Abstract: The present invention is directed to the process of forming a multi-layer or hybrid circuit assembly. The assembly includes at least one ceramic substrate having a layer of foil bonded thereto by a high temperature organic adhesive. The foil may be etched and have a resistive metal alloy tape can be bonded so as to provide a path of precise resistance. Also, layers of foil may be bonded to a substrate and stacked to form multi-layer circuit assemblies.

Abstract: The present invention relates to a process and apparatus for forming in situ surface treated metal foil. The apparatus includes a cathode and anode arranged and/or shaped to define a plating region characterized by a first zone having a first interelectrode gap and a second zone having a second interelectrode gap smaller than the first interelectrode gap. It has been found that by providing such an arrangement it is possible to generate in the first zone a localized current density below the limiting current density sufficient to plate metal foil onto the cathode and to simultaneously generate in the second zone a localized current density above the limiting current density sufficient to form dendrites on the freshly produced foil.

Abstract: This invention relates to a laminated glass capacitor and method of making the capacitor. The capacitor is constructed of a plurality of internal electrodes stacked and having glass layers therebetween to give electrostatic capacity. External electrodes are connected to associated internal electrodes for taking out the electrostatic capacity. The glass layers are selected from a substantially pore free glass and the internal electrodes are formed of a metal foil selected from the group consisting of deoxidized copper alloy and oxygen free copper alloy.

Abstract: Multi-layer circuitry incorporating electronic elements is disclosed. The circuitry comprises a plurality of layers including a metal or alloy substrate formed with a recess on one surface. An electronic element is positioned within the recess and a second electronic element is positioned on the surface. Also, a first dielectric material layer is disposed on the surface. Further, a first layered conductive circuit pattern overlies the first dielectric material layer so as to provide circuitry over a substantial portion of the substrate. The first circuit pattern is electrically connected to the first electronic element. The first circuit pattern also has a cavity therein for receiving the second electronic element. A second layered conductive pattern overlies at least a portion of the first layered conductive circuit pattern and the second electronic element and is electrically connected to the second electronic element.

Abstract: The present invention relates to a process and apparatus for controlling an electromagnetic casting system. The process and apparatus utilize at least one sense loop and an electrical parameter relating to the sense loop, e.g. the mutual inductance between the sense loop and a containment inductor, to control during casting the height of the contained head of molten material and/or the ingot size. In a first embodiment, a sense loop is positioned in the air gap between the containment inductor and the outer surface of the forming ingot or the molten metal head, preferably in a location in the vicinity of the liquid-solid interface. In a second embodiment, a plurality of sense loops are used to control the casting system.

Abstract: A process for electromagnetically casting molten material into a thin strip having a substantially constant thickness. An inductor is provided for electromagnetically shaping the molten material. The material is electromagnetically shaped into a strip having a desired thickness. Variations in the thickness of the molten material are automatically reduced during the shaping step by selecting the frequency of the current applied to the inductor so that the thickness of the strip is about 1.8 to about 2.6 current penetration depth.

Abstract: The present invention relates to a thermosonic wire bonding technique for forming high quality wire interconnections in semiconductor devices. The technique includes using palladium or palladium alloy lead wires to form the wire interconnections between the components of a semiconductor device. The technique also includes forming a protective atmosphere about the palladium lead wire during a portion of the bonding process and controlling the stage temperatures used during the bonding process.

Abstract: The present invention relates to a heat exchanger assembly having a plurality of heat exchange fluid passageways formed from a modified copper-zinc alloy. The copper-zinc alloy contains from about 21% to about 39% zinc, from about 1% to about 5% nickel, from about 0.02% to about 1% arsenic and the balance essentially copper. In a preferred embodiment, the copper-zinc alloy consists essentially of from about 25% to about 35% zinc, from about 2.5% to about 3.5% nickel, from about 0.03% to about 0.06% arsenic and the balance essentially copper. The heat exchanger assemblies of the present invention have particular utility as motor vehicle radiators.

Abstract: The present invention relates to solutions for extracting magnetic particles from a surrounding matrix. The solutions extract the magnetic particles by dissolving the surrounding matrix and leaving the magnetic particles. Useful solutions include aqueous citrate solutions and aqueous solutions containing free ammonia. The magnetic particles produced using the solutions of the present invention have particular utility in magnetic recording media.

Abstract: A method for producing a metallic strip is disclosed. A metallic melt containing above about 20% by weight of iron is formed into a strip so that fine iron particles are distributed throughout. The strip may be rolled to elongate the iron particles.

Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.

Abstract: A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree. C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree. C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree. C.

Abstract: The present invention relates to a method for producing magnetic particles for use in recording media. The method comprises providing an alloy capable of forming a magnetic precipitate, aging the alloy to form a magnetic precipitate comprising a plurality of magnetic particles dispersed throughout a surrounding matrix; and dissolving the matrix to leave the magnetic particles. Magnetic particles produced by the present method are characterized by a size in the range of about 100 .ANG. to about 2000 .ANG., a single magnetic domain, an aspect ratio up to about 10:1, a relatively smooth surface, and a substantially uniform composition throughout.

Abstract: An improved hermetically sealed semiconductor casing and a process for producing the casing are disclosed. This casing includes a lead frame having an electrical device affixed thereto. A base member is glass bonded to a matching surface of the lead frame. A metal window frame shaped device is provided having one surface with a refractory oxide coating and a second opposite readily solderable surface. The refractory oxide layer of the window frame device is glass bonded to the lead frame and the base member. The semiconductor or electrical device is connected to the lead frame after the window frame has been glass bonded into place. A metal lid having a solderable surface is solder bonded to the solderable surface of the window frame to hermetically seal the electrical device within the casing.

Abstract: The present invention relates to a process and apparatus for forming a substantially uniform electrodeposit on a metal or metal alloy foil. The apparatus includes a frame assembly for substantially preventing bowing and/or flapping of the metal or metal alloy foil and for promoting substantially uniform electrodeposits by maintaining the gap between the foil and each treatment anode substantially constant. The process and apparatus have particular utility in the treatment of delicate copper foil for use in electronic and electrical applications.

Abstract: The present invention is directed to a communication cable having improved adhesion between metallic and non-metallic layers. The cable has a metallic core structure in which at least one optical fiber and/or electrical conductor is housed, at least one external layer fabricated from a non-metallic material and an adherent, plasma deposited polymeric film coating between the core structure and an external layer for improving the adhesion between the core structure and the external layer. A process and apparatus for fabricating the communication cable are also described.

Abstract: A method for producing a metallic strip is disclosed. A metallic melt containing above about 20% by weight of iron is formed into a strip so that fine iron particles are distributed throughout. The strip may be rolled to elongate the iron particles.

Abstract: The process of forming a composite with an alloy having an alloy component of about 0.5 to 12% aluminum and a matrix selected from a material of the group consisting of copper, iron or nickel. The alloy is heated in an oxygen-rich atmosphere to form a material oxide-rich layer on a surface of the alloy. The alloy is then heated in a reducing atmosphere to reduce the material oxide-rich layer to form an aluminum oxide on the surface of the alloy and a material-rich layer on the aluminum oxide layer.

Abstract: The present invention relates to a technique for improving the tarnish and oxidation resistance of copper and copper base alloy materials. The technique of the present invention involves immersing the copper or copper base alloy material in a dilute aqueous chromic acid-phosphoric acid solution. After emerging from the chromic acid-phosphoric acid solution, the copper or copper base alloy material is preferably rinsed with a dilute aqueous caustic solution and dried. Copper and copper base alloy materials treated in accordance with the present invention have particular utility in printed circuit applications.

Abstract: A system for producing continuous lengths of electroformed metal foil or strip having enhanced ductility and a moderately refined grain structure is described. The system includes an anode and a cathode having a moving plating surface at least partially immersed within an electrolytic solution. To obtain the aforementioned improvements in foil or strip properties, the electrolytic solution is sonically agitated in the vicinity of the moving plating surface. Preferably, one or more ultrasonic generators are used to agitate the electrolyte. The generators may be mounted in a variety of locations including within the electrolyte flow path, within one of the anode and the cathode, or in contact with a surface of either the anode or the cathode.