Abstract: An optical fiber communication cable and a process for making it comprise providing at least one optical fiber and surrounding the optical fiber with a high strength drawn copper alloy tube having a generally longitudinally extending seam. The edges of the tube which define the seam are substantially nonlinear deformed edges whose length from the outside of the tube to the inside thereof exceeds the thickness of the tube wall.

Abstract: A thermally conductive module is adapted for mounting a plurality of electronic components. A ceramic substrate has a first layer of foil glass bonded thereto and adapted for mounting a plurality of electronic components thereon. A second layer of foil is glass bonded to a second surface of the ceramic substrate and is adapted to conduct heat from the module.

Abstract: An improved thermode for bonding interconnect tape to at least one bonding site on an electronic device is disclosed. The thermode includes a component for controlling deflection of the interconnect tape at a position outside of said bonding site whereby thermal stresses generated in the interconnect tape while bonding are substantially reduced.

Abstract: The present invention relates to composites having excellent combinations of bending strength, electrical conductivity, stress relaxation in bending and bend formability and having particular utility in electrical connector applications. The composites of the present invention have a core formed from a copper base alloy having an electrical conductivity of at least about 80% IACS and a clad formed from a copper-nickel alloy containing more than about 30% by weight nickel. Preferred composites are triclad composites formed from copper alloy C151 and MONEL 400 and having clad layer thicknesses of at least about 10%, most preferably at least about 20%, of the overall composite thickness.

Abstract: The present invention is directed to the process of forming a circuit pattern in a strip of metallic tape with an electrical discharge machining apparatus having an electrode and a pool of dielectric material. The electrode, having a negative image of the circuit pattern cut into a first end thereof, is submerged in the dielectric material. By controlling the pulsing of direct current across the gap between the electrode and the strip of metallic material for a period of time, a spark discharging across the gap causes small quantities of the metallic foil to be removed so as to cut the circuit pattern.

Abstract: An electronic circuit assembly is disclosed including a semiconductor die having an aluminum therminal pad on its top surface. A lead frame is disposed adjacent the semiconductor die and is adapted to be electrically connected to the die. An electrical connection device interconnects the terminal pad to the lead frame. The electrical connection device includes a biclad transport tape comprising a first member formed from a nickel containing material and a second member formed from a copper containing material. The transport tape is disposed in the electronic circuit assembly with its first member bonded to the terminal pad and its second member bonded to the lead frame. The transport tape may be constructed so as to efficiently dissipate heat from the semiconductor die.

Abstract: The present invention relates to a method for producing magnetic particles for use in recording media. The method comprises providing an alloy capable of forming a magnetic precipitate, aging the alloy to form a magnetic precipitate comprising a plurality of magnetic particles dispersed throughout a surrounding matrix; and dissolving the matrix to leave the magnetic particles. Magnetic particles produced by the present method are characterized by a size in the range of about 100 .ANG. to about 2000 .ANG., a single magnetic domain, an aspect ratio up to about 10:1, a relatively smooth surface, and a substantially uniform composition throughout.

Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bend formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.

Abstract: A solution for etching copper or a copper base material, the solution consisting essentially of peroxydisulfuric acid, being present in an amount of from about 0.5N up to about 6.0N, with chloride or fluoride present in an amount of from about 10 ppm up to about 500 ppm, and the balance water is described.

Abstract: This application is directed to a process of forming a laminate. The steps include providing a glass and a metal foil of either deoxidized copper alloy or oxygen-free copper alloy. The glass is heated at a temperature of between about 600.degree. to about 1025.degree. C. with a viscosity between about 10.sup.3 to about 10.sup.8 poise. Then it is pressed against the foil and cooled to chemically bond it to the foil and form a laminate of a metal foil and a substantially pore-free glass.

Abstract: An improved interconnect tape for use in tape automated bonding comprising a carrier member for supporting at least one pattern of interconnect leads. At least one first ring is provided having a plurality of sides with each of the sides supporting the leads extending inwardly of the member. Yieldable portions connecting the ring to the carrier member provide reduced stresses in the leads and reduced thermal dissipation during inner lead bonding.

Abstract: The present invention relates to a copper base alloy consisting essentially of from about 3.5% to about 6.0% aluminum, from about 0.1% to about 3.0% nickel, from about 0.03% to about 1.0% magnesium and the balance essentially copper. The alloys of the present invention have been found to be cost effective and easily processable. They have also been found to have particular utility in electronic and electrical applications such as electrical connectors.

Abstract: The present invention is directed to a cermet material comprising a matrix of metal or alloy with ceramic particles distributed therein. The cermet includes a glass binder for bonding between the metal or alloy and the ceramic particles.

Abstract: The present invention relates to iron-nickel alloys having improved glass sealing properties. Alloys of the present invention contain from about 30% to about 60% nickel, from about 0.5% to about 3% silicon, from about 0.5% to about 3.5% aluminum and the balance essentially iron. Preferably, the alloys have a total aluminum plus silicon content of less than about 4%. The alloys of the present invention have particular utility in electronic and electrical applications. For example, they may be used as a lead frame or a similar component in a semiconductor package.

Abstract: A process and apparatus for fabricating an optical fiber communication cable are described herein. The optical fiber cable has a cable core including a metal containment tube and at least one optical fiber within the tube. The containment tube preferably is formed by drawing a strip of metal through at least one forming die. In a first aspect of the present invention, smooth operation of the forming die is promoted by first passing the metal strip through a shaving die to remove any shearing burrs along the strip edges and to maintain the width of the strip within a desired tolerance.In a second aspect of the present invention, various approaches for effectively sealing the containment tube are described. In a first embodiment, the tube is sealed using a wave soldering approach wherein a flow of moving molten solder is used to substantially fill a seam in the tube.

Abstract: The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a deoxidized or oxygen free copper alloy foil bonded thereto by a bonding glass. The copper alloy foil may be a circuit to which a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be glass bonded to a substrate and stacked to form multi-layer circuits.

Abstract: The present invention relates to a technique for forming silicon carbide coated porous filters for use in filtering molten metal, especially copper and copper alloy melts. The technique comprises preparing a silicon carbide containing slurry having a viscosity in the range of about 1 to about 50, preferably from about 5 to about 30, centipoise and impregnating a rigid porous substrate material with the slurry. In a preferred embodiment, the slurry contains mono-aluminum phosphate as a binding agent, ethylene glycol as a wetting agent, powdered silicon carbide having a maximum settling rate of about 0.1 mm./min. and the balance essentially water. After draining of the excess slurry, the coated substrate material is heated to substantially prevent foaming of the coating during firing and fired to bond the silicon carbide coating to the substrate material.

Abstract: A graded seal assembly adapted for hermetically sealing a semiconductor package is disclosed. First and second members having first and second coefficients of thermal expansion respectively are provided. A leadframe is disposed between the first and second members. A first sealing glass is bonded to opposite surfaces of the leadframe and is disposed between the leadframe and the first member for sealing the leadframe to the first member. The second sealing glass is bonded to the second member. The second sealing glass has a third CTE which has a mismatch of less than about 5.times.10.sup.-7 in/in/.degree.C. with said second member. A graded interface zone having stratified layers fuses the first and second sealing glasses. Each of the layers in the zone has a coefficient of thermal expansion which is mismatched less than about 5.times.10.sup.-7 in/in/.degree.C. with an adjacent layer to absorb thermal stress formed by exposure of the semiconductor package to thermal cycling.

Abstract: A process for step etching a metal tape adapted for use in tape automated bonding comprises forming an etch resist pattern on the tape having a first portion defining a pattern of leads and a second portion within the first portion defining steps in the leads. The metal tape is etched in the regions not covered by the resist at a desired rate and etched in the regions for forming the step at a reduced rate as compared to the desired rate, thereby forming the tape having a plurality of leads corresponding to the resist pattern with each of the leads having a step therein generated by the second portion of the resist pattern. The metal tape formed by the process has a unique structure wherein the web between bumps formed at the end of the leads and the remainder of the leads has a unique channel beam cross section for stiffening the web which is relatively thin as compared to the leads or the bump.

Abstract: The present invention relates to techniques for producing magnetic particles for use in recording media. The process of the present invention generally comprises providing an alloy capable of forming a magnetic precipitate, aging the alloy to form a magnetic precipitate comprising a plurality of magnetic particles dispersed throughout a surrounding matrix; and dissolving the matrix to leave the magnetic particles. The dissolution of the matrix is done electrochemically using a pyrophosphate solution.