Abstract: Described are circuits and methods for automatically measuring the program threshold voltage VTP and the erase threshold voltage VTE of EEPROM cells. The measured threshold voltages are employed to measure tunnel-oxide thickness and to determine optimal program and erase voltage levels for EEPROM circuits. One embodiment automatically sets the program and erase voltages based on the measured threshold voltages.

Abstract: Disclosed are circuits and methods of identifying defective memory cells among rows and columns of memory cells. In one embodiment, all the memory cells in an array are programmed to conduct with a conventional read voltage applied and not to conduct with a conventional read-inhibit voltage applied. Any rows that conduct with the read-inhibit voltage applied are termed “leaky,” and are defective. Another read-inhibit voltage lower than the conventional level is selected to cause even leaky cells not to conduct. This test read-inhibit voltage is consecutively applied to each row under test. If one of the rows includes a leaky bit, that bit will conduct with the conventional read-inhibit voltage applied but will not conduct with the test read-inhibit voltage applied. The test flow therefore identifies a row as including a leaky bit when a leak is suppressed by application of the test read-inhibit voltage. A redundant row can be provided to replace a row having a leaky bit.

Abstract: Disclosed are systems and methods for removing stubborn contaminants, aluminum fluoride and aluminum chloride in particular, from components of semiconductor-processing equipment. One embodiment forces steam through small holes in a gas distribution plate to remove build up on the interior walls of the holes. A cleaning fixture disposed between the steam source and the gas distribution plate delivers the steam at increased pressures. The gas distribution plate can be immersed in water during cleaning to capture the exiting steam.

Abstract: An ESD protection circuit includes a bipolar transistor, a resistor, and a zener diode formed on and within a semiconductor substrate. The resistor extends between the base and emitter regions of the transistor so that voltage developed across the resistor can turn on the transistor. The zener diode is formed in series with the resistor and extends between the base and collector regions of the transistor. Thus configured, breakdown current through the zener diode, typically in response to an ESD event, turns on the transistor to provide a nondestructive discharge path for the ESD. The zener diode includes anode and cathode diffusions. The cathode diffusion extends down into the semiconductor substrate in a direction perpendicular to the substrate. The anode diffusion extends down through the cathode diffusion into the semiconductor substrate. The anode diffusion extends down further than the cathode diffusion so that the zener diode is arranged vertically with respect to the substrate.

Abstract: Described are cleaning methods and apparatus that minimize the volume of hazardous materials used and created when cleaning components, and further to minimize the possibility of cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater than the volume of liquid used to clean the component. One embodiment of the invention reduces the requisite volume of cleaning solution using a number of liquid-displacing elements (e.g., balls) contained within a cleaning receptacle.

Abstract: A method for dynamically burn-in testing a PLD by either configuring or fabricating the PLD to implement a self-executing logic operation that automatically and repeatedly turns on and off selected transistors of the PLD using only static test signals. The self-executing logic operation implemented by the PLD includes a driving logic function (e.g., an oscillator) and a driven logic function (e.g., a counter). The PLD is placed on a conventional load board and heated in a conventional oven while static test signals are applied to selected terminals of the PLD through the load board, thereby causing the PLD to implement the self-executing logic operation.

Abstract: A rotatable electrical connector has a pair of wiring boards. Each wiring board supports two (or more) concentric conductors that have substantially smooth coplanar surfaces. The coplanar surfaces of the concentric conductors on each wiring board define a contact plane. To provide electrical contact between the two wiring boards, each wiring board is positioned perpendicular to an axis of rotation and is supported so that the respective contact planes of the first and second wiring boards are parallel. A resilient member, such as a spring, urges the wiring boards together to establish electrical contact between the respective surfaces of corresponding conductors on the two wiring boards. The above-described wiring boards are included in a circuit module that also includes a printed circuit board, or other electrical component, sandwiched between a pair of the wiring boards.

Abstract: A circuit measures the signal propagation delay through a selected test circuit. The test circuit is provided with a feedback path so that the test circuit and feedback path together form a free-running oscillator. The oscillator then automatically provides its own test signal that includes alternating rising and falling signal transitions on the test-circuit input node. A phase discriminator samples the output of the oscillator and accumulates data representing the signal propagation delay of either rising or falling signal transitions propagating through the test circuit. The worst-case delay associated with the test circuit can then be expressed as the longer of the two. Knowing the precise worst-case delay allows IC A designers to minimize the guard band and consequently guarantee higher speed performance.

Abstract: A CPLD employs a low-voltage, non-degenerative transmitter circuit to eliminate the need for a dedicated control pin to provide the relatively high voltage levels required to verify the program states of programmable memory cells. Eliminating the need for a dedicated control pin frees up valuable chip real estate for the inclusion of an additional general-purpose input/output pin.

Abstract: Described are methods and circuits for accurately placing signal transitions, or “edges,” simultaneously on two or more pins of an integrated circuit (IC). A conventional tester is connected to an integrated circuit, such as a programmable logic device. The integrated circuit is adapted to include a coincidence detector that compares the timing of edges on two input pins of the integrated circuit. The coincidence detector indicates when the two edges are coincident, allowing an operator of the tester to adjust the tester to establish coincidence. The amount of offset necessary to provide coincident edges is stored in a database for later use in deskewing edges used in subsequent tests. The integrated circuit can be a programmable logic device configured to include one or more coincidence detectors with which to place edges relative to one another on different pins.

Abstract: A ramp-up circuit on an integrated circuit receives a relatively high program (erase) voltage for changing the program state of a memory cell. The ramp-up circuit gradually raises the program (erase) voltage to prevent damage to the memory cell. The ramp-up circuit includes a pass gate and associated control circuitry that provides a controlled, ramped-up version of the program (erase) voltage to the memory cell without raising internal circuit nodes above the program (erase) voltage.

Abstract: Described are methods of adapting FIB techniques to copper metallization, and to structures that result from the application of such techniques. A method in accordance with the invention can be used to sever copper traces without damaging adjacent material or creating conductive bridges to adjacent traces. Semiconductor devices that employ copper traces typically include a protective passivation layer that protects the copper. This passivation layer is removed to render the copper traces visible to an FIB operator. The copper surface is then oxidized, as by heating the device in air, to form a copper-oxide layer on the exposed copper. With the copper-oxide layer in place, an FIB is used to mill through the copper-oxide and copper layers of a selected copper trace to sever the trace. The copper-oxide layer protects copper surfaces away from the mill site from reactive chemicals used during the milling process. In one embodiment, a copper-oxide layer of at least 40 nanometers thick affords adequate protection.

Abstract: Described are programmable logic systems and methods in which programmable logic devices receive configuration data. In some embodiments, one or more input/output blocks of a programmable logic device are adapted to store a value identifying a remote memory space as a source of reconfiguration data. In other embodiments, external memory spaces for storing configuration data are adapted to store the value.

Abstract: A reticle and pellicle that are modified to prevent ESD damage to the masking material between portions of the lithographic mask pattern on the reticle during an integrated circuit fabrication process. The modification involves providing conducting lines on the glass side of the reticle and on the surface of the pellicle to balance any buildup of electrostatic charges on those devices, thereby reducing or eliminating the induction of opposite charges onto adjacent mask pattern features on the reticle and preventing the melting and bridging of those mask pattern features and the defects caused by such melting or bridging. The conductive metal lines may have a smaller width than the smallest resolution value of the reduction lens used in the mask pattern transfer process, and may also be located outside of the focal plane of the reduction lens to avoid transfer of the images of the conductive lines onto the target semiconductor substrate during the mask pattern transfer process.

Abstract: A semiconductor device assembly facilitates high-speed communication between an integrated-circuit die and external circuitry. The die is mounted on a wiring board that includes rows of bond sites in which the signal-bearing bond sites are separated by bond sites bearing DC voltage levels. Signal-bearing bond wires extending from the bond sites are thus separated from one another by bond wires at fixed voltage levels. This arrangement improves shielding between signal wires, thereby minimizing cross-talk and facilitating high data rates.

Abstract: Described are cleaning methods and apparatus that minimize the volume of hazardous materials used and created when cleaning components, and further to minimize the possibility of cross-contamination between components from different deposition chambers. Components to be cleaned are stored within or supported by a dedicated cassette before they are placed in a receptacle of cleaning liquid. The cassette displaces a significant percentage of the receptacle's volume; consequently, only a relatively small volume of cleaning liquid is needed to fully submerge the component. In typical embodiments, the combined cassette and component displace a volume of liquid that is greater than the volume of liquid used to clean the component. One embodiment of the invention reduces the requisite volume of cleaning solution using a number of liquid-displacing elements (e.g., balls) contained within a cleaning receptacle.

Abstract: Described are systems for producing differential logic signals and circuits for biasing the voltages of the differential logic signals. These systems can be adapted for use with different loads by programming one or more programmable elements. One embodiment includes a series of driver stages, the outputs of which are connected to one another. The driver stages turn on successively to provide increasingly powerful differential amplification. This progressive increase in amplification produces a corresponding progressive decrease in output resistance, which reduces the noise associated with signal reflection. The systems can be incorporated into programmable IOBs to enable PLDs to provide differential output signals.

Abstract: A programmable logic device (PLD) can be reconfigured without losing state data derived from logical operations performed using a previous logic configuration. One PLD in accordance with the invention includes a number of configurable logic blocks (CLBS) and input/output blocks (IOBs). Each CLB and IOB includes a number of configuration memory cells adapted to store the logical function of the FPGA. Each CLB and IOB additionally includes user storage elements adapted to store state data that results from the PLD performing a programmed logical function, such as a selected combinatorial function of input signals. The PLD preserves the data stored in the user storage element as the PLD is reconfigured. The state data is therefore available for use by the PLD after the PLD is reconfigured to perform a new logic function.

Abstract: Described are systems and methods for measuring the size uniformity of circuit features defined by the critical dimension of an integrated-circuit fabrication process. An integrated circuit is configured to include a number of oscillators, each occupying a region of the integrated circuit. Each oscillator oscillates at a frequency that depends on the critical dimension of features in the region in which it is formed. Consequently, the critical dimensions of regions across the surface of the integrated circuit can be mapped and compared by comparing the oscillation frequencies of identical oscillators formed in various regions of the integrated circuit. In programmable logic devices, oscillators can be implemented using programmable logic resources. In other embodiments, small, simple oscillators can be placed at various locations on the integrated circuit.

Abstract: A programmable logic device (PLD) can be reconfigured without losing state data derived from logical operations performed using a previous logic configuration. One PLD in accordance with the invention includes a number of configurable logic blocks (CLBs) and input/output blocks (IOBs). Each CLB and IOB includes a number of configuration memory cells adapted to store the logical function of the FPGA. Each CLB and IOB additionally includes user storage elements adapted to store state data that-results from the PLD performing a programmed logical function, such as a selected combinatorial function of input signals. The PLD preserves the data stored in the user storage element as the PLD is reconfigured. The user data is therefore available for use by the PLD after the PLD is reconfigured to perform a new logic function.