Abstract: A light source and method for making the same are disclosed. The light source includes a substrate and a light emitting structure that is deposited on the substrate. A barrier divides the light emitting structure into first and second segments that are electrically isolated from one another. A serial connection electrode connects the first segment in series with the second segment. A first blocking diode between the light emitting structure and the substrate prevents current from flowing between the light emitting structure and the substrate when the light emitting structure is emitting light. The barrier extends through the light emitting structure into the first blocking diode.

Abstract: An apparatus for generating ECG recordings and a method for using the same are disclosed. The apparatus includes a handheld device and a controller. The handheld device has first, second, third, and fourth electrodes on an outer surface of the handheld device. The controller records signals from the first, second, third, and fourth electrodes and generates an ECG recording from the signals. The controller also provides placement information regarding locations on a user's body that are to be brought into contact with the first, second, third, and fourth electrodes while the controller records the signals. The handheld device can include a cellular telephone or a PDA. The controller stores an exemplary normal ECG recording, and compares a newly generated ECG recording with the stored ECG recording and generates an indication that indicates whether the newly generated ECG recording is consistent with the stored ECG recording.

Abstract: A light sensor having a light conversion element between first and second electrodes is disclosed. The light conversion element includes a body of semiconductor material having first and second surfaces. The body of semiconductor material is of a first conductivity type and has doping elements in a concentration gradient that creates a first electrostatic field having a magnitude that varies monotonically from the first surface to the second surface. A bias circuit applies a variable potential between the first and second electrodes to create a second electrostatic field having a direction opposite to that of the first electrostatic field and a magnitude determined by the potential. One of the electrodes is transparent to light in a predetermined band of wavelengths. The body of semiconductor material can include an epitaxial body having a monotonically increasing concentration of a doping element as a function of the distance from one the surfaces.

Abstract: A pen transcription system and method for using the same are disclosed. The pen transcription system includes a receiver having first and second acoustical sensors mounted on a planar base and separated from one another, an EM detector, and a controller. The first and second acoustical sensors detect an acoustical signal at a first wavelength emitted by a moveable signal source. The EM detector detects an EM signal that is synchronized with the acoustical signal. The controller measures the difference in time of detection between the EM signal and the acoustical signals detected by the first and second acoustical sensors. The acoustical sensors include a detector and a housing surrounding the detector, the housing having an aperture having a maximum dimension that is less than the first wavelength divided by 6.28.

Abstract: A camera for forming an image of a scene that moves relative to the camera and the method of forming that image are disclosed. The camera includes an imaging array having a plurality of CMOS pixel sensors having a plurality of columns and rows, an imaging system, and a controller. The imaging system causes a portion of an image of a scene to be projected on the imaging array such that the image of the scene moves across the imaging array in the column direction. First and second images of the scene are formed at first and second times chosen such that the image of the scene moves a predetermined number of rows of the imaging array between the first and second times. The controller combines pixel values from rows in the first image with rows in the second image that are separated by the predetermined number of rows.

Abstract: A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die emits light of a first wavelength through a top surface of the die and one or more side surfaces of the die, and is bonded to a mounting substrate. The light conversion component converts light of the first wavelength to light of a second wavelength, the light conversion component having a bottom surface bonded to the top surface of the die. The light conversion component has lateral dimensions such that a space exists around the die, the space being bounded by the substrate and the light conversion component. The scattering ring is positioned in the space such that a portion of the light emitted from the side surfaces of the die is scattered into the light conversion component.

Abstract: A method of synchronizing respective state transitions in a group of devices including at least one responding device is disclosed. The group of devices is communicatively coupled to an initiating device via a communication network. The method includes the at least one responding device receiving a trigger message from the initiating device. The trigger message includes a state transition time or a time from which a state transition time is obtainable. The method further includes the at least one responding device jointly making a respective state transition at the state transition time. A responding device, and a system including the initiating device and the responding device are also disclosed.

Abstract: A light source having a substrate with a plurality of component LED light generators mounted thereon is disclosed. The substrate has a first metallic surface characterized by a normal that points in a normal direction. The first metallic surface is in contact with air over the first metallic surface. The component LED light generators are mounted directly on the first metallic surface. Each component LED light generator includes an LED characterized by an operating temperature and emitting light in the normal direction. Each LED generator generates more than 0.5 watts of heat. The component LED light generators are spaced apart on the first metallic surface such that the operating temperature remains less than 75° C. above the air temperature. In one aspect of the invention, the first metallic surface surrounding each component LED light generator radiates an amount of heat equal to the heat generated by that component LED light generator.

Abstract: A light emitting device, a wafer for making the same, and method for fabricating the same are disclosed. The device and wafer include a first layer of a first conductivity type, an active layer, and a layer of a second conductivity type. The active layer overlies the first layer, the active layer generating light. The second layer overlies the active layer, the second layer having a first surface in contact adjacent to the active layer and a second surface having a surface that includes features that scatter light striking the second surface. A layer of transparent electrically conducting material is adjacent to the second surface and covered by a first layer of a dielectric material that is transparent to the light generated by the active layer. A mirror layer that has a reflectivity greater than 90 percent is deposited on the first layer of dielectric material.

Abstract: An imaging array and a method for operating the same are disclosed. The imaging array includes a plurality of light pixels and a sense amplifier. Each light pixel includes a photodetector that generates and couples a signal indicative of a light exposure to a light pixel node, a readout circuit, and a mixer that mixes a signal on the light pixel node with a pixel oscillator signal. The sense amplifier includes an input node that receives a signal from each light pixel, one light pixel at a time. The sense amplifier also includes a high pass filter that attenuates signals with frequencies less than a cutoff frequency and a mixer that demodulates the signal from the filter to provide a signal that is related to the potential on the light pixel node of the light pixel connected to the first input node.

Abstract: A light-emitting device and the method for making the same are disclosed. The device includes a substrate, a light-emitting structure and a light scattering layer. The light-emitting structure includes an active layer sandwiched between a p-type GaN layer and an n-type GaN layer, the active layer emitting light of a predetermined wavelength when electrons and holes from the n-type GaN layer and the p-type GaN layer, respectively, combine therein. The light scattering layer includes a GaN crystalline layer characterized by an N-face surface. The N-face surface includes features that scatter light of the predetermined wavelength. The light-emitting structure is between the N-face surface and the substrate.

Abstract: A memory cell comprising a ferroelectric capacitor, a variable impedance element and a conductive load is disclosed. The ferroelectric capacitor, characterized by first and second polarization states, is connected between a control terminal and a first switch terminal. The variable impedance element has an impedance between the first and second switch terminals that is determined by a signal on a control terminal. The conductive load is connected between a first power terminal and the first switch terminal. The second switch terminal is connected to a second power terminal. When a potential difference is applied between the first and second power terminals, a potential on the first switch terminal varies in a manner determined by the state of polarization of the ferroelectric capacitor.

Abstract: A light source and method for making the same are disclosed. The light source includes a plurality of Segmented LEDs connected in parallel to a power bus and a controller. The power bus accepts a variable number of Segmented LEDs. The controller receives AC power and provides a power signal on the power bus. Each Segmented LED is characterized by a driving voltage that is greater than 3 times the driving voltage of a conventional LED fabricated in the same material system as the Segmented LED. The number of Segmented LEDs in the light source is chosen to compensate for variations in the light output of individual Segmented LEDs introduced by the manufacturing process. In another aspect of the invention, the number of Segmented LEDs connected to the power bus can be altered after the light source is assembled.

Abstract: A photosensor and an imaging array utilizing the same are disclosed. The photosensor includes a light conversion region that has separate charge storage regions. The light conversion region includes a plurality of separate charge storage regions within a doped region, each charge collection region being doped such that the mobile charges generated by light striking that charge storage region are prevented from moving to an adjacent charge storage region. The photosensor also includes a plurality of transfer gates, having a gate region adjacent to a corresponding one of the charge storage regions and disposed between that charge storage region and a drain region. The charge collection regions and the drain regions are doped such that the mobile charges collected in the charge storage region will flow to the drain region when a first electric field is applied to the gate region.

Abstract: A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die emits light of a first wavelength through a top surface of the die and one or more side surfaces of the die, and is bonded to a mounting substrate. The light conversion component converts light of the first wavelength to light of a second wavelength, the light conversion component having a bottom surface bonded to the top surface of the die. The light conversion component has lateral dimensions such that a space exists around the die, the space being bounded by the substrate and the light conversion component. The scattering ring is positioned in the space such that a portion of the light emitted from the side surfaces of the die is scattered into the light conversion component.

Abstract: An LED-based lighting device and method for making the same are disclosed. The lighting device includes an LED light source mounted on a heat sink, a power adaptor, and a controller. The power adaptor is configured to be interchangeable with a conventional incandescent bulb power adapter. The controller provides an average current to the LED light source when power is coupled to the device via the power adaptor. The average current causes the LED light source to generate light of a predetermined standard intensity that is substantially independent of variations in the LED light source from device to device. In one aspect of the invention, the LED light source includes a plurality of LEDs connected in series, the LEDs are bonded to the heat sink and connected to one another in series by wire bonds and to conducting traces on the heat sink.

Abstract: A light source and method for making the same are disclosed. The light source includes a substrate, and a light emitting structure that is divided into segments. The light emitting structure includes a first layer of semiconductor material of a first conductivity type deposited on the substrate, an active layer overlying the first layer, and a second layer of semiconductor material of an opposite conductivity type from the first conductivity type overlying the active layer. A barrier divides the light emitting structure into first and second segments that are electrically isolated from one another. A serial connection electrode connects the first layer in the first segment to the second layer in the second segment. A power contact is electrically connected to the second layer in the first segment, and a second power contact electrically connected to the first layer in the second segment.

Abstract: A protective covering constructed from an electrostatically charged sheet having a top and bottom surface and an absorbent layer. The absorbent layer has top and bottom surfaces, the bottom surface of the absorbent layer being bonded to the top surface of the electrostatically charged sheet. The absorbent layer is divided into a plurality of cells for containing liquid spilled on the absorbent layer. The absorbent layer can be constructed from paper, open cell foam, fibrous mat, or any other absorbent material. In the preferred embodiment of the present invention, the cells are constructed by providing hydrophobic barriers in the absorbent layer. The barriers can be constructed from paraffin, plastic, or any other material that can penetrate the absorbent layer. In one embodiment of the present invention, a hydrophobic layer is bonded to the top surface of the absorbent layer.

Abstract: A light source and method for fabricating the same are disclosed. The light source includes a substrate and a light emitting structure. The substrate has a first surface and a second surface, the second surface including a curved, convex surface with respect to the first surface of the substrate. The light emitting structure includes a first layer of a material of a first conductivity type overlying the first surface, an active layer overlying the first layer, the active layer generating light when holes and electrons recombine therein, and a second layer includes a material of a second conductivity type overlying the active layer and a second surface opposite to the first surface. A mirror layer overlies the light emitting structure.

Abstract: A method for stacking integrated circuit substrates and the substrates used therein are disclosed. In the method, an integrated circuit substrate having top and bottom surfaces is provided. The substrate is divided vertically into a plurality of layers including an integrated circuit layer having integrated circuit elements constructed therein and a buffer layer adjacent to the bottom surface. An alignment fiducial mark extending from the top surface of the wafer into the substrate to a depth below that of the circuit layer is constructed. The vias are arranged in a pattern that provides a fiducial mark when viewed from the bottom surface of the substrate. The pattern can be chosen such that it is recognized by a commercial stepper/scanner/contact mask aligner when viewed from said backside of said wafer. After the substrate is thinned, the alignment fiducial mark is then used to position a mask used in subsequent processing.