Abstract: A semiconductor package with a heat dissipating structure is provided, including a lead frame with a die pad for allowing a chip to be mounted on an upper surface of the die pad, and a heat sink abutting against a lower surface of the die pad. A top surface of the heat sink, in contact with the lower surface of the die pad, is formed with at least a recessed portion. During a molding process of using a resin material to form an encapsulant for encapsulating the chip, lead frame and heat sink, the resin material fills into the recessed portion and forms a supporting member between the die pad and heat sink to provide support for a central portion of the die pad, so as to prevent the chip from cracking in a step of building up a packing pressure of the molding process, thereby assuring yield and reliability of fabricated products.

Abstract: A trench capacitor with an expanded area for use in a memory cell and a method for making the same are provided. The trench capacitor includes a vertical trench formed in a semiconductor, a doping region formed around a low portion of the trench, a collar isolation layer formed on an inner sidewall of an upper portion of the trench, a doped silicon liner layer formed on a surface of the collar isolation layer, wherein the doped silicon liner layer is electrically connected to the doping region, a dielectric layer formed on a surface of the doped silicon liner layer and inner sidewall of the lower portion of the trench, and a doped silicon material formed inside the trench.

Abstract: The present invention relates to a pharmaceutical composition for the hepatoprotection and treatment of liver diseases comprising as an active ingredient a dihydroxyphenyl derivative represented by the following formula (1), pharmaceutically acceptable acid addition salt or stereochemical isomer thereof together with a pharmaceutically acceptable inert carrier: in which in which A, B, D and E are defined as described in the specification.

Abstract: A flip-chip bumping method is proposed for the fabrication of solder bumps on a semiconductor wafer for flip-chip application. The proposed flip-chip bumping method is intended for use on a semiconductor wafer predefined with a plurality of chip regions which are delimited from each other by a predefined cutting line and each of which is formed with a plurality of aluminum or copper based bond pads, and is characterized in the provision of a plating bus over and along the cutting line and connected to each bond pad. By means of this plating bus, the required UBM (Under Bump Metallization) fabrication and solder-bump fabrication can be both carried out through plating. Since plating process is considerably lower in cost than sputtering process and etching process, the proposed flip-chip bumping method can be more cost-effective to implement than prior art.

Abstract: The present invention includes polymers and photoresist compositions that comprise the polymers as a resin binder component. Photoresists of the invention include chemically-amplified positive-acting resists that can be effectively imaged at short wavelengths such as sub-200 nm, particularly 193 nm. Polymers of the invention contain in specified molar ratios both nitrile and photoacid labile groups that have an alicyclic moiety, particularly a bridged bicyclic or tricyclic group or other caged group. Polymers and resists of the invention can exhibit substantial resistance to plasma etchants.

Abstract: A semiconductor device and a fabrication method of the same are proposed, in which at least one electronic component is firstly mounted on a first substrate, and then the first substrate is attached onto a semiconductor chip or a second substrate. Further, with the chip being deposited on the second substrate, electrical connection is established among the first substrate, the second substrate and the chip. This combined structure is subsequently subjected to molding, ball implantation and singulation processes, and thus completes the fabrication of the semiconductor device. Such a semiconductor device provides significant advantages, including prevention of the occurrence of wire short-circuiting, no need to alter the substrate design, no need to use a circuit pattern with fine pitches or an expensive substrate integrated with electronic components.

Abstract: A multi-mode input control device for use with a computer via a graphic user interface (GUI) is disclosed. The input control device may optionally perform functions of a mouse device and a trackball device. The mouse and trackball devices share the same key switch, control unit, interface circuit, and signal channel to the computer, which are included in the mouse device. In the mouse mode, the mouse device is individually moved to perform the input control operation in a conventional manner. For the trackball mode, a first signal connector of the trackball device and a second signal connector of the mouse device are connected to each other so that the trackball device can perform the input control operation via the mouse device.

Abstract: The invention relates to a device and a method, as well as a computer program product, for measuring a physical or physiological activity by a subject and for assessing the psychosomatic state of the subject. The subject is automatically provided with a sequence of different sensory stimuli by means of a stimulus generator controlled by a control means. Electrical signals are then derived from a physical or physiological activity by the subject in response to each sensory stimulus provided, in particular a force of pressure exerted on a letter balance. The electrical signals are compared with a pre-settable index value. On the basis of this, information can be obtained about the psychosomatic state of the subject, in particular about preferences and inclinations. The device is preferably used as an allergy testing apparatus, wherein the sensory stimuli provided in the sequence represent substances which potentially trigger allergies.

Abstract: To reduce the total bit-line capacitance in a semiconductor memory arrangement, it is proposed that the semiconductor memory arrangement be so divided into a plurality of memory blocks (9) that each memory block (9) has a corresponding data bus and a group of sense amplifiers (1) connected to this data bus (2) associated with it. In this way it is possible for the bus-line capacitance (CB), which contributes to the total bit-line capacitance, to be reduced because the bus-line capacitance then depends simply on the length of a memory sector (6).

Abstract: The invention provides lipophilic phosphonoacid/nucleoside conjugates that exhibit exceptional antiviral activity, including activity against drug-resistant HIV strains. Compounds of the invention include phosphonoacid/nucleoside conjugates where the carboxyl group and phosphonyl groups of the phosphonacid are esterified whereby the compound contains at least one lipophilic group and at least one nucleoside group.

Abstract: A low profile stack semiconductor package is proposed. A lower chip having centrally-situated bond pads is mounted on a substrate, and electrically connected to the substrate by bonding wires. A cushion member is peripherally situated on the lower chip, allowing the bonding wires to extend from the bond pads in a direction parallel to the lower chip, and to reach the cushion member beyond which the bonding wires turn downwardly to be directed toward the substrate. An adhesive is applied on the lower chip, for encapsulating the bond pads, cushion member and bonding wires. This allows an upper chip to be readily stacked on the lower chip by attaching the upper chip to the adhesive, without affecting or damaging structural or electrical arrangement formed on the lower chip.

Abstract: A multi-chip semiconductor package is proposed, in which a lead frame is formed with a chip carrier that consists of at least one supporting frame and a plurality of downwardly extending portions integrally formed with the supporting frame. As the chip carrier occupies small space, this does not impede flowing of a molding compound used for forming an encapsulant. The adjacent extending portions are provided with sufficient space therebetween for allowing the molding compound to flow through the space, so that problems of incomplete filling with the molding compound and the formation of voids can be eliminated. Moreover, the downwardly extending portions can function as a pre-stressed structure so as to closely abut a bottom of a mold cavity after mold engagement, thereby making the chip carrier well assured in position without being dislocated.

Abstract: The invention includes polymers that contain a heterocyclic ring, preferably an oxygen-or sulfur-containing ring. The heterocyclic ring is preferably fused to the polymer backbone. The invention also provides photoresists that contain such polymers, particularly for imaging at short wavelengths such as sub-200 nm.

Abstract: A dual-die integrated circuit package is provided, which can be used to pack two semiconductor dies in the same package unit. These two semiconductor dies are of the type having an array of bonding pads formed thereon. The dual-die integrated circuit package has a first leadframe and a second leadframe, each having a die pad and a plurality of leads, with the die pad being arranged at a different elevation with respect to the leads. The two semiconductor dies are mounted on the respective die pads of the two leadframes, with the bottom surface of each semiconductor die facing the bottom surface of the other, allowing the bottom surface of one semiconductor die to be separated from the die pad of the first leadframe and the bottom surface of the other semiconductor die to be separated from the die pad of the second leadframe.

Abstract: Featured is a device that provides a mechanism for imaging structure and/or tissue of a surgical site during and after performing a microsurgical procedure such as ophthalmic surgical procedures. Also featured are methods and systems related thereto. In the imaging method of the present invention using such a device includes positioning a high frequency ultrasonic signal transmitting and receiving apparatus imaging mechanism in close proximity to the area to be scanned/imaged (e.g., surgical site), so that the high frequency ultrasonic signal penetrates the tissue/structure of the surgical site being scanned. The reflected ultrasonic signals, are processed so as to yield high quality/high resolution images of the scanned tissue/structure. Further, the high resolution images are evaluated by the surgeon during the procedure to determine if the surgical approach should be adjusted.

Abstract: The present invention relates to an established cell line of microglia having the following properties: (a) form: having a macrophage-like or globular form in the presence of granulocyte-macrophage colony-stimulating factor. and in the absence of said factor, a branched form similar to branched microglia present in the brain, or both of the above forms; (b) functional characteristics: having specific affinity for the brain, and having a strong phagocytic ability; and (c) cell growth ability: growing depending on granulocyte-macrophage colony-stimulating factor. In particular, cell lines FERM BP-7061 and FERM BP-7062.

Abstract: A novel organic anion transporter gene participating in organic anion transport in the placenta; and an organic anion transporter which is a polypeptide encoded by the gene. A placental organic anion transporter OAT4, more particularly, a placental organic anion transporter OAT4 having the amino acid sequence represented by SEQ ID NO:2 or an amino acid sequence derived therefrom by deletion, substitution or addition of a part of the amino acids thereof. A nucleic acid (preferably DNA) having a base sequence encoding the placental organic anion transporter OAT4 or a base sequence hybridizable therewith under stringent conditions.

Abstract: A method is proposed for mounting a passive component, such as a resistor or a capacitor, over an IC package substrate, such as a BGA (Ball Grid Array) substrate. Conventionally, the mounting of a passive component over a substrate would result in the undesired existence of a gap between the passive component and the substrate, which could lead to such problems as bridged short-circuit, popcorn effect, and dismounting of the passive component during subsequent processes. As a solution to these problems, the proposed method utilizes an electrically-insulative material, such as epoxy resin, to fill up the gap between the passive component and the substrate. Various techniques can be employed to fill the electrically-insulative material into the gap, including dispensing and stencil printing.

Abstract: Methods are provided for treatment of eye disorders and injury, including methods for treatment of reduced flow of blood or other nutrients to retinal tissue and/or optic nerve, methods for treatment of retinal ischemia and trauma and methods for treatment for optic nerve injury/damage.

Abstract: Novel oligomers, and synthesis thereof, comprising one or more bi-, tri, or polycyclic nucleoside analogues are disclosed herein. The nucleoside analogues have a “locked” structure, termed Locked Nucleoside Analogues (LNA). LNA's exhibit highly desirable and useful properties. LNA's are capable of forming nucleobase specific duplexes and triplexes with single and double stranded nucleic acids. These complexes exhibit higher thermostability than the corresponding complexes formed with normal nucleic acids. The properties of LNA's allow for a wide range of uses such as diagnostic agents and therapeutic agents in a mammal suffering from or susceptible to, various diseases.