Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: A process and apparatus for fabricating an optical fiber communication cable are described herein. The optical fiber cable has a cable core including a metal containment tube and at least one optical fiber within the tube. The containment tube preferably is formed by drawing a strip of metal through at least one forming die. In a first aspect of the present invention, smooth operation of the forming die is promoted by first passing the metal strip through a shaving die to remove any shearing burrs along the strip edges and to maintain the width of the strip within a desired tolerance.In a second aspect of the present invention, various approaches for effectively sealing the containment tube are described. In a first embodiment, the tube is sealed using a wave soldering approach wherein a flow of moving molten solder is used to substantially fill a seam in the tube.

Abstract: The present invention relates to a technique for improving the adhesive properties of a metal or metal alloy material by reducing the number of bare spots and unplated regions on each treated surface of the metal or metal alloy material. The technique comprises electrolytically forming a substantially uniform metal oxide layer on at least one surface of the material, chemically converting the oxide layer into a substantially uniform layer of fresh metal, and thereafter electrolytically forming a plurality of dendritic structures on the at least one surface. The technique of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the technique is also described.

Abstract: The present invention relates to a treatment for improving the laminate adhesion of metal and metal alloy materials, particularly copper and copper alloy foils. The treatment comprises electrolytically forming a plurality of dendrites on a surface of the metal or metal alloy material and bonding the dendrites thereto. The dendrites are formed on and bonded to the metal or metal alloy material surface by one or more treatment anodes positioned at an angle to the material being treated and a single current source.

Abstract: The present invention relates to a system and a process for producing improved quality electrodeposited and/or treated metal or metal alloy foil to be used in electrical and electronic applications. The quality of the foil being produced and/or treated by the system is improved by providing each treatment tank in the system with a dual filtration system. The dual filtration system for each tank comprises a filter conditioning loop for substantially continuously withdrawing solution from the tank and removing particulate matter from the withdrawn solution and a system for removing surface impurities from the solution. In a first embodiment, the surface impurities removing system comprises an off-line solution filtration and replenishment system. In a second embodiment, the surface impurities removing system comprises a skimmer floating on the surface of the solution. The present invention has particular utility in systems for producing electrodeposited and/or treated copper foils.

Abstract: The present invention relates to a treatment for improving the adhesive properties of metallic foils to be used in electrical and electronic applications. The treatment of the present invention comprises applying a light substantially uniform layer of metal to at least one surface of the metallic foil just prior to the formation of a plurality of dendritic structures on the surface. The metal layer renders the surface or surfaces to be treated more uniformly electrochemically active and consequently more receptive to the subsequent dendritic treatment. The treatment of the present invention has particular utility in improving the adhesive properties of wrought copper and copper alloy foils. An apparatus for performing the present treatment is also described.

Abstract: A method is disclosed for producing iron or iron alloy particles. A metal or metal alloy strip having fine particles of iron or alloy distributed throughout is provided. The metal strip is selectively dissolved without substantial dissolving of the iron or iron alloy particles in order to recover the particles.

Abstract: Several embodiments of high density packages which form an enclosure adapted to receive electronic devices are disclosed. Each package includes a metal lead frame having staggered leads which extend external to the package. A seal ring construction is provided so that hermetic seals are possible without subjecting the electronic devices to high temperatures. Various metals and sealing materials are advantageously used in the contruction of the devices.

Abstract: An apparatus for collecting ferromagnetic particles distributed in metal or metal alloy material is disclosed. A tank containing an electrolyte is provided to electrochemically dissolve the metal or metal alloy material without substantial dissolving of the particles. A support surface is provided within the electrolyte for supporting the dissolving metal material and collecting undissolved particles. The support surface further comprises the working electrode in conjunction with the metal material. A magnetic field forming device is associated with the support surface for magnetically adhering undissolved particles to the support surface so as to maximize recovery of the particles.

Abstract: A copper or copper alloy material having a reduced number of defects is formed by removing impurities from the material while in a molten state with a member having exposed silicon carbide particles. The member may be a bed filter formed from bed media having exposed silicon carbide particles, a porous body formed from a slurry containing silicon carbide, a porous body having at least one melt contacting surface coated with a silicon carbide material, and/or a lining having at least one melt contacting surface coated with a silicon carbide material.

Abstract: A process and apparatus for forming a thin-walled, elongated member having superior strength properties from an age hardenable copper base alloy is described herein. A slug or billet of a slurry cast, age hardenable copper base alloy is formed into a semi-solid slurry having about 10% to about 30% of the alloy in a liquid phase. The semi-solid slurry is then thixoforged to form the thin-walled, elongated member. Thereafter, the member is age hardened to provide a product having desired strength properties. The process and apparatus of the instant invention may be utilized to form cartridge casings.

Abstract: A copper or copper alloy material having a reduced number of stringer defects is formed by removing iron-containing components from the material with a member having exposed silicon carbide particles while the material is in a molten state. The member may be a bed filter formed from bed media having exposed silicon carbide particles, a porous body formed from a slurry containing silicon carbide, a porous body having at least one melt contacting surface coated with a silicon carbide material, and/or a furnace or passageway lining having at least one melt contacting surface coated with a silicon carbide material.

Abstract: Reinforced glass composites are disclosed which are useful in hermetic semiconductor packaging as well as other applications. The disclosed composites include discrete particles in a tin-phosphorous-oxyfluoride glass mixture having a low glass transition temperature to prevent serious degradation of the discrete particles.

Abstract: The present invention relates to a system for aligning a plurality of rollers in a metal or metal alloy foil production line. The alignment system comprises a reference frame having a longitudinal dimension parallel to the direction of foil travel through the production line and an optical alignment system movably mounted to the frame. The optical alignment system comprises a laser beam generator, beam splitters and a mirror for generating an orthogonal reference frame for aligning each foil contacting roller in the production line.

Abstract: A method and apparatus is disclosed for electromagnetic casting of metal and alloy ingots of rectangular or other desired shape having corners or portions of small radius of curvature. A coolant application system is provided which lessens the severity of the rounding off or radius of the corners of the electromagnetically cast ingots by contouring the coolant application rate and/or elevation so that the rate and/or elevation is a minimum at the corners of the ingot.

Abstract: An electroforming apparatus for producing metal foil having a rotating drum cathode and an improved anode construction and a process for using the apparatus are described. The improved anode construction comprises an arcuate anode having a perforated zone. The perforated zone is placed over a manifold for distributing electrolyte into a gap between the cathode and anode for providing a more uniform current distribution and a more uniform foil deposition in the plating region over the manifold as well as other advantages.

Abstract: A one-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises forming a plasma of a polar containing organic species and at least one of nitrogen and hydrogen and exposing a substrate material to the plasma for a period of time sufficient to deposit a polymeric film on at least one surface. In a preferred embodiment, a plasma of an azole, nitrogen and/or hydrogen is utilized. The process has particular utility in forming adherent polymeric films on one or more surfaces of copper and copper alloy foils to be used in printed circuit applications.

Abstract: A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.

Abstract: A three-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises sequentially exposing the substrate to a first plasma of oxygen gas, a second plasma of a hydrocarbon monomer gas and a third plasma of oxygen gas. The process has particular utility in forming polymeric films on one or more surfaces of copper or copper alloy foils to be used in printed circuit applications.

Abstract: An apparatus and method for high speed production of a multiple gauge metal strip product having a configuration with a transverse variable thickness are described. A milling machine cuts away at least approximately 75% of the total volume of metal to be removed from the surface of the initial strip of metal. This forms a pattern corresponding to the multiple gauge surface desired in the strip product. Then, the milled strip is passed into a shaving device which is located in axial alignment with the milling device. The shaving apparatus shaves off a maximum of about 25% of the total volume of metal to be removed from the surface of the milled strip in a single shaving pass to substantially form the desired configuration of the strip product.