Imide-containing Reactant Patents (Class 528/170)
  • Publication number: 20030109666
    Abstract: In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
    Type: Application
    Filed: August 1, 2002
    Publication date: June 12, 2003
    Applicant: Loctite Corporation
    Inventors: Stephen M. Dershem, Dennis B. Patterson, Jose A. Osuna
  • Publication number: 20030105270
    Abstract: A polyimide is disclosed of the formula: 1
    Type: Application
    Filed: October 28, 2002
    Publication date: June 5, 2003
    Inventors: Geoffrey A. Lindsay, Richard A. Hollins, Peter Zarras, Andrew J. Guenthner, Andrew P. Chafin, Mathew C. Davis, Stephen Fallis
  • Patent number: 6569984
    Abstract: The invention is directed to method for making a polyimide by converting the dianhydride to the ester acid and reacting the ester acid with a diamine. The invention allows for the controlled addition of aliphatic diamines resulting in control of the polyimide properties such as the glass transition temperature, solubility, and melt processability.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Virginia Tech Intellectual Properties, Inc.
    Inventors: James E. McGrath, Sue J. Mecham
  • Patent number: 6569954
    Abstract: The physical properties of high performance composites can be tailored by using blends to make the composites. The resulting composites are relatively easy to make and have long-term, high performance capabilities even in harsh service conditions. The blends of the present invention include at least one oligomer having an aromatic, aliphatic, or mixed aromatic and aliphatic backbone from one chemical family and an unsaturated hydrocarbon end cap and at least one polymer from a different chemical family. Upon curing, the oligomer in the blend addition polymerize to form composites possessing advanced properties with respect to those exhibited by the pure oligomer or the pure polymer. Coreactive oligomer blends can be used instead of a pure oligomer to form composites that include addition polymers, block copolymers, and the compatible polymer, thereby further achieving a tailoring of properties in the cured composite. The blends can be prepregged and cured to form composites.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: May 27, 2003
    Assignee: The Boeing company
    Inventors: Clyde H. Sheppard, Hyman R. Lubowitz
  • Publication number: 20030096918
    Abstract: A star-blocked polymeric material based on polyethylene glycol and having a uniform distribution of both hydroxy and amine functional groups throughout the polymeric material is described. The polymeric material, known as HYDRA (hydroxy and amine functionalised resin), is prepared by forming a polyimine compound by reacting an aldehyde and an amine. The polyimine is then reacted with a reducing agent to form a star-blocked polymeric material. HYDRA resins can be used, for example, as solid supports for organic synthesis, for enzymatic assays, for immobilization of biomolecules, for controlled release of drugs, and for chromatographic separations.
    Type: Application
    Filed: August 28, 2001
    Publication date: May 22, 2003
    Inventors: Morten Peter Meldal, Thomas Groth
  • Publication number: 20030092870
    Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained.
    Type: Application
    Filed: September 3, 2002
    Publication date: May 15, 2003
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Yoichi Kodama, Minehiro Mori, Naoshi Nagai, Masaru Kawaguchi
  • Publication number: 20030092869
    Abstract: Novel compositions and synthetic methods for forming nonlinear optic polymers, which may be incorporated into multiple light-based devices, are disclosed. These compositions include chromophoric monomer units that incorporate nonlinear optic chromophores, linking monomers that may be used to link chromophoric monomers, and polymers made from chromophoric monomers or chromophoric monomers in combination with linking monomers. The polymers can exhibit high thermal stability, which is believed to arise from their covalently bonded chromophore structures. In addition to their covalently bonded chromophore structures, in one aspect, nonlinear optic polymers are disclosed that may be crosslinked to further increase the thermal and dipole stability of the polymers.
    Type: Application
    Filed: July 15, 2002
    Publication date: May 15, 2003
    Inventor: Luping Yu
  • Publication number: 20030092871
    Abstract: The present invention relates to a method of producing high-density polyidimide (HPI) films and its production equipment. The production equipment comprises a raw material supplying means, a vacuum cavity, an energy supplier, a clad laminator, and a baked solidified polymer. The foregoing components constitutes the production equipment, using the monomer with the CONH bond or copolymer as raw materials to extract the unsaturated C═N bond by heat, electrons, light, radiation rays or ions as energy under low-pressure environment, so that the H in vacuum can extract the non-solidified HPI film from the electronic radical covalent polymers and via heat or light to rearrange the structure into a solidified HPI film. By means of the method according to the present invention, the original HPI that is not easily to produce as a film can be easily made in form of a film of HPI polymer on the clad laminator.
    Type: Application
    Filed: September 20, 2002
    Publication date: May 15, 2003
    Inventor: Tien Tsai Lin
  • Patent number: 6562420
    Abstract: The present invention provides a kind of liquid crystal aligning film composition used for liquid crystal display (LCD), in which the liquid crystal aligning film composition used for LCD is a polyimide resin oligomer (A) having the structural formula (I) as shown in the following: wherein m is an interger of 1, 2, and 3, R is selected one of from aromatic and cyclicaliphatic, X is selected from the group containing amide, ester, and ether etc., Y is the group of containing cholesterol structure; this polyimide resin oligomer (A) and the second reagent (B) are mixed together, through an induced process (C), to produce a thin film for aligning liquid crystal molecule.
    Type: Grant
    Filed: July 31, 2001
    Date of Patent: May 13, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Yi-Chun Liu, Hui-Lung Kuo, Chein-Dhau Lee, Jing-Pin Pan
  • Patent number: 6559273
    Abstract: In the process of the present invention, a recovered polyamide is used as a part of the raw materials for producing polyamide. By carrying out the polycondensation under a condition such that the recovered polyamide is dissolved in the reaction system during the polycondensation, the properties of the polyamide being produced are not deteriorated as compared with those of polyamide which is produced without using the recovered polyamide. By changing the addition amount of the recovered polyamide, the crystallization speed of the resultant polyamide is controlled or increased as compared when produced without using the recovered polyamide.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: May 6, 2003
    Assignee: Mitsubishi Gas Chemical Company, Ltd.
    Inventors: Takatoshi Shida, Kazumi Tanaka
  • Publication number: 20030083459
    Abstract: An object of the present invention is to provide an aromatic polyimide ester having a small coefficient of linear expansion and small water absorbing property; and moreover excellent heat resistance.
    Type: Application
    Filed: September 5, 2002
    Publication date: May 1, 2003
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Satoshi Okamoto, Manabu Hirakawa
  • Publication number: 20030083458
    Abstract: The present invention relates to a method of producing high-density polyidimide (HPI) films and its production equipment. The production equipment comprises a raw material supplying means, a vacuum cavity, an energy supplier, a clad laminator, and a baked solidified polymer. The foregoing components constitutes the production equipment, using the monomer with the CONH bond or copolymer as raw materials to extract the unsaturated C═N bond by heat, electrons, light, radiation rays or ions as energy under low-pressure environment, so that the H in vacuum can extract the non-solidified HPI film from the electronic radical covalent polymers and via heat or light to rearrange the structure into a solidified HPI film. By means of the method according to the present invention, the original HPI that is not easily to produce as a film can be easily made in form of a film of HPI polymer on the clad laminator.
    Type: Application
    Filed: October 23, 2001
    Publication date: May 1, 2003
    Inventor: Tien Tsai Lin
  • Publication number: 20030073803
    Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35 % by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.
    Type: Application
    Filed: April 1, 2002
    Publication date: April 17, 2003
    Applicant: National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Publication number: 20030072954
    Abstract: A fusible polyimide showing a fusion endothermic peak in a differential scanning calorimeter has a recurring unit of the following formula (1): 1
    Type: Application
    Filed: October 11, 2002
    Publication date: April 17, 2003
    Inventors: Hideki Ozawa, Shigeru Yamamoto
  • Patent number: 6548621
    Abstract: The invention provides a poly(imide-benzoxazole) (PIBO) copolymer prepared from a trimellitic anhydride halide monomer and a bis(o-diaminophenol) monomer. The PIBO copolymer is characterized by the following recurring unit: wherein X is —O—, —S—, —C(CF3)2—, —C(CH3)2—, —CO—, —CH2—, —SO2—, —SO—, or deleted; and n is an integer. The PIBO copolymers of this invention are particularly useful as dielectric layers in semiconductor devices because they possess hydroxyl groups which create better adhesion to semiconductor substrates.
    Type: Grant
    Filed: November 8, 2001
    Date of Patent: April 15, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Jung Tsai, Steve Lien-Chung Hsu, Yuan-Pin Huang
  • Publication number: 20030069385
    Abstract: A separating agent that serves as an optical resolution agent is composed of a novel, useful optically active polymer. The separating agent is obtained through anionic polymerization of a novel maleimide and serves to separate optically active compounds.
    Type: Application
    Filed: August 23, 2002
    Publication date: April 10, 2003
    Applicant: TOSOH CORPORATION
    Inventors: Takumi Kagawa, Hideo Sakka
  • Publication number: 20030065128
    Abstract: The present invention provides an optical polyimide compound defined by the following formula in an optical high polymer material: 1
    Type: Application
    Filed: October 8, 2002
    Publication date: April 3, 2003
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
  • Publication number: 20030064235
    Abstract: For providing a polyimide optical component exhibiting good physical properties inherent to a polyimide, i.e.
    Type: Application
    Filed: April 9, 2002
    Publication date: April 3, 2003
    Inventors: Yuichi Okawa, Yoshihiro Sakata, Takashi Ono, Shoji Tamai
  • Patent number: 6538097
    Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxylic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 25, 2003
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Patent number: 6538099
    Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C. under a load of 2,160 g, wherein said relative viscosity and said melt flow rate have a relationship of the following formula (I): 2.87×103 exp(−3.48 &eegr;r)≦MFR≦3.25×104 exp(−3.48 &eegr;r)  (I) wherein &eegr;r is relative viscosity and MFR is melt flow rate. The nylon 12 has excellent extrusion moldability and creep characteristics, fatigue characteristics and the like mechanical properties and is suited for tubular molds. A nylon 12 composition comprising the nylon 12 having the above-described specific relationship between &eegr;r and MFR and a plasticizer is also disclosed.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: March 25, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
  • Patent number: 6534622
    Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: March 18, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Hiroaki Yamaguchi, Fumio Aoki
  • Patent number: 6531570
    Abstract: Disclosed are the use of lactams, aminocarboxylic acids or mixtures thereof as acceleratant or cocatalyst in the production of polyamides from aminonitriles and water, and a suitable process therefor.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: March 11, 2003
    Assignee: BASF Aktiengesellschaft
    Inventors: Ralf Mohrschladt, Volker Hildebrandt
  • Patent number: 6531568
    Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: March 11, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Atsushi Shibuya, Tomomi Okumura, Hideaki Oikawa, Yoshihiro Sakata, Takashi Kuroki, Yuichi Okawa, Shoji Tamai
  • Publication number: 20030045670
    Abstract: Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transistion (Tg) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents.
    Type: Application
    Filed: March 8, 2002
    Publication date: March 6, 2003
    Inventors: John W. Connell, Joseph G. Smith, Paul M. Hergenrother, Kent A. Watson, Craig M. Thompson
  • Publication number: 20030045669
    Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.
    Type: Application
    Filed: October 9, 2001
    Publication date: March 6, 2003
    Inventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
  • Patent number: 6525166
    Abstract: The invention concerns a polyamide comprising macromolecular chains having a star-shaped configuration, a method for making said polyamide and compositions comprising same. More particularly, the invention concerns a method for making a polyamide comprising linear macromolecular chains and star-shaped macromolecular chains with control of the star-shaped chain concentration in the polymer. Said control is obtained by using besides the polyfunctional polymers and amino acids or lactams a polyfunctional comonomer comprising either acid functions or amine functions. The resulting polyamide has optimal mechanical and rheological properties for improving the speed and quality of mould filling and producing mouldable compositions comprising high filler factors.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: February 25, 2003
    Assignee: Nyltech Italia S.r.l.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6525167
    Abstract: The continuous process for producing polyamides by reacting at least one aminonitrile with water comprises the following steps: (10) reacting at least one aminonitrile with water at a temperature of from 200 to 290° C. at a pressure of from 40 to 70 bar in a flow tube containing a Brönsted acid catalyst selected from a beta-zeolite, sheet-silicate or metal oxide catalyst in the form of a fixed bed, (11) diabatically or adiabatically expanding the reaction mixture from step (1) into a first separation zone to a pressure of from 20 to 40 bar, the pressure being at least 10 bar lower than the pressure in step (1), and to a temperature within the range from 220 to 290° C. by flash evaporation and removal of ammonia, water and any aminonitrile monomer and oligomer, (12) further reacting the reaction mixture from step (2) in the presence of water at a temperature of from 200 to 290° C.
    Type: Grant
    Filed: August 9, 2001
    Date of Patent: February 25, 2003
    Assignee: BASF Aktiengesellschaft
    Inventors: Ralf Mohrschladt, Volker Hildebrandt, Motonori Yamamoto
  • Publication number: 20030036624
    Abstract: The present invention provides a kind of liquid crystal aligning film composition used for liquid crystal display (LCD), in which the liquid crystal aligning film composition used for LCD is a polyimide resin oligomer (A) having the structural formula (I) as shown in the following: wherein m is an interger of 1, 2, and 3, R is selected one of from aromatic and cyclicaliphatic, X is selected from the group containing amide, ester, and ether etc., Y is the group of containing cholesterol structure; this polyimide resin oligomer (A) and the second reagent (B) are mixed together, through an induced process (C), to produce a thin film for aligning liquid crystal molecule.
    Type: Application
    Filed: July 31, 2001
    Publication date: February 20, 2003
    Applicant: Industrial Technology research Institute, Taiwan
    Inventors: Yi-Chun Liu, Hui-Lung Kuo, Chein-Dhau Lee, Jing-Pin Pan
  • Publication number: 20030036625
    Abstract: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage.
    Type: Application
    Filed: June 27, 2002
    Publication date: February 20, 2003
    Inventors: Masahiro Nozaki, Reiko Koshida, Takeo Tasaka, Tadao Ushida
  • Patent number: 6517343
    Abstract: A curable composition is placed on a candle, and then the composition is exposed to curing conditions such as ultraviolet light, to thereby cure the coating composition and provide a candle having a cured coating. The curable composition may be the reaction product of TMPTA (trimethylolpropanetriacrylate), itself the reaction product of trimethylolpropane and acrylic acid) and oleyl amine (an unsaturated primary amine having eighteen carbons). The candle may be made of wax or a gelled solvent, i.e., a mixture of gellant and solvent, particularly a hydrocarbon or other low polarity solvent. The undiluted coating may be applied by spraying on the oily surface of the candle. Ultraviolet cure of the coating occurs in 1-2 seconds.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: February 11, 2003
    Assignee: Arizona Chemical Company
    Inventors: Raymond H. Jones, Charles D. Moses, Ronald L. Gordon
  • Patent number: 6518392
    Abstract: A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: February 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Kenneth R. Carter, James L. Hedrick, Victor Yee-Way Lee, Dale C. McHerron, Robert D. Miller
  • Publication number: 20030013838
    Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): 1
    Type: Application
    Filed: April 11, 2002
    Publication date: January 16, 2003
    Inventors: Wataru Yamashita, Katsuji Watanabe, Takahisa Oguchi
  • Patent number: 6500913
    Abstract: The present invention relates to a novel polyimide of the general formula (1) and a process for the preparation thereof.
    Type: Grant
    Filed: March 13, 2001
    Date of Patent: December 31, 2002
    Assignees: Council of Scientific and Industrial Research, Laboratoire des Materiaux Organiques a Proprietes Speciques
    Inventors: Jinu Suju Mathew, Subhash Pundlik Vernekar, Reges Mercier, Rachid Kerboua
  • Patent number: 6500904
    Abstract: A method for the synthesis of high molecular weight poly(imide)s comprising coupling poly(imide) precursors having complementary functional groups and a weight average molecular weight of less than about 50,000 Daltons to form high molecular weight poly (imides)s having a weight average molecular weight greater than 50,000 Daltons.
    Type: Grant
    Filed: November 2, 2001
    Date of Patent: December 31, 2002
    Assignee: General Electric Company
    Inventor: Robert F. Hayes
  • Publication number: 20020198358
    Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).
    Type: Application
    Filed: March 8, 2002
    Publication date: December 26, 2002
    Inventors: Jung-Ki Park, Shi-joon Sung, Jong-Woo Lee
  • Publication number: 20020198356
    Abstract: In accordance with the present invention, there are provided novel heterobifunctional monomers and uses for the same. Invention compounds have many of the properties required by the microelectronics industry, such as, for example, hydrophobicity, high Tg values, low dielectric constant, ionic purity, low coefficient of thermal expansion (CTE), and the like. These properties result in a thermoset that is particularly well suited to high performance applications where typical operating temperatures are often significantly higher than those at which prior art materials were suitable. Invention compounds are particularly ideal for use in the manufacture of electronic components, such as, for example, printed circuit boards, and the like.
    Type: Application
    Filed: July 22, 2002
    Publication date: December 26, 2002
    Applicant: Loctite
    Inventors: Stephen M. Dershem, Kevin J. Forrestal
  • Patent number: 6498224
    Abstract: A new method for the synthesis of poly(etherimide)s comprises transimidation of bis(imide) (IV) in the presence of a substituted phthalic anhydride or 4-substituted tetrahydrophthalic anhydride to yield dianhydride (V) which may then be reacted with a diamine to produce poly(etherimide)s. By-product substituted N-alkylphthalimide or 4-substituted N-alkyltetrahydrophthalic anhydride may be recycled or converted to 4-substituted N-alkylphthalimide for use in the formation bisimide (IV), obviating the need for a nitration step.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: December 24, 2002
    Assignee: General Electric Company
    Inventors: Roy Ray Odle, Thomas Link Guggenheim, William James Swatos, Michael J. Vollmer
  • Patent number: 6498225
    Abstract: The invention relates to carbodiimide-based block copolymers, a method of preparing them and also their use as hydrolysis stabilizers in ester-group-containing polymers. The advantages of the block copolymers according to the invention are, in particular, their high efficiency at low dosage as hydrolysis protection in ester-group-containing polymers, and also their nontoxic behavior, their high thermal stability and their good compatibility during incorporation in the polymeric matrix of the polymers to be protected.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: December 24, 2002
    Assignee: Rhein Chemie Rheinau GmbH
    Inventors: Heiko Tebbe, Ludger Heiliger, Volker Müller
  • Patent number: 6498226
    Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.
    Type: Grant
    Filed: May 3, 2001
    Date of Patent: December 24, 2002
    Assignee: Industrial Technology Research Institute
    Inventors: Kung-Lung Cheng, Shu-Chen Lin, Wen-Ling Lui, Chih-Hsiang Lin, Wei-Ling Lin, Woan-Shiow Tzeng
  • Publication number: 20020193553
    Abstract: A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web.
    Type: Application
    Filed: March 1, 2002
    Publication date: December 19, 2002
    Inventors: Jian Qin, Yong Li, Wendy Lynn Van Dyke, Anthony John Wisneski, Palani Raj Ramaswami Wallajapet, Hannong Rhim
  • Publication number: 20020188088
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Application
    Filed: July 22, 2002
    Publication date: December 12, 2002
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Publication number: 20020188090
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): 1
    Type: Application
    Filed: March 20, 2002
    Publication date: December 12, 2002
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Publication number: 20020188095
    Abstract: A method of manufacturing a new N-carboxyamino acid anhydride and polyamino acid using a simple process operation.
    Type: Application
    Filed: April 26, 2002
    Publication date: December 12, 2002
    Applicant: JSR CORPORATION
    Inventors: Hiroto Kudoh, Takeshi Endoh
  • Patent number: 6492484
    Abstract: A polycarbodiimide represented by the formula (I): wherein R1 is an alkylene group having 2 to 10 carbon atoms, R2 is a divalent aromatic group, R3 is a monovalent aromatic group, k is 0 or an integer of 1 to 30, m is an integer of 2 to 100, and n is 0 or an integer of 1 to 30, a process for preparing the same and uses of the polycarbodiimide. The polycarbodiimide is favorably used in the form of films such as adhesive films for die bonding and adhesive films for underfilling, which can be used in semiconductor devices.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: December 10, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Sadahito Misumi, Yuji Hotta, Akiko Matsumura
  • Publication number: 20020183479
    Abstract: The invention relates to a semi-aromatic polyamide containing at least tetramethylene terephthalamide units and also hexamethylene terephthalamide units.
    Type: Application
    Filed: March 29, 2002
    Publication date: December 5, 2002
    Inventors: Rudy Rulkens, Robert C.B. Crombach
  • Patent number: 6489431
    Abstract: A polyimide precursor having a repeating unit represented by the following general formula (1), wherein R1 contains a bivalent organic group constituting a diamine having a hexafluoropropylidene group in its molecule represented by the following general formula (2), and the reduced viscosity is from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl), and a polyimide obtained by imidizing said precursor: (wherein R1 is a bivalent organic group constituting a diamine, A is a hydrogen atom, a linear alkyl group including a methyl group, or a trifluoromethyl group, and n is the number of a substituent on an aromatic ring and an integer of from 1 to 4).
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: December 3, 2002
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuhisa Ishii, Takayasu Nihira, Hiroyoshi Fukuro
  • Patent number: 6486292
    Abstract: The present invention provides an optical polyimide compound defined by the following formula in an optical high polymer material: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl; A is a divalent aromatic or halogenated aromatic moiety; and Z is a tetravalent moiety which may be a partly or fully fluorinated aromatic ring, a partly or fully chlorinated aromatic ring, a partly or fully fluorinated cycloaliphatic group, a partly or fully chlorinated aliphatic group, or combinations thereof connected via hetero atoms.
    Type: Grant
    Filed: March 7, 2001
    Date of Patent: November 26, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
  • Patent number: 6479615
    Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: November 12, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Takahiro Fukuoka, Amane Mochizuki, Naoki Kurata, Naotaka Kinjo, Toshihiko Omote
  • Patent number: 6476181
    Abstract: Process for increasing the molecular weight of nylon 6 while reducing its content of caprolactam and other volatiles by a two-staged heating process.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: November 5, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Albert W. Alsop, David N. Marks
  • Patent number: 6476182
    Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: November 5, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Brian C Auman, William R Corcoran, Jr., John D Summers