Abstract: A method for volume based registration of images is presented. The method includes receiving a first image data set and at least one other image data set. Further the method includes identifying a first image slice in the at least one other image data set corresponding to the first image data set. The method also includes selecting a first point of interest on at least one of the first image data set or the first image slice in the at least one other image data set. In addition, the method includes selecting a second point of interest on the other of the first image data set or the first image slice in the at least one other image data set, wherein the second point of interest corresponds to the first point of interest. Moreover, the method includes translating one of the first image data set, the first image slice, or both, in a first direction, a second direction and a third direction to align the first point of interest with the second point of interest.

Abstract: A vertical transient voltage suppressing (TVS) device includes a semiconductor substrate of a first conductivity type where the substrate is heavily doped, an epitaxial layer of the first conductivity type formed on the substrate where the epitaxial layer has a first thickness, and a base region of a second conductivity type formed in the epitaxial layer where the base region is positioned in a middle region of the epitaxial layer. The base region and the epitaxial layer provide a substantially symmetrical vertical doping profile on both sides of the base region. In one embodiment, the base region is formed by high energy implantation. In another embodiment, the base region is formed as a buried layer. The doping concentrations of the epitaxial layer and the base region are selected to configure the TVS device as a punchthrough diode based TVS or an avalanche mode TVS.

Abstract: A radio system for a motor vehicle includes a digital antenna coupled by a digital link to a base unit. The digital antenna includes an antenna and a programmable radio tuner coupled to the antenna located exterior of the vehicle, and a first network interface coupled to the radio tuner. The radio tuner selectively tunes to a radio frequency (RF) and convert a RF signal to a baseband signal. The first network interface transmits the baseband signal over the digital link to the base unit.

Abstract: A deicing system includes a heating element configured to impart heat to water within a water-retaining structure, a guard configured to prevent the heating element from abutting surfaces of the water-retaining structure, and a securing spring that securely fastens the heating element to the guard.

Abstract: A semiconductor die has first and second discrete semiconductor components mounted over a plurality of wettable contact pads formed on a carrier. Conductive pillars are formed over the wettable contact pads. A semiconductor die is mounted to the conductive pillars over the first discrete components. The conductive pillars provide vertical stand-off of the semiconductor die as headroom for the first discrete components. The second discrete components are disposed outside a footprint of the semiconductor die. Conductive TSV can be formed through the semiconductor die. An encapsulant is deposited over the semiconductor die and first and second discrete components. The wettable contact pads reduce die and discrete component shifting during encapsulation. A portion of a back surface of the semiconductor die is removed to reduce package thickness. An interconnect structure is formed over the encapsulant and semiconductor die. Third discrete semiconductor components can be mounted over the semiconductor die.

Abstract: A semiconductor die has a first semiconductor die mounted to a carrier. A plurality of conductive pillars is formed over the carrier around the first die. An encapsulant is deposited over the first die and conductive pillars. A first stepped interconnect layer is formed over a first surface of the encapsulant and first die. The first stepped interconnect layer has a first opening. A second stepped interconnect layer is formed over the first stepped interconnect layer. The second stepped interconnect layer has a second opening. The carrier is removed. A build-up interconnect structure is formed over a second surface of the encapsulant and first die. A second semiconductor die over the first semiconductor die and partially within the first opening. A third semiconductor die is mounted over the second die and partially within the second opening. A fourth semiconductor die is mounted over the second stepped interconnect layer.

Abstract: A window blind assembly includes a roller blind unit, a curtain member unit, and a clamping unit. The roller blind unit includes a roller rod that extends horizontally and that is rotatably mounted at or in proximity to an upper edge portion of the window, and a roller blind piece a top edge of which is connected to the roller rod and which is able to be wound around and extended from the roller rod. The curtain member unit includes a curtain member having a sheltering portion and a plurality of partitioning portions. The clamping unit includes a plurality of connecting members associated respectively with the partitioning portions. Each of the connecting members has a confining portion, and two securing portions connected to opposite ends of the confining portion and that connect the confining portion to a respective one of the partitioning portions.

Abstract: A PiP semiconductor device has an inner known good semiconductor package. In the semiconductor package, a first via is formed in a temporary carrier. A first conductive layer is formed over the carrier and into the first via. The first conductive layer in the first via forms a conductive bump. A first semiconductor die is mounted to the first conductive layer. A first encapsulant is deposited over the first die and carrier. The semiconductor package is mounted to a substrate. A second semiconductor die is mounted to the first conductive layer opposite the first die. A second encapsulant is deposited over the second die and semiconductor package. A second via is formed in the second encapsulant to expose the conductive bump. A second conductive layer is formed over the second encapsulant and into the second via. The second conductive layer is electrically connected to the second die.

Abstract: The invention is a method of playing computerized card games against real or virtual players. The cards games are usually variations of poker, where the quality of the players' hands is due to skill and strategy rather than the luck of the draw. Players request desired cards from a computerized dealer without knowledge of which cards other players have requested. A null card, which has no value in determining the outcome of the game, is delivered to players who request the same card as another player has requested regardless of whether the card was requested previously or during the current round. In another embodiment, a null card is delivered only when two or more players request the same card during the current round or if a player requests a card that has already been distributed.

Abstract: The present invention discloses compounds of formula I, or pharmaceutically acceptable salts, esters, or prodrugs thereof: which inhibit serine protease activity, particularly the activity of hepatitis C virus (HCV) NS3-NS4A protease. Consequently, the compounds of the present invention interfere with the life cycle of the hepatitis C virus and are also useful as antiviral agents. More specifically, the invention relates to oxime compounds containing a carbocyclic P2 unit, and the oxime is tethered to one of the carboxylic acid on P2. The present invention further relates to pharmaceutical compositions comprising the aforementioned compounds for administration to a subject suffering from HCV infection. The invention also relates to methods of treating an HCV infection in a subject by administering a pharmaceutical composition comprising the compounds of the present invention.

Abstract: A semiconductor device is made from a semiconductor wafer containing semiconductor die separated by a peripheral region. A conductive via-in-via structure is formed in the peripheral region or through an active region of the device to provide additional tensile strength. The conductive via-in-via structure includes an inner conductive via and outer conductive via separated by insulating material. A middle conductive via can be formed between the inner and outer conductive vias. The inner conductive via has a first cross-sectional area adjacent to a first surface of the semiconductor device and a second cross-sectional area adjacent to a second surface of the semiconductor device. The outer conductive via has a first cross-sectional area adjacent to the first surface of the semiconductor device and a second cross-sectional area adjacent to the second surface of the semiconductor device. The first cross-sectional area is different from the second cross-sectional area.

Abstract: An improved control system for controlling radiation direction of an antenna beam of an antenna is disclosed. The radiation direction is adjustable by an actuating device influencing phase shifting means based on an actuating signal. The system includes filtering means, arranged for filtering out a control signal and being connected, in use, to a feeder cable arranged for carrying RF signals and control signals. The system further includes an external control unit including detecting means, arranged for detecting the filtered out control signal, and control means, arranged for producing the actuating signal based on the detected control signal. The filtering means is directly connected to the external control unit so as to provide the filtered out control signal directly to the external control unit.

Abstract: A solder mask for flip chip interconnection has a common opening that spans a plurality of circuit elements. The solder mask allows confinement of the solder during the remelt stage of interconnection, yet it is within common design rules for solder mask patterning. Also, a substrate for flip chip interconnection includes a substrate having the common opening that spans a plurality of circuit elements. Also, a flip chip package includes a substrate having a common opening that spans a plurality of circuit elements.

Abstract: A mirror is shaped using a shaping apparatus including a crossbar and a horizontal array of members (wheels in some embodiments) attached to a bottom of the crossbar. The height of the array of members is adjusted to form a predetermined shape. The shaping apparatus is positioned over a mirror such that the members contact the mirror. The shaping apparatus is moved along a length of the mirror such that the members remain in contact with the mirror. A frame is attached to the mirror such that when the shaping apparatus is removed from the mirror, the mirror substantially retains the predetermined shape.

Abstract: Methods and systems for patient positioning in an imaging system are provided. A palette for an imaging system is provided that includes a base portion movably connected to the imaging system and an extender portion removably connected to the base portion. The extender portion together with the base portion supports an object to be imaged by the imaging system.

Abstract: The present invention relates to substituted 2-indolinone containing zinc-binding moiety based derivatives that have enhanced or unique properties as inhibitors of protein tyrosine kinase (PTK) receptors and their use in the treatment of PTK related diseases and disorders such as cancer. The said derivatives may further act as HDAC inhibitors.

Abstract: The present invention relates to compounds and pharmaceutically acceptable salts, esters and prodrugs of Formula (I) or (II): which are useful as AMPK modulators effective in treating diabetes, obesity and cancer in a subject.

Abstract: The present invention generally relates to polymers and macromolecules, in particular, to polymers useful in particles such as nanoparticles. One aspect of the invention is directed to a method of developing nanoparticles with desired properties. In one set of embodiments, the method includes producing libraries of nanoparticles having highly controlled properties, which can be formed by mixing together two or more macromolecules in different ratios. One or more of the macromolecules may be a polymeric conjugate of a moiety to a biocompatible polymer. In some cases, the nanoparticle may contain a drug. Other aspects of the invention are directed to methods using nanoparticle libraries.

Abstract: In one aspect, the invention is related to a method of treating a patient with Parkinson's disease, the method including administering to the respiratory tract of the patient particles that include more than about 90 weight percent (wt %) of levodopa. The particles are delivered to the patient's pulmonary system, preferably to the alveoli or the deep lung.