Abstract: An ungrounded electrical power distribution system may experience a single line to ground fault. Such a fault may not disrupt operation of the system, but its presence may raise a risk of additional problems if left uncorrected. A system for progressively grounding the ungrounded system may be initiated when a line to ground fault is suspected. As grounding through successively lower impedance proceeds, fault current may increase and detection of severity of the line to ground fault may be more readily achieved, thus facilitating localization of the fault.

Abstract: A method and system for improving peak power capability in an electrical system is disclosed. The system may include an auxiliary generator operated in conjunction with one or more main engine generators during the need for increased transient load demands. The system may include a main engine generator, an auxiliary generator, an inverter/converter controller (ICC) connected to respective generators, a semi-conductor power device connected between the ICCs, and a main bus between the semi-conductor power device and a load.

Abstract: A shell that mechanically supports the diode lead wires against movement both during assembly and subsequent operation of the rotor shaft. In addition, the present invention relates to a method for retaining diode lead wires in a power generator rotor by using the shell of the present invention.

Abstract: A semiconductor power device, e.g., an Insulated Gate Bi-polar Transistor (IGBT) or a Metal-Oxide Field Effect Transistor (MOSFET) may be constructed in a reusable and repairable cost-effective sealed shell. The switch may be provided with direct-pressure-contact caps which may perform as electrical conductors for a semiconductor die of the switch and also as thermal heat-sink contacts for the device. The switch may be provided with internal self-powered gate driving control and PHM incorporated in sealed shell. Embodiments of the switch may be constructed with no external gating/PHM connection pin penetrations through the shell.

Abstract: Properly managing surges of regenerative power is needed in systems where power is generated and distributed to mechanical and electrical loads to protect them from overvoltage. A controller provides protection against excess regenerative power when these systems operate at a wide range of speeds. Controller functions and control methods for overvoltage protection may include an added control loop for detecting an overvoltage condition, calculating a power factor and generating a gating signal to transition the controller into a motoring mode that converts the excess regenerative power into mechanical power.

Abstract: An ungrounded or floating DC electrical power distribution system may experience a single line to ground fault. Such a fault may not disrupt operation of the system, but its presence may raise a risk of additional problems if left uncorrected. A system for progressively grounding the ungrounded system may be initiated when a line to ground fault is suspected based on the voltage difference measured to a common chassis point. As grounding through successively lower impedance proceeds, fault current may increase and detection of severity of the line to ground fault may be more readily achieved, thus facilitating localization of the fault. Localization may be achieved through an analysis of direction of capacitive currents in isolatable zones of the system.

Abstract: A controlled frequency generating system (CFG) may be constructed with a main generator and an exciter driven by a common shaft. Excitation power may be provided from the common shaft; as distinct from prior-art systems which may require independent excitation power sources. While controlling the output voltage and frequency of the main generator, the bi-directional controller extracts power from a main generator output and may supply the extracted power to supplement excitation power when needed at certain rotational speeds. The controller may extract power from the exciter when, at other rotational speeds, the exciter produces excess power. The extracted excess power may be delivered to the output of the main generator to maintain a desired level of output power at a desired frequency, irrespective of speed of rotation of the CFG.

Abstract: An apparatus for inspecting a turbine blade of an aircraft engine may include a shaft having a proximate end and a distal end, an attachment device coupled to the distal end of the shaft and capable of being attached to a strut of the aircraft engine and an engagement device, coupled to the attachment device, capable of moving away from the attachment device and attaching to a trailing edge of the turbine blade. The apparatus may also include a probe moveably coupled to the engagement device and capable of moving along a leading edge of the turbine blade to detect a surface anomaly of the turbine blade and a control device for controlling the movement of the probe along the leading edge of the turbine engine in response to user manipulation.

Abstract: An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.

Abstract: A micro electro-mechanical systems device having variable capacitance is controllable over the full dynamic range and not subject to the “snap effect” common in the prior art. The device features an electrostatic driver (120) having a driver capacitor of fixed capacitance (121) in series with a second driver capacitor of variable capacitance (126). A MEMS variable capacitor (130) is controlled by applying an actuation voltage potential to the electrostatic driver (120). The electrostatic driver (120) and MEMS variable capacitor (130) are integrated in a single, monolithic device.

Abstract: Selective encapsulation of a micro electro-mechanical pressure sensor provides for protection of the wire bands (140) through encapsulation while permitting the pressure sensor diaphragm (121) to be exposed to ambient pressure without encumbrance or obstruction. Selective encapsulation is made possible by the construction of a protective dam (150) around the outer perimeter of a pressure sensor diaphragm (121) to form a wire bond cavity region between the protective dam (150) and the device housing (105). The wire bond cavity may be encapsulated with an encapsulation gel (160) or by a vent cap (170). Alternatively, the protective dam (150) may be formed by a glass frit pattern (152) bonding a cap wafer (151) to a device wafer (125) and then dicing the two-wafer combination into individual dies with protective dams attached.

Abstract: Removing a portion of an active wafer (12) at the edge (18) after the active wafer (12) is bonded to a base wafer (10) prevents chipping of the edge of the active wafer during thinning of the active wafer (12). Grinding and polishing of the edges of the active wafer (12) is preferably performed.

Abstract: A method for demodulating a radio frequency signal having a frequency, by oscillating a demodulator at a frequency different from the signal frequency, and measuring a DC offset value at this different frequency, the DC offset value being associated with interference. Then the demodulator is oscillated at the signal, thereby providing a demodulated signal. The DC offset value is subtracted from the demodulated signal in order to provide a demodulated signal with a substantially reduced DC component. The demodulated signal is then monitored for further DC offset components, and these further DC offset components are subtracted from the demodulated signal.

Abstract: For a data processing device having a main memory comprised of a non-volatile memory and a CPU, memory protection and security are ensured for its programs and so forth. An auxiliary memory for storing security bit data is provided, for example, in an EPROM that comprises the main memory. Assuming that the result read by the CPU is "0" when a current flows between a drain and a source of a transistor in the EPROM, and "1" when the current does not flow, then the security bit data read from two transistors A and B are A=1 and B=1, which means they are set so that access to the main memory and a write to the auxiliary memory are prohibited. With A=0 and B=0, security is set, but a write to the auxiliary memory is permitted; with A=1 (0) and B=0 (1), security is reset.

Abstract: An ohmic contact to a III-V semiconductor material is fabricated by dry etching a silicon nitride layer overlying the III-V semiconductor material with a chemical comprised of a group VI element. An ohmic metal layer is formed on the III-V semiconductor material after the silicon nitride layer is etched and before any exposure of the III-V semiconductor material to a chemical which etches the III-V semiconductor material or removes the group VI element.

Abstract: Throughput and accuracy of testing of a semiconductor device is improved by forming the contacts to allow the leads of a packaged semiconductor device to pass through the contacts. Both AC and DC testing may be done because the contact length is substantially shortened.

Abstract: A heatsink having isolated bonding pads formed on the heatsink eliminates breaking of the wire bond, lifting of the wire bond to the heatsink, and die attach material contamination of the bond. In one embodiment, the isolated bonding pad has an elevated pedestal configuration. In a second embodiment, the isolated bonding pad has an elevated pedestal configuration, so that the pedestal is also configured to lock a mold compound around the pedestal. In a third embodiment, the isolated bonding pad has an island configuration. In a fourth embodiment, the island configuration is configured to lock the mold compound formed around the island. The locking mechanism of the elevated pedestal or island prevents delamination of the mold compound to heatsink interface, preventing lifting or breaking of a wire bonded to the isolated bonding pad.

Abstract: A sculptured diaphragm of a sensor is fabricated by providing a semiconductor material, forming at least one cavity on the front side of the semiconductor material, forming a diaphragm layer over the semiconductor material, and the etching a cavity on the back side of the semiconductor material. If a sensor having a diaphragm with a central boss is desired, then the diaphragm layer is planarized to form a thick and a thin portion in the diaphragm layer.

Abstract: An apparatus for and method of decomposing a chemical compound, which may be an environmentally undesirable material, is accomplished by impinging a flow of the chemical compound on a heated member. Various embodiments are possible, including having the member have a plurality of openings, having the member be configured to direct the flow of the chemical compound in a particular direction, and having the member be self supported on the wall of the reaction chamber.

Abstract: An apparatus for decomposing a chemical compound, which may be an environmentally undesirable material, is accomplished by impinging a flow of the chemical compound on a heated member. Various embodiments are possible, including having the member have a plurality of openings, having the member be configured to direct the flow of the chemical compound in a particular direction, and having the member be self supported on the wall of the reaction chamber.