Abstract: Memory devices and methods disclosed such as a memory device having a plurality of memory dies where each die includes a network identification that uniquely identifies the memory die on a bus. Access for each memory die to the bus can be scheduled by a bus controller.

Abstract: Methods and apparatus for use in a memory system having a non-volatile memory and a controller for limiting the number of non-volatile memory arrays from a plurality of available arrays accessed at one time are useful in the control of concurrent access of memory arrays. One method includes implementing a pipelining sequence for transferring data to and from the non-volatile memory arrays and limiting the number of active arrays operating at one time. The controller is configured to wait for the at least one of the arrays to complete before initiating a transfer to and from a further array.

Abstract: A memory device includes a first bit line coupled to a first source/drain region of a first multiplexer gate, a second bit line coupled to a first source/drain region of a second multiplexer gate, and a sensing device having an input coupled to a second source/drain region of the first multiplexer gate and a second source/drain region of the second multiplexer gate. The input of the sensing device is formed at a vertical level that is different than a vertical level at which at least one of the first and second bit lines is formed.

Abstract: Memory devices and methods are disclosed, such as those facilitating an assignment scheme of reference cells throughout an array of memory cells. For example, one such assignment scheme assigns reference cells in a staggered pattern by row wherein each column contains a single reference cell. Additional schemes of multiple reference cells assigned in a repeating or a pseudo-random pattern are also disclosed.

Abstract: Methods for programming and memory devices are disclosed. One such method for programming includes initially biasing a subset of a plurality of control gates of a string of memory cells with a negative voltage, wherein the subset is less than all of the plurality of control gates of the string. The control gate of a selected memory cell is subsequently biased with a programming voltage during a programming phase.

Abstract: Apparatus configured to perform a programming operation on at least one memory cell of the memory array in response to original data, and further configured to perform a comparison of verified data of the at least one memory cell of the memory array to the original data following success of the programming operation. Certain apparatus may be configured to permit skipping the comparison.

Abstract: Solid state storage device controllers, solid state storage devices, and methods for operation of solid state storage device controllers are disclosed. In one such solid state storage device, the controller can operate in either an expansion DRAM mode or a non-volatile memory mode. In the DRAM expansion mode, one or more of the memory communication channels normally used to communicate with non-volatile memory devices is used to communicate with an expansion DRAM device.

Abstract: A selected memory cell on a selected word line is programmed through a plurality of programming pulses that are incremented by a step voltage. After a successful program verify operation, programming of the selected memory cell is inhibited while other memory cells of the selected word line are being programmed. Another program verify operation is performed on the selected memory cell. If the program verify operation fails, a bit line coupled to the selected cell is biased at the step voltage and a final programming pulse is issued to the selected word line. The selected memory cell is then locked from further programming without evaluating the final program verify operation.

Abstract: For one embodiment, a program starting voltage of one or more program pulses applied to one or more memory cells is in response, at least in part, to on a number of program pulses previously required to program the one or more memory cells and/or an erase starting voltage of one or more erase pulses applied to one or more memory cells is based on a number of erase pulses previously required to erase the one or more memory cells. For another embodiment, a program starting voltage level and/or an erase starting voltage level of one or more program and/or erase pulses applied to one or more memory cells is in response, at least in part, to a number of program/erase cycles previously applied to the one or more memory cells.

Abstract: An embodiment of a memory device has a plurality of conductive plugs formed on a semiconductor substrate and a pair of successively adjacent first and second bit lines overlying and in contact with each of the conductive plugs.

Abstract: A charge pump in a memory device is activated to produce a programming voltage prior to data loading during a programming operation. During an initial programming cycle, first and second load voltages are charged from the charge pump. The first load is removed from the charge pump during a verify operation. The first load voltage is subsequently recharged by charge sharing from the second load voltage so that the charge pump is not initially necessary for recharging the first load voltage.

Abstract: Methods for programming a memory array and memory devices are disclosed. In one such method, inhibited bit lines are charged to an inhibit voltage that is less than a supply voltage. The word lines of memory cells to be programmed are biased at a programming preparation voltage that is less than a nominal programming preparation voltage as used in the conventional art. Programming pulses can be applied to selected word lines of the memory cells to be programmed when the uninhibited bit lines are at 0V.

Abstract: Methods of programming memory cells and control circuitry for memory arrays facilitate a reduction of program disturb. A memory cell is shifted from a first data state to a second data state if it is desired to alter a first digit of a data value of the memory cell. If it is desired to alter a second digit of the data value of the memory cell, the memory cell is shifted to a third data state if the memory cell is in the first data state and shifted to a fourth data state if the memory cell is in the second data state. The first, second, third and fourth data states correspond to respective non-overlapping ranges of threshold voltages. The threshold voltages corresponding to the fourth data state are greater than the threshold voltages corresponding to the third data state.

Abstract: Systems, apparatus, memory devices, sense amplifiers and methods are provided, such as a system that includes an input node, a first transistor having a gate that couples to the input node, and a second transistor having another gate that couples to the input node. In one or more embodiments, the second transistor has a greater activation voltage threshold than does the first transistor and the first transistor amplifies a signal that is present on the input node. In one such embodiment, after the first transistor amplifies the signal, the second transistor maintains the amplified signal on the input node while the first transistor is deactivated.

Abstract: Memory devices adapted to process and generate analog data signals representative of data values of two or more bits of information facilitate increases in data transfer rates relative to devices processing and generating only binary data signals indicative of individual bits. Programming of such memory devices includes programming to a target threshold voltage range representative of the desired bit pattern. Reading such memory devices includes generating an analog data signal indicative of a threshold voltage of a target memory cell. Cell reads are performed multiple times and the read threshold voltages averaged to more closely approximate actual threshold voltage and to compensate for random noise.

Abstract: Memory devices and methods of their operation, where following an erasure of a string of memory cells, a selective compaction verify operation is performed on one or more, but less than all, of the memory cells of the string, and, if the selective compaction verify operation indicates compaction is desired, a soft programming pulse is applied to one or more of the memory cells of the string.

Abstract: An NROM flash memory cell is implemented in an ultra-thin silicon-on-insulator structure. In a planar device, the channel between the source/drain areas is normally fully depleted. An oxide layer provides an insulation layer between the source/drain areas and the gate insulator layer on top. A control gate is formed on top of the gate insulator layer. In a vertical device, an oxide pillar extends from the substrate with a source/drain area on either side of the pillar side. Epitaxial regrowth is used to form ultra-thin silicon body regions along the sidewalls of the oxide pillar. Second source/drain areas are formed on top of this structure. The gate insulator and control gate are formed on top.

Abstract: A level shifting circuit having an input and an output where the level shifting circuit is configured to receive a logical high level having a first voltage level at the input and to output a logical high level having a second voltage level at the output where the second voltage level is higher than the first voltage level. Level shifting circuit embodiments having two or more parallel coupled depletion mode transistors coupled to a high voltage source and further coupled to the output by an enhancement mode transistor, and an additional transistor coupled between a first signal and the output of the level shifting circuit where the first signal has the same logic level of the input are disclosed.

Abstract: Methods for sensing in a memory device and a memory device are disclosed. In one such sensing method, a single read operation with multiple sense amplifier circuit comparisons to a reference threshold level are performed to determine a state of a selected memory cell. A ramped voltage turns on the selected memory cell when the ramped voltage reaches the threshold voltage to which the selected memory cell is programmed. In one embodiment, the turned on memory cell discharges its respective bit line.

Abstract: Memory devices adapted to receive and transmit analog data signals representative of bit patterns of two or more bits facilitate increases in data transfer rates relative to devices communicating data signals indicative of individual bits. Programming of such memory devices includes determining a rate of programming (i.e., rate of movement of the respective threshold voltage) of the memory cells and biasing the corresponding bit line with a programming rate control voltage that is greater than the bit line enable voltage and less than the inhibit voltage. This voltage can be adjusted to change the speed of programming. A capacitor coupled to the bit line stores the programming rate control voltage in order to maintain the proper bit line bias for the duration of the programming operation or until it is desired to change the programming rate.