Abstract: A semiconductor device and a fabrication method of the same are proposed, in which at least one electronic component is firstly mounted on a first substrate, and then the first substrate is attached onto a semiconductor chip or a second substrate. Further, with the chip being deposited on the second substrate, electrical connection is established among the first substrate, the second substrate and the chip. This combined structure is subsequently subjected to molding, ball implantation and singulation processes, and thus completes the fabrication of the semiconductor device. Such a semiconductor device provides significant advantages, including prevention of the occurrence of wire short-circuiting, no need to alter the substrate design, no need to use a circuit pattern with fine pitches or an expensive substrate integrated with electronic components.

Abstract: The present invention relates to methods for modulating calcium sensitivity of cardiac muscle. In preferred aspects, the invention provides methods for enhancing myocardial contractility and cardiac performance, and methods for treatment of heart failure and other disorders associated with cardiac contractility by administration of one or more xanthine oxidase inhibitor compounds.

Abstract: A method and art apparatus are proposed for inspecting solder balls on a BGA (Ball Grid Array) package, which are capable of rejecting defectively-bonded solder balls while allowing properly-bonded ones to pass therethrough. The proposed method and apparatus are characterized by the use of a rotatable disk having a plurality of flaps arranged at equal angular intervals along the perimeter thereof, and which is capable of being rotated in steps if a force greater than a preset threshold torque is being applied tangentially to any one of the flaps. The threshold torque is set to be equal to or less than the shear-resistant strength of a properly-bonded solder ball but greater than the shear-resistant strength of a defectively-bonded one. During an inspection procedure, the BGA package is moved toward the rotatable disk to allow each solder ball to push against one of the flaps on the rotatable disk.

Abstract: The invention provides a compound recognizing the minor group of hydrogen bonds between base pairs and being capable of forming a covalent bond with bases. The inventive compound can recognize a specific nucleotide sequence and can strongly bind to adjacent bases via covalent bonding, to regulate the expression of a DNA with the nucleotide sequence. The invention provides a DNA alkylating agent comprising a compound represented by the general formula I: wherein R represents a lower amyl group or a polyamide group; and X represents nitrogen or CH.

Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The process is characterized by a pretreatment sequence that includes contact of the substrate with a single solution containing a reducing agent and a polyelectrolyte. The use of the single solution decreases the incidence of interconnect defects in printed circuit manufacture.

Abstract: The present invention provides an apparatus that lifts, secures, splits and/or crushes tree stumps or other materials, particularly wooden materials and other materials that may be present at an excavation site. The apparatus is characterized in part by a two pivot point design. A first pivot point allows for the pivotable operation of an engaging unit which grabs and lifts the tree stump. The engaging unit further acts a durable and secure support member for the tree stump during the splitting and crushing process. The second pivot point allows for the pivotable operation of a cutting device which facilitates splitting and crushing of the stumps.

Abstract: The present invention relates to a novel process for preparing pyrrole ester compounds, which are key intermediates in the preparation of farnesyl transferase inhibitors, an anti-cancer agent Horner-Emmons reaction of aldehyde compounds provides the corresponding &agr;,&bgr;-unsaturated esters, which without any separation and/or purification steps, are treated with toluenesutfonyl-methylisocyanate in the presence of base to give pyrrole esters in one-pot fashion.

Abstract: Metallic track members having locking slots designed for receiving and retaining metallic stud members that contain construction aids enable the assembly of metallic frames used in the construction of buildings. A flat metallic strip is converted to a W-shaped metallic track member by a series of stamping, bending and severing steps. U-shaped stud members, manufactured in a similar manner are inserted into the track members and held relatively stable by upper and lower track members. An upper track member can be the same shaped design as the lower member or can be U-shaped with stud retaining means into which the stud members can slip-fit. The process for manufacturing is adaptable for computer aided manufacturing using data from the computer aid design of the building. Manufacturing equipment for the manufacture of the construction members is relatively light-weight and can be transported to the job site.

Abstract: A digital reorder system and med is disclosed for making reprints from a negative strip. The strip advances toward a digital scanner which reads the bar code adjacent each frame to determine frame number and other parameters, and an image associated with each frame is scanned by a digital camera. Computer software manipulates the bar code information and the scanned image to place the image in a proper orientation. Consequently, the operator need not spend time orienting the negative strips prior to insertion into the feeder. The reorder system can include a multiple strip feeder which receives a stack of negative strips and automatically feeds the strips one-by-one into the reorder system.

Abstract: A semiconductor package and a fabricating method thereof are proposed, in which a substrate is prepared for having at least one flash preventing mechanism disposed on a surface of the substrate corresponding to a position in front of an entry of an air vent in a mold. After a semiconductor chip is mounted on the substrate by a plurality of conductive elements, a molding compound having high fluidity and fine filler particles is used to encapsulate the chip and the flash preventing mechanism. As the flash preventing mechanism is disposed in a manner of reducing the entry space of the air vent, the flow of the molding compound is impeded by the flash preventing mechanism, making the molding compound rapidly absorb heat of the mold and accordingly increased in viscosity. This helps prevent flash of the molding compound from occurrence, and assure the semiconductor package in quality and profile.

Abstract: A low profile stack semiconductor package is proposed, wherein at least two chips having centrally-situated bond pads are stacked on a substrate that is formed with a through opening. A first chip is mounted on the substrate, with bond pads thereof being exposed to the opening. A second chip mounted on the first chip, is formed with a peripherally-situated cushion member, whereby bonding wires are adapted to extend from bond pads of the second chip in a direction parallel to the chip, and reach the cushion member beyond which the bonding wires turn downwardly to be directed toward the substrate, wherein the bonding wires are free of forming wire loops as extending above the second chip. By the above structure, the bonding wires would be firmly held in position to be free of contact or short circuit with the second chip, and overall package profile can be significantly miniaturized.

Abstract: The invention includes antibodies that provide superior anti-coagulant activity by binding native human TF with high affinity and specificity. Antibodies of the invention can effectively inhibit blood coagulation in vivo. Antibodies of the invention can bind native human TF, either alone or present in a TF:VIIa complex, effectively preventing factor X binding to TF or that complex, and thereby reducing blood coagulation. Preferred antibodies of the invention specifically bind a conformational epitope predominant to native human TF, which epitope provides an unexpectedly strong antibody binding site.

Abstract: In preferred aspects, the present invention features a non-traumatic cannula for use in connection with eye surgery, such as retinal tear and/or detachment surgery. The non-traumatic cannula of the present invention is particularly configured so as to minimize or avoid the potential for damage to the retina when infusing air or a gas therein. Related methods are also disclosed for infusing air during eye surgical procedures e.g. for treating a retinal tear or detachment and macular hole surgery. The method for infusing a fluid, such as a gas, into a patient's eye during eye surgery includes flowing the fluid from a fluid source to the patient's eye and diffusing the flowing fluid as it enters into the patient eye. Such a method further includes providing a non-traumatic cannula that is fluidly coupled to the fluid source, and which diffuses fluid exiting an end thereof. Thus, the fluid flowing out of the cannula is thereby diffusively infused.

Abstract: A semiconductor package with an exposed heat spreader includes a substrate having a semiconductor chip adhered to a first surface of the substrate. The heat spreader includes an upper portion, a lower portion with an opening formed in the center for receiving the semiconductor chip, and a connecting portion for connecting the upper portion and the lower portion in a manner that the upper portion is raised to a height above the opening of the lower portion. The lower portion is formed with a plurality of positioning members outwardly extending from edges of the lower portion to prevent the heat spreader from being dislocated during a molding process, and further includes downward flutes formed on the periphery of the opening for enabling resin flow underneath the heat spreader. The upper portion of the heat spreader is exposed to an exterior of the semiconductor package to improve heat dissipation.

Abstract: A microsphere is prepared containing a compound possessing physiological activity coupled to a styrene-glycidyl methacrylate polymer through a spacer. Compounds that may be used include receptors such as proteins, and 3-[(5-(2,3-dimethoxy-6-methyl-benzoquinonyl)]-2-nonyl-2-propionic acid. A preferred spacer is an ethylene glycol diglycidyl ether derivative. Preferably, the whole surface of the styrene-glycidyl methacrylate polymer is covered with glycidyl methacrylate. The microsphere may be used for isolating and detecting substances such as proteins that bind to the coupled compound.

Abstract: The invention provides novel peptide prodrugs which contain cleavage sites specifically cleaved by prostate specific antigen (PSA). These prodrugs are useful for substantially inhibiting the non-specific toxicity of a variety of therapeutic drugs. PSA is secreted by prostatic glandular cells. Upon cleavage of the prodrug by PSA, the therapeutic drugs are activated and exert their toxicity. Novel sesquiterpene-&ggr;-lactones are also provided by the invention, and are designed to be linked to carrier moieties such as the peptides of the invention. Methods for treating cell proliferative disorders are also featured in the invention.

Abstract: A method is proposed for fabricating a TFBGA (Thin & Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be highly difficult to incorporate an embedded heat spreader therein. As a solution to this problem, the proposed method utilizes a single substrate pre-defined with a plurality of package sites, and further utilizes a heat-spreader frame including an integrally-formed matrix of heat spreaders each corresponding to one of the package sites on the substrate. A batch of semiconductor chips are then mounted on the respective package sites on the substrate. During the encapsulation process, a single continuous encapsulation body is formed to encapsulate the entire heat-spreader frame and all the semi-conductor chips. After ball implantation, a singulation process is performed to cut apart the encapsulation body into individual package units, each serving as the intended TFBGA package.

Abstract: A semiconductor package with stacked chips is proposed, wherein at least two chips are stacked on a chip carrier in a stagger manner as to dispose a second chip on a first chip, and a supporting element is disposed on the second chip and dimensioned to cover area on the second chip with no support from the first chip. The supporting element provides support to the second chip, allowing bonding wires to be successfully connected to the second chip, without the occurrence of cracks of the second chip. The supporting element can be formed on its lower surface with protruding portions positioned outside edge sides of the second chip; this is to enhance structural strength of the supporting element, and help maintain the second chip intact in structure during wire bonding. The supporting element can further have its upper surface to be exposed to the atmosphere; this improves heat dissipating efficiency of the semiconductor package.

Abstract: A heat sink with a collapse structure and a semiconductor device with the heat sink are proposed, in which the heat sink is in ladder-like shape due to a height difference formed between an extending portion and an body of the heat sink, and the body has at least one surface exposed to outside of the semiconductor package. The extending portion produces collapse deformation in response to stress from engagement of molds in a molding process, so as to prevent a semiconductor chip from being damaged by the stress. The heat sink directly attached to the chip allows heat generated by the chip to pass through the extending portion to the body of the heat sink, and then the heat can be dissipated through the exposed surface of the body to the outside of the semiconductor package, so as to improve the heat dissipating efficiency.