Abstract: A radio frequency identification (RFID) device includes an antenna configured to transmit or receive a radio frequency signal to or from an external communication apparatus; an analog block configured to generate a first power voltage in response to the radio frequency signal; a digital block configured to receive the first power voltage from the analog block, to transmit a response signal to the analog block, and to output a memory control signal; and a memory configured to read/write data in response to the memory control signal, the memory including a high voltage generating unit for generating a second power voltage from the first power voltage, a first portion driven by the second power voltage, and a second portion driven by the first power voltage, wherein the level of the first power voltage is lower than that of the second power voltage.

Abstract: A semiconductor device including a threshold voltage detector and a boosted voltage generating unit. The threshold voltage detector detects a threshold voltage level of cell transistors and outputs a detected threshold voltage level. The boosted voltage generating unit changes a target level of a boosted voltage in response to the detected threshold voltage level. The threshold voltage detector includes a detected current generating unit and a detected voltage generating unit. The detected current generating unit has a plurality of cell transistors in a cell array and generates a detected current whose amplitude varies corresponding to an average level of the threshold voltages of the cell transistors. The detected voltage generating unit generates the detected threshold voltage level whose level is determined corresponding to the amplitude of the detected current.

Abstract: An internal voltage generation circuit for a semiconductor device and method therefor includes a voltage generator configured to generate voltages with different levels by using an external voltage. A code storing unit is configured to store a selection code to select an internal voltage out of the plurality of voltages. A decoding unit selects the internal voltage from among the plurality of voltages in response to the selection code in a normal mode, and selects the internal voltage out of the plurality of voltages in response to a test selection code set in a test mode. The interval voltage selected in the normal mode is used as an initial value that is a reference of the selection in the test mode.

Abstract: A method for fabricating a nonvolatile memory device includes repeatedly stacking a stacked structure over a substrate to form a multi-stacked structure, wherein the stacked structure includes a conductive layer and an insulation layer, forming a photoresist pattern over the multi-stacked structure, first-etching an uppermost stacked structure of the multi-stacked structure using the photoresist pattern as an etch barrier, second-etching a resultant structure formed by the first-etching through the use of a breakthrough etching, slimming the photoresist pattern to form a slimmed photoresist pattern, and third-etching the uppermost stacked structure using the slimmed photoresist pattern as an etch barrier and, at the same time, etching a stacked structure disposed under the uppermost stacked structure and exposed by the first-etching.

Abstract: A semiconductor device includes a semiconductor substrate including an active region and a gate region, and a gate channel formed in a portion of the active region that overlaps the gate region. The gate channel includes a recessed multi-bulb structure.

Abstract: A semiconductor device with a dielectric structure and a method for fabricating the same are provided. A capacitor in the semiconductor device includes: a bottom electrode formed on a substrate; a first dielectric layer made of titanium dioxide (TiO2) in rutile phase and formed on the bottom electrode; and an upper electrode formed on the first dielectric layer.

Abstract: Internal voltage generation circuit including a reference oscillation signal generator for generating a reference oscillation signal according to a comparison result of a pumping voltage with a reference voltage, an oscillation signal generator for generating a plurality of oscillation signals with a predetermined phase difference and a pumping voltage generator for generating a pumping voltage through sequential charge pumping operations performed in response to the plurality of oscillation signals, respectively.

Abstract: An RFID device includes an analog block configured to receive a radio frequency signal so as to output an operation command signal, a digital block configured to output an address, a temperature address, an operation control signal, and a temperature sensor activation signal in response to the operation command signal received from the analog block and to provide a corresponding response signal into the analog block. The device further includes a memory block configured to receive the address, the temperature address, and the operation control signal so as to generate an internal control signal for controlling the internal operation, and to read/write data in a cell array including a non-volatile ferroelectric capacitor in response to the internal control signal, and a temperature sensor processing unit configured to detect a temperature change state of an RFID tag in response to the temperature sensor activation signal.

Abstract: Output driver circuit, semiconductor memory device including the output driver circuit, and method for operating the semiconductor memory device, including a pre-driver to generate a pull-up control signal and a pull-down control signal according to a logic value of data to output, and to adjust and output a slew rate of the pull-up control signal and a slew rate of the pull-down control signal according to a termination resistance setting information, a pull-up driver to output logic high data in response to the pull-up control signal and a pull-down driver to output logic low data in response to the pull-down control signal.

Abstract: A semiconductor device includes a semiconductor substrate, an insulation pattern on the semiconductor substrate, and an etch stop layer on the insulating pattern, the insulation pattern and the etch stop layer defining a contact hole that exposes the substrate, a first plug filled in a portion of the contact hole, a diffusion barrier layer formed above the first plug and in a bottom portion and on sidewalls of a remaining portion of the contact hole, a second plug formed on the diffusion barrier layer and filled in the contact hole, and a storage node coupled to and formed on the second plug.

Abstract: A semiconductor device includes a pad configured to receive a data strobe signal, and a path selector configured to output the data strobe signal through a corresponding input path during a normal operation, and to output the data strobe signal through a plurality of input paths in response to a path selection signal during a test operation.

Abstract: A semiconductor memory device is capable of controlling a tRCD (RAS to CAS Delay) time regardless of an address input timing during a test operation of the semiconductor memory device. The semiconductor memory device includes a column address strobe pulse generator for generating a column address strobe pulse in response to a column command signal and a row address strobe pulse generator for receiving an active command signal or the column command signal to produce a row address strobe pulse in response to a test mode signal.

Abstract: A semiconductor memory device has a simple layout pattern of a sub hole region. The semiconductor memory device includes a segment input/output line, a first local input/output line and a second local input/output line corresponding to the segment input/output line, an input/output switch configured to selectively connect the segment input/output line and the first local input/output line in response to a first switch control signal, and a dummy input/output switch which is connected to a second local input/output line but is not connected to the segment input/output line.

Abstract: On die termination circuit and method for calibrating the same includes a external resistor connected to a first node, a plurality of calibration resistors connected to a second node, the plurality of calibration resistors being turned on/off in response to a calibration code set, a current mirror configured to mirror currents of the first node and the second node and a code generator configured to generate a calibration code set according to the mirrored currents. In accordance with a method for calibrating an on die termination circuit of the present invention, the method includes a step of mirroring a current of a first node connected to an external resistor and a current of a second node connected to a plurality of calibration resistors and a step of generating a calibration code set according to the mirrored currents.

Abstract: A refresh signal generator generates an internal refresh signal to conduct a refresh with an interval controlled based on PVT fluctuations. The refresh signal generator includes a temperature sensing unit for sensing an internal temperature and activating a corresponding signal of a plurality of temperature sensing signals in response to a temperature sense driving signal, a power supply selecting unit for driving a driving voltage supply terminal to one of different voltage levels according to the plurality of temperature sensing signals, and an internal refresh signal generating unit for receiving a driving voltage from the power supply selecting unit and producing internal refresh signals at a constant interval.

Abstract: The present invention provides a semiconductor memory device that can reduce unnecessary current consumption, as banks not accessing data maintain an inactivation state and do not receive an input address. A semiconductor memory device includes a plurality of banks grouped into a first group and a second group; and a bank control unit for selecting one of the first group and the second group in response to a bank address to transfer an address to the selected group.

Abstract: A semiconductor memory device includes a delay locked loop (DLL) unit configured to generate a plurality of DLL clocks, each having a different phase according to delay values predefined by a DLL operation; a data output buffering unit configured to output data in response to the DLL clocks; and a skew compensating unit disposed between the DLL unit and the data output buffering unit to remove a clock skew occurring when the DLL clocks are transferred to the data output buffering unit.

Abstract: A semiconductor memory device includes an aligning signal generator, a data aligning unit, a data transmitting controller and a data transmitter. The aligning signal generator receives a data strobe signal to output aligning signals. The data aligning unit aligns a plurality of data pieces input in succession in response to the aligning signals. The data transmitting controller generates a data transmitting signal synchronized with the transition of the aligning signal. The data transmitter transmits an aligned data output from the data aligning unit to a data storage area in response to the data transmitting signal. A method for driving the semiconductor memory device includes aligning data pieces input in succession as parallel data in response to a data strobe signal, generating a data transmitting signal corresponding to transition of the data strobe signal and transmitting the parallel data to a data storage area in response to the data transmitting signal.

Abstract: A semiconductor memory device having multiple banks each including multiple memory blocks arranged in column and row directions. The memory blocks are divided into multiple memory block groups each sharing a corresponding column select signal. The memory blocks belonging to the respective memory block groups are arranged adjacently in the column direction. Multiple global input/output lines are separately connected to the memory block groups of the respective banks to transfer data of the memory blocks belonging to the respective memory block groups in a time division manner.

Abstract: A method for forming a zirconium oxide (ZrO2) layer on a substrate in a chamber includes controlling a temperature of the substrate; and repeating a unit cycle of an atomic layer deposition (ALD) method. The unit cycle includes supplying a zirconium (Zr) source into a chamber, parts of the Zr source being adsorbed into a surface of the substrate; purging non-adsorbed parts of the Zr source remaining inside the chamber; supplying a reaction gas for reacting with the adsorbed parts of the Zr source; and purging non-reacted parts of the reaction gas remaining inside the chamber and reaction byproducts, wherein the temperature of the substrate and a concentration of the reaction gas are controlled such that the ZrO2 layer is formed with a tetragonal structure.