Abstract: A semiconductor device and a method of fabricating the same are disclosed. The semiconductor device includes a lower wire, an interlayer insulating film formed on the lower wire and having a via hole exposing the upper surface of the lower wire, a diffusion barrier formed on the inner wall of the via hole, and an upper wire filling the via hole and directly contacting the lower wire, in which a dopant region containing a component of the diffusion barrier is formed in the lower wire in the extension direction of the via hole.

Abstract: In a device including multiple metal-insulator-metal (MIM) capacitors and a method of fabricating the same, the multiple MIM capacitors comprise a lower interconnect in a substrate; a first dielectric layer on the lower interconnect; a first intermediate electrode pattern on the first dielectric layer overlapping with the lower interconnect; a second intermediate electrode pattern on the first dielectric layer and spaced apart from the first intermediate electrode pattern in a same plane of the device as the first intermediate electrode pattern; a second dielectric pattern on the second intermediate electrode pattern; and an upper electrode pattern on the second dielectric pattern.

Abstract: A CMOS transistor includes first and second conductivity type MOS transistors. The first conductivity type MOS transistor includes elevated source and drain regions which abut a channel region in a semiconductor substrate and which are formed by elevated epitaxial layers, each including a first epitaxial layer formed in a first recessed of the semiconductor substrate and a second epitaxial layer formed on the first epitaxial layer and extending to a level that is above an upper surface of the semiconductor substrate. The second conductivity type MOS transistor includes recessed source and drain regions which abut a channel region of the semiconductor substrate and which are formed by recessed epitaxial layers, each including a first epitaxial layer formed in a second recess of the semiconductor substrate and a second epitaxial layer formed in the second recess on the first epitaxial layer.

Abstract: A semiconductor substrate having a reference semiconductor chip and a method of assembling semiconductor chips using the same are provided. According to the method, a semiconductor substrate having a plurality of semiconductor chips is provided. An identification mark is made on a reference semiconductor chip among the semiconductor chips. The semiconductor substrate is aligned with reference to the reference semiconductor chip, so that an electrical die sorting test can be performed on the semiconductor chips on the semiconductor substrate.

Abstract: In a high frequency LDMOS transistor, a gate structure is formed on a substrate. A drain, doped with first type impurities at a first concentration, is formed on the substrate spaced apart from the gate structure. A buffer well, doped with the first type impurities at a second concentration lower than the first concentration, surrounds side and lower portions of the drain. A lightly doped drain, doped with the first type impurities at a third concentration lower than the second concentration, is formed between the buffer well and the gate structure. A source, doped with the first type impurities at the first concentration, is formed on the substrate adjacent to the gate structure and opposite to the drain with respect to the gate structure. Accordingly, an on-resistance decreases while a breakdown voltage increases in the LDMOS transistor without increasing a capacitance between the gate structure and the drain.

Abstract: Provided are a simplified 4:2 carry save adder (CSA) cell and a 4:2 carry save adding method. The 4:2 CSA cell is formed of an odd detector and first through sixth switches through logic optimization. The odd detector generates an XOR of the first through fourth input signals, outputs the XOR as an odd signal, generates an XOR of the first and second input signals, and outputs the XOR as a first XOR signal. The first switch outputs the third input signal as a carry output signal in response to the first XOR signal. The second switch outputs the first input signal as the carry output signal in response to an inverted first XOR signal. The third switch outputs the carry input signal as a carry signal in response to the odd signal. The fourth switch outputs the fourth input signal as the carry signal in response to an inverted odd signal. The fifth switch outputs an inverted carry input signal as a sum signal in response to the odd signal.

Abstract: A cell region layout of a semiconductor device formed by adding active regions in the outermost portion of a cell region, and a method of forming a contact pad using the same are provided. The layout and the method include a first active region formed at the outermost portion of the cell region, and having the same shape as that of an inner active region located inwardly from the outermost portion of the cell region, and a third active region formed by adding at least two second active regions having shapes different from that of an inner active region. Further, an insulating layer fills a portion below a bit line passing the third active region. A lifting phenomenon occurring where an active region is not formed can be prevented by adding the active regions at the outermost portion of the cell region, and a bridge phenomenon occurring when bit lines or a bit line contact and a gate line electrically contact can be suppressed by filling a portion below a bit line with an insulating layer.

Abstract: A method for estimating statistical distribution characteristics of physical parameters of a semiconductor device includes manufacturing a plurality of semiconductor device chips, each having a plurality of transistors, preparing electrical characteristic data by measuring electrical characteristics of the plurality of transistors included in the plurality of chips, extracting an inter-chip distribution characteristic and an intra-chip distribution characteristic of the electrical characteristics by analyzing the electrical characteristic data, generating random number data satisfying the extracted inter-chip and intra-chip distribution characteristics, and performing a simulation for extracting statistical distribution characteristic data of the physical parameters of the chips, based on the random number data.

Abstract: Provided are a focus search apparatus and method for performing a focus search after moving an optical pickup to a focus-on point according to a signal output from a sine wave generator so that a stable and smooth focus search is performed. In the focus search method, a sine wave is generated in response to a focus search command. The focus search is performed using an optical pickup in response to the sine wave. The optical pickup is driven in response to an amplitude of the sine wave during the focus search and in response to a filtered focus error signal during a focus servo.

Abstract: A semiconductor device, a test system and a method of testing an on die termination (ODT) circuit are disclosed. The semiconductor device includes an ODT circuit, a termination impedance control circuit and a boundary scan circuit. The termination impedance control circuit generates termination impedance control signals in response to a test mode command. The ODT circuit is coupled to the plurality of input/output pads and generates a plurality of termination impedances in response to the impedance control signals. The boundary scan circuit stores the termination impedances to output the stored termination impedances. Thus, the semiconductor device may test an ODT circuit accurately by using a smaller number of pins and may reduce a required time for testing the semiconductor device.

Abstract: In methods of selectively forming an epitaxial semiconductor layer on a single crystalline semiconductor and semiconductor devices fabricated using the same, a single crystalline epitaxial semiconductor layer and a non-single crystalline epitaxial semiconductor layer are formed on a single crystalline semiconductor and a non-single crystalline semiconductor pattern respectively, using a main semiconductor source gas and a main etching gas. The non-single crystalline epitaxial semiconductor layer is removed using a selective etching gas. The main gases and the selective etching gas are alternately and repeatedly supplied at least two times to selectively form an elevated single crystalline epitaxial semiconductor layer having a desired thickness only on the single crystalline semiconductor. The selective etching gas suppresses formation of an epitaxial semiconductor layer on the non-single crystalline semiconductor pattern.

Abstract: A sensing circuit that operates even at a low power supply voltage and reduces stress on a memory cell in a flash memory device without lowering a reading speed at the low power supply voltage is provided. The sensing circuit includes a first load element, a first inverting circuit, a second load element, a second inverting circuit, and a sense amplifier. The first load element includes an end connected with a bit line of a main cell array within the flash memory device. The first inverting circuit includes an input terminal connected with the bit line of the main cell array and an output terminal connected with another end of the first load element. The second load element includes an end connected with a bit line of a reference cell array within the flash memory device. The second inverting circuit includes an input terminal connected with the bit line of the reference cell array and an output terminal connected with another end of the second load element.

Abstract: In a method of fabricating a trench isolation structure of a semiconductor device, excellent gap filling properties are attained, without the generation of defects. In one aspect, the method comprises: loading a substrate with a trench formed therein into a high-density plasma (HDP) chemical vapor deposition apparatus; primarily heating the substrate; applying a first bias power to the apparatus so as to form an HDP oxide liner on side wall and bottom surfaces of the trench, a gap remaining in the trench following formation of the HDP oxide liner; removing the application of the first bias power and secondarily heating the substrate; applying a second bias power at a power level that is greater than that of the first bias power to the substrate so as to form an HDP oxide film to fill the gap in the trench; and unloading the substrate from the apparatus.

Abstract: In a semiconductor device and a method of manufacturing the semiconductor device, preliminary isolation regions having protruded upper portions are formed on a substrate to define an active region. After an insulation layer is formed on the active region, a first conductive layer is formed on the insulation layer. The protruded upper portions of the preliminary isolation regions are removed to form isolation regions on the substrate and to expose sidewalls of the first conductive layer, and compensation members are formed on edge portions of the insulation layer. The compensation members may complement the edge portions of the insulation layer that have thicknesses substantially thinner than that of a center portion of the insulation layer, and may prevent deterioration of the insulation layer. Furthermore, the first conductive layer having a width substantially greater than that of the active region may enhance a coupling ratio of the semiconductor device.

Abstract: Provided are a method and apparatus for designing a fine pattern that can be entirely transferred onto an object. The method includes reading the original data of a fine pattern for exposure. The fine pattern is divided into a first pattern not requiring revision and a second pattern requiring revision. The fine pattern is revised by forming an auxiliary pattern maintaining a first distance D1 from the second pattern. A fine pattern to be transferred onto a target object is estimated by running an emulation program including a first auxiliary pattern and a second auxiliary pattern. The estimated fine pattern is compared to the original data of the fine pattern for exposure, and the revised fine pattern is designated as a final fine pattern if there is no difference between the estimated fine pattern and the original data of the fine pattern for exposure.

Abstract: Provided are a fuse box that simultaneously prevents damage caused by laser blowing and cross talk between the fuses and a method of manufacturing the same. In a fuse box having an open region in which fuses are opened by laser blowing and a bundle region in which fuse opens do not occur, a capping layer, adjacent to the open region, having a metal layer and an insulation layer covers the outermost fuses in the bundle region, thereby reducing the influence of laser blowing of fuses in the bundle region, and preventing capacitive coupling caused by the formation of a parasitic capacitor between fuse lines and an insulation layer therebetween. Accordingly, cross talk due to the capacitive coupling can be prevented, thereby enhancing the reliability of a fuse circuit. Lower fuses can be disposed in a lower layer in the bundle region, thereby forming a two-layered fuse box.

Abstract: Provided are an interconnection of a semiconductor device which includes a capping layer and a method for forming the interconnection. The interconnection of the semiconductor device is a copper damascene interconnection where the capping layer is formed as a dual layer of a silicon nitride layer and silicon carbide layer on a copper layer processed by chemical mechanical polishing (CMP). Therefore, it is possible to maintain a high etching selectivity and a low dielectric constant of the silicon carbide layer while providing superior leakage suppression.

Abstract: A processor chip having a cache hit logic for determining whether data required by a processor is stored in a cache memory includes a dummy cell string that operates the same as a sense amplifier for sensing a tag address stored in a tag memory cell array and a comparison logic for determining whether the sensed tag address coincides with an input tag address, a dummy sense amplifier, and a dummy comparison logic. The processor chip having the cache hit logic improves the reliability of a hit signal and operation speed is not limited.

Abstract: A power gating structure controls a connection between a power supply terminal and a virtual power supply node so as to operate a logic circuit in a plurality of operation modes. The power gating structure includes a first path and a second path. In an active mode, the first path electrically couples the power supply terminal with the virtual power supply node in response to a first control signal. In a data retention mode, the second path electrically couples the power supply terminal with the virtual power supply node in response to the first control signal and a second control signal with a predetermined voltage level difference. In a power-down mode, both the first path and the second path electrically isolate the power supply terminal from the virtual power supply node in response to the first control signal and the second control signal.

Abstract: According to a nonvolatile memory device having a multi gate structure and a method for forming the same of the present invention, a gate electrode is formed using a damascene process. Therefore, a charge storage layer, a tunneling insulating layer, a blocking insulating layer and a gate electrode layer are not attacked from etching in a process for forming the gate electrode, thereby forming a nonvolatile memory device having good reliability.