Abstract: A system for the long-term storage and high-speed retrieval of images stored on silicon wafers. The images are stored by utilizing semiconductor fabrication techniques. These images are organized and managed using metadata in the form of a barcode. Each barcode is a unique identifier that contains the location information for each specific image on the silicon wafer substrate. The system further provides an identifier in an electronic database that references the appropriate barcode and describes the contents of the image. The images and barcodes are transferred to specific predetermined locations on the silicon wafer. The stored images are retrieved by use of a software program that searches for a user's queries in the electronic database and outputs the specific barcode to the image reader. The image reader translates the barcode information for the desired image and drives the optics or the silicon wafer to the appropriate location.

Abstract: Disclosed herein are a method and an apparatus to identify alpha-emitting radionuclides and to measure absolute alpha radioactivity using a low temperature detector. A 4? metallic absorber which encloses a radioactive material containing alpha-emitting radionuclides absorbs the total alpha decay energy in the form of thermal energy. The corresponding temperature changes are measured by a low temperature detector attached to the 4? absorber with high energy resolution. The identification of alpha-emitting radionuclides is declared by comparing the measured temperature signal with characteristic decay energy of radionuclides. The absolute amount of the radionuclides is determined by counting the number of the pulses for each of the identified nuclides.

Abstract: A two-piece sensor assembly is disclosed comprising a sensor body insert having a thermoplastic sensor body molding that can be snap-fit into a thermoplastic sensor housing a spherical-type snap-fit eliminating leak paths or openings that may damage the sensor body.

Abstract: The invention includes a packaged semiconductor device in which the bond wires are bonded to the leads with an aluminum bump bond. The semiconductor device is mounted on a leadframe having leads with a nickel plating. To form the bump bond between a fine aluminum wire, such as a 2 mil diameter wire, and the lead, an aluminum bump is bonded to the nickel plating and the wire is bonded to the bump. The bump is aluminum doped with nickel and is formed from a large diameter wire, such as a 6 mil diameter wire.

Abstract: A molded, leadless packaged semiconductor multichip module includes 100 has four mosfets 10, 12, 14, 16 for a full bridge circuit. The mosfets may include two N-channel and two P-channel devices or four mosfets of the same type, but four N-channel are preferred. In module 100 there are two leadframes 30, 40 for assembling the mosfets. In particular, the two N-channel and two P-channel devices are disposed between two leadframes and encapsulated in an electrically insulating molding compound 84. The resulting package has four upper heat sinks 44.1-44.4 that are exposed in the molding compound 84 for transferring heat from the mosfets to the ambient environment. No wire bonds are required. This can significantly reduce the on resistance, RDSON. The top or source-drain lead frame 30 may be soldered to the sources and gates of the bridge mosfets.

Abstract: A method to identify a Region Of Interest (ROI) within an image includes the steps of: reading a digital image; finding predetermined brightness values; analyzing lines near a plurality of outer edges of the digital image; identifying an entire area of the digital image as the ROI if the found brightness values are also found in lines near the plurality of outer edges of the digital image; computing Radon transforms to generate one dimensional (1D) projections of the digital image if the found brightness values are not found in the lines; detecting a set of edges within the 1D projections; selecting edges from the set of edges; validating the selected edges to identify a set of validated edges; computing the ROI from the set of validated edges of the 1D projections; and saving the computed ROI to memory. A system to perform the method is also described.

Abstract: Disclosed in this specification is a method for inhibiting the formation of SET1 family core complexes. A guanidinium-containing molecule is used to competitively inhibit the binding of the N-SET region of a SET1 protein to WDR5, thus inhibiting the formation of the SET1 family core complex. The guanidinium-containing molecule may be, for example, an arginine-containing peptide. When bound to WDR5, the guanidinium moiety is bound between the F-133 and F-263 residues of the WDR5 when a crystal structure of the bound complex is obtained.

Abstract: An apparatus comprising: a sensor array having rows of pixels which are exposed to symbol indicia, wherein the sensor array generates a sync signal; an aiming pattern generator for producing an aiming pattern superimposed on the symbol indicia; a processor which utilizes the sync signal to control the aiming pattern generator to: turn on the aiming pattern during exposure of a first predetermined row of pixels; turn off the aiming pattern during exposure of a second predetermined row of pixels; turn on the aiming pattern during exposure of a third predetermined row of pixels; and, a housing for housing the sensor array, aiming pattern generator and processor for hand held operation.

Abstract: A noise attenuator for attaching a side wall panel to a frame that is exposed to vibratory loads and which includes a rigid core having a sleeve with two radially disposed end plates. A bracket encircles a portion of said sleeve between the end plates and is in non-contiguous relationship with the core. An elastomeric bushing is bonded to a portion of the bracket and the core with the exception of the outer faces of the end plates, which remain exposed. Voids are passed through the rear plate and extend axially between the bracket and the sleeve some length into the sleeve. Due to the geometry of the unit, the non-voided sections of the bushing are loaded in either a combination of tension and shear or compression and shear when the core is connected to a vibrating frame and the bracket is connected to a side wall panel.

Abstract: A wide bandgap silicon carbide device has an avalanche control structure formed in an epitaxial layer of a first conductivity type above a substrate that is connected to a first electrode of the device. A first region of a second conductivity type is in the upper surface of the epitaxial layer with a connection to a second electrode of the device. A second region of the first conductivity type lies below the first region and has a dopant concentration greater than the dopant concentration in the epitaxial layer.

Abstract: An exploitation of the proper classification of conventional call processing states into categories, each category corresponding to one of the call states of the SIP finite-state machine (FSM), yields simplified design, implementation, and operation of heterogeneous call processing. A separate FSM for the SIP-categorized call states running in parallel with a conventional port event processing (PEP) FSM, implements a VoIP Local Call Controller by passing events between the SIP-type FSM and the PEP FSM only at the points where a transition between SIP categories occurs. The SIP FSM does not require notification of PEP FSM transitions not affecting the SIP call state. For this reason, none of the code associated with the transitions between PEP FSM states within the same major state category requires any modification. Consequently the integration of VoIP and PEP call processing can be done more simply, and at dramatically-reduced cost in software development, support, and maintenance.

Abstract: A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat spreader can include additional projections on its edges that act as heat collectors and help to secure the spreader in the MLP. The connecting projection is attached to a lead of the leadframe so that heat gathered by the cap can be transferred through the connecting projection to the lead and to a printed circuit board to which the lead is connected. In embodiments, the heat spreader includes a central heat collector projection from the cap toward the die, preferably in the form of a solid cylinder, that enhances heat collection and transfer to the cap. The cap can include fins projecting from its top surface to facilitate radiant and convection cooling.

Abstract: A semiconductor package assembly including a molded leadless package (MLP) having an exposed top emitter pad and an exposed bottom source pad. A folded heat sink is attached to the exposed top emitter pad of the MLP by a soft solder attach process. The folded heat sink has a planar member generally coextensive in size with the MLP and in electrical and thermal contact with the top emitter pad of the MLP, and also has one or more leads extending generally perpendicularly to the planar member in a direction towards the lower surface of the MLP. These heat sink leads may provide the emitter connection to a printed circuit (PC) board.

Abstract: A mechanical linear actuator having a tubular member that is defined by a housing for rotatably and axially supporting a circular nut, a lead screw is mated to the circular nut so that it can move axially in and out of the tubular member. A torsion spring clutch brake is wound about the circular nut to normally brake the nut and thus prevent the lead screw from moving into or out of the tubular member. An unlocking mechanism can remotely unwind the torsion spring clutch brake to sufficiently release the circular nut and thus allow the lead screw to pass in and out of the tubular member. An adjustable stop is provided for adjusting the stroke of the actuator.

Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.

Abstract: A method for authenticating data comprising the steps of: providing data to a first device having at least two initial cryptographic keys; generating authentication information required to authenticate the data utilizing the at least two initial cryptographic keys; sending the data and authentication data to a second device having paired cryptographic keys wherein each paired cryptographic key is associated to one of the at least two initial cryptographic keys; and authenticating the data in the second device utilizing the paired cryptographic keys.

Abstract: A semi-insert hearing protector includes a thin-walled enclosure sized substantially to that of the outer ear of a wearer, the enclosure being made from a rigid or semi-rigid material and secured to the head of said wearer by means of an adjustable headband. A short tube extends from the enclosure for communication with the ear canal, the short tube being made from a rigid or semi-rigid material and including a flexible cuff disposed over the tube made from a resilient material. The enclosure contains sound absorbing material configured to vary the frequency characteristic of sound attenuation by the semi-insert.

Abstract: A process for treating biological targets in a fluid of a biological organism, including introducing a fluid comprising a biological target to an assembly comprising an inlet connected to receive the fluid and an outlet connected to pass the fluid from the assembly, wherein the assembly comprises a flow chamber for conveying a flow of the fluid, and a capture zone comprising a target-specific binding agent, wherein during flow of the fluid through the flow chamber, the biological target undergoes flux rolling along the target-specific binding agent.

Abstract: A buck converter module includes a high side (HS) die having source, drain, and gate bonding pads on a front side of the HS die, a low side (LS) die having a first section thereof with a plurality of through silicon vias (TSVs) extending from a back side to a front side of the LS die, the LS die having source, drain, and gate bonding pads located on a front side of a second section separate from the first section, the drain bonding pad electrically connected to the back side of the LS die in the second section. The HS die and the LS die are bonded together such that the source bonding pad of the HS die is electrically connected to the back side of the LS die, and each of the drain and gate bonding pads are electrically connected to separate TSVs in the LS die.