Abstract: A new current reference circuit is achieved. This current reference circuit is based on MOS transistors but does not depend upon the threshold voltage. The circuit comprises, first, a first MOS transistor having gate, drain, and source. A gate voltage value is coupled from the gate to the source. A second MOS transistor has gate, drain, and source. The second MOS transistor is of the same size and type as the first MOS transistor. The source is coupled to said first MOS transistor source. The gate voltage value plus a delta voltage value is coupled from the gate to the source. A means is provided for forcing a drain voltage value from the drain to the source of the first MOS transistor and from the drain to the source of the second MOS transistor. The first MOS transistor and the second MOS transistor conduct drain currents in the linear mode.

Abstract: A memory device with burn-in capability is achieved. The device comprises, first, an array of memory cells, and, second, a burn-in test block. The burn-in test block comprises a memory address generator, a data pattern generator, and a command pattern generator. The burn-in test block is capable of writing data to the memory cells, of turning ON word lines in the array, and of holding the array in a static mode. A method to perform wafer level burn-in with this device is disclosed.

Abstract: A new cascaded NMOS transistor output circuit with enhanced ESD protection is achieved. A driver PMOS transistor has the source connected to a voltage supply, the gate connected to the input signal, and the drain connected to the output pad. A dummy PMOS transistor has the source and the gate connected to the voltage supply, and the drain connected to the output pad. A driver NMOS cascaded stack comprises first and second NMOS transistors. The first NMOS transistor has the source connected to ground and the gate connected to the input signal. The second NMOS transistor has the gate connected to the voltage supply, the source connected to the first NMOS transistor drain, and the drain connected to the output pad. A p− implanted region underlies the n+ region of the drain but does not underlie the n+ region of the source. A dummy NMOS cascaded stack comprises third and fourth NMOS transistors. The third NMOS transistor has the gate and the source connected to ground.

Abstract: A new method to form a SRAM memory cell in an integrated circuit device is achieved. The method comprises providing a bi-stable flip-flop cell having a data storage node and a data bar storage node. A first capacitor is formed coupled to the data bar storage node, and a second capacitor is formed coupled to the data storage node. The first and second capacitors comprise a first conductor layer overlying a second conductor layer with a dielectric layer therebetween. One of the first and second conductor layers is coupled to ground. A new SRAM device is disclosed.

Abstract: A new level-shifting circuit is achieved comprising: a first cascaded switch comprising a first NMOS transistor and a first zero threshold NMOS transistor, the second cascaded switch comprises a second NMOS transistor and a second zero threshold NMOS transistor, and the cross-coupled pull-up comprises a first PMOS transistor and a second PMOS transistor. The sources of both of these PMOS transistors are coupled to a high voltage supply. The gate of the second PMOS transistor and the drain of the first PMOS transistor are coupled to the drain of the first zero threshold NMOS transistor to form an inverted output. The gate of the first PMOS transistor and the drain of the second PMOS transistor are coupled to the drain of the second zero threshold NMOS transistor to form a non-inverted output.

Abstract: A new method to form flash memory devices in the manufacture of an integrated circuit device is achieved. The method comprises providing a substrate. A first film is formed comprising a first oxide layer overlying the substrate and a floating gate layer overlying the first oxide layer. A second film is formed comprising a second oxide layer overlying the first film, a control gate layer overlying the second oxide layer, and an insulating layer overlying the control gate layer. The first and second films are patterned to form stacked gates comprising floating gates and control gates. Ions are implanted into the substrate between the stacked gates to form source and drain regions. A third oxide layer is then formed on the sidewalls of the stacked gates. A plug layer is then deposited overlying the substrate and the stacked gates and filling spaces between the stacked gates.

Abstract: A multi-bit split-gate (MSG) flash cell with multi-shared source/drain, a method of making and a method of programming the same are disclosed. Furthermore, a method of bit-by-bit erasing, in addition to page erasing, of a plurality of cells of two or more is disclosed through the application of a positive voltage forced onto the control gate of the unselected cell. Thus, by providing the bit-by-bit erasing flexibility, the bit alterability is enhanced. The MSG is formed with N+1 stacked gates comprising floating gates and control gates, separated by N select gates, all sharing the same source/drain between a pair of bit lines. The programming, that is, writing of the plurality of N+1 bits is accomplished also bit by bit where the programmed bits are selected by word line, bit line and control gate. The read operation is similar to the write operation.

Abstract: A particular wide band interface circuit provides an interface between a very fast slope clock signal input and a very slow slope voltage controlled delay cell of a delay lock loop. The invention generates the internal clock signal to track the slope of each delay stage, whether it is a higher frequency for which the slope of the delay stage is faster or a lower frequency for which the slope of the delay stage is slower. The integrated circuit includes a voltage bias portion, an analog clock input portion, circuit devices for interfacing with clock frequency inputs over all the available frequency range, and an output portion for producing clock signals. The invention applies to the multiple delay stages of a delay lock loop.

Abstract: A method of internally executing an externally initiated access to a dynamic memory array including a plurality of dynamic memory cells, wherein the dynamic memory cells require periodic refreshing, is achieved. The method comprises, first, determining if an external access to the dynamic memory array has been initiated. Second, a waiting period of RW idle time is inserted. The RW idle time comprises a sum of a row access time plus a pre-charge time. A pending refresh is performed during said RW idle time. A pending write access may be performed during the RW idle time. Finally, the external access is internally executed in the dynamic memory array after the RW idle time.

Abstract: A new method to form CMOS image sensors in the manufacture of an integrated circuit device is achieved. The method comprises providing a semiconductor substrate. Sensor diodes are formed in the semiconductor substrate each comprising a first terminal and a second terminal. Gates are formed for transistors in the CMOS image sensors. The gates comprise a conductor layer overlying the semiconductor substrate with an insulating layer therebetween. The transistors include reset transistors. Ions are implanted into the semiconductor substrate to form source/drain regions for the transistors. The source regions of the reset transistors are formed in the first terminals of the sensor diodes. Ions are implanted into the reset transistor sources to form double diffused sources. The implanting is blocked from other source/drain regions.

Abstract: A method to form a SCR device in the manufacture of an integrated circuit device is achieved. The method comprises providing a SOI substrate comprising a silicon layer overlying a buried oxide layer. The silicon layer further comprises a first well of a first type and a second well of a second type. A first heavily doped region of the first type is formed in the second well to form an anode terminal. A second heavily doped region of the second type is formed in the first well to form a cathode terminal and to complete the SCR device. A gate isolation method is described. A salicide method is described. LVT-SCR methods, including a floating-well, LVT-SCR method, are described.

Abstract: A method of protecting the active surface, front side, of semiconductor wafers during the operations of backside grinding, transporting, and packaging has been achieved. The invention discloses a method for applying an organic passivation layer or an aqueous material for protection of the active components. These materials are easily removed prior to final packaging of the dies.

Abstract: A new method to test multiple integrated circuit device designs using a single, probe card design is achieved. The method compriseproviding a plurality of integrated circuit device designs each having a probe pad array comprising a fixed pitch. A first integrated circuit device having a first design is loaded on a probing stage. The first integrated circuit device is probed using a vertical probe card comprising a probe tip array. The probe tip array comprises the same fixed pitch. An automated tester is thereby coupled to the first integrated circuit device. The first integrated circuit device is tested with the automated tester. The steps of loading, probing, and testing are repeated on at least one other integrated circuit device having a differing design than the first integrated circuit device.

Abstract: A new method to reduce variation in an output parameter by selection of an optimal process recipe in the manufacture of an integrated circuit device is achieved. The method may be used to reduce the array voltage threshold in a DRAM circuit by compensating the source/drain ion implantation by calculating a predicted array voltage threshold. The integrated circuit device wafer is measured to obtain a present set of process parameter values. A predicted value of an output parameter is calculated by evaluating a first equation at the present set of process parameter values. The first equation is derived from a plurality of previous sets of process parameter values and the corresponding plurality of sets of output parameter values. The difference between the predicted value of the output parameter and a target value of the output parameter is the output parameter delta. A process recipe offset is calculated by evaluating a second equation at the output parameter delta.

Abstract: A new method to form color image sensor cells without damaging bonding pads in the manufacture of an integrated circuit device is achieved. The method comprises, first, forming cell electrodes and bonding pads on a semiconductor substrate. A passivation layer is formed overlying the cell electrodes but exposing the top surface of the bonding pads. The semiconductor substrate is then dipped in a hydrogen peroxide solution to thereby form a metal oxide layer overlying the bonding pads. A first transparent planarization layer is deposited overlying the passivation layer and the metal oxide layer. A color filter photoresist layer is deposited overlying the first transparent planarization layer. The color filter photoresist layer is patterned to form color filter elements to complete the color image sensor cells in the manufacture of the integrated circuit device. The presence of the metal oxide layer prevents damage to the bonding pads from an alkaline developer.

Abstract: A regulated voltage supply circuit having improved power supply rejection ratio is achieved. The circuit comprises, first, a voltage follower having an input, an output, and a power supply voltage. The input is coupled to a reference voltage. The output comprises the regulated voltage supply. Second, a means of compensating noise on the power supply voltage comprises phase shifting the power supply voltage 180 degrees and feeding back the phase shifted power supply voltage to the voltage follower input to thereby improve power supply rejection ratio. The means of compensating noise may comprise an adjustable gain. This adjustable gain may further comprise an adjustable value resistance. The adjustable gain is used in a to optimize the PSRR by testing comprising modulating noise on the power supply voltage, measuring the noise on the regulated voltage supply, and adjusting the gain.

Abstract: A new method of fabricating a rim phase shifting mask is achieved. An opaque layer is provided overlying a transparent substrate. A resist layer is deposited overlying the opaque layer. The resist layer is patterned. The opaque layer and the transparent substrate are etched. The resist layer masks this etching. The opaque layer is etched through during this etching. Notches are thereby etched into the transparent substrate at the edges of the opaque layer. These notches will cause a phase shift in incident light relative to incident light passing through regions in the transparent substrate adjacent to the notches. During this etching, an overetch is performed to remove any mask defects in the transparent substrate. Optionally, the notches may be etched into a phase shifting layer overlying the transparent substrate. An etch stopping layer may also be used in the phase shifting layer embodiment.

Abstract: In accordance with the objects of this invention, A battery protection circuit is achieved. The circuit comprises, first, a FET switch. Last, a control circuit determines the ON/OFF state of the FET switch. The FET switch and the control circuit comprise a single integrated circuit device. The control circuit may comprise over charge and over discharge detectors, a voltage reference, and a level shifter.

Abstract: A new method of forming gate conductor lines for a DRAM in the manufacture of an integrated circuit device has been achieved. A semiconductor substrate is provided. Active areas are defined. A gate conductor layer is deposited overlying the semiconductor substrate. The gate conductor layer is patterned to form gate conductor lines. The intersections of the gate conductor lines and the active areas form DRAM transistors. Adjacent gate conductor lines are spaced a first minimum distance in critical regions and are spaced a second minimum distance in non-critical regions. The critical regions are defined as the active areas between adjacent gate conductor lines where bit line contacts are planned. The non-critical regions are defined as areas located between the critical regions and the adjacent gate conductor lines. The second minimum distance is greater than the first minimum distance to thereby decrease the aspect ratio in the non-critical regions to less than the aspect ratio in the critical regions.

Abstract: A method to control the illumination intensity of a gas discharge lamp is achieved. The method comprises, first, converting an analog lamp illumination signal into a digital lamp illumination signal. The analog lamp illumination signal is a function of the illumination intensity of a gas discharge lamp. Second, digital target signal is subtracted from the digital lamp illumination signal to create a digital error signal. Third, a digital frequency set point is adjusted from a current value to a new value based on the digital error signal. The digital frequency set point is a high resolution digital value. Fourth, the current value and the new value are averaged by a digital delta sigma modulator to create a smoothed frequency set point. The smoothed frequency set point is a medium resolution value. Finally, an oscillating voltage signal is generated with a drive frequency based on the smoothed frequency set point. The drive frequency determines the illumination intensity of the gas discharge lamp.