Abstract: A delay timer formed by a sequence of inverters alternating in type, some with single and some with multiple outputs each having an output connected to the input of the next. An output from each of the multiple output inverters is connected to the timer output.

Abstract: Disclosed is a cover for a semiconductor chip package. The cover comprises a sealing surface for providing a seal between the cover and a semiconductor chip package. A mounting surface for mounting a capacitor to the surface of cover is provided. The mounting surface comprises metalization including a metalized power pad and a metalized ground pad for mounting at least one capacitor on the surface of the cover.

Abstract: A method for sensing magnetic states of magnetic bit structures formed of separated double layer, magnetoresistive, ferromagnetic memory films through providing a word line current in a direction which results in a magnetic field due thereto, in the memory films of these bit structures, that is oriented in a direction opposite a common direction followed at least partially by orientations of edge magnetizations in these films that are parallel to the edges thereof, and sensing a change in electrical resistance of these bit structures as a result of that current.

Abstract: A method for making a bipolar integrated circuit structure in a semiconductor substrate. A layer of insulating material having an implantation opening is formed on the upper surface of the semiconductor substrate. A polysilicon layer is formed in the implantation opening. A doping material is implanted into the polysilicon-filled opening. The doping material is diffused into the substrate material from the polysilicon-filled opening.

Abstract: A variable pitch tab leadframe assembly comprising a plurality of patterned conductive elements for transmitting input and output signals to bonding locations on an electronic device. The leadframe assembly comprises conductive elements with a variable pitch to accommodate a plurality of standard pitch bond site printed circuit board footprints.

Abstract: A thermostat subbase has a conductive grid located on a first surface of an insulating base. Terminals for connection to the controlled heating and cooling apparatus and terminals for connection to a thermostat are integrally formed from the conductive grid. Manual switching is provided to connect adjoining grid portions. The adjoining grid portions extend over a pocket formed in the base and are shaped to receive a conductive ball.

Abstract: An improved disturbance resistant data storage circuit having a further transistor for each one of a pair of input transistors, the cross-coupled transistors, and the output transistors which are paired therewith.

Abstract: A scratch reducing shadow mask for providing vapor deposition patterns of bonding metals onto a surface of a die. The shadow mask comprises a top surface and a bottom surface which define a plurality of vias for permitting vaporized bonding metals to pass through the mask. Mask bottom surface comprises a plurality of recessed regions to minimize the contact area of the mask with the die during the vapor deposition process.

Abstract: Disclosed is a low-cost high-performance semiconductor chip package enabling a direct chip to printed circuit board connection. The package comprises a semiconductor chip having a front surface and a back surface. The front surface comprises pads for input and output of signals to and from the chip. The package further comprises a leadframe having power, ground, and signal conductive elements having first and second end portions for transmitting input and output signals to the pads. The package also comprises a bonding system for selectively connecting the first end portions of the conductive elements to the pads and a protective system for providing sealed and environmental protection around the semiconductor chip and portions of the leadframe while permitting other portions of the leadframe to protrude from the protective means to provide connection with other devices.

Abstract: A system and method for generating 2.sup.n test patterns is disclosed. The system utilizes a linear feedback shift register (LFSR) to generate a sequence of 2.sup.n -1 test patterns. In addition, the system includes apparatus external to the shift register which generates a 2.sup.n th test pattern. A switching circuit is employed to insert the 2.sup.n th test pattern into the sequence of test patterns. Therefore, a 2.sup.n test pattern sequence is generated. The test pattern sequence produced is pseudo-random in nature. The system further includes an output for providing a test pattern; such output could be used for the testing of a very large scale integration (VSLI) sub-system such as read only memory (ROM). A method utilizing the techniques embodied in the system is also disclosed.

Abstract: A printed wiring board connector which mechanically supports the board. A connector base has legs which extend away from ends of the base and terminate in stakes which penetrate the board for attachment and electrical connection. Walls extend from the base, arch over the base, and terminate above the base. A conductive protrusion extending from a mounted electrical device is secured between the free ends of the walls and the base providing both support of the printed wiring board and electrical connection.

Abstract: A photon detector based upon photon-assisted tunneling in superconductor-insulator-superconductor or super-Schottky structures, in which the superconductor is a high transition temperature superconductor. An electrical bias is provided on either side of such structures so that photo-assisted tunneling, in the presence of incident photons on the structure, can occur to thereby permit a tunneling current therebetween.

Abstract: A semiconductor device comprising a semiconductor body having a depression formed into the first surface of the body. The device further comprises member means comprising a thermal-to-electric transducer or static electric element, the member means having a predetermined configuration suspended over the depression. The member means is connected to the first surface so that the predetermined configuration is cantilevered over the depression, the depression opening to the first surface around at least a portion of the predetermined configuration. The depression provides substantial physical and thermal isolation between the element and the semiconductor body. In this manner, an integrated semiconductor device provides an environment of substantial physical and thermal isolation between the transducer or element and the semiconductor body.

Abstract: The specific gravity, l, of a fluid of interest is determined based on thermal conductivity, k, and specific heat, c.sub.p, of the fluid of interest. An embodiment uses proximately positioned resistive heater and thermal sensor elements coupled by the fluid of interest. Pulses of electrical energy are applied to the heater of a level and duration such that both a transient change and a substantially steady-state temperature occur in the sensor. The k of the fluid of interest is determined based upon sensor output at steady-state elevated temperature, c.sub.p of the fluid of interest is determined based upon the rate of change of sensor output during a time interval of transient temperature change in the sensor, and l is determined from k and c.sub.p.

Abstract: A color signature sensor for color recognition or discrimination utilizing a spectral analysis system for use as a process control for automation and on-line quality assurance. An object to be observed is illuminated by a suitable light source, light collected from the object under examination is routed into a monochromator. The output of the monochromator is fed to an analog-to-digital converter and analyzed by a microprocessor.

Abstract: The marginal adhesion of platinum to silicon nitride is a serious issue in the fabrication of microbridge mass air flow sensors. High temperature stabilization anneals (500.degree.-1000.degree. C.) are necessary to develop the properties and stability necessary for effective device operation. However, the annealing process results in a significant reduction in the already poor platinum/silicon nitride adhesion. Annealing at relatively high temperatures leads to the development of numerous structural defects and the production of non-uniform and variable sensor resistance values. The use of a thin metal oxide adhesion Layvr, approximately 20 To 100 angstromw in thickness is very effective in maintaining platinum adhesion to silicon nitride, and through the high temperature anneal sequence.

Abstract: Electrochemically stable, non-hygroscopic ionically conducting solid electrolyte films for use in environmental sensors feature an amount of tetraalkylammonium salt in one or more aprotic solvents together with an amount of organic polymeric matrix material and an amount of a plasticizer, if desired.

Abstract: Methods of solution processing of rigid chain and ladder polymers to films, coatings, or fibers from isotropic or anisotropic solutions in aprotic organic solvents containing Lewis acids are disclosed.

Abstract: A method and apparatus for determining both the thermal conductivity, k, and specific heat, c.sub.p, of a fluid of interest are disclosed. An embodiment uses proximately positioned resistive heater and thermal sensor coupled by the fluid of interest. A pulse of electrical energy is applied to the heater of a level and duration such that both a transient change and a substantially steady-state temperature occur in the sensor. The k of the fluid of interest is determined based upon a known relation between the sensor output and k at steady-state sensor temperature; and c.sub.p of the fluid of interest is determined based on a known relation among k, the rate of change of the sensor output during a transient temperature change in the sensor and c.sub.p.

Abstract: A microbridge air flow sensor which has a sealed etched cavity beneath the silicon nitride diaphragm so that the cavity is not susceptible to contamination from residual films or other material accumulating within the cavity. The cavity thermally isolates the heater and detectors which are encapsulated in the diaphragm. The cavity is fabricated by front side etching of the silicon wafer. Narrow slots are made through the silicon nitride diaphragm to expose a thin film (400 angstrom) rectangle of aluminum. A first etch removes the aluminum leaving a 400 angstrom very shallow cavity under the diaphragm. Anisotropic etch is then introduced into the shallow cavity to etch the silicon pit.