a low dielectric constant: wherein Q is one selected from the group consisting of —CH2—, m is 0 or 1, A is a divalent organic group having 4 or less carbon atoms, Ph is a phenyl group, X's are a hydrogen atom when Q is and the same or different halogen atoms when Q is —CH2—, and n is an integer of 2 to 300.Type: GrantFiled: September 23, 1999Date of Patent: June 19, 2001Assignee: Nitto Denko CorporationInventors: Sadahito Misumi, Akiko Matsumura, Amane Mochizuki, Michio Satsuma, Michie Sakamoto
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Patent number: 6235866Abstract: Bis(halophthalimides) such as, 3-bis[N-(4-chlorophthalimido)]benzene are prepared in slurry in an organic liquid such as o-dichlorobenzene or anisole, by a reaction at a temperature of at least 150° C. between at least one diamino compound, preferably an aromatic diamine such as m- or p-phenylenediamine, and at least one halophthalic anhydride such as 4-chlorophthalic anhydride, in the presence of an imidization catalyst such as sodium phenylphosphinate. The solids content of the reaction mixture is at least about 5% and preferably at least about 12% by weight. The product slurry may be employed directly in the preparation of polyetherimides, and similar slurries may be employed to prepare other polyether polymers.Type: GrantFiled: October 6, 1999Date of Patent: May 22, 2001Assignee: General Electric CompanyInventors: Farid Fouad Khouri, Ganesh Kailasam, Joseph John Caringi, Peter David Phelps, Paul Edward Howson
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Patent number: 6235867Abstract: The present invention provides a liquid crystal-aligning agent including, as the resin component, a polyimide precursor containing a chemical structure represented by the following formula (1): The present invention further provides a liquid crystal-aligning agent including, the above polyimide precursor and a polyimide precursor represented by the following general formula (2): (wherein Y is a tetravalent aliphatic group, Z is a bivalent aromatic group, and R is H or an alkyl group).Type: GrantFiled: November 5, 1999Date of Patent: May 22, 2001Assignee: Sumitomo Bakelite Company LimitedInventors: Toshimasa Eguchi, Toshiro Takeda
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Patent number: 6232428Abstract: Essentially colorless, transparent polyimide coatings and films prepared by combining aromatic dianhydrides with para-substituted aromatic diamines are provided. The polyimide coatings and films are produced by a process whereby the dianhydride and diamine monomer components are reacted at temperatures of greater than 80° C.Type: GrantFiled: January 14, 2000Date of Patent: May 15, 2001Assignee: I.S.T. CorporationInventors: Gary L. Deets, Toshiyuki Hattori
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Patent number: 6228972Abstract: An aromatic polycarbodiimide comprising a structure represented by the following formula (1) has high solubility in organic solvents, good processability, excellent moisture resistance, and water repellency: wherein n is an integer of 2 to 300, and R represents an organic group.Type: GrantFiled: October 20, 1999Date of Patent: May 8, 2001Assignee: Nitto Denko CorporationInventors: Takami Hikita, Michie Sakamoto, Sadahito Misumi, Amane Mochizuki, Takahiro Fukuoka