Abstract: Machinable alpha beta brass having a reduced lead concentration is claimed. The alloy contains bismuth to improve machinability. Either a portion of the zinc is replaced with aluminum, silicon or tin, or a portion of the copper is replaced with iron, nickel or manganese.

Abstract: A self-powered fuze apparatus for a projectile containing an explosive charge which comprises a first housing containing a mechanical safety device for releasably preventing undesired movement of a detonator cup holder containing a detonator from an unarmed to an armed position wherein the detonator cup is shielded from the charge to be exploded in the unarmed position and the detonator cup communicates with the charge only in the armed position and the second housing adjacent the first housing containing an electronic safety means for sensing target impact and projectile launch and selectively passing a piezoelectrically generated firing current to the detonator cup only upon sensing a predetermined magnitude target impact only within a predetermined time after sensing the launch acceleration and only when the electronic means is electrically and mechanically connected to the detonator cup in the armed position.

Abstract: There is provided a magnetic device having first and second portions with different magnetic coercivities. A magnetic field is induced in both the first and second portion. When exposed to a sufficiently high external magnetic field, the polarity of the first portion reverses generating a voltage pulse which may be detected by an external sensor. Either the first or second portion, or both, is formed from a copper alloy containing dispersed magnetic phase.

Abstract: A process for the assembly of a pin grid array electronic package by vacuum lamination is provided. A vacuum is applied to the package components at the same time the components are bonded with a dielectric sealant. The sealant flow into holes formed in the package base is improved thereby electrically isolating terminal pins which pass through the holes.

Abstract: A technique for improving the tarnish and oxidation resistance of metallic substrate is disclosed. The substrate is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. Either the temperature of the aqueous solution or the current density is selected so that at least one surface of the substrate is coated with a nontransparent layer. A chromium-zinc coating is electrolytically applied. The coating provides tarnish resistance at temperatures in excess of 230.degree. C. The coating is removable by immersion in sulfuric acid. Improved results are obtained by rinsing deionized water containing a small amount of an alkaline or alkaline earth hydroxide.

Abstract: A molten metal gas-atomizing spray-depositing apparatus has an atomizer which employs a pressurized gas flow for atomizing a stream of molten metal into a spray pattern of metal particles being initially hotter than the solidus temperature of the metal. The apparatus also has a substrate system which includes an outer substrate of metallic foil and an inner substrate for supporting the outer substrate. The outer foil substrate is movable relative to the metal particles in the spray pattern thereof and disposed below the atomizer for receiving on a surface of the foil a deposit of the particles in the spray pattern to form a product on the outer foil substrate. The outer foil substrate is of a thickness which is less than a predefined maximum thickness at which the capacity of the foil to absorb heat from the deposit is equal to the latent heat and super heat, if present, of the deposit.

Abstract: There is provided an electronic package assembly having a die attach paddle bonded to the package base by a compliant adhesive. A recessed channel formed in the base is partially overlapped by the die attach paddle. During package sealing, excess adhesive accumulates in the recessed channel, eliminating bridging of the adhesive to the leadframe.

Abstract: A palladium alloy of the form Pd.sub.x M.sub.y M'.sub.z where M is at least one element selected from the group consisting of silicon, iron, nickel, copper, chromium, cobalt, boron and aluminum and M' is at least one element selected from the group consisting of titanium, vanadium, chromium, zirconium, niobium, molybdenum, hafnium, tantalum and tungsten is provided. The alloys exhibit oxidation resistance and low electrical contact resistance and are particularly suited for electrical applications such as coatings for electrical contacts or connectors. In a preferred embodiment, the alloy is palladium/niobium containing from about 5 to about 10 atomic percent niobium.

Abstract: A method for the manufacture of an electronic circuit is provided. A substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the nonconductive substrate and patterned into a plurality of circuit traces. These steps may be repeated a plurality of time for a multi-metal layer structure.

Abstract: A technique for improving the tarnish and oxidation resistance of copper and copper based ally material is disclosed. The material is electrolytically coated by immersion in an aqueous electrolyte containing sodium hydroxide, zinc ions and chromium (VI) ions. The deposited coating is a codeposited layer of zinc and chromium with a zinc to chromium ratio of from about 5:1 to about 12:1. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. and is removable by immersion in sulfuric acid.

Abstract: There is provided a composite copper alloy having a copper alloy core and a modified surface layer containing a nitride or carbide film. Alternatively, the modified surface layer may contain a carbo-nitride film. The alloy is formed by reacting a copper alloy with nitrogen, carbon or a nitrogen/carbon mixture at elevated temperatures. The resultant surface layer improves the tribological and mechanical properties of the alloy while maintaining useful electrical conductivity.

Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.

Abstract: A surface mount package for encapsulating an electronic device is provided. The package has a ceramic frame containing a plurality of apertures. Copper-tungsten composite metallic components are bonded to the ceramic frame and individually extend across each of the apertures. The metallic components may include a flange for bonding and a pedestal extending into each aperture.

Abstract: An electrolyte solution for the electroforming of metal foil, such as copper, is provided. The electrolyte contains an effective concentration of chloride ions to promote the formation of a uniformly matte surface finish. Foil so formed forms a strong mechanical bond with a dielectric substrate during a subsequent lamination process.

Abstract: A process which comprises heating a reaction mixture comprised of an aqueous solution containing perchlorate ions, chlorate ions and hydrogen ions to produce chlorine dioxide and oxygen gas.The novel process of the present invention provides a commercially viable process for producing chlorine dioxide from mixtures of oxy-chlorine species in the absence of a reducing agent. The process can be operated without producing an acidic salt by-product while producing a chlorine dioxide product which is substantially free of chlorine. In addition, the process of the invention permits a reduction in the amount of acid fed to the chlorine dioxide generator.

Abstract: Compositions consisting essentially of calcium hypochlorite and a water soluble zinc salt, the compositions containing from about 40 percent to about 99 percent by weight of calcium hypochlorite, provide controlled release of the components for continuous and effective sanitation and algae control to waters treated for use in swimming pools and spas.

Abstract: A method for the manufacture of an electronic circuit is provided. A non-conductive substrate is provided with an indexing means and personality windows by etching. An adhesive is deposited on one surface of the substrate to coat at least those regions to be laminated to a metallic foil. The foil is bonded to the non-conductive substrate and patterned into a plurality of circuit traces. Mechanical stamping of the substrate is not required providing a means to inexpensively manufacture small quantities of a desired circuit configuration.

Abstract: The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than cooper based packages and better thermal conductivity than plastic based packages.

Abstract: A process for producing dichlorine monoxide which includes: feeding an aqueous solution of hypochlorous acid containing at least 20% by weight of HOCl to a reaction vessel; maintaining the temperature of the aqueous solution of hypochlorous acid in the range of from about -10.degree. to about +40.degree. C.; passing an inert gas through the aqueous solution of hypochlorous acid to produce a gaseous mixture comprising dichlorine monoxide, chlorine and inert gas; an contacting the gaseous mixture with dry ice to provide a solid phase of dry ice and dichlorine monoxide.

Abstract: A pin grid array package is provided. An array of terminal pins pass through apertures formed in an interconnect tape. The terminal pins are electrically connected to circuit traces formed on interconnect tape. The electrically conductive bond between the terminal pins and circuit traces is either by a mechanical cinch by soldering. In one embodiment, at least a portion of the interconnect tape, terminal pins and a heat sink are embedded in a molding polymer resin.