Patents Represented by Attorney Paul Weinstein

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  • Terminal pins for flexible circuits
    Patent number: 5046971
    Abstract: The present invention relates to a terminal pin for electronic circuitry. The terminal pin includes an axial passageway. Various processes for electrically connecting the pin to the circuit are provided. The processes include riveting, welding and soldering. The axial passageway aids in the control of metal deformation to improve the bond between the pin and the circuitry.
    Type: Grant
    Filed: July 30, 1990
    Date of Patent: September 10, 1991
    Assignee: Olin Corporation
    Inventors: Murray A. Ruggiero, Kin S. Chang, George A. Anderson, Robert T. Brooker
  • Glass/ceramic sealing system
    Patent number: 5047371
    Abstract: The present invention relates to a glass/ceramic sealing system. A sealing glass having a coefficient of thermal expansion in excess of 160.times.10.sup.-7 in/in/.degree. C. is provided. The glass is useful for matched sealing of copper and copper based alloys. The glass is capable of ceramization, greatly increasing the resistance of the glass to moisture penetration and fracture due to mechanical damage. The temperature of ceramization has been designed so that a solutionized copper alloy leadframe is age hardened during ceramization. The glass has particular utility in the manufacture of electronic packages and multi-layer circuitry.
    Type: Grant
    Filed: September 2, 1988
    Date of Patent: September 10, 1991
    Assignee: Olin Corporation
    Inventor: Satyam C. Cherukuri
  • Hermetic cerglass and cermet electronic packages
    Patent number: 5043535
    Abstract: The invention relates to a process for coating sintered cermet or cerglass articles with a metal or metal alloy. The process is particularly useful to eliminate pores and cavities from the surface of the article. During hermeticity testing, these pores and cavities trap tracer gas and result in an erroneous leak rate measurement. In one embodiment, the coated surfaces are subsequently coated with a second metal layer by immersion plating followed by electrolytic deposition. The process is particularly suited to the manufacture of cermet and cerglass components for semiconductor packages.
    Type: Grant
    Filed: March 10, 1989
    Date of Patent: August 27, 1991
    Assignee: Olin Corporation
    Inventor: Lifun Lin
  • Metal sealing glass composite with matched coefficients of thermal expansion
    Patent number: 5043222
    Abstract: The present invention relates to a glass for making glass to metal seals. The coefficient of thermal expansion of the glass is in excess of 160.times.10.sup.-7 in/in/.degree.C. making the glass particularly useful for sealing copper and copper based alloys. The glass has particular utility in the manufacture of electronic packages and multi-layer circuitry.
    Type: Grant
    Filed: April 23, 1990
    Date of Patent: August 27, 1991
    Assignee: Olin Corporation
    Inventor: Satyam C. Cherukuri
  • Metal electronic package having improved resistance to electromagnetic interference
    Patent number: 5043534
    Abstract: A metal electronic package is provided having improved electromagnetic interference shielding. Metal base and cover components are electrically interconnected to remain at same voltage potential thereby reducing EMI induced mutual inductance. An electrically conductive conduit, such as a contact pin, provides interconnection. If the electronic device is mounted on a chip pad attach, the conductive conduit also connects to the support pads of the chip attach.
    Type: Grant
    Filed: July 2, 1990
    Date of Patent: August 27, 1991
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Jeffrey S. Braden, Stephen P. Noe
  • Copper alloys having improved softening resistance and a method of manufacture thereof
    Patent number: 5039478
    Abstract: A method for the manufacture of copper base alloys having improved resistance to thermally induced softening is provided. The alloy composition is selected so that the alloy undergoes either a peritectic or eutectic transformation during cooling. The solidification rate is controlled so that the second phase forms as a uniform dispersion of a relatively small dispersoid. The dispersoid inhibits recrystallization resulting in an alloy less susceptible to softening at elevated temperatures.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: August 13, 1991
    Assignee: Olin Corporation
    Inventor: Ashok Sankaranarayanan
  • Hypochlorous acid process
    Patent number: 5037627
    Abstract: A process for producing hypochlorous acid by reacting an aqueous solution of an alkali metal hydroxide in droplet form with gaseous chlorine to produce hypochlorous acid vapor and solid alkali metal chloride particles in which the improvement comprises employing molar ratios of gaseous chlorine to the alkali metal hydroxide of at least about 22:1.The process achieves high yields of hypochlorous acid by minimizing side reactions including the formation of chlorate as an impurity in the alkali metal chloride particles produced.The hypochlorous acid solution produced contains from about 35 to about 60 percent by weight of HOCl, a dissolved chlorine concentration of less than about 2 percent by weight, and is substantially free of alkali metal ions and chloride ions.
    Type: Grant
    Filed: October 25, 1989
    Date of Patent: August 6, 1991
    Assignee: Olin Corporation
    Inventors: James K. Melton, John H. Shaffer, Garland E. Hilliard, John A. Wojtowicz
  • Ultrapure hydrazine production
    Patent number: 5035775
    Abstract: A process for producing hydrazine containing at least 98 percent by weight of N.sub.2 H.sub.4 which admixes an aqueous solution of hydrazine with an alkali metal hydroxide to form a hydrazine solution having a N.sub.2 H.sub.4 concentration of at least 70 percent by weight. The molar ratio of alkali metal hydroxide to water is less than about 0.5:1. The concentrated hydrazine solution is distilled in a fractional distillation apparatus at an overhead vapor temperature below about 50.degree. C. and at a pressure of less than about 60 mm Hg.
    Type: Grant
    Filed: February 9, 1989
    Date of Patent: July 30, 1991
    Assignee: Olin Corporation
    Inventors: Allen B. Quackenbush, James G. Rigsby
  • Removal of thiosulfate from hydrosulfite solutions
    Patent number: 5034202
    Abstract: A process for treating an alkali metal hydrosulfite solution which comprises contacting the alkali metal hydrosulfite solution, having a residual alkalinity of from about 1 to about 20 grams per liter of hydroxide ion, with aluminum. The process of the invention can be operated at low temperatures i.e., those which are normally used for storage of the sodium hydrosulfite solution to minimize thermal decomposition.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: July 23, 1991
    Assignee: Olin Corporation
    Inventor: Karl O. Knollmueller
  • Semiconductor bridge (SCB) packaging system
    Patent number: 5029529
    Abstract: The present invention is direct to primer housings to secure a semiconductor bridge device in close proximity to an energetic charge. The primer housings are formed from an electrically conductive alloy and contain a dielectric medium disposed between components to maintain electrical isolation. The housings are characterized by high ductility to resist fracture during assembly or handling. In certain embodiments, one or both lead wires are removed to reduce the potential for lead wire breakage or separation.
    Type: Grant
    Filed: September 25, 1989
    Date of Patent: July 9, 1991
    Assignee: Olin Corporation
    Inventors: Frank N. Mandigo, George C. Mei, Julius C. Fister
  • Composite coating for electrical connectors
    Patent number: 5028492
    Abstract: A composite coating for electrical connectors is provided. The coating contains a ductile metal matrix and an uniformly dispersed polymer component. The polymer component is present in a concentration effective to reduce frictional forces generated when inserting an insertion component into a socket. The composite coating has lower friction and improved fretting corrosion resistance as compared to an electrodeposited tin coating. One preferred coating contains 0.5 weight percent polytetrafluoroethylene in a tin matrix.
    Type: Grant
    Filed: March 13, 1990
    Date of Patent: July 2, 1991
    Assignee: Olin Corporation
    Inventor: Bruce M. Guenin
  • Process for the production of lithium hypochlorite
    Patent number: 5028408
    Abstract: A process for producing lithium hypochlorite comprises admixing an aqueous hypochlorous acid solution having a concentration of 35 percent of greater by weight of HOCl with an aqueous slurry of lithium hydroxide at a temperature in the range of from about 0.degree. to about 20.degree. C. to produce a solution of lithium hypochlorite. The solution is concentrated by evaporation at temperatures in the range of from about 30.degree. to about 60.degree. C. and at subatmospheric pressures to form a paste of lithium hypochlorite. After separating the paste into a cake of lithium hypochlorite and a mother liquor, a potassium compound is admixed with the mother liquor. The process produces a highly pure solid lithium hypochlorite product having a concentration of at least 80 percent available chlorine.
    Type: Grant
    Filed: March 2, 1990
    Date of Patent: July 2, 1991
    Assignee: Olin Corporation
    Inventors: Budd L. Duncan, Larry D. Carpenter, Leslie R. Osborne
  • Electronic packaging of components incorporating a ceramic-glass-metal composite
    Patent number: 5024883
    Abstract: The present invention is directed to components and the process of forming the components for housing semiconductor devices. The components are formed of a unique ceramic-glass-metal composite material comprising ceramic particles, metallic particles and a glass matrix with said ceramic and metallic particles dispersed throughout. Metal elements can be embedded into the material to enable simplified fabrication of devices such as semiconductor packaging.
    Type: Grant
    Filed: September 14, 1989
    Date of Patent: June 18, 1991
    Assignee: Olin Corporation
    Inventors: Narendra N. SinghDeo, Deepak Mahulikar, Sheldon H. Butt
  • Multi-layer lead frames for integrated circuit packages
    Patent number: 5025114
    Abstract: A composite leadframe is provided. The leadframe comprises a rigid metal portion electrically interconnected to a flexible multi-layer portion. When sealed within an electronic package, the composite leadframe provides a higher lead density than achieved by rigid metal leadframes and better electrical and mechanical properties than achieved with flexible leads. The package may comprise a discrete base and cover component with the leadframe disposed between or a monolithic block of plastic encapsulating the electronic device and a portion of the leadframe.
    Type: Grant
    Filed: October 30, 1989
    Date of Patent: June 18, 1991
    Assignee: Olin Corporation
    Inventor: Jeffrey S. Braden
  • Aluminum alloy semiconductor packages
    Patent number: 5023398
    Abstract: The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.
    Type: Grant
    Filed: April 4, 1990
    Date of Patent: June 11, 1991
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, James M. Popplewell
  • Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil
    Patent number: 5022968
    Abstract: A technique for improving the tarnish and oxidation resistance of copper and copper based alloy materials is disclosed. Copper or a copper alloy is immersed in an aqueous solution containing sodium hydroxide, zinc ions and chromium (VI) ions. While the compositional ranges may vary, the concentration of either zinc ions or chromium (VI) ions, or both, is less than 1.0 gm/l. A chromium-zinc coating is electrolytically applied. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. The coating is removable by immersion in sulfuric acid. Improved results are obtained by rinsing deionized water containing a small amount of an alkaline or alkaline earth hydroxide.
    Type: Grant
    Filed: September 20, 1990
    Date of Patent: June 11, 1991
    Assignee: Olin Corporation
    Inventors: Lifun Lin, Chung-Yao Chao
  • Anti-microbial composition containing aliphatic polygycidol adducts
    Patent number: 5023008
    Abstract: Novel nonionic antimicrobial amine glycidol compounds which may be used in cleaning compositions with anionics, nonionics or cationic surfactants as cleaning agents or a preservative in water-based functional fluids or surface coating compositions are represented by the formula: ##STR1## wherein R represents an alkyl group having from about 8 to about 18 carbon atoms and mixtures thereof,Y represents H, ##STR2## or R', and mixtures thereof; R' represents an alkyl group, the sum total of carbon atoms in R+R' being from about 8 to about 18;n is from about 1 to about 6; andm+n are from about 2 to about 12;wherein the molar ratio of amine glycidol compound to surfactant is from about 10:1 to about 1:10.
    Type: Grant
    Filed: November 17, 1989
    Date of Patent: June 11, 1991
    Assignee: Olin Corporation
    Inventors: Michael Scardera, Frank R. Grosser
  • Oxidized activated carbon and its use in removal of aromatic compounds from aqueous solutions
    Patent number: 5021164
    Abstract: Aromatic hydrocarbons are readily recovered from aqueous solutions by contacting the aqueous solution with an oxidized activated carbon having a low concentration of acidic oxides.The novel oxidized activated carbon is produced by contacting activated carbon with an acidic oxidizing agent which is used in low concentrations.The process can be employed to reduce aromatic hydrocarbons such as benzene from aqueous solutions such as industrial effluents or potable water supplies to levels permissible by environmental protection regulations.
    Type: Grant
    Filed: December 27, 1988
    Date of Patent: June 4, 1991
    Assignee: Olin Corporation
    Inventor: Walter A. Gay
  • Copper alloys having improved softening resistance and a method of manufacture thereof
    Patent number: 5017250
    Abstract: A method for the manufacture of copper base alloys having improved resistance to thermally induced softening is provided. The alloy composition is selected so that the alloy undergoes either a peritectic or eutectic transformation during cooling. The solidification rate is controlled so that the second phase forms as a uniform dispersion of a relatively small dispersoid. The dispersoid inhibits recrystallization resulting in an alloy less susceptible to softening at elevated temperatures.
    Type: Grant
    Filed: July 26, 1989
    Date of Patent: May 21, 1991
    Assignee: Olin Corporation
    Inventor: Sankaranarayanan Ashok
  • Thermal performance package for integrated circuit chip
    Patent number: 5015803
    Abstract: Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: May 14, 1991
    Assignee: Olin Corporation
    Inventors: Deepak Mahulikar, Jacob Crane, Abid A. Khan