Patents Represented by Attorney Paul Weinstein

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  • Alpha copper base alloy adapted to be formed as a semi-solid metal slurry
    Patent number: 4642146
    Abstract: A copper base alloy capable of forming a microstructure comprising a plurality of discrete particles in a surrounding metal matrix having a lower melting point than the particles. The alloy consists essentially of from about 3% to about 6% nickel, from about 2% to about 4.25% aluminum, from about 0.25% to about 1.2% silicon, from about 5% to about 15% zinc, up to about 5% iron and the balance essentially copper. When iron is included in an amount from about 3% to about 5% and zinc is restricted to a range of from about 8% to about 10%, the alloy is capable of forming the desired structure in the as-cast condition using a process which does not include stirring during casting.
    Type: Grant
    Filed: October 11, 1985
    Date of Patent: February 10, 1987
    Assignee: Olin Corporation
    Inventors: Sankaranarayanan Ashok, John F. Breedis
  • Apparatus for forming a thixoforged copper base alloy cartridge casing
    Patent number: 4638535
    Abstract: A process and apparatus for forming a thin-walled, elongated member having superior strength properties from an age hardenable copper base alloy is described herein. A slug or billet of a slurry cast, age hardenable copper base alloy is formed into a semi-solid slurry having about 10% to about 30% of the alloy in a liquid phase. The semi-solid slurry is then thixoforged to form the thin-walled, elongated member. Thereafter, the member is age hardened to provide a product having desired strength properties. The process and apparatus of the instant invention may be utilized to form cartridge casings.
    Type: Grant
    Filed: December 2, 1985
    Date of Patent: January 27, 1987
    Assignee: Olin Corporation
    Inventors: Michael J. Pryor, Joseph Winter, Jonathan A. Dantzig
  • Method of making a strip for an electrical contact terminal
    Patent number: 4625400
    Abstract: A method of producing a strip adapted for use as an electrical contact terminal comprising the following steps. First, a strip of relatively flexible substrate material is provided. Then, a substantially continuous strip of powdered metal or metal alloy is deposited onto a surface of the strip to produce the electrical contact terminal.
    Type: Grant
    Filed: July 6, 1983
    Date of Patent: December 2, 1986
    Assignee: Olin Corporation
    Inventor: Julius C. Fister
  • Method and apparatus for electro-magnetic casting of complex shapes
    Patent number: 4612972
    Abstract: An apparatus is provided for electromagnetically coiling a molten material into a longitudinally extending casting defining a longitudinal axis thereof. The casting has a desired cross section extending perpendicular to the longitudinal axis. At least one portion of the outer peripheral surface of the casting extends transversely of the longitudinal axis and has a small radius of curvature. The apparatus includes an inductor extending transversely about the molten material for providing an electromagnetic containment force field acting on the outer peripheral surface of the molten material to form the desired cross section. The improvement comprises a device for turning the electromagnetic containment force field about the longitudinal axis to cause a corresponding turn of the transverse cross section of the molten material about the longitudinal axis.
    Type: Grant
    Filed: May 24, 1984
    Date of Patent: September 23, 1986
    Assignee: Olin Corporation
    Inventor: Jonathan A. Dantzig
  • Copper-silicon-tin alloys having improved cleanability
    Patent number: 4612166
    Abstract: The present invention relates to copper-silicon-tin alloys having improved cleanability. These alloys consist essentially of from about 1.0% to about 5.0% tin, from about 1.0% to about 4.5% silicon, an element selected from the group consisting of from about 0.05% to about 0.5% magnesium and from about 0.01% to about 0.5% lithium, and the balance essentially copper. The alloys may also contain from about 0.01% to about 0.45% chromium.
    Type: Grant
    Filed: October 15, 1985
    Date of Patent: September 16, 1986
    Assignee: Olin Corporation
    Inventors: Andrew J. Brock, Edward F. Smith, Eugene Shapiro
  • Process and apparatus for fabricating optical fiber cables
    Patent number: 4611748
    Abstract: A process and apparatus for fabricating an optical fiber communication cable are described herein. The optical fiber cable has a cable core including a metal containment tube and at least one optical fiber within the tube. The containment tube preferably is formed by drawing a strip of metal through at least one forming die. In a first aspect of the present invention, smooth operation of the forming die is promoted by first passing the metal strip through a shaving die to remove any shearing burrs along the strip edges and to maintain the width of the strip within a desired tolerance.In a second aspect of the present invention, various approaches for effectively sealing the containment tube are described. In a first embodiment, the tube is sealed using a wave soldering approach wherein a flow of moving molten solder is used to substantially fill a seam in the tube.
    Type: Grant
    Filed: October 1, 1984
    Date of Patent: September 16, 1986
    Assignee: Olin Corporation
    Inventors: Joseph Winter, Michael J. Pryor
  • Apparatus and process for electro-magnetically forming a material into a desired thin strip shape
    Patent number: 4606397
    Abstract: An apparatus and process for electromagnetically forming a material into a desired thin strip shape. The apparatus comprises a first portion for electromagnetically containing and forming the material in molten form into a cross-sectional shape substantially the same as the desired thin strip shape. A second portion receives the molten material in the thin strip shape from the first portion. In addition, the second portion reduces the distortion in the cross-sectional shape due to surface tension. The second portion includes a device for providing an electromagnetic field having a reduced strength as compared to the strength of an electromagnetic field in the first portion. The electromagnetic field may be reduced in strength by providing an inductor having hollow inner surfaces facing the molten material so as to form substantially straight vertical surfaces in the molten material.
    Type: Grant
    Filed: June 27, 1984
    Date of Patent: August 19, 1986
    Assignee: Olin Corporation
    Inventors: John C. Yarwood, Gary L. Ungarean, Derek E. Tyler
  • Tape packages
    Patent number: 4607276
    Abstract: The present invention is directed to Tape Packages adapted to house semiconductor devices. The packages comprise a base component having a cover component disposed thereon to form an enclosure to house the semiconductor. A tape lead frame is disposed between the base and the cover and has a plurality of lead fingers extending into the enclosure for electrical connection to the semiconductor component. A spring between the base and the semiconductor device presses the semiconductor device into contact with the cover component. The spring comprises at least one of the lead fingers which is bonded to the semiconductor device and formed into an arch-like shape which contacts the base component.
    Type: Grant
    Filed: March 8, 1984
    Date of Patent: August 19, 1986
    Assignee: Olin Corporation
    Inventor: Sheldon H. Butt
  • Copper alloys having an improved combination of strength and conductivity
    Patent number: 4605532
    Abstract: A copper base alloy having an improved combination of conductivity and strength for applications such as lead frames or electrical connectors. The alloys consists essentially of from about 0.3 to 1.6% by weight iron, with up to one-half the iron content being replaced by nickel, manganese, cobalt, and mixtures thereof; from about 0.01 to about 0.20% by weight magnesium; from about 0.10 to about 0.40% by weight phosphorus; up to about 0.5% by weight tin or antimony and mixtures thereof; and the balance copper. The phosphorus to magnesium ratio and phosphorus to the total content of phosphide formers ratio are maintained within critical limits.
    Type: Grant
    Filed: June 3, 1985
    Date of Patent: August 12, 1986
    Assignee: Olin Corporation
    Inventors: David B. Knorr, John F. Breedis
  • Technique for removing impurities from a copper melt
    Patent number: 4601460
    Abstract: A copper or copper alloy material having a reduced number of defects is formed by removing impurities from the material while in a molten state with a member having exposed silicon carbide particles. The member may be a bed filter formed from bed media having exposed silicon carbide particles, a porous body formed from a slurry containing silicon carbide, a porous body having at least one melt contacting surface coated with a silicon carbide material, and/or a lining having at least one melt contacting surface coated with a silicon carbide material.
    Type: Grant
    Filed: April 29, 1985
    Date of Patent: July 22, 1986
    Assignee: Olin Corporation
    Inventors: Derek E. Tyler, Harvey P. Cheskis, Paul D. Tungatt
  • One-step plasma treatment of copper foils to increase their laminate adhesion
    Patent number: 4598022
    Abstract: A one-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises forming a plasma of a polar containing organic species and at least one of nitrogen and hydrogen and exposing a substrate material to the plasma for a period of time sufficient to deposit a polymeric film on at least one surface. In a preferred embodiment, a plasma of an azole, nitrogen and/or hydrogen is utilized. The process has particular utility in forming adherent polymeric films on one or more surfaces of copper and copper alloy foils to be used in printed circuit applications.
    Type: Grant
    Filed: March 4, 1985
    Date of Patent: July 1, 1986
    Assignee: Olin Corporation
    Inventors: Reza Haque, Edward F. Smith, III, Igor V. Kadija
  • Optical fiber cables having improved hermeticity
    Patent number: 4594766
    Abstract: The present invention relates to a process and apparatus for fabricating optical fiber cables having improved hermeticity. The optical fiber cables are formed by first reducing the water content of the buffer material surrounding each optical fiber. Thereafter, the dried optical fiber(s) are encapsulated into a metal or metal alloy tube. After fiber encapsulation, the tube may be sealed to prevent the ingress of moisture and/or water from the surrounding environment.
    Type: Grant
    Filed: February 25, 1985
    Date of Patent: June 17, 1986
    Assignee: Olin Corporation
    Inventors: Warren F. Smith, Jr., Eugene Shapiro, Joseph Winter
  • Method of making semiconductor casing
    Patent number: 4594770
    Abstract: A casing for an electrical component comprises a metal lead frame having the electrical component connected thereto. A metal base member is bonded to one surface of the lead frame. A plastic housing member is bonded to a second surface of the lead frame. An adhesive seals and bonds the metal base member and plastic housing member to the lead frame so as to enclose the electrical component.
    Type: Grant
    Filed: August 9, 1984
    Date of Patent: June 17, 1986
    Assignee: Olin Corporation
    Inventor: Sheldon H. Butt
  • Copper base alloy for forging from a semi-solid slurry condition
    Patent number: 4594117
    Abstract: A process and apparatus for forming a thin-walled, elongated member having superior strength properties from an age hardenable copper base alloy consisting essentially of about 3% to about 20% nickel, about 5% to about 10% aluminum, and the balance essentially copper, is described herein. A slug or billet of a slurry cast, age hardenable copper base alloy is formed into a semi-solid slurry having about 5% to about 40% of the alloy in a liquid phase. The semi-solid slurry is then thixoforged to form the thin-walled, elongated member. Thereafter, the member is age hardened to provide a product having desired strength properties. The process and apparatus of the instant invention may be utilized to form cartridge casings.
    Type: Grant
    Filed: May 31, 1984
    Date of Patent: June 10, 1986
    Assignee: Olin Corporation
    Inventors: Michael J. Pryor, Joseph Winter, Jonathan A. Dantzig
  • Multipurpose copper alloys with moderate conductivity and high strength
    Patent number: 4594221
    Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bead formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.
    Type: Grant
    Filed: April 26, 1985
    Date of Patent: June 10, 1986
    Assignee: Olin Corporation
    Inventors: Ronald N. Caron, John F. Breedis
  • Three-step plasma treatment of copper foils to enhance their laminate adhesion
    Patent number: 4588641
    Abstract: A three-step plasma treatment for improving the laminate adhesion of metallic and non-metallic substrates is described. The treatment comprises sequentially exposing the substrate to a first plasma of oxygen gas, a second plasma of a hydrocarbon monomer gas and a third plasma of oxygen gas. The process has particular utility in forming polymeric films on one or more surfaces of copper or copper alloy foils to be used in printed circuit applications.
    Type: Grant
    Filed: March 4, 1985
    Date of Patent: May 13, 1986
    Assignee: Olin Corporation
    Inventors: Reza Haque, Edward F. Smith, III
  • Copper-tin alloys having improved wear properties
    Patent number: 4586967
    Abstract: A copper-tin alloy having improved wear performance and a process for forming the alloy is described herein. The alloy consists essentially of about 2% to about 11%, preferably about 3.5% to about 9% tin, about 0.03% to about 0.75%, preferably about 0.08% to about 0.5% phosphorous and the balance essentially copper. The processing for improving the wear performance includes a final heat treatment at a temperature in the range of about 400.degree. C. to about 650.degree. C., preferably about 500.degree. C. to about 600.degree. C. in an atmosphere having a dew point in the range of about -75.degree. C. to about +95.degree. C., preferably -57.degree. C. to +21.degree. C. and an oxygen level in the range of about 0.001 ppm to about 225 ppm.
    Type: Grant
    Filed: November 23, 1984
    Date of Patent: May 6, 1986
    Assignee: Olin Corporation
    Inventors: Eugene Shapiro, Frank N. Mandigo
  • Beta copper base alloy adapted to be formed as a semi-solid metal slurry and a process for making same
    Patent number: 4585494
    Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.
    Type: Grant
    Filed: June 28, 1985
    Date of Patent: April 29, 1986
    Assignee: Olin Corporation
    Inventors: Sankaranarayanan Ashok, John F. Breedis
  • Technique for repairing and joining small diameter optical fiber cables
    Patent number: 4585304
    Abstract: A technique for repairing or joining lengths of ultra-fine, small diameter optical fiber cables is described. The technique comprises: positioning a hollow cylindrical ferrule over one of two cable portions; forming a splice joint between the optical fibers to be joined together; forming a protective buffer layer about the splice joint; sliding the ferrule over the protective buffer layer and into overlapping relationship with each cable portion; and bonding the ferrule to each cable portion. An apparatus for performing the repair or joining technique is also described.
    Type: Grant
    Filed: September 6, 1983
    Date of Patent: April 29, 1986
    Assignee: Virginia
    Inventors: Joseph Winter, Michael J. Pryor
  • Adhesion primers for encapsulating epoxies
    Patent number: 4582556
    Abstract: A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
    Type: Grant
    Filed: May 31, 1984
    Date of Patent: April 15, 1986
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Edward F. Smith, III, F. Dennis Gyurina