Abstract: A cadmium carbonate/cadmium sulfide photoconductor is made by mixing solutions containing carbonate, cadmium and copper ions to form CdCO.sub.3 :Cu precipitate which is subsequently converted to CdCO.sub.3 /CdS:Cu by bubbling hydrogen sulfide gas through a hot aqueous suspension of the CdCO.sub.3 :Cu precipitate.
Abstract: A thermostatic metal comprises a layer of a low expansion metal bonded to a layer of a high expansion metal, the outer surface of one of the layers comprising a layer of similar composition but containing, in addition, a grain growth limiting additive.
Abstract: A heat recuperator having a triple pass cross-flow ceramic core comprising ribbed layers bonded together has divider ribs thicker than other supporting ribs in order to provide greater seal area to adjoining layer.
Abstract: A fluorescent lamp has two layers of different phosphors, the underlying phosphor serving to improve the maintenance of the overlying phosphor.
Abstract: A heat recuperator having a triple pass cross-flow ceramic core comprising ribbed layers bonded together has divider ribs thicker than other supporting ribs in order to provide greater seal area to adjoining layer.
Abstract: An alloy for brazing ceramic to a ceramic or a metal consists essentially of 35 to 95% tin, 0.5 to 70% silver, 0.5 to 20% copper, 0.1 to 4% titanium and/or vanadium and/or zirconium, 0 to 5% nickel, 0 to 2% chromium, all percentages by weight.
Abstract: An IC chip package comprises a lead frame support on which lead frame segments are disposed. An IC chip is disposed on a pad area on the lead frame support. There is a cover on the support. A sealant material encircles the IC chip within the confines of the support and cover in order to seal the IC chip from the environment.
Type:
Grant
Filed:
September 22, 1986
Date of Patent:
May 5, 1987
Assignee:
GTE Products Corporation
Inventors:
Thomas G. Gilder, Jr., Raymond D. O'Dean
Abstract: A lead frame for use with an integrated circuit chip comprises a plurality of lead frame segments, each segment comprising a plurality of leads the inner ends of which converge towards a pad area for the chip encircled by the segments.
Type:
Grant
Filed:
September 22, 1986
Date of Patent:
May 5, 1987
Assignee:
GTE Products Corporation
Inventors:
Thomas G. Gilder, Jr., Raymond D. O'Dean
Abstract: A circuit breaker formed of a PMB bimetal fastened to a post and arranged to face against a new contact that is disposed upon a U-shaped calibration bracket. A span is exposed in the U-shaped calibration bracket to enable a calibration probe to break the circuit breaker at a predetermined time to permanently bend it into a fixed position.
Abstract: A refractory metal silicide sputtering target is made by reacting refractory metal and silicon to about 70 to 90% completion of the reaction, comminuting the material, and then vacuum hot pressing the comminuted material to a high density compact having a theoretical density greater than about 95 percent and forming the metal silicide.
Type:
Grant
Filed:
April 15, 1985
Date of Patent:
May 5, 1987
Assignee:
GTE Products Corporation
Inventors:
Edward D. Parent, Charles S. Purinton, Charles W. Sutter
Abstract: In the manufacture of a packaged IC chip, a lead frame segment has a plurality of leads, the ends of which are connected to opposing rails. After the leads are secured to a lead frame support, the rails are removed and an IC chip is then connected. The chip and lead frame are then encapsulated between the support and a cover.
Type:
Grant
Filed:
January 27, 1986
Date of Patent:
March 31, 1987
Assignee:
GTE Products Corporation
Inventors:
Thomas G. Gilder, Jr., Raymond D. O'Dean
Abstract: A thermostatic metal comprises a layer of a low expansion metal bonded to a layer of a high expansion metal, the outer surface of one of the layers comprising a layer of similar composition but containing, in addition, a grain growth limiting additive.
Abstract: Fired phosphor powder is deagglomerated by introducing a slurry thereof to the bottom of a vibratory mill while water is added to the top of the mill. This establishes a vertical gradient in the phosphor concentration in the slurry, the bottom being thicker than the top. The fine phosphor particles move out faster through an outlet at the top, while the coarse particles receive longer milling time.
Abstract: An infrared responsive cadmium selenide photoconductor is prepared by blending cadmium selenide, copper-containing cadmium selenide mix and cadmium chloride, and then firing the blend at 425.degree. C.
Abstract: An alloy for brazing ceramic to a ceramic or a metal consists essentially of 35 to 95% tin, 0.5 to 70% silver, 0.5 to 20% copper, 0.1 to 4% titanium and/or vanadium and/or zirconium, 0 to 5% nickel, 0 to 2% chromium, all percentages by weight.
Abstract: A composition having a low dielectric constant and low dielectric loss tangent from room temperature to at least about 1100.degree. C. comprises a silicon nitride based material containing an effective amount of a sintering aid and an effective amount of a low dielectric loss promoter.
Abstract: A circuit breaker comprises a two piece metal enclosure, a cover and a base. Disposed within the enclosure is a PMB bimetal which is fastened to a step in the cover. The opening time of the circuit breaker can be adjusted by means of the step.
Abstract: A station protector for communication lines includes an electrical conductor formed for connection to the communications lines and affixed to a base member, a grounding means affixed to the base member, an arrester cartridge disposed in an aperture in the base member and a biased resilient member electrically coupling the electrical conductor to a surge voltage arrester or to circuit ground in the absence of the arrester.