Abstract: An apparatus for accurately and precisely cleaving crystalline material comprising a platform having an edge over which a workpiece projects, and a rotatable member having a scribing point and protrusion extending substantially radially therefrom. Upon rotation of the rotatable member, the arcs described by the scribing point and protrusion are substantially parallel to the platform edge, and intersect that portion of the workpiece which projects over the platform edge.

Abstract: A method of pattern generating a circuit film and adjacent barrier film on a substrate. A continuous layer of circuit film is applied to the substrate surface, and a photoresist pattern is delineated on the circuit film such that the photoresist remains on the circuit film pattern area. The area of circuit film not covered by photoresist is then removed, exposing the substrate surface. While retaining the photoresist which covers the circuit film pattern, the entire substrate surface is coated with the barrier film. The remaining photoresist is then removed, causing the barrier film which covers it to lift off, thereby exposing the circuit film pattern.