Abstract: An LED-based lighting device and method for making the same are disclosed. The lighting device includes an LED light source mounted on a heat sink, a power adaptor, and a controller. The power adaptor is configured to be interchangeable with a conventional incandescent bulb power adapter. The controller provides an average current to the LED light source when power is coupled to the device via the power adaptor. The average current causes the LED light source to generate light of a predetermined standard intensity that is substantially independent of variations in the LED light source from device to device. In one aspect of the invention, the LED light source includes a plurality of LEDs connected in series, the LEDs are bonded to the heat sink and connected to one another in series by wire bonds and to conducting traces on the heat sink.

Abstract: A light emitting device, a wafer for making the same, and method for fabricating the same are disclosed. The device and wafer include a first layer of a first conductivity type, an active layer, and a layer of a second conductivity type. The active layer overlies the first layer, the active layer generating light. The second layer overlies the active layer, the second layer having a first surface in contact adjacent to the active layer and a second surface having a surface that includes features that scatter light striking the second surface. A layer of transparent electrically conducting material is adjacent to the second surface and covered by a first layer of a dielectric material that is transparent to the light generated by the active layer. A mirror layer that has a reflectivity greater than 90 percent is deposited on the first layer of dielectric material.

Abstract: A lighting apparatus and method for operating LED-based lighting devices are disclosed. The apparatus includes a receiver that receives a potential from a power source whose output varies as a function of time, an energy storage device, and an LED array. The energy storage device stores energy from the power source when the driving potential is greater than a predetermined value. The LED array has variable forward bias potential, the LED array generating light when a potential across the array is greater than the selected forward bias potential. A source selector connects the energy storage device to the array when the potential from the power source is less than a predetermined value. A controller that varies the forward bias potential such that the difference between the forward bias potential and potential across the array is maintained at a value less than a predetermined value.

Abstract: A precursor structure for fabricating light sources, the light sources fabricated therefrom, and the method of fabricating the precursor structure are disclosed. A precursor substrate includes a flexible printed circuit board on which dies are bonded and a separation ridge. The flexible printed circuit board has a bottom heat-conducting layer, an insulating layer, and a circuit layer. The insulating layer and the circuit layer include a plurality of openings that expose the top surface of the heat-conducting layer. The separation ridge extends above the circuit layer and the dies and is configured to prevent contact with the dies and any structures constructed above the dies when the precursor substrate is in contact with a surface positioned over the die and in contact with the separation ridge. The structure is well suited for roll-to-roll processing equipment.

Abstract: A memory having a plurality of ferroelectric memory cells connected between first and second bit lines is disclosed. A read circuit is also connected between the first and second bit lines. A word select circuit selects one of the ferroelectric memory cells and generates a potential on the first hit line indicative of a value stored in the selected one of the plurality of ferroelectric memory cells. Each ferroelectric memory cell includes a ferroelectric capacitor and a variable impedance element having an impedance between first and second switch terminals that is determined by a signal on a control terminal. The ferroelectric capacitor is connected between the control terminal and the first switch terminal. First and second gates connect the ferroelectric memory cell to the bit lines in response to the word select circuit selecting that ferroelectric memory cell.

Abstract: A light-emitting device capable of being powered by an AC power supply or an unregulated DC power supply is disclosed. The light-emitting device, in an aspect, is coupled to a controller, a light-emitting diode (“LED”) array, and a power supply, wherein the power supply can be an AC power source or an unregulated DC power source. While the power supply provides electrical power, the controller generates various LED control signals in response to power fluctuation of the electrical power. The LED array allows at least a portion of LEDs to be activated in accordance with the logic states of the LED control signals.

Abstract: A ferroelectric memory having a plurality of ferroelectric memory cells, each ferroelectric memory cell including a ferroelectric capacitor is disclosed. The ferroelectric memory includes read and write lines and a plurality of ferroelectric memory cell select buses, one select bus corresponding to each of the ferroelectric memory cells. Each of the ferroelectric memory cells includes first and second gates for connecting the ferroelectric memory cell to the read line and the write line, respectively, in response to signals on the ferroelectric memory cell select bus corresponding to that ferroelectric memory cell. A write circuit causes a charge to be stored in the ferroelectric capacitor of the ferroelectric memory cell currently connected to the write line, the charge having a value determined by a data value having at least three states.

Abstract: A light emitting device and method for making the same are disclosed. The device includes an active layer disposed between first and second layers. The first layer has top and bottom surfaces. The top surface includes a first material of a first conductivity type, including a plurality of pits in the substantially planar surface. The active layer overlies the top surface of the first layer and conforms to the top surface, the active layer generating light characterized by a wavelength when holes and electrons recombine therein. The second layer includes a second material of a second conductivity type, the second layer overlying the active layer and conforming to the active layer. The device can be constructed on a substrate having a lattice constant sufficiently different from that of the first material to give rise to dislocations in the first layer that are used to form the pits.

Abstract: A light module and method for using the same are disclosed. The light module includes a heat-conducting structure and a plurality of LEDs bonded to a heat-conducting structure. The LEDs are bonded to a first surface of the heat-conducting structure and are mounted on the heat-conducting structure such that at least 50 percent of the heat generated by the LEDs is transferred to the heat-conducting structure. The heat-conducting structure includes a ferromagnetic material and is structured such that the heat-conducting structure bonds magnetically to a heat-dissipating structure with sufficient force to support the light module during the normal operation thereof when the light source is placed against the heat-dissipating structure. The present invention can be utilized for retrofitting an existing light fixture having an enclosure that includes a ferromagnetic material and a plurality of legacy light sources.

Abstract: A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial stepper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.

Abstract: A light-conversion composition and light sources utilizing that composition are disclosed. The light-conversion composition includes a transparent carrier medium, a phosphor-conversion medium, and a heat-conducting medium. The transparent carrier medium is transparent to light at first and second wavelengths. The phosphor-conversion medium converts light of the first wavelength to light of the second wavelength, the phosphor-conversion medium being dispersed in the transparent carrier medium. The heat-conducting medium has a thermal resistance that is less than that of the carrier medium. The heat-conducting medium is dispersed in the transparent carrier medium such that the heat-conducting medium is present in a concentration sufficient to yield a net thermal resistance that is less than 90 percent of the carrier thermal resistance. The heat-conducting medium can include particles of a transparent crystalline material, such as silicon, diamond, or sapphire.

Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, and a light emitting structure that is divided into segments. The light emitting structure includes a first layer of semiconductor material of a first conductivity type deposited on the substrate, an active layer overlying the first layer, and a second layer of semiconductor material of an opposite conductivity type from the first conductivity type overlying the active layer. A barrier divides the light emitting structure into first and second segments that are electrically isolated from one another. A serial connection electrode connects the first layer in the first segment to the second layer in the second segment. A power contact is electrically connected to the second layer in the first segment, and a second power contact is electrically connected to the first layer in the second segment.

Abstract: A basic building block for wafer scale stacked integrated circuits is disclosed. The building block includes an integrated circuit device having an integrated circuit substrate having a circuit layer sandwiched between a buffer layer and a dielectric layer. The dielectric layer has a top side and a bottom side, the bottom side being in contact with the circuit layer. The top surface of the dielectric layer includes a plurality of pads. Each pad extends above the top surface by a predetermined distance. The pads have dimensions that reduce irregularities in the top surface of the pads. In addition, the pads are arranged in a manner to promote planarization of the surface of the wafer via CMP.

Abstract: An imaging array and method for using the same to capture an image are disclosed. The imaging array includes an array of pixel sensors and a controller. Each pixel sensor includes a dual-ported photodiode characterized by ports having first and second gates, and a charge conversion circuit. The charge conversion circuit generates a signal that is a function of a charge on the dual-ported photodiode when the first gate in the dual-ported photodiode is activated to transfer a charge on the dual-ported photodiode to the charge conversion circuit. The controller applies a potential to the second gates and measures a current flowing out of the second gates, each second port passing charge stored in the photodiode connected to the second port when a potential in the photodiode exceeds the applied potential. The controller determines an average light intensity incident on the array of pixel sensors.

Abstract: A compound light source that compensates for changes in electrical conversion efficiency with increasing operating temperature is disclosed. The compound light source generates light of a design intensity at a design temperature in response to a drive current flowing through the light source. The light source includes a primary light source and a compensating light source. The primary and compensating light sources convert an electrical current passing therethrough to light, each light source being characterized by an electrical conversion efficiency that decreases with increasing temperature and that also decreases with increasing current. The compound light source includes a temperature sensor that measures the temperature of the primary light source and a current splitting circuit that divides the drive current between the primary and compensating light sources to compensate for the decrease in efficiency of the primary light source with temperature above the design temperature.

Abstract: A compound light source is characterized by an output spectral measure that lies within a spectral measure design range and an average light intensity per component light source that lies within an output intensity design range. The plurality of component light sources includes light sources whose spectral measure value and output intensity lie outside the corresponding design ranges. The component light sources are chosen from a number of predetermined groups obtained by sorting the component light sources with respect to the spectral measure value and output intensity of each source such that the compound light source has a spectral measure value and output intensity that lies within the corresponding design ranges.

Abstract: An imaging array and method for capturing an image utilizing the same are disclosed. The imaging array includes an array of pixel sensors in which each pixel includes a dual-ported photodiode or photogate and a charge conversion circuit. The charge conversion circuit generates a voltage signal that is a function of a charge on the dual-ported photodiode. The controller applies a potential that varies over the exposure to the second gates in the dual-ported photodiodes, each second port passing charge stored in the photodiode connected to the second port when a potential in the photodiode exceeds the applied potential. The potential is chosen such that charge flows through the second gates of pixel sensors that are exposed to light intensities greater than a first threshold intensity during the exposure.

Abstract: A pen transcription system and method for using the same are disclosed. The pen transcription system includes a receiver having first and second acoustical sensors mounted on a planar base and separated from one another, an EM detector, and a controller. The first and second acoustical sensors detect an acoustical signal emitted by a moveable signal source. The EM detector detects an EM signal that is synchronized with the acoustical signal. The controller measures the difference in time of detection between the EM signal and the acoustical signals detected by the first and second acoustical sensors. The acoustical sensors include a detector and a housing surrounding the detector, the housing having an aperture defined by an axis. The acoustical sensor has a reception function that is symmetrical about the axis and the axis is substantially perpendicular to the base surface.

Abstract: A CCD containing circuit and method for making the same. The circuit includes a CCD array and a protection circuit. The CCD array is constructed on an integrated circuit substrate and includes a plurality of gate electrodes that are insulated from the substrate by an insulating layer. The gate electrodes are connected to a conductor bonded to the substrate. The protection circuit is also constructed on the substrate. The protection circuit is connected to the conductor and to the substrate and protects the CCD array from both negative and positive voltage swings generated by electrostatic discharge events and the like. The protection circuit and the CCD can be constructed in the same integrated circuit fabrication process.

Abstract: A light-emitting device capable of being powered by an AC power supply or an unregulated DC power supply is disclosed. The light-emitting device, in an aspect, is coupled to a controller, a light-emitting diode (“LED”) array, and a power supply, wherein the power supply can be an AC power source or an unregulated DC power source. While the power supply provides electrical power, the controller generates various LED control signals in response to power fluctuation of the electrical power. The LED array allows at least a portion of LEDs to be activated in accordance with the logic states of the LED control signals.