Abstract: A method is provided for making a silicon-on-insulator substrate. Such method can include epitaxially growing a highly p-type doped silicon-containing layer onto a major surface of an underlying semiconductor region of a substrate. Subsequently, a non-highly p-type doped silicon-containing layer may be epitaxially grown onto a major surface of the p-type highly-doped epitaxial layer to cover the highly p-type doped epitaxial layer. The overlying non-highly p-type doped epitaxial layer can have a dopant concentration substantially lower than the dopant concentration of the highly p-type doped epitaxial layer. The substrate can then be processed to form a buried oxide layer selectively by oxidizing at least portions of the highly p-type doped epitaxial layer covered by the non-highly p-type doped epitaxial layer, the buried oxide layer separating the overlying monocrystalline semiconductor layer from the underlying semiconductor region.

Abstract: A field effect transistor (“FET”) is provided which includes an active semiconductor region including a channel region, a first source-drain region and a second source-drain region. A major surface of the active semiconductor region is divided into a mutually exclusive first portion and a second portion. A first liner applies a first stress to the first portion of the major surface, and a second liner applies a second stress to the second portion of the major surface. The first and second stresses are each selected from high tensile stress, high compressive stress and neutral stress, with the first stress being different from the second stress. The liners can help to differentiate a first operating current conducted by the first portion of the FET under one operating condition and a second operating current that is conducted by the second portion of the FET under a different operating condition.

Abstract: A chip is provided which includes an active semiconductor region and a field effect transistor (“FET”) having a channel region, a source region and a drain region all disposed within the active semiconductor region. The FET has a longitudinal direction in a direction of a length of the channel region, and a transverse direction in a direction of a width of the channel region. A dielectric stressor element having a horizontally extending upper surface extends below a portion of the active semiconductor region. The dielectric stressor element shares an edge with the active semiconductor region, the edge extending in a direction away from the upper surface. In particular structures, two or more dielectric stressor elements are provided at locations opposite from each other in the longitudinal and/or transverse directions of the FET.

Abstract: A design structure embodied in a machine-readable medium used in a design process is provided. The design structure comprises a static random access memory (“SRAM”), including a plurality of cells arranged in an SRAM having a plurality of columns; and a voltage control circuit operable to temporarily raise a voltage level of a low voltage reference to cells belonging to a column selected for writing from the plurality of columns, wherein the voltage control circuit includes a first n-type field effect transistor (“NFET”) and a second NFET, the first NFET having a conduction path connected between ground and the low voltage reference, the second NFET having a conduction path connected between a power supply and the low voltage reference.

Abstract: Carriers (10) holding parts (50) for assembling complex MEMS devices are transported to a central assembly location. The parts are stacked in a pre-assigned order and later released from their carriers. Alternatively, they are positioned over the appropriate location and released so as to fall into position as needed. The assembly area (100) includes a cavity below the plane of the carriers such that the parts held within the carrier drop into the cavity. Heating elements are integrated into the cavity to assist in the release of the parts. The cavity is supplied with parts by one or more carriers which are move around by any number of MEMS drive systems (200, 250). The cavity and some of the MEMS assembled therein deliver with precision amounts of materials as required suitable for biomedical applications, or may be processed in-situ, as in an on-chip laboratory.

Abstract: A conversion enclosure allows a first group of hard disk drives of a first size to be received by a hard disk drive enclosure having a second group of hard disk drives of a second size. The conversion enclosure includes a chassis having first and second side panels, each of the side panels having a front edge and a rear edge, a plurality of pairs of chassis rails having a first rail of each of the pairs of chassis rails connected to the first side panel, and the second rails connected to the second side panel. Pairs of slots are included therein, each slot bounded on one side by a first plane passing through a first pair of chassis rails, and on the other side, by a second plane passing through the second pair of chassis rails adjacent to the first pair. The conversion enclosure includes a pair of engaging panels, each having a vented area respectively connected to the rear edge of the first side panel and to the rear edge of the second side panel.

Abstract: A method of fabricating a MEMS switch having a free moving inductive element within in micro-cavity guided by at least one inductive coil. The switch consists of an upper inductive coil at one end of a micro-cavity; optionally, a lower inductive coil; and a free-moving inductive element preferably made of magnetic material. The coils are provided with an inner permalloy core. Switching is achieved by passing a current through the upper coil, inducing a magnetic field unto the inductive element. The magnetic field attracts the free-moving inductive element upwards, shorting two open conductive wires, closing the switch. When the current flow stops or is reversed, the free-moving magnetic element drops back by gravity to the bottom of the micro-cavity and the conductive wires open. When the chip is not mounted with the correct orientation, the lower coil pulls the free-moving inductive element back at its original position.

Abstract: A method and a system for conducting a static timing analysis on a circuit having a plurality of point-to-point delay constraints between two points of the circuit, in which two conservative and two optimistic user defined tests are derived for all types of the point-to-point delay constraints. The method shows that when a conservative test is performed without introducing any special tags, then it is found that the point-to-point constraint is satisfied. On the other hand, when the optimistic test fails without any special tags, it is determined that the point-to-point constraint is bound to fail if special tags are introduced, in which case, they are to be introduced only when an exact slack is desired. Finally, for anything in between, a real analysis with special tags or path tracing is required. Based on the topology of the graph, arrival time based tests may be tighter in some situations, while the required arrival time based tests, may be tighter in others.

Abstract: A method for identifying potentially defective integrated circuit chips and excluding them from future testing as wafers move through a manufacturing line The method includes data-collecting steps, tagging the chips on wafers identified as potentially bad chips based on information collected as the wafer moves down the fabrication line, evaluating test cost savings by eliminating any further tests on the tagged chips preferably using a test cost database. Considering all the future tests to be preformed, the tagged chips are skipped if it is determined that the test cost saving is significant. Tagging bad chips is based on various criteria and models which are dynamically adjusted by performing the wafer final test on samples of the tagged chips and feeding-back the final test results. The dynamic adaptive adjustment method preferably includes a feedback loop or iterative process to evaluate financial tradeoffs when assessing the profit of salvaging chips against the additional test costs.

Abstract: The present invention relates to a method of fabrication process which integrates the processing steps for fabricating the trench MIM capacitor with the conventional middle-of-line processing steps for fabricating metal contacts, so that the inner metallic electrode layer of the trench MIM capacitor and the metal contact of the FET or other logic circuitry components are formed by a single middle-of-line processing step and comprise essentially the same metallic material. The semiconductor device contains at least one trench metal-oxide-metal (MIM) capacitor and at least one other logic circuitry component, preferably at least one field effect transistor (FET). The trench MIM capacitor is located in a trench in a substrate and comprises inner and outer metallic electrode layers with a dielectric layer therebetween. The FET comprises a source region, a drain region, a channel region, and at least one metal contact connected with the source or drain region.

Abstract: A preliminary static timing analysis run is performed to calculate the delay and slew as well as timing windows for each net in the design, followed by coupling analysis for each given aggressor-victim combination, and to calculate the noise effect on the timing of victim net. Given a set of functional groups that relate the coupled aggressors to each other, the worst set of aggressors are calculated that satisfy the constraints from the functional groups, based on the calculated impact of each aggressor on the victim. Similarly the set of aggressors which contribute to the maximum amount of inductive coupling noise effect on timing are calculated. Furthermore, the coupling noise impact of the reduced set of aggressors on the given victim line and adjust the delay value calculated in the preliminary static timing analysis run.

Abstract: A method of forming an improved static random access memory (SRAM) interconnect structure is provided. The method includes forming a sidewall spacer around a periphery of a patterned poly-silicon layer formed over a silicon layer of a semiconductor substrate; removing the patterned poly-silicon layer for exposing a portion of a cap layer; etching the exposed portion of the cap layer for revealing a portion of the silicon layer; etching the portion of the silicon layer, in which a portion of said silicon layer connects at least a portion of pull-down device of said SRAM to at least a portion of pull-up device of said SRAM; forming a gate oxide; and forming a gate conductor over the gate oxide. An interconnect structure is also provided.

Abstract: A method of fabricating a MEMS switch that is fully integratable in a semiconductor fabrication line. The method consists of forming two posts, each end thereof terminating in a cap; a rigid movable conductive plate having a surface terminating in a ring in each of two opposing edges, the rings being loosely connected to guiding posts; forming upper and lower electrode pairs and upper and lower interconnect wiring lines connected and disconnected by the rigid movable conductive plate. The conductive plate moves up, shorting two upper interconnect wirings lines. Conversely, the conductive plate moves down when the voltage is applied to the lower electrode pair, while the upper electrode pair is grounded, shorting the two lower interconnect wiring lines and opening the upper wiring lines.

Abstract: A method is provided for controlling a voltage level supplied to a static random access memory (“SRAM”). In such method, when a column of the SRAM is selected for writing, a first p-type field effect transistor (“PFET”) and a second PFET can be operated to supply the power at a lower voltage level to cells belonging to a selected column, the lower voltage level being lower than the power supply voltage level. The first PFET can have a conduction path connected between a power supply and the cells belonging to the selected column. The second PFET may have a conduction path connected between the cells belonging to the selected column and ground. While supplying the power at the lower voltage level, a cell belonging to the selected column may be written. When the column is no longer selected for writing, the first and second PFETs can be operated to supply the power at the power supply voltage level again to the cells belonging to the selected column.

Abstract: A semiconductor micro-electromechanical system (MEMS) switch provided with noble metal contacts that act as an oxygen barrier to copper electrodes is described. The MEMS switch is fully integrated into a CMOS semiconductor fabrication line. The integration techniques, materials and processes are fully compatible with copper chip metallization processes and are typically, a low cost and a low temperature process (below 400° C.). The MEMS switch includes: a movable beam within a cavity, the movable beam being anchored to a wall of the cavity at one or both ends of the beam; a first electrode embedded in the movable beam; and a second electrode embedded in an wall of the cavity and facing the first electrode, wherein the first and second electrodes are respectively capped by the noble metal contact.

Abstract: A method for performing timing optimization of a detail routed netlist, incorporating statistical variability information, common path pessimism reduction, and capacitative coupling information, in a tightly coupled, incremental manner with minimal perturbations to the placement, routing, and asserted parasitic information. The method corrects violations in a placed and routed design of a VLSI circuit chip, where the design is represented by a netlist describing logical and physical characteristics of the design and by a corresponding timing graph, the method including the steps of: identifying violations in the design; iteratively eliminating the violations by incrementally transforming the logical and the physical characteristics of the design, incorporating in the design only legal placements and routes; and applying incremental timing to evaluate the transformations, and updating the existing timing graphs to reflect changes consisting of the legal placements and routes.

Abstract: A method of fabrication is provided in which a field effect transistor (FET) is formed having a channel region and source and drain regions adjacent to the channel region. A first stressed region underlies the channel region, in which the first type of stress is either compressive type or tensile type. Second stressed regions having a second type of stress underlie the source and drain regions, in which the second type of stress is an opposite one of the compressive type or tensile type stress of the first stressed region.

Abstract: A metallized feature is formed in the top surface of a substrate, and a handling plate is attached to the substrate. The substrate is then thinned at the bottom surface thereof to expose the bottom of the feature, to form a conducting through-via. The substrate may comprise a chip having a device (e.g. DRAM) fabricated therein. The process therefore permits vertical integration with a second chip (e.g. a PE chip). The plate may be a wafer attached to the substrate using a vertical stud/via interconnection. The substrate and plate may each have devices fabricated therein, so that the process provides vertical wafer-level integration of the devices.

Abstract: An interconnect structure and method of making the same are provided. The interconnect structure includes a dielectric layer having a patterned opening, a metal feature disposed in the patterned opening, and a dielectric cap overlying the metal feature. The dielectric cap has an internal tensile stress, the stress helping to avoid electromigration from occurring in a direction away from the metal line, especially when the metal line has tensile stress.

Abstract: The invention is directed to an improved transistor that reduces dopant cross-diffusion and improves chip density. A first embodiment of the invention comprises gate electrode material partially removed at a junction of a first gate electrode region comprised of gate material doped with first ions for a first device and second gate electrode region comprised of gate material doped with second ions for a second device. The respectively doped regions are connected by a silicide layer near the top surface of the gate conductors.