Abstract: The present invention relates to a novel pyrrole derivative which shows an inhibitory activity against farnesyl transferase or pharmaceutically acceptable salts or isomers thereof; to a process for preparation of said compound; and to a pharmaceutical composition such as anti-cancer composition, etc. comprising said compound as an active ingredient together with pharmaceutically acceptable carrier.

Abstract: A photo-curing sealing agent comprising (a)an (meth)acrylate ester having a solubility parameter of 9 to 14, hydrophobic silica, and a photo reaction initiator. This sealing agent has high adhesion property to a cold-rolled steel, a galvanized steel or an aluminum alloy, to which a press oil, a rust-preventing oil or the like adheres.

Abstract: A semiconductor package and a method for fabricating the same are proposed, in which a chip is attached to a die pad formed with an opening in a manner that the chip covers the opening and a surface of the chip is partially exposed to the opening. A covering layer is formed on the exposed surface of the chip, so as to fill a gap formed between the chip and the die pad in proximity to the opening, and allow air in the gap to be dissipated. This makes an encapsulant formed for encapsulating the chip and the die pad with no void formed therein, so that no die crack or popcorn effect occurs in the fabricated product, and thus quality and reliability of the semiconductor package can be assured.

Abstract: A photosensitive semiconductor package with a lid is proposed, in which a chip carrier is formed with an encapsulant thereon, and the encapsulant is formed with a cavity for exposing a semiconductor chip mounted on the chip carrier. A top of the encapsulant is structured with a groove and at least a beveled portion that descends toward the groove and is associated with the groove. When a lid is attached onto the encapsulant by using an adhesive, the groove can temporarily retain excess adhesive with its flow being directed toward the groove by the beveled portion, so that undersirable adhesive loss and adhesive flash can both be prevented from occurrence, allowing the appearance of the semiconductor package to be well maintained.

Abstract: An apparatus and method for splicing photographic films is disclosed, where the films are conveyed along a path and supported by a track element. Upon being positioned to receive a splice, the films are clamped between a movable splice pad and the track clement. The clamping action produced by the movable splice pad substantially eliminates the problem of film foldovers caused by curling at the trailing end of a film. A splice head is lowered to apply a splice tape to the films, thereby forming the splice. The films are spliced together in a flattened state, producing a continuous web of film which can be wound onto a roll or core for further processing.

Abstract: A semiconductor package structure with a heat-dissipation stiffener and a method of fabricating the same are proposed. The proposed packaging technology includes a substrate; a thermally-conductive stiffener mounted over the front surface of the substrate, the stiffener being formed with a centrally-hollowed portion and an outward-extending passage a semiconductor chip mounted on the front surface of the substrate and within the centrally-hollowed portion of the stiffener; an underfill layer filled and cured in a gap between the semiconductor chip and the substrate; and a plurality of solder balls mounted on the back surface of the substrate. Alternatively, the passage can be formed in the front surface of the substrate. During fabrication process, the passage is used for the injection of a cleaning solvent into the gap between the semiconductor chip and the substrate so as to clean away remnant solder flux.

Abstract: A new flip-chip technology, denominated as DDFC (Direct-Downset Flip-Chip) technology, is characterized by the forming of a downset device hole in the substrate, and by the use of an array of solder bumps over the semiconductor chip and an array of recessed solder-bump pads of an inwardly-tapered conical shape over the bottom surface of the device hole for bonding the semiconductor chip to the substrate. During assembly, the semiconductor chip is embedded in a direct-downset manner into the device hole of the substrate, with the solder bumps being fitted and wetted to the recessed solder-bump pads. The proposed DDFC technology can be implemented without requiring solder-deflux or flip-chip underfill processes, thereby simplifying overall package fabrication.

Abstract: A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.

Abstract: A semiconductor package with an embedded heat-dissipating device is proposed. The heat-dissipating device including a heat sink and a plurality of connecting bumps attached to connecting pads formed on the heat sink is mounted on a substrate by reflowing the connecting bumps to ball pads of the substrate. The connecting bumps and the ball pads help buffer a clamping force generated during the molding process, so as to prevent a packaged semiconductor chip from being cracked. Moreover, the reflowing process allows the connecting bumps to be self-aligned on the substrate, so as to assure the toning and planarity of the heat sink mounted thereon. Accordingly, during molding, the precisely-positioned beat sink can have its upper side closely abutting an upper mold, allowing a molding resin to be prevented from flashing on the upper side thereof i.e.

Abstract: The invention provides novel peptide prodrugs which contain cleavage sites specifically cleaved by prostate specific antigen (PSA). These prodrugs are useful for substantially inhibiting the non-specific toxicity of a variety of therapeutic drugs. PSA is secreted by prostatic glandular cells. Upon cleavage of the prodrug by PSA, the therapeutic drugs are activated and exert their toxicity. Novel sesquiterpene-&ggr;-lactones are also provided by the invention, and are designed to be linked to carrier moieties such as the peptides of the invention. Methods for treating cell proliferative disorders are also featured in the invention.

Abstract: Active enamel substances may be used for the preparation of a pharmaceutical or cosmetic composition for healing of a wound, improving healing of a wound, soft tissue regeneration or repair, or for preventing or treating infection or inflammation.

Abstract: The present invention relates to a novel flavone derivative, pharmaceutically acceptable salt, hydrate, solvate and isomer thereof which is useful as an inhibitor against Cyclin Dependent Kinase (CDK), a process for preparation thereof, and a composition of anti-cancer agent or agent for treating neurodegenerative disease comprising this compound as an active ingredient.

Abstract: Method of processing photographs in a photographic laboratory by means of a photographic processing system, comprising the steps of: receiving customer orders and processing information, respectively assigned to the customer orders, each order comprising at least one photographic image and each processing information defining processing tasks, wherein a number of processing tasks is assigned to at least one processing site based on the processing skills of a number of operators available at the processing site, and if particular processing information of said received processing information, which is assigned to a corresponding order, requires the execution of at least one of said assigned processing tasks, the corresponding order is processed at the at least one assigned processing site for said execution.

Abstract: A multi-chip semiconductor package with a heat dissipating structure is proposed, in which a chip receiving cavity and an opening respectively formed in the heat dissipating structure and a chip carrier, are used to accommodate semiconductor chips therein with the chips being in direct contact with the heat dissipating structure, allowing heat generated by the chips to be rapidly dissipated through the heat dissipating structure. With the provision of through holes for interconnecting the chip receiving cavity and opening, gold wires pass the through holes and electrically connect the chips to the chip carrier. Such a structure with chips embedded in the chip receiving cavity and opening makes internal elements to be more compactly arranged in the semiconductor package, which is preferable in response to profile miniaturization of electronic product development.

Abstract: A flip-chip underfill method is proposed for the purpose of underfilling a gap formed beneath a semiconductor chip mounted in a flip-chip manner over an underlying surface. The flip-chip underfill method comprises the following procedural steps of: preparing a dispensing needle having an outlet; then, moving the dispensing needle in such a manner as to position the outlet thereof at a corner point between the upper surface and the sidewall of the semiconductor chip; and finally injecting resin at the targeted corner point, which allows the injected resin from the outlet of the dispensing needle to flow down along the sidewall of the semiconductor chip to the edge of the lower surface of the semiconductor chip and subsequently fill into the gap through capillary action.

Abstract: A dual-chip integrated circuit package with unaligned chip arrangement and a method of manufacturing such a dual-chip integrated circuit package are provided. The dual-chip integrated circuit package includes a leadframe having a first set of leads and a second set of leads. The dual-chip integrated circuit package is used to pack two integrated circuit chips in an unaligned chip arrangement, in which the first integrated circuit chip is mounted to one side of the inner part of the first set of leads, and the second integrated circuit chip is mounted to the other side of the same in such a manner as to allow the bonding pads on the second integrated circuit chip to be positioned in the spacing formed between the two sets of leads. This unaligned chip arrangement can help facilitate the wire-bonding process for the bonding pads are the second integrated circuit chip.

Abstract: A unit dose, gas-filled syringe is provided which is filled with gas and packaged in a gas barrier material prior to use to increase shelf-life, that is, to minimize gas leakage and dilution of the contents of the syringe. The syringe is filled with a selected gas and sealed inside a container made from a high gas barrier material. The container is also filled with the selected gas. The container material is selected to have a gas transmission rate sufficient to prevent the selected gas from diffusing out of the container into the atmosphere. The volume of gas in the container is greater that atmospheric pressure to prevent atmospheric contaminants from entering the container and syringe.

Abstract: A multi-hip semiconductor package is proposed, in which a first chip and a second chip are mounted on opposing surfaces of a lead frame in a staggered manner. This staggered arrangement assures the die bonding quality for firmly disposing the second chip in the semiconductor package without being detrimental affected by the first chip. Moreover, as both opposing surfaces of the lead frame have chips mounted thereon, a mold flow of a molding resin used in a molding process can be balanced, so that turbulence the mold flow is decreased, and void formation can be avoided. In addition, the semiconductor package can incorporate a third chip in a stacked manner with respect to the first or second chip. This therefore further improves the functionality and performance of the semiconductor package.

Abstract: A device for perutaneous treatment by a serotonin receptor antagonist, comprising at least three layers including A) a drug-impermeable backing layer, B) a drug storage layer provided between the packing layer and a drug release layer and containing serotonin receptor antagonist, and C) a drug release layer constituted of a pressure-sensitive adhesive layer capable of controlling the release of a drug.

Abstract: In a first aspect, polymers of the invention in general comprise a photoacid-labile unit that can generate multiple anions or acidic groups such as hydroxy (particularly phenolic) preferably from a single photoacid-induced polymer deprotection reaction. In a further aspect, polymers of the invention comprise a photoacid-labile unit that generate substantially or essentially no volatile species species during a photoacid-induced deprotection reaction of the polymer to thereby avoid undesired outgassing and/or shrinkage of a resist coating layer containing a polymer of the invention. In particularly preferred aspects of the invention, polymers are provided that combine both aspects, i.e. the polymers contain blocking groups that can generate multiple anions or acid groups preferably from a single photoacid-induced polymer deprotection reaction, and those blocking groups also generate substantially no volatile species during microlithographic processing.