Abstract: A semiconductor wafer contains a plurality of semiconductor die each having a peripheral area around the die. A first insulating layer is formed over the die. A recessed region with angled sidewall is formed in the peripheral area. A first conductive layer is formed over the first insulating layer outside the recessed region and further into the recessed region. A conductive pillar is formed over the first conductive layer within the recessed region. A second insulating layer is formed over the first insulating layer, conductive pillar, and first conductive layer such that the conductive pillar is exposed from the second insulating layer. A dicing channel partially through the peripheral area. The semiconductor wafer undergoes backgrinding to the dicing channel to singulate the semiconductor wafer and separate the semiconductor die. The semiconductor die can be disposed in a semiconductor package with other components and electrically interconnected through the conductive pillar.

Abstract: The present invention provides novel proline substituted cyclosporinanalogue compounds, pharmaceutical compositions comprising these compounds and methods of using these compounds for the treatment of disorders and diseases, including immune disorders, inflammatory disorders and viral infections.

Abstract: The present invention relates to quinazoline containing zinc-binding moiety based derivatives of formula I that have enhanced and unexpected properties as inhibitors of epidermal growth factor receptor tyrosine kinase (EGFR-TK) and their use in the treatment of EGFR-TK related diseases and disorders such as cancer.

Abstract: The present invention relates to computer-based multiplayer games that follow the scoring rules of poker in which players select cards from a second deck of playing cards that is composed of cards randomly selected by the software from a first deck of playing cards for each new hand, where the second deck has fewer cards than the first deck. The introduction of a smaller second deck whose composition and size can vary substantially from hand-to-hand, adds a fascinating and challenging puzzle component to the strategy and chance elements of prior card selection games. The use of a prior art deck that remains unchanged allows each player to tend to rely on a predetermined set of fixed card selection strategies. Whereas, the ever-changing, smaller second deck compels each player to formulate his/her card selection strategy anew for each hand, keeping play fresh and exciting.

Abstract: A semiconductor device has a substrate and RF FEM formed over the substrate. The RF FEM includes an LC low-pass filter having an input coupled for receiving a transmit signal. A Tx/Rx switch has a first terminal coupled to an output of the LC filter. A diplexer has a first terminal coupled to a second terminal of the Tx/Rx switch and a second terminal for providing an RF signal. An IPD band-pass filter has an input coupled to a third terminal of the Tx/Rx switch and an output providing a receive signal. The LC filter includes conductive traces wound to exhibit inductive and mutual inductive properties and capacitors coupled to the conductive traces. The IPD filter includes conductive traces wound to exhibit inductive and mutual inductive properties and capacitors coupled to the conductive traces. The RF FEM substrate can be stacked over a semiconductor package containing an RF transceiver.

Abstract: A portable imaging system is presented. The system includes at least a display panel. Further, the system includes a control panel, where the display panel and the control panel include a seamless form factor of a single unit box, and where the seamless form factor is configured to aid in cleaning the system.

Abstract: A method of manufacturing a semiconductor device includes providing a substrate having a conductive bump formed over the substrate and a semiconductor die with an active surface oriented to the substrate. An encapsulant is deposited over the semiconductor die and the conductive bump, and the encapsulant is planarized to expose a back surface of the semiconductor die opposite the active surface while leaving the encapsulant covering the conductive bump. A channel is formed into the encapsulant to expose the conductive bump. The channel extends vertically from a surface of the encapsulant down through the encapsulant and into a portion of the conductive bump. The channel extends through the encapsulant horizontally along a length of the semiconductor die. A shielding layer is formed over the encapsulant and the back surface of the semiconductor die.

Abstract: Disclosed herein are systems for removing particulate matter from a fluid, comprising a particle functionalized by attachment of at least one activating group or amine functional group, wherein the modified particle complexes with the particulate matter within the fluid to form a removable complex therein. The particulate matter has preferably been contacted, complexed or reacted with a tethering agent. The system is particularly advantageous to removing particulate matter from a fluid waste stream following mining or ore processing operations.

Abstract: A semiconductor device has a prefabricated multi-die leadframe with a base and integrated raised die paddle and a plurality of bodies extending from the base. A thermal interface layer is formed over a back surface of a semiconductor die or top surface of the raised die paddle. The semiconductor die is mounted over the raised die paddle between the bodies of the leadframe with the TIM disposed between the die and raised die paddle. An encapsulant is deposited over the leadframe and semiconductor die. Vias can be formed in the encapsulant. An interconnect structure is formed over the leadframe, semiconductor die, and encapsulant, including into the vias. The base is removed to separate the bodies from the raised die paddle. The raised die paddle provides heat dissipation for the semiconductor die. The bodies are electrically connected to the interconnect structure. The bodies operate as conductive posts for electrical interconnect.

Abstract: The present invention includes a separable test tube for use in a centrifugal separator that does not need to separately transfer separation liquid to another test tube for a second separation after a first separation. The separable test tube includes a first tube including a first coupling portion, a second coupling portion, and an adjustment portion. A second tube includes a first body part, a first space portion, a first packing fastener, a third coupling portion which engages the first coupling portion, and an adjustment groove into which the adjustment portion is inserted. A third tube includes a second body part having a second space portion, a second packing fastener, and a fourth coupling portion which engages the second coupling portion. First and second watertight members are coupled to the first and second coupling portions, respectively. First and second packings are coupled to the first and second packing fasteners, respectively.

Abstract: The present invention provides an isolated specific binding member capable of binding a sialyltetraosyl carbohydrate and directly inducing cell death without the need for immune effector cells. Such a binding member may be an antibody or a part thereof. Also provided are the use of such binding members in medicine and nucleic acids encoding such binding members.

Abstract: A Fo-WLCSP has a first polymer layer formed around a semiconductor die. First conductive vias are formed through the first polymer layer around a perimeter of the semiconductor die. A first interconnect structure is formed over a first surface of the first polymer layer and electrically connected to the first conductive vias. The first interconnect structure has a second polymer layer and a plurality of second vias formed through the second polymer layer. A second interconnect structure is formed over a second surface of the first polymer layer and electrically connected to the first conductive vias. The second interconnect structure has a third polymer layer and a plurality of third vias formed through the third polymer layer. A semiconductor package can be mounted to the WLCSP in a PoP arrangement. The semiconductor package is electrically connected to the WLCSP through the first interconnect structure or second interconnect structure.

Abstract: A semiconductor wafer has a plurality of first semiconductor die. A first conductive layer is formed over an active surface of the die. A first insulating layer is formed over the active surface and first conductive layer. A repassivation layer is formed over the first insulating layer and first conductive layer. A via is formed through the repassivation layer to the first conductive layer. The semiconductor wafer is singulated to separate the semiconductor die. The semiconductor die is mounted to a temporary carrier. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. A second insulating layer is formed over the repassivation layer and encapsulant. A second conductive layer is formed over the repassivation layer and first conductive layer. A third insulating layer is formed over the second conductive layer and second insulating layer. An interconnect structure is formed over the second conductive layer.

Abstract: The present invention provides apparatus, systems and methods for displaying to each of a plurality of users upon each user's request a preview of shipping rates and delivery schedules for the particular user to ship a particular package, wherein each user accesses the computer system over a global communications network using a client computer device, and wherein each user has an individual electronic connection to the global communications network. The present invention compares shipping rates and delivery schedules for each service and each carrier for shipping a particular package and reports the carrier and service offering the lowest rate or the fastest delivery schedule, according to the user's option.

Abstract: The present invention provides a method of manufacturing interior material using transfer paper, the method comprising the steps of: processing release paper for coating a surface of the release paper with a release agent; coating an acryl resin layer for coating the surface of the release paper manufactured in the release paper processing with an acryl resin layer in order to improve a printing eligibility of the surface of the release paper for a convenient digital printing; printing images for printing various designs such as pictures, figures or patterns desired by a customer on the acryl resin layer of the release paper formed in the acryl resin coating process through a digital ink jet printer in order to manufacture transfer paper; bonding a master sheet for bonding the images of the transfer paper manufactured through the image printing process to a master sheet to be transferred; and post-treating master sheet for bonding a surface paper layer or surface reinforcement layer to the surface of the mast

Abstract: The present invention provides apparatus, systems and methods for determining from a set of delivery times for each of a plurality of services for each of a plurality of carriers a potential delivery schedule for each of the plurality of services for each of the plurality of carriers in response to a request by each of a plurality of users, according to an input by each particular user of a shipping date, a set of parcel specifications for shipping a particular parcel, a set of shipping requirements for shipping the particular parcel, a particular origin postal code and a particular destination postal code. Each user accesses the present invention over a global communications network using a client computer device, and each user client computer device has an individual electronic connection to the global communications network.

Abstract: Exemplary embodiments of the present invention provide image-customized postage labels, and systems and methods for providing image-customized postage labels, in rolls adapted for high-speed application to mail pieces. The output of the exemplary systems and methods of the present invention is one or more exemplary rolls of liner-backed, self-adhesive, image-customized postage labels per an order placed by a customer. Each of the exemplary rolls comprises a label roll core and an exemplary length of liner-backed, self-adhesive, image-customized postage labels rolled around the label roll core.

Abstract: The present invention relates, in part, to the discovery that a pharmaceutical composition comprising aripiprazole and a carrier administered in a bolus injection resulted in an extended release profile similar to that obtained by the injection of a poly lactide-co-glycolide microsphere formulation containing the active agent. This surprising result suggests that pharmacologically beneficial extended release formulations without the complexities and expense associated with the manufacture microspheres.

Abstract: A base game may be a conventional video reel-type game. During play of the base game, at least a first progressive jackpot is accumulated by a first percentage of the wagers. A community Bingo game is concurrently initiated for all eligible players (players betting above the minimum bet) when an eligible player achieves a special symbol combination in the base game. The number of virtual Bingo cards dealt to each eligible player is based on the player's average bet. A central controller then random selects Bingo numbers, one at a time, and the first player to fill in a Bingo card wins the bonus game and an award. Only the player that triggered the bonus game is eligible for the first progressive jackpot. At various levels of the game, the players are motivated to bet above the minimum bet to be eligible for the bonus game and increase the player's chances of winning the bonus game.

Abstract: The invention describes a procedure for the examination of objects by the means of ultrasound waves whereby a volume-of-interest is scanned by a 3D-ultrasound-probe by moving a transmitter/receiver beam in a scan plane within selectable limits. This B-mode scan plane is also simultaneously moved in a direction across to this scan plane. The transmitting of sound pulses and acquiring the echo-signals is done more or less continuously during the movement in B-plane and across to it The echo-signals are stored in a volume memory on addresses which correspond to the spatial position of the echo-generating structure inside the object. These stored data-sets are evaluated by a 3D-processor and are represented on at least one display unit by different algorithms with selectable parameters. Important is that the acquisition and the representation is done continuously.