Patents Represented by Attorney Patent Law Group
  • Patent number: 8324240
    Abstract: The present invention relates to HSP90 inhibitors containing fused amino pyridine core that are useful as inhibitors of HSP90 and their use in the treatment of HSP90 related diseases and disorders such as cancer, an autoimmune disease, or a neurodegenerative disease.
    Type: Grant
    Filed: March 10, 2008
    Date of Patent: December 4, 2012
    Assignee: Curis, Inc.
    Inventors: Xiong Cai, Changgeng Qian, Haixiao Zhai
  • Patent number: 8324155
    Abstract: The present invention discloses compounds of formula I and II or pharmaceutically acceptable salts, esters, or prodrugs thereof: which inhibit serine protease activity, particularly the activity of hepatitis C virus (HCV) NS3-NS4A protease. Consequently, the compounds of the present invention interfere with the life cycle of the hepatitis C virus and are also useful as antiviral agents. The present invention further relates to pharmaceutical compositions comprising the aforementioned compounds for administration to a subject suffering from HCV infection. The invention also relates to methods of treating an HCV infection in a subject by administering a pharmaceutical composition comprising the compounds of the present invention.
    Type: Grant
    Filed: November 14, 2008
    Date of Patent: December 4, 2012
    Assignee: Enanta Pharmaceuticals, Inc.
    Inventors: Yonghua Gai, Yat Sun Or, Zhe Wang
  • Patent number: 8323047
    Abstract: An extension cordset assembly includes a receptacle and a sealing gasket. The receptacle includes a receptacle main body, a receptacle connecting interface and first and second spade mating holes extending into the receptacle main body from the receptacle connecting interface. The receptacle is configured to mate with a plug having a standard spade configuration. The sealing gasket is positioned on the receptacle connecting interface and includes first and second spade openings aligned with the first and second spade mating holes, respectively. The sealing gasket is configured to provide a water-resistant seal between the receptacle and the plug.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: December 4, 2012
    Assignee: Allied Precision Industries, Inc.
    Inventors: Thomas K. Reusche, Philip E. Chumbley
  • Patent number: 8327254
    Abstract: A method and system for associating one or more contents with an electronic page. The method includes receiving a request for the electronic page from a user. The method further includes processing the request in a predefined manner. Thereafter, the method includes selecting one or more contents in response to processing the request. Further, the method includes rendering one or more contents along with the electronic page in a predetermined format.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: December 4, 2012
    Assignee: Wishfi Pte. Ltd
    Inventors: Shao-Chun Chen, Kunlin Chen, Harri Okkonen
  • Patent number: 8323643
    Abstract: The invention relates to the discovery that collagenase injections are effective in lyse the collagenous adhesions in the shoulder and treat the disorder, adhesive capsulitis. As such, the invention relates to methods of treating or preventing adhesive capsulitis, or frozen shoulder, in a patient in need of such treatment comprising injecting or otherwise delivering an effective amount of collagenase to the collagenous adhesions in the shoulder. The invention also relates to the use of collagenase in the manufacture of a medicament to treat adhesive capsulitis.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: December 4, 2012
    Assignee: The Research Foundation of State University of New York
    Inventors: Marie A. Badalamente, Edward Wang
  • Patent number: 8320659
    Abstract: A method and system of inspecting baggage to be transported from a location of origin to a destination is provided that includes generating scan data representative of a piece of baggage while the baggage is at the location of origin, and storing the scan data in a database. A rendered view representative of a content of the baggage is provided where the rendered views are based on the scan data retrieved from the database over a network. The rendered views are presented at a destination different from the origin.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: November 27, 2012
    Assignee: TeleSecurity Sciences, Inc.
    Inventors: Samuel Moon-Ho Song, Douglas Perry Boyd
  • Patent number: 8319506
    Abstract: A portable imaging detector and a method for operating the portable imaging detector are provided. The portable imaging detector includes a docking connector having a plurality of docking connector contacts. The method includes measuring a voltage at a first docking connector contact, and determining whether the portable detector is (i) operating in a digital cassette mode or is (ii) installed in either a cassette holder or a charging bin using the measured voltage. A detector state monitoring system is also discussed.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: November 27, 2012
    Assignee: General Electric Company
    Inventors: James Zhengshe Liu, Scott Petrick, Donald Langler, Chuande Liu, Gary McBroom, Roy Schley
  • Patent number: 8317358
    Abstract: An LED lamp includes a light engine. The light engine includes a substrate including a transparent or translucent thermally conductive material, a plurality of LED semiconductor devices mounted to the substrate, a plurality of conductive traces formed over the substrate to electrically interconnect each of the plurality of LED semiconductor devices, and conductive leads connected to the substrate for supplying electrical energy to the plurality of LED semiconductor devices. The substrate of the light engine may include an aluminum nitride (AlN), or diamond film material. A thermally conductive rod is connected to the light engine. A heatsink is formed by an extrusion or die casting process. The heatsink includes a fin structure for dissipating heat energy into the environment. The thermally conductive rod and the heatsink are thermally connected. An optional optical envelope is mounted to the heatsink. The optional optical envelope is disposed over the light engine.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: November 27, 2012
    Assignee: Enertron, Inc.
    Inventor: Der Jeou Chou
  • Patent number: 8320758
    Abstract: A method for estimating optical power in an optical channel includes determining a tunable filter full-width, FWF, by measuring a response of the tunable filter to a known signal and mapping the response to frequency. A portion of an optical channel is coupled to an input of the tunable optical filter. A peak power response, PR, and a full width tunable filter response, FWR, to the optical channel are determined by measuring a response of the tunable filter to the optical channel and mapping the response to frequency. A signal power, PS, is then calculated from the peak power response, PR, and a ratio of the full width tunable filter response, FWR, to the tunable filter full-width, FWF.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: November 27, 2012
    Assignee: Aegis Lightwave, Inc.
    Inventor: Michael Cahill
  • Patent number: 8318541
    Abstract: A semiconductor device has a plurality of semiconductor die or components mounted over a carrier. A leadframe is mounted over the carrier between the semiconductor die. The leadframe has a plate and bodies extending from the plate. The bodies of the leadframe are disposed around a perimeter of the semiconductor die. An encapsulant is deposited over the carrier, leadframe, and semiconductor die. A plurality of conductive vias is formed through the encapsulant and electrically connected to the bodies of the leadframe and contact pads on the semiconductor die. An interconnect structure is formed over the encapsulant and electrically connected to the conductive vias. A first channel is formed through the interconnect structure, encapsulant, leadframe, and partially through the carrier. The carrier is removed to singulate the semiconductor die. A second channel is formed through the plate of the leadframe to physically separate the bodies of the leadframe.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: November 27, 2012
    Assignee: STATS ChipPAC, Ltd.
    Inventors: HanGil Shin, NamJu Cho, HeeJo Chi
  • Patent number: 8320777
    Abstract: An interferometer includes an optical beam splitter that splits an input optical signal into a first optical signal propagating in a first optical path comprising free space and a second optical signal propagating in a second optical path comprising a dielectric medium. A differential delay delays the second optical signal relative to the first optical signal by a differential delay time that is proportional to at least one of a temperature and a refractive index of the dielectric medium. A temperature controller in thermal contact with the dielectric medium changes the temperature of the dielectric medium to control at least one of thermal expansion/contraction and a temperature dependent change in the refractive index of the dielectric medium, thereby changing the differential phase delay.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: November 27, 2012
    Assignee: Finisar Corporation
    Inventors: Reuven Zaibel, Gil Blecher
  • Patent number: 8319673
    Abstract: An embodiment of an analog-to-digital converter system is described wherein an analog voltage signal Vin(t) is provided by an input amplifier. The analog signal Vin(t) has a predetermined full-scale range that is less wide than a reference voltage (Vref) range used by a downstream ADC to derive a first digital (numerical) representation D1(k) of a sampled value Vin(k) of the analog signal Vin(t). The first digital representation has N bits. A digital circuit then converts the N-bit D1(k) code to a second numerical representation D2(k) of the sampled analog voltage Vin(k) with respect to the full-scale range of the ADC system. The D2(k) code has P bits of resolution, which may be less than N bits. The P-bit D2(k) code representing Vin(k) is the output of the ADC system. Therefore, the width of the reference voltage range applied to the ADC is greater than the width of the system's full-scale range at the output of the system.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: November 27, 2012
    Assignee: Linear Technology Corporation
    Inventor: Jesper Steensgaard-Madsen
  • Patent number: 8319625
    Abstract: In accordance with the embodiments of the present invention, an alarm system is provided. The alarm system includes a system controller coupled to at least one initiation device. At least one textual notification device such as for example a signboard is coupled to the system controller. In one embodiment, the textual notification device is a multi-line signboard having an alarm input and a secondary input. The textual notification device is supervised, controlled, and powered integrally with the system controller. In an additional embodiment, an audible generator can be provided that provides an audible message in conjunction with the visual message on the textual notification devices.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: November 27, 2012
    Assignees: SimplexGrinnell LP, Inova Solutions
    Inventors: Daniel G. Farley, Jeffrey R. Brooks, Anthony J. Capowski, John R. Haynes, Gerald P. Gorman
  • Patent number: 8319770
    Abstract: A method and system for optimizing user input points that identify points within an image of a left ventricle of a heart includes identifying user input points on an image. The user input points include an apical point and left and right basal points positioned proximate to an endocardium of a left ventricle. An adjusted apical point is determined based on at least an autocorrelation of points in the image proximate to the apical point. The adjusted apical point is displayed on the image.
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: November 27, 2012
    Assignee: General Electric Company
    Inventors: Zvi M. Friedman, Peter Lysyansky, Nahum Smirin
  • Patent number: 8318537
    Abstract: A flip chip interconnect of a die on a substrate is made by mating the interconnect bump onto a narrow interconnect pad on a lead or trace, rather than onto a capture pad. The width of the narrow interconnect pad is less than a base diameter of bumps on the die to be attached. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having narrow interconnect pads on electrically conductive traces in a die attach surface, in which the bumps are mated onto the narrow pads on the traces.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: November 27, 2012
    Assignee: STATS ChipPAC, Ltd.
    Inventor: Rajendra D. Pendse
  • Patent number: 8314135
    Abstract: The present invention discloses compounds of Formula (I), or pharmaceutically acceptable salts, esters, or prodrugs thereof: which inhibit RNA-containing virus, particularly the hepatitis C virus (HCV). Consequently, the compounds of the present invention interfere with the life cycle of the hepatitis C virus and are also useful as antiviral agents. The present invention further relates to pharmaceutical compositions comprising the aforementioned compounds for administration to a subject suffering from HCV infection. The invention also relates to methods of treating an HCV infection in a subject by administering a pharmaceutical composition comprising the compounds of the present invention.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: November 20, 2012
    Assignee: Enanta Pharmaceuticals, Inc.
    Inventors: Yao-Ling Qiu, Ce Wang, Lu Ying, Xiaowen Peng, Yat Sun Or
  • Patent number: 8311944
    Abstract: A transaction process system (10) provides for data transactions between parties. In a credit card transaction, the parties are the merchant (20), acquiring bank (24), card association (34), issuing bank (14), and cardholder (12). A transaction processing center (30) is positioned between the acquiring bank and the card association. The transaction processing center provides data processing channels for message-based processing (72) and filed-based processing (76). The file-based processing uses an incoming queue (80) and outgoing queue (84) to simplify the interface. The transaction processing center also provides for currency conversions and account reconciliation on a per transaction basis. The transaction processing center uses a scheduler (160) to efficiently manage the data processing resources.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: November 13, 2012
    Assignee: Mtrex, Inc.
    Inventors: W. Jeffrey Knowles, Russell Hales Day, David J. Matthews, Jeffrey R. Burke, Scott E. Wessman, A. Carlo Okowitz, Joseph B. Emig
  • Patent number: 8309451
    Abstract: A semiconductor wafer contains a plurality of semiconductor die. The wafer has contact pads formed over its surface. A passivation layer is formed over the wafer. A stress buffer layer is formed over the passivation layer. The stress buffer layer is patterned to expose the contact pads. A metal layer is deposited over the stress buffer layer. The metal layer is a common voltage bus for the semiconductor device in electrical contact with the contact pads. An adhesion layer, barrier layer, and seed layer is formed over the wafer in electrical contact with the contact pads. The metal layer is mounted to the seed layer. Solder bumps or other interconnect structures are formed over the metal layer. A second passivation layer is formed over the metal layer. In an alternate embodiment, a wirebondable layer can be deposited over the metal layer and wirebonds connected to the metal layer.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: November 13, 2012
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Byung Tai Do, Stephen A. Murphy, Yaojian Lin, Heap Hoe Kuan, Pandi Chelvam Marimuthu, Hin Hwa Goh
  • Patent number: 8309452
    Abstract: A semiconductor device has a substrate with an inductor formed on its surface. First and second contact pads are formed on the substrate. A passivation layer is formed over the substrate and first and second contact pads. A protective layer is formed over the passivation layer. The protective layer is removed over the first contact pad, but not from the second contact pad. A conductive layer is formed over the first contact pad. The conductive layer is coiled on the surface of the substrate to produce inductive properties. The formation of the conductive layer involves use of a wet etchant. The second contact pad is protected from the wet etchant by the protective layer. The protective layer is removed from the second contact pad after forming the conductive layer over the first contact pad. An external connection is formed on the second contact pad.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: November 13, 2012
    Assignee: STATS ChipPAC, Ltd.
    Inventors: Yaojian Lin, Haijing Cao, Qing Zhang
  • Patent number: D671647
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: November 27, 2012
    Assignee: General Electric Company
    Inventors: Aurelie Boudier, Regis Personnelli