Imide-containing Reactant Patents (Class 528/170)
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Patent number: 6476177Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.Type: GrantFiled: December 21, 2000Date of Patent: November 5, 2002Assignee: E. I. du Pont de Nemours and CompanyInventors: Brian C. Auman, William R Corcoran, Jr., John R Dodd, Mark A Guidry, John D. Summers
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Publication number: 20020161163Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C.Type: ApplicationFiled: August 7, 2001Publication date: October 31, 2002Applicant: Ube Industries, Ltd.Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
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Publication number: 20020156231Abstract: An electronically active film comprising a compound of the formula: 1Type: ApplicationFiled: April 20, 2001Publication date: October 24, 2002Inventors: Geoffrey A. Lindsay, Richard A. Hollins, John D. Stenger-Smith, Peter Zarras
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Patent number: 6469126Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.Type: GrantFiled: December 21, 2000Date of Patent: October 22, 2002Assignee: E. I. du Pont de Nmeours and CompanyInventors: Brian C. Auman, William R. Corcoran, Jr., John D. Summers
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Patent number: 6469130Abstract: A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having,the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web.Type: GrantFiled: July 26, 2000Date of Patent: October 22, 2002Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Jian Qin, Yong Li, Wendy Lynn Van Dyke, Anthony John Wisneski, Palani Raj Ramaswami Wallajapet, Hannong Rhim
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Publication number: 20020151234Abstract: A water-soluble polyimide precursor, which can be suitably applied for aromatic polyimides and exhibits a low reduction in heat resistance and mechanical properties, an aqueous solution of the polyimide precursor and a polyimide obtained from the precursor. A heat-resistant fiber impregnated material and an impregnated sheet-like material are prepared by using the precursor and a laminate is prepared by employing the precursor.Type: ApplicationFiled: January 31, 2002Publication date: October 17, 2002Applicant: Ube Industries, Ltd.Inventors: Hideki Ozawa, Fumio Aoki
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Patent number: 6458912Abstract: A thermoplastic polyimide having good thermal stability, comprising a repeating unit represented by the chemical formula (1), a molecular terminal being composed of the chemical formula (2) and/or chemical formula (3), characterized in that: a melt viscosity ratio calculated by the numerical formula (1) and/or the numerical formula (3) is within a numerical range shown in the numerical formula (2) and/or the numerical formula (4) and 1,3-bis(4-aminophenoxy)benzene represented by the chemical formula (3) for production of the above polyimide, characterized in that the content of an azo compound is from 0.0 to 0.2%. The thermoplastic polyimide of the present invention has excellent characteristics {circle around (1)} to {circle around (4)} described below. {circle around (1)} It is superior in thermal stability on melting. That is, the degree of lowering of the fluidity on melting with a lapse of time is small and it is possible to apply to conventional melt molding.Type: GrantFiled: February 5, 2001Date of Patent: October 1, 2002Assignee: Mitsui Chemicals, Inc.Inventors: Takashi Kuroki, Yoshihiro Sakata, Tomomi Okumura, Atsushi Shibuya, Yuichi Okawa, Hideaki Oikawa, Kayako Yanagihara, Yasunori Yoshida, Masaji Yoshimura, Hiroyasu Kido, Shoji Tamai
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Publication number: 20020132964Abstract: In the process for producing polyamide of the present invention, a diamine and a dicarboxylic acid are melt-polycondensed in a batch-wise fist polymerizer in the absence of a solvent to produce a middle-stage polyamide. The diamine has a boiling point higher than a melting point of the middle-stage polyamide being produced under inner pressures of the first polymerizer. The middle-stage polyamide is fed into a continuous second polymerizer while controlling the change of relative viscosity within ±0.2, and further polycondensed there to produce the objective polyamide. With such a process, the change of polymerization degree of the middle-stage polyamide during the switching of the polymerization step from a batch-wise manner to a continuous manner is avoided, thereby preventing the variation in quality of the final product.Type: ApplicationFiled: January 8, 2002Publication date: September 19, 2002Inventors: Kazumi Tanaka, Takatoshi Shida, Hideyuki Kurose
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Patent number: 6451956Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes. The barrier layer comprises a polyester-co-imide, polyesterionomer-co-imide or polyamide-co-imide having covalently bonded as repeating units in the polymer chain, aromatic tetracarboxylbisimide groups of the formula: wherein Ar1 and Ar2 represent, respectively, tetravalent and trivalent aromatic groups of 6 to 20 carbon atoms.Type: GrantFiled: June 8, 2001Date of Patent: September 17, 2002Assignee: Nex Press Solutions LLCInventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire
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Patent number: 6451955Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.Type: GrantFiled: September 28, 2000Date of Patent: September 17, 2002Assignee: Sumitomo Bakelite Company LimitedInventors: Michael C. Hausladen, Jin-O Choi
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Patent number: 6451960Abstract: The present invention relates to amine compositions useful in the preparation of polyimides. The polyimides can be used for inducing alignment of a liquid crystal medium with polarized light in liquid crystal display elements.Type: GrantFiled: February 4, 2000Date of Patent: September 17, 2002Assignee: Elsicon, Inc.Inventors: Wayne M. Gibbons, Paul J. Shannon, Hanxing Zheng
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Publication number: 20020128424Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.Type: ApplicationFiled: December 21, 2000Publication date: September 12, 2002Inventors: Brian C. Auman, William R. Corcoran, John R. Dodd, Mark A. Guidry, John D. Summers
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Publication number: 20020123610Abstract: A process for producing a polyimide platy object includes (a) providing a solution containing a solvent and a solute (i.e., a polyimide precursor or polyimide); (b) pouring the solution onto a supporting member; (c) removing a portion of the solvent from the solution at a first temperature lower than boiling point of the solvent, thereby forming a precursory platy object thereon, the precursory platy object having a self-supporting property and a first surface in contact with the supporting member and a second surface away therefrom and a first content of the solvent at the first surface and a second content (less than the first content by 2-10 wt %) of the solvent at the second surface; and (d) detaching the precursory platy object therefrom; and (e) heating the precursory platy object at a second temperature higher than boiling point of the solvent and is lower than decomposition temperature of the polyimide.Type: ApplicationFiled: February 20, 2002Publication date: September 5, 2002Inventors: Yoshihiro Moroi, Hidehisa Nanai, Yuji Yamamoto, Shigeki Sakaguchi
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Publication number: 20020120090Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): 1Type: ApplicationFiled: May 3, 2001Publication date: August 29, 2002Applicant: Industrial Technology Research InstituteInventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
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Publication number: 20020120091Abstract: A poly amic acid precursor containing a combination of tetrahydrofuran and N-methylpyrrolidinone as cosolvents is described. Utilizing the combination of tetrahydrofuran and N-methylpyrrolidinone allows for the removal of significant portions of the solvent during the formation of the polyimide. The removal of tetrahydrofuran and N-methylpyrrolidinone can be done without the use of preheating zones so as to allow for the large scale production of polyimide articles.Type: ApplicationFiled: February 15, 2002Publication date: August 29, 2002Inventor: Lisa Scott
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Patent number: 6441127Abstract: An alignment treating agent for a liquid crystal cell, which comprises a polyimide resin of the formula (I): wherein R1 is a tetravalent organic group constituting a tetracarboxylic acid or its derivative, R2 is a bivalent organic group constituting a diamine, and m is a positive integer, provided that at least 10 mol % of R2 is a bivalent organic group selected from the group consisting of: wherein X is H, OH, an alkyl group, an alkoxy group, a carboxyl group, an acyl group or a halogen atom, said polyimide resin being made insoluble in an organic solvent by coating a precursor solution of said polyimide resin on a substrate, followed by heating.Type: GrantFiled: January 19, 1994Date of Patent: August 27, 2002Assignee: Nissan Chemical Industries Ltd.Inventors: Kiyoshi Sawahata, Toyohiko Abe, Yoshihiro Tsuruoka, Hiroyoshi Fukuro
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Patent number: 6440576Abstract: A metal-plated aromatic polyimide film composed of an aromatic polyimide resin film, a surface layer of which contains a dispersed palladium metal or a palladium compound, and a metal layer which is chemically plated on the surface layer of the polyimide resin film. The surface layer is preferably formed by placing a palladium compound on a self-supporting aromatic polyimide precursor film and heating the self-supporting film having the palladium compound on its surface layer to a temperature at which the polyimide precursor is converted into its corresponding aromatic polyimide.Type: GrantFiled: February 3, 2000Date of Patent: August 27, 2002Assignee: Ube Industries, Ltd.Inventors: Tomohiko Yamamoto, Jun Takagi, Hiroto Shimokawa
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Patent number: 6423811Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.Type: GrantFiled: July 19, 2000Date of Patent: July 23, 2002Assignee: Honeywell International Inc.Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
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Patent number: 6423817Abstract: A process for preparing inherently light- and heat-stabilized polyamides comprises polymerizing in the presence of at least one triacetonediamine compound of the formula where R is hydrogen or hydrocarbyl having from 1 to 20 carbon atoms, preferably alkyl having from 1 to 18 carbon atoms, or benzyl.Type: GrantFiled: December 31, 1996Date of Patent: July 23, 2002Assignee: BASF AktiengesellschaftInventors: Klaus Weinerth, Karlheinz Mell, Paul Matthies, Ludwig Beer
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Publication number: 20020091225Abstract: Sulfonated polymers are made by the direct polymerization of a sulfonated monomer to form the sulfonated polymers. The types of sulfonated polymers may include polysulfones or polyimides. The sulfonated polymers can be formed into membranes that may be used in proton exchange membrane fuel cells or as ion exchange membranes. The membranes formed from the sulfonated polymers exhibit improved properties over that of Nafion®. A heteropoly acid may be added to the sulfonated polymer to form a nanocomposite membrane in which the heteropoly acid is highly dispersed. The addition of a heteropoly acid to the sulfonated polymer increases the thermal stability of the membrane, enhances the conductivity above 100° C., and reduces the water uptake of the membrane.Type: ApplicationFiled: September 20, 2001Publication date: July 11, 2002Inventors: James E. McGrath, Michael Hickner, Feng Wang, Yu-Seung Kim
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Patent number: 6417321Abstract: A thermally cured polyimide is provided, and in particular a crosslinked polyimide, comprising a fluorenyl diamine and comprising an aromatic ring having at least one C1-C10 branched or unbranched alkyl substituent, where the alkyl substituent includes a benzylic hydrogen. The present invention provides a crosslinked polyimide made by a process comprising the step of crosslinking a polyimide comprising diamines comprising pendent fluorenyl groups and comprising aromatic rings having at least one C1-C10 branched or unbranched alkyl substituent, the alkyl substituent including a benzylic hydrogen, by raising the temperature of said polyimide above its glass transition temperature.Type: GrantFiled: August 21, 2000Date of Patent: July 9, 2002Assignee: 3M Innovative Properties CompanyInventors: Kazuhiko Minami, Hiroshi Ayukawa, Toshihiro Suwa, Mitsuaki Kobayashi, Bert T. Chien, Stephen A. Ezzell
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Patent number: 6414105Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): where R is an organic group having 3 or more carbon atoms, and n is an integer of 2 to 300, and a polycarbodiimide solution, a polycarbodiimide sheet, and an insulated coated electric wire which are prepared using the aromatic polycarbodiimide. The aromatic polycarbodiimide has high solubility in an organic solvent, satisfactory workability, and excellent heat resistance and humidity resistance. The insulated coated electric wire has excellent durability and is highly reliable under high pressure, high humidity conditions.Type: GrantFiled: March 1, 2001Date of Patent: July 2, 2002Assignee: Nitto Denko CorporationInventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
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Publication number: 20020082383Abstract: In the production of polyamide by the melt-polymerization of the present invention, the polymerization conditions are rapidly and accurately controlled by a near-infrared spectroscopy to enable the efficient production of a desired polyamide with a good stability in its quality.Type: ApplicationFiled: December 18, 2001Publication date: June 27, 2002Inventors: Hideyuki Kurose, Kazumi Tanaka
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Patent number: 6410677Abstract: The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications.Type: GrantFiled: September 27, 2000Date of Patent: June 25, 2002Assignee: Sumitomo Bakelite Company LimitedInventors: Takashi Enoki, Nobuhiro Higashida, Mitsuru Murata
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Publication number: 20020077445Abstract: The invention is a novel method for the late introduction of additives into a process for making condensation polymers. The method employs a reactive carrier that functions as a delivery vehicle for one or more additives. The reactive carrier reacts with the condensation polymers, thereby binding the reactive carrier in the polymer resin and preventing the emergence of the reactive carrier from the polymer resin during subsequent thermal processing.Type: ApplicationFiled: December 14, 2001Publication date: June 20, 2002Inventors: Carl Steven Nichols, Tony Clifford Moore, Robert Joseph Schiavone, Walter Lee Edwards
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Publication number: 20020077443Abstract: The invention is a novel method for the late introduction of additives into condensation polymers. The method employs a reactive carrier that functions as a delivery vehicle for one or more additives. The reactive carrier reacts with the condensation polymers, thereby binding the reactive carrier in the polymer resin and preventing the emergence of the reactive carrier from the polymer resin during subsequent thermal processing.Type: ApplicationFiled: December 14, 2001Publication date: June 20, 2002Inventors: Carl Steven Nichols, Tony Clifford Moore, Robert Joseph Schiavone, Walter Lee Edwards
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Patent number: 6407197Abstract: Aqueous dispersion of a polymer, which polymer has been obtained by subjecting a starting polymer which contains maleic anhydride monomer units and vinyl aromatic monomer units to an imidization reaction, the starting polymer containing 7-50 mole % maleic anhydride monomer units and the imidization reaction having been carried out in such a way that at most 75% of the maleic anhydride monomer units has been imidized.Type: GrantFiled: September 1, 2000Date of Patent: June 18, 2002Assignee: DSM N.V.Inventors: Hendrik J. Van Den Berg, Mathijs H. G. Maassen, Laurentius W. Steenbakkers
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Patent number: 6395907Abstract: The present invention is directed to new polycyclicaromatic-ethynyl terminated materials that possesses excellent mechanical and chemical properties for high-performance composite application that can be cured at lower temperatures than phenyl-ethynyl terminated imide materials.Type: GrantFiled: November 17, 2000Date of Patent: May 28, 2002Assignee: Virginia Commonwealth UniversityInventors: Michel E. Wright, Derek Schorzman
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Patent number: 6392004Abstract: An element of a gigahertz electronic device is provided comprising a polyimide selected to have an imide equivalent weight of 375 or greater. The polyimide preferably has a dielectric loss at 12.8 GHz of 0.009 or less and a Tg of 260° C. or greater. Such elements include circuit substrates and antennas.Type: GrantFiled: August 21, 2000Date of Patent: May 21, 2002Assignee: 3M Innovative Properties CompanyInventors: Bert T. Chien, Stephen A. Ezzell
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Publication number: 20020055606Abstract: A polycarbodiimide represented by the formula (I): 1Type: ApplicationFiled: August 30, 2001Publication date: May 9, 2002Inventors: Sadahito Misumi, Yuji Hotta, Akiko Matsumura
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Patent number: 6384181Abstract: A method of producing a polyamide resin by reacting with at least one diamine compounds at least one linear polyester resin consisting of at least one dicarboxylic acid component and at least one diol component and having an intrinsic viscosity of not less than 0.2 dl/g, so that the at least one diol component of the linear polyester resin is substituted by the diamine compound, resulting in the polyamide resin as a reaction product, wherein the improvement comprises: at least one of a carboxylic acid-activator and an inorganic salt being present in a reaction system of the linear polyester resin and the diamine compound.Type: GrantFiled: June 28, 2000Date of Patent: May 7, 2002Assignee: M & S Research and Development Co., Ltd.Inventor: Seiko Nakano
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Patent number: 6383578Abstract: An angularity enhancement layer in a liquid crystal display, which display comprises a liquid crystal cell, wherein the angularity enhancement layer includes a negative birefringent polyimide layer comprising a plurality of structural units having pendant fluorene groups, said angularity enhancement layer being disposed on at least one surface of said liquid crystal cell. A liquid crystal display can comprise an angularity enhancement construction of the invention which comprises a polyimide layer.Type: GrantFiled: April 3, 2001Date of Patent: May 7, 2002Assignee: 3M Innovative Properties Co.Inventors: Stephen A. Ezzell, Hassan Sahouani, Ernest L. Thurber
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Publication number: 20020052464Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxlic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: ApplicationFiled: October 29, 2001Publication date: May 2, 2002Applicant: Ube Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Publication number: 20020052463Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.Type: ApplicationFiled: October 29, 2001Publication date: May 2, 2002Applicant: Ube Industries, Ltd.Inventors: Hiroaki Yamaguchi, Fumio Aoki
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Publication number: 20020045054Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.Type: ApplicationFiled: August 10, 2001Publication date: April 18, 2002Inventors: Kenji Uhara, Naofumi Yasuda, Kouichi Sawasaki
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Publication number: 20020045725Abstract: The method for forming a finely divided polymerizate in the form of a dispersion (D) of particles (50, 51) for the purpose of manufacturing powder lacquers or fiber compound materials comprises two steps:Type: ApplicationFiled: October 11, 2001Publication date: April 18, 2002Applicant: Sulzer Markets and Technology AGInventors: Albert Vodermayer, Lothar Kuhnert
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Publication number: 20020037991Abstract: A 6,6′-dialkyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to 1-line, developed and heated to form a polyimide relief pattern.Type: ApplicationFiled: August 30, 2001Publication date: March 28, 2002Applicant: Hitachi Chemical DuPont MicroSystems Ltd.Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara
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Publication number: 20020035196Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.Type: ApplicationFiled: September 25, 2001Publication date: March 21, 2002Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
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Patent number: 6359107Abstract: A composition of and method for making high performance imide resins that are processable by resin transfer molding (RTM) and resin infusion (RI) techniques were developed. Materials with a combination of properties, making them particularly useful for the fabrication of composite parts via RTM and/or RI processes, were prepared, characterized and fabricated into moldings and carbon fiber reinforced composites and their mechanical properties were determined. These materials are particularly useful for the fabrication of structural composite components for aerospace applications. The method for making high performance resins for RTM and RI processes is a multi-faceted approach. It involves the preparation of a mixture of products from a combination of aromatic diamines and aromatic dianhydrides at relatively low calculated molecular weights (i.e. high stoichiometric offsets) and endcapping with latent reactive groups.Type: GrantFiled: May 18, 2000Date of Patent: March 19, 2002Assignee: The United States of America as represented by the Administrator, National Aeronautics and Space AdministrationInventors: John W. Connell, Joseph G. Smith, Paul M. Hergenrother
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Publication number: 20020032273Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.Type: ApplicationFiled: September 25, 2001Publication date: March 14, 2002Inventors: Akira Tanaka, Satoshi Tazaki, Yasuhiro Yoneda, Kishio Yokouchi
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Patent number: 6355769Abstract: A process for making partially aromatic polyamides is provided in which an aromatic dicarboxylic acid component, at least 20-100% by weight of the dicarboxylic acid in the acid component is in the form of an alkylated ester, and a diamine component, comprising a diamine having from 6-12 carbon atoms, are admixed in the presence of water and with heating to form polyamide having from 1-100% on a molar basis of N-alkylated amide and amine groups. The polyamides are particularly useful in the manufacture of products intended for use at elevated temperatures or products in which retention of properties at elevated temperatures is required, including articles using injection molding technology, parts for automotive end-uses and electronics. The polyamides can also be formed into films and fibers for use in associated products.Type: GrantFiled: June 21, 2000Date of Patent: March 12, 2002Assignee: DuPont Canada, Inc.Inventor: Howard Ng
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Patent number: 6355737Abstract: The process for producing polymer blends by reacting at least one aminonitrile with water in the presence of thermoplastic polymers and optionally further polyamide-forming monomers comprises the following steps: (1) reacting at least one aminonitrile with water at a temperature from 90 to 400° C. and a pressure from 0.1 to 35×106 Pa to obtain a reaction mixture, (2) further reacting the reaction mixture at a temperature from 150 to 400° C.Type: GrantFiled: August 16, 2000Date of Patent: March 12, 2002Assignee: BASF AktiengesellschaftInventors: Ralf Mohrschladt, Martin Weber, Volker Hildebrandt
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Patent number: 6355357Abstract: A flexible printed board, in which a polyimide resulting from the imidation of a polyamic acid obtained by the addition polymerization of diamines and acid dianhydrides is formed as an insulating layer on a metal foil, is characterized in that the diamines include specific imidazolyl-diaminoazines represented by the formula 1; (where A is an imidazolyl group; R1 is an alkylene group; m is 0 or 1; R2 is an alkyl group; n is 0, 1, or 2; R3 and R4 are alkylene groups; p and q are each 0 or 1; and B is an azine residue, diazine residue, or triazine residue).Type: GrantFiled: December 8, 1999Date of Patent: March 12, 2002Assignee: Sony Chemicals Corp.Inventors: Satoshi Takahashi, Hidetsugu Namiki
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Patent number: 6353084Abstract: Biodegradable polyesteramides as defined in the specification are obtained by reacting a mixture consisting essentially of a1) a mixture consisting essentially of 35 to 95 mol % of adipic acid or ester-forming derivatives thereof, 5 to 65 mol % of terephthalic acid or ester-forming derivatives thereof, and 0 to 5 mol % of a compound containing sulfonate groups, a2) a mixture consisting essentially of 95.5 to 0.5 mol % of a dihydroxy compound, 0.5 to 99.5 mol % of an amino-C2-C12-alkanol or an amino-C5-C10-cycloalkanol, 0 to 50 mol % of a diamino-C1-C8-alkane, and 0 to 50 mol % of a 2,2′-bisoxazoline of the formula I wherein R1 is as set forth in the specification, and a3) 0 to 5 mol %, based on a1), of a compound D as set forth in the specification; and other biodegradable polymers and thermoplastic molding compositions, their manufacture and their use for producing biodegradable moldings, adhesives, foams, and coatings.Type: GrantFiled: July 7, 1997Date of Patent: March 5, 2002Assignee: BASF AktiengesellschaftInventors: Volker Warzelhan, Gunnar Schornick, Edwin Baumann, Ursula Seeliger, Motonori Yamamoto, Gerhard Ramlow
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Patent number: 6350844Abstract: A polyimide film having sufficiently excellent characteristics such as a sufficiently high elastic modulus, a low water absorption, a small coefficient of moisture-absorption expansion, a small coefficient of linear expansion and a high dimensional stability; and various electric/electronic equipment bases with the use of the polyimide film. A polyimide film having a tensile elastic modulus of 700 kg/mm2 or less and a coefficient of moisture-absorption expansion of 20 ppm or less and containing a specific repeating unit as an essential repeating unit is synthesized. Then various electric/electronic equipment bases such as a laminate for flexible print connection boards are produced by using the polyimide film.Type: GrantFiled: November 5, 1999Date of Patent: February 26, 2002Assignee: Kaneka CorporationInventors: Kazuhiro Ono, Kiyokazu Akahori, Hidehito Nishimura
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Patent number: 6350845Abstract: Novel polyimides substituted by a substituent having an alkyl or fluoroalkyl group and having reduced water absorption; a process for producing these novel polyimides; and novel acid dianhydrides to be used in the production thereof. A polyimide containing a structure represented by the following general formula (I): wherein X1 represents a tetravalent organic group having a substituent —R1AR2 (wherein A represents a divalent linkage group; R1 represents a single bond or a C1-3 alkylene group; and R2 represents a C1-25 alkyl group or a fluoroalkyl group); and Y represents a divalent organic group.Type: GrantFiled: June 26, 2000Date of Patent: February 26, 2002Assignee: Kaneka CorporationInventors: Koji Okada, Shoji Hara, Hitoshi Nojiri
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Publication number: 20020022712Abstract: The invention relates to a randomly branched polyamide comprising at least units derived from:Type: ApplicationFiled: June 18, 2001Publication date: February 21, 2002Inventors: Atze J. Nijenhuis, Rene Aberson, Boudewijn J.R. Scholtens
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Publication number: 20020022710Abstract: The invention is directed to method for making a polyimide by converting the dianhydride to the ester acid and reacting the ester acid with a diamine. The invention allows for the controlled addition of aliphatic diamines resulting in control of the polyimide properties such as the glass transition temperature, solubility, and melt processability.Type: ApplicationFiled: April 27, 2001Publication date: February 21, 2002Inventors: James E. McGrath, Sue J. Mecham
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Patent number: 6348562Abstract: A process of increasing the melt processing of synthetic polyamides, in particular pigmented and/or filled synthetic polyamide, by adding thereto an additive having the formula (I) wherein R1 represents a methyl group as such or in the form of a stabilizer masterbatch composition. The invention also relates to modified synthetic polyamides obtainable by this process having improved properties due to the stabilization effect of the compound of the above formula (I).Type: GrantFiled: January 13, 1999Date of Patent: February 19, 2002Assignee: Clariant Finance (BVI) LimitedInventors: Bansi Lal Kaul, Jan Malik, Mohamed Sidqi
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Publication number: 20020012862Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes.Type: ApplicationFiled: June 8, 2001Publication date: January 31, 2002Applicant: NexPress Solutions, LLCInventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire