Abstract: An electrostatic discharge (ESD) protection circuit is provided. The ESD protection circuit includes a first rail, a second rail, a first transistor and a resistance unit. The drain of the first transistor is electrically coupled to the first rail, and the source and gate of the first transistor are electrically coupled to the second rail. The resistance unit is electrically coupled between a body of the first transistor and the second rail. When ESD occurs, the resistance unit provides a resistance between the body of the first transistor and the second rail. An ESD protection device is also provided.

Abstract: A centrifugal force sensing device is disclosed, which includes a first rotating shaft, two first movable and two first fixing sleeves, a first and a second weight, two first and two second linkages, a restoration element, a first sensing unit for sensing centrifugal force, and two fixers. The two first movable sleeves are disposed through the first rotating shaft. The two first linkages are connected to the first weight and the two first movable sleeves. The restoration element having a fixing block and two first damping elements is disposed at the first rotating shaft. The two second linkages are connected to the second weight and the two first movable sleeves. The two first fixing sleeves are fixed at the first rotating shaft and respectively located between each of the two first movable sleeves and one of the two fixers.

Abstract: An active device array substrate including a substrate, an active device array, a black matrix, a color filter, at least a pad, and at least a contact window is provided. The substrate has a display region and a periphery circuit region. The pad is disposed in the display region or the periphery circuit region and is constituted by at least one of a first conductive layer and a second conductive layer. The contact window is disposed on the pad, through which a third conductive layer is connected to the pad. The contact window is surrounded by at least two different types of light-shielding patterns, wherein each light-shielding pattern surrounds only a part of the periphery of the contact window. The light-shielding patterns are selected form at least two of the black matrix, the color filter, the first conductive layer, and the second conductive layer.

Abstract: A photo sensing element array substrate is provided. The photo sensing element array substrate includes a flexible substrate and a plurality of photo sensing elements. The photo sensing elements are disposed in array on the flexible substrate. Each of the photo sensing elements includes a photo sensing thin film transistor (TFT), an oxide semiconductor TFT and a capacitor. The photo sensing TFT is disposed on the flexible substrate. The oxide semiconductor TFT is disposed on the flexible substrate. The oxide semiconductor TFT is electrically connected to the photo sensing TFT. The capacitor is disposed on the flexible substrate and electrically connected between the photo sensing TFT and the oxide semiconductor TFT. When the photo sensing element array substrate is bent, it remains unaffected from normal operation.

Abstract: A pressure device of flexible electronics capable for sensing a large area includes flexible films, electrodes, sensing blocks, and bumps. The flexible films are disposed with intervals and define two spaces. The electrodes and the sensing blocks are disposed on the flexible films and are in a space. The bumps are disposed on the flexible films and are in another space. The air in the spaces maintains a buffer distance of each two adjacent flexible films with the electrodes and the sensing blocks. When the pressure device of flexible electronics is deformed, it is capable of avoiding erroneous signals caused by contact of the sensing block and the electrode or the two sensing blocks disposed on the different flexible films respectively.

Abstract: A method of fabricating an active device array substrate is provided. A substrate having scan lines, data lines and active devices formed thereon is provided. Each of the active devices is electrically connected to the corresponding scan line and data line. An organic material layer is formed over the substrate to cover the scan lines, the data lines and the active devices. Then, a plasma treatment is performed to the surface of the organic material layer to form a number of concave patterns. The dimension of each of the concave patterns is smaller than one micrometer. Afterward, pixel electrodes are formed on the organic material layer and each of the pixel electrodes is electrically connected to one of the corresponding active devices.

Abstract: A pixel unit including a pixel electrode, a scan electrode, a common voltage electrode, a data electrode and at least one redundancy electrode is provided. During the fabricating process of the pixel unit, if a particle is simultaneously located between any two of the pixel electrode, the scan electrode and the common voltage electrode, it would cause a short circuit between the two electrodes. The pixel unit can generate a cross-shaped defect signal at the location where a short circuit happens when the pixel unit undergoes an array test or a cell test. The user can thereby quickly locate the defect and repair it.

Abstract: A video decoding apparatus capable of controlling presentation of sub-pictures includes a first decoder, a second decoder, a first scaler, a second scaler and a combiner. The first decoder and the second decoder respectively decode a digital audio/video signal to generate a decoded video and a decoded sub-picture. In accordance with an output picture size, the decoded video size, the decoded sub-picture size and a sub-picture aspect ratio, the first scaler and the second scaler generate a first scaling factor and a second scaling factor. The combiner combines the decoded video and the decoded sub-picture according to the first scaling factor and the second scaling factor and outputs the combination thereof. A video decoding method and a digital audio/video playback system capable of controlling presentation of sub-pictures are also disclosed.

Abstract: An electronic device and an assembling method thereof are provided. The electronic device includes a first electronic module, a second electronic module, and a through connection element. The first electronic module includes a plurality of electronic units, a plurality of lead wires, a daughterboard, and a first connector. The first connector is disposed on the daughterboard. The lead wires are separately connected between the electronic units and the daughterboard. The daughterboard is electrically connected between the lead wires and the first connector. The second electronic module includes a motherboard and a second connector, wherein the second connector disposed on the motherboard is electrically connected with the motherboard. The through connection element being assembled between the first and the second connectors is electrically connected to the first and the second connectors to connect the first electronic module with the second electronic module.

Abstract: A random access memory data resetting method is provided. The method includes following steps. First, a state machine resetting signal is provided to a RAM. Next, the state machine resetting signal is extended for a predetermined time period. Afterwards, a data resetting operation is executed in the RAM within the predetermined time period.

Abstract: To obtain truly flexible electro-optic films for image display or other related applications and to obtain a low cost solution for making electro-optic films, a new concept for manufacturing such films is disclosed. The method disclosed in this invention include mixing liquid crystal with “sponge particles” having fibril or porous surface morphology, coating such mixture directly on substrates with conductive electrodes and laminating with release liner or another substrate having conductive electrodes. The electro-optic films manufactured by using traditional R2R coating techniques. The electro-optic film manufactured by the method disclosed in the invention can be used for segment type, passive matrix type or active matrix type display applications or other related applications.

Abstract: A liquid-control optical element is provided herein. The optical element includes two liquids with different phases. The two liquids are immiscible and have different optical index. By applying a voltage through electrodes to form an electric field, the slope of an interface between the two liquids is changed. The purpose of changing the slope is to change the shape of the interface or the moving or rotating direction. Thus, according to the law of total internal reflection or the law of refraction, the liquid-control optical element can be used as a liquid shutter device, or a liquid scanner device if a scanning is performed after penetrating the element.

Abstract: Multiphase voltage sources are used in driving an AC_LED; different light timing is achieved by changing the relative phase or frequency of the voltage sources. Different light color mixing is also achieved when more than one AC_LED with different colors are combined to use.

Abstract: A serial transmission controller, a serial transmission decoder and a serial transmission method thereof are disclosed. First, a current address and an access address are compared to select one of a plurality of transmission address modes as an access address mode and then to produce corresponding address information. The transmission address modes use different bits to transmit the address information respectively. According to the access address mode, an access command is selected from a serial command set. Finally, the access command and the address information are transmitted to a serial interface serially. After the access command is encoded to different length of bits, the encoded access command is transmitted to the serial interface so as to reduce the transmission bits and improve the transmission efficiency.

Abstract: A wafer-level chip packaging process includes the following steps. First, a wafer having a plurality of chip units, an active surface, and a corresponding back surface is provided. Each chip unit has a plurality of pads on the active surface. Next, a plurality of through holes is formed under the pads. The through holes are filled with a conductive material such that the conductive material within each through hole is electrically connected to corresponding one of the pads and a portion of the conductive material is exposed and protrudes from the back surface of the wafer. Thereafter, a transparent adhesive layer is formed on the active surface. Next, a transparent cover panel is disposed on the transparent adhesive layer such that the transparent cover panel is connected to the wafer through the transparent adhesive layer. Afterwards, a singulation step is performed to form a plurality of independent chip package structures.

Abstract: The speed of the network address translation translated with software is generally slower than the speed of transmitting packet in the network, so that the data stored in memory is affected. In this invention, the network address translation is translated by hardware, and a plurality of comparing engines is employed to accelerate the translating speed. Therefore, even in the worst case scenario, the time needed for translating the network address is shorter than the time needed for storing the packet into memory, so that the operation of the network address translation is assured not to affect the data transmission in the network.

Abstract: An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.

Abstract: A plurality of cells of a flash memory are tested to determine if they need to be refreshed. The cells are read and a plurality of different sensing ratios are used to determine if any of the cells need to be refreshed. Any cells that are determined to need refreshing are refreshed. The cells are read using only a single constant gate voltage.