Abstract: A semiconductor package having a lead frame formed with a die pad and a plurality of conductive leads, wherein the die pad is formed with a plurality of tabs to impede the resin flow below the die pad such that a downward pressure is produced because the resin flow above the die pad moves at a speed faster than that below the die pad. As a result, the tab is urged against a bottom surface of a mold cavity during a transfer molding process so as to prevent the die pad from being exposed to an encapsulant for encapsulating the die pad and a semiconductor die mounted on the die pad.

Abstract: An improved encapsulation method is proposed for the encapsulation of a substrate-based package assembly, which can help to prevent mold flash over exposed package surfaces after encapsulation process is completed. The proposed encapsulation method is characterized by the forming of a cutaway portion in a solder mask over the substrate along a seam line between the solder mask and the molding tool that would exist between the solder mask and the molding tool when the semi-finished package assembly is fixed in position in the molding tool. During encapsulation process, the cutaway portion defines a constricted flow passage to the injected encapsulation material; and consequently, when the encapsulation material flows into this constricted flow passage, it would more quickly absorb the heat in the molding tool, thereby increasing its viscosity and retarding its flow speed.

Abstract: A hapten-polymer carrier complex was found to be useful for immunoassay purposes, specifically ELISAs, for the detection of pesticides and their degradation products in hydrosoil and ground water. The degradation products of Casoron G® (also known as dichlorobenzonitrile and dichlorbenil) and Prefix® (also known as chlorthiamid and dichlorobenzthiamide) are analytes detected with high specificity and sensitivity, particularly the degradation product BAM (2,6-dichlorobenzamide). The polymer carrier complex is bound to the hapten via a linker unit, strategically positioned meta to the amide or amide derivative of BAM.

Abstract: A process for preparing a 1-substituted 5-hydroxymethylimidazole of the formula: , wherein R represents alkyl, hydroxyalkyl, allyl, or substituted or unsubstituted arylmethyl or diarylmethyl, comprising the step of reacting a 1-substituted 2-mercapto-5-hydroxymethylimidazole of the formula: , wherein R is as defined above, in the presence of a transition metal catalyst and an oxidizing agent in a solvent.

Abstract: A semiconductor package and a fabricating method thereof are proposed. The semiconductor package includes a semiconductor chip; a plurality of leads surrounding the chip and formed with a plurality of connecting mechanisms and strengthening structures; and an encapsulant for encapsulating the chip and the leads. The foregoing semiconductor package eliminates the use of a die pad, allowing the thickness of the package to be reduced and a surface of the chip to be exposed to the outside of the encapsulant for improving the heat dissipating efficiency thereof. The leads have the same height as the semiconductor package, allowing upper and lower surfaces of the leads to be exposed to the outside of the encapsulant, which further enhance the dissipation of heat generated by the chip in operation.

Abstract: A multilayer heat shrinkable film having high heat shrink, high burn-through resistance and a broad impulse sealing range including an outer and a heat sealable inner layer each of a thermoplastic polymer or copolymer, wherein said outer layer has a melting point at least 20° C. higher than said inner layer.

Abstract: A chip carrier, a semiconductor package and a fabricating method thereof are proposed, in which on one side of the chip carrier finally removed from an engaged surface of a mold in a de-molding process there is formed at least one grounding means corresponding in position to an eject pin of the mold, so as to allow a gear amount of electrical static generated on a surface of the semiconductor package during molding and de-molding to be discharged to the outside, instead of being retained on a semiconductor chip, conductive elements and conductive traces of the semiconductor package. This therefore can prevent electrical leakage and damage to the semiconductor chip from occurrence, and improve the quality and production efficiency for the semiconductor package.

Abstract: Negative photoimageable compositions are disclosed which contain a radiation sensitive component for producing an acid when subjected to radiation at wavelengths of 320 to 420 nanometers, a resin binder and a reactive oligomer. The compositions are useful in constructing printed circuits and integrated circuit packages.

Abstract: Apparatus and methods for converting a monochrome night vision or other electro-optical device into one that provide a sensation of full color, including from red to blue with white and black. Preferred apparatus of the invention comprise an electro-optical viewing device, particularly a mono-chromatic night vision device, that comprises a plurality of light filters. A first light filter system is positioned at a light-input end of the device, and a second light filter system is positioned at a light-output end of the device, whereby the plurality of filters systems provide to a viewer a sensation of full color, including from red to blue with white and black.

Abstract: A solar telescope is disclosed that facilitates safe observation of the sun with minimal setup, targeting effort or operator skill. The folded solar telescope of the invention includes a friction stabilized telescope support system that is capable of maintaining a specified telescope orientation. The telescope further includes a targeting system that comprises one or more pointing aids to simplify the process of aligning the telescope with the sun so a solar image is projected onto a viewing surface.

Abstract: A semiconductor packaging technology is proposed for the fabrication of a chip-on-chip (COC) based multi-chip module (MCM) with molded underfill. The proposed semiconductor packaging technology is characterized by the provision of a side gap of an empirically-predetermined width between the overlying chips mounted through COC technology over an underlying chip to serve as an air vent during molding process. This allows the injected molding material to flow freely into the flip-chip undergaps during molding process. In actual application, the exact width of the side gap is empirically predetermined through molded-underfill simulation experiments to find the optimal value. Based on experimental data, it is found that this side gap width should be equal to or less than 0.3 mm to allow optimal underfill effect. The optimal value for this side gap width may be varied for different package specifications.

Abstract: A novel, cost effective optical filter is employed for photosensors used in ultraviolet-based water purification systems. Optically tuned to specifically eliminate the non-germicidal wavelength polychromatic emissions from mercury lamps, this unique optical filter approach significantly reduces the cost in manufacturing reliable water purification systems employing ultraviolet light.

Abstract: A stacked multi-chip package structure with on-chip integration of passive component is proposed, which is characterized in the mounting of passive component on a remaining surface area of the underlying semiconductor chip that is unoccupied by the overlying semiconductor chip, so that the overall package construction can be made more compact in size. The proposed package structure comprises: a substrate; a first semiconductor chip mounted over the substrate; a second semiconductor chip mounted over the first semiconductor chip; and at least one passive component mounted beside the second semiconductor chip and over the first semiconductor chip. The first and second semiconductor chips can be mounted by means of adhesive layers or flip chip technology. The passive component can be electrically coupled to the semiconductor chips through the use of wire-bonding technology (WBT) or surface-mount technology (SMT).

Abstract: The present invention provides radiation sensitive compositions and methods that comprise novel means for providing relief images of enhanced resolution. In one aspect the invention provides a method for controlling diffusion of photogenerated acid comprising adding a polar compound to a radiation sensitive composition and applying a layer of the composition to a substrate; exposing the composition layer to activating radiation whereby a latent image is generated comprising a distribution of acid moieties complexed with the polar compound; and treating the exposed composition layer to provide an activating amount of acid.

Abstract: A delamination-preventing substrate and a semiconductor package with the substrate are provided. A metal layer and a solder mask layer are sequentially laminated on a chip attach area of a substrate, and both formed with corresponding openings for partly exposing the substrate. This allows an adhesive for chip-bonding use to be directly attached to the substrate via the openings, so as to reduce contact area between the adhesive and the metal layer, and to increase bonding between the substrate and a chip mounted on the substrate by means of the adhesive. Direct contact between the adhesive and the substrate also helps reduce stress generated between the chip and substrate, thereby preventing stress-induced delamination. Due to weak adhesion between adhesive and metal materials, reduced contact area between the adhesive and the metal layer would further enhance bonding of the chip to the substrate, thereby assuring quality of fabricated package products.

Abstract: Medicinal compositions having an effect of regulating the activation of glycine receptor and novel morphan derivatives. Medicinal compositions comprising morphan derivatives or its salts and a pharmaceutically acceptable carrier. These compositions potentiate or inhibit the activation of glycine receptor, which makes them useful as drugs for the central nervous system. Novel 1- and/or 2-substituted morphan derivatives (2-azabicyclo[3.3.1]nonane derivatives) or salts thereof.

Abstract: Featured are a method and apparatus for fixing adjacent vertebrate of a spine that avoids the need and associated problems with prior cage or straight rod and screw systems. Methods and apparatus of the invention utilize a new implant member, which preferably is arcuate. Preferred methods of the invention for stabilizing adjacent vertebrae of the spine, include steps of providing a positioning apparatus including two guide sleeves, each guide sleeve having a long axis and locating the two guide sleeves with respect to the adjacent vertebrae such that a vertex formed by the long axis of each guide sleeve is located in the intervertebral space for the adjacent vertebrae. The method further includes forming an aperture in each of the adjacent vertebrae using the guide sleeves and inserting an implant into the apertures formed in each of the adjacent vertebrae so that the implant extends between the adjacent vertebrae and through the intervertebral space.

Abstract: This invention provides a novel process for producing optically active 3-hydroxy-&ggr;-butyrolactone in a short step, which is superior economically and in efficiency and industrially suitable by using a starting material which is inexpensive and easily available and reagents easy to handle. This invention relates to a process for producing optically active 3-hydroxy-&ggr;-butyrolactone represented by formula I: wherein the symbol * means an asymmetric carbon atom, which comprises hydrogenating an optically active 4-substituted oxy-3-hydroxybutyrate represented by formula II: wherein R1 represents a C1-4 lower alkyl group, R2 represents a protective group for a hydroxyl group deprotected by hydrogenation with a heterogeneous hydrogenation catalyst, and the symbol * has the same meaning as defined above, in the presence of a heterogeneous hydrogenation catalyst and an acidic substance followed by deprotection and simultaneous ring closure thereof.

Abstract: The invention includes pharmaceutically active compounds and methods of treatment and pharmaceutical compositions that utilize or comprise one or more such compounds. Compounds of the invention are particularly useful for treating or prophylaxis of undesired thrombosis.

Abstract: A leadframe-based semiconductor package is proposed for the packaging of a semiconductor device, such as a multi-media card (MMC) chipset. The proposed semiconductor package is characterized by the use of a leadframe, rather than BT substrate or film, as the chip carrier for MMC chipset. The leadframe includes a supporting bar, a chip-supporting structure arranged at a downset position in relation to the supporting bar; and a plurality of leads, each lead including an outer-lead portion and an inner-lead portion; wherein the outer-lead portion is levelly linked to the supporting bar, while the inner-lead portion is arranged beside the chip-supporting structure and linked to the outer-lead portion via an intermediate-lead portion. The leadframe can be either the type having die pad or the type having no die pad.