Abstract: A method of interconnecting electronic components by using a plurality of conductive studs on a surface of a first electronic component and a plurality of corresponding conductive vias on the surface of a second electronic component. Camber on the surface of electronic components may be overcome by coating the surface with a dielectric, planarizing the dielectric, and forming conductive vias corresponding to the contact pads thereon. The conductive studs are substantially lead-free and preferably comprise of copper.

Abstract: A photosensitive device includes an array of active pixel sensor devices, each APS device being formed in an isolated cell of silicon. Each cell has an insulating barrier around it, and sits upon an insulating layer formed on an underlying substrate. A semiconductor connector making vertical contact between the pinning layer and the body of each APS device preferably replaces at least some portion of the insulating barrier adjacent to each cell. The semiconductor connector may be a single vertical connection for each cell or it may be an elongated strip connecting multiple APS devices. It may extend only to the underlying insulating layer or it may extend through the insulating layer to the substrate, with the substrate acting to interconnect and ground the pinning layer and the body of each APS device. The invention also includes the method of making the photosensitive device.

Abstract: An assembly is provided that includes an interposer having first and second substantially flat, opposed surfaces, and at least one speed critical signal line extending directly through the interposer from the first surface to the second surface. A first IC is coupled to the first surface of the interposer and has a first external connection mechanism coupled to the at least one speed critical signal line. A second IC is coupled to the second surface of the interposer and has a first external connection mechanism coupled to the at least one speed critical signal line. Preferably at least one non-speed critical signal line is provided within the interposer and is coupled to a second external connection mechanism of the first IC and/or the second IC for delivering non-speed critical signals thereto or for receiving such signals therefrom.

Abstract: A computer program storage device having a program of instructions executable to perform a method of determining time sensitive values for multiple parametric data having different variable effective intervals. The program is adapted to access a database containing i) parametric data values of a first work factor for a plurality of continuous time intervals and ii) parametric data values of a second work factor for a plurality of continuous time intervals, at least one time interval of the second work factor being different from a time interval of the first work factor.

Abstract: A semiconductor post-polishing processing apparatus and method employing a non-optical wafer sensor for detecting the presence of a semiconductor wafer within the processing stations. The apparatus comprising a wet processing station, a wafer transport track, and the non-optical sensor. Preferably, the non-optical wafer sensor is a transducer, and most preferably, a piezo element, which emits and detects sound waves. The sound waves are reflected back to the emitter signaling the presence of a semiconductor wafer. The signal is sent to a receiver linked to a processor which is adapted to move a wafer holder situated at the end of the transport track to receive a wafer in the next available empty slot of the holder. The non-optical wafer sensor is impervious to slurry and CMP residue, film build-up, bubbles, wafer color/hue variations, and other wet environment problems.

Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material.

Abstract: An apparatus and method are provided that remove sufficient heat from both SOI and non-SOI semiconductor devices to prevent the devices from overheating during operation. A plurality of thermally conductive pads such as electrically conductive studs are coupled to a first side of a semiconductor device having circuit elements formed thereon. The thermally conductive pads also are coupled to a substrate comprising an apparatus for extracting heat from the thermally conductive pads. The apparatus for extracting heat from the thermally conductive pads preferably comprises one or more metallic planes. A module cover having a thermally conductive path formed therein also may be coupled between the apparatus for extracting heat and a heat sink to further aid in heat removal from the semiconductor device. Thermally conductive pads may be coupled between the semiconductor device and I/O pins of the substrate to improve heat dissipation via the I/O pins.

Abstract: A method of forming inter-level contacts or vias between metal layers using a tungsten film deposited into the via using non-collimated sputter deposition. The sputter chamber is configured with a pressure of about 1 mTorr to about 10 mTorr with an inert gas flow of at least at least 25 cm3/min to about 150 cm3/min. Shielding inside the chamber is coated with a material, preferably, aluminum oxide, that promotes adhesion of tungsten to the shielding. An adhesion layer of titanium may be included prior to deposition of the tungsten film. Non-collimated sputter deposition increases the target to substrate distance inside the sputter chamber; reduces the heating effect associated with traditional collimated sputtering; and provides more robust diffusion barriers.

Abstract: A process and system for entering and retrieving previously stored data at a client computer in an HTML form accessed from an intra- or internet source. A set of data in a form file is provided in a program storage device accessible by the client computer. The form file further contains information concerning time of creation of the data and a unique identification which distinguishes the form file from other forms. A blank form is then accessed from an intra- or internet source and viewed on the client computer. The form file is then accessed from the program storage device and data from the form file is utilized to complete the blank form and the completed form is transmitted to the intra- or internet source. Each form file may be stored as an HTML source file combined with a set of data for the source file, and the program storage device includes a combined form table containing a list of the form files.

Abstract: Web browser interaction with HTML files is modified to allow for columns of row headings to be defined as non-scrollable so that the headings will always be visible as the data rows are scrolled to the left or to the right. Multiple non-scrollable row headings may be in an adjacent position and certain row headings are allowed to displace other columns of row headings when they are in an adjacent position. A new HTML tag, referred to as the column scroll tag, identifies a column of row headings in a file as non-scrollable depending on the screen position of the column. When there is a column of headings that reach the left-most position of the screen, the columns become locked and remain on the screen. A column scroll tag also has the property of displacement or no displacement. Displacement means that once two non-scrollable columns are adjacent, the right-most non-scrollable column would immediately displace the left-most column non-scrollable column, when the data is scrolled to the left on a screen.

Abstract: The distance between a discrete or passive electrical component and an electrical semiconductor device and substrate or carrier is minimized by shortening the lead length connections of the passive component. One or more passive electronic components are mounted within the body of a carrier or board by creating a cavity in the substrate or carrier that is directly below a semiconductor device. The passive component is electrically connected to the substrate and device using solder bump technology resulting in much shorter lead length connections to and from the passive component.

Abstract: A method of constructing a gate dielectric on a semiconductor surface includes cleaning a silicon surface then growing a silicon nitride barrier layer on the silicon surface using a high density plasma (HDP) of nitrogen. A gate dielectric layer is then deposited on the silicon nitride layer and a second silicon nitride layer is then grown on the dielectric layer, also using an HDP nitrogen plasma, followed by deposition of the conductive gate layer. The HDP nitrogen plasma is heated using an inductively coupled radio frequency generator. The invention also includes a gated device including a gate dielectric constructed on a semiconductor surface by the method of the invention.

Abstract: A process for creating a customized web page containing information from other web pages accessible by a client computer from an inter- or intra-net. First, there is provided the parameters for a search of desired information from web pages on a network. A search is initiated from a client computer and the desired information on the network is retrieved. The client computer then views the desired information retrieved from the search on the network, and at least one original web page on the network from which the desired information was retrieved in the search. The search may be optionally modified, and the above steps repeated. The customized web page is then created, for example, on a program storage device accessible by the client computer, and contains: 1) the desired information retrieved in the search and 2) other structure, not retrieved in the search, of at least one original web page.

Abstract: The present invention is a process for visually organizing multiple information and headings on a computer screen of a Web browser. A single file containing data and integrated headings is translated by a Web browser. Hypertext markup language is used to control the integrated headings determining which headings are scrollable or non-scrollable. Top and bottom headings are non-scrollable. Scrollable middle headings scroll with the data and replace top headings when they reach the top of the screen.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: A method of and novel composition for transient liquid phase bonding of refractory metal structures is described herein. Preferably, the composition comprises a first component substantially similar to the composition of the refractory metal structure, and a second component having a lower melting temperature than the first component comprising a metallic constituent selected from the group consisting of iron, nickel and cobalt. The second component acts as a melting point depressant to temporarily lower the melting point of the first component so that the join can be accomplished without melting the structure itself. Upon applying the composition to the surfaces of refractory metal structures in need of joining, the assembly is heated to a eutectic point defined as the lowest melting point of the composition.

Abstract: A top clock stacked circuit is provided that substantially prevents charge sharing and that prevents any deleterious bipolar effect. The top clock stacked circuit comprises a primary pre-charge circuit coupled to a primary node, a first device coupled between the primary node and a first secondary node, and a second device coupled between the first secondary node and a second secondary node. A second pre-charge circuit is coupled to the first secondary node and a pre-discharge circuit is coupled to the second secondary node. In response to a first clock polarity, the primary and the second pre-charge circuits pre-charge the primary and the first secondary nodes, respectively, and the pre-discharge circuit pre-discharges the second secondary node. Thereafter, in response to a second clock polarity, the first device creates a path between the primary node and the first secondary node. Because both nodes are pre-charged to the same voltage, charge sharing is substantially prevented.

Abstract: The present invention is a complementary active pixel sensor cell and method of making and using the same. The complementary active pixel sensor cell approximately doubles the available signal for a given quanta of light. The device of the present invention utilizes the holes produced by impinging photons in a complementary active pixel sensor cell circuit. Two active pixel sensor cell circuits, an NFET circuit and complementary PFET circuit are created for use with a photodiode. The NFET circuit captures electron current. The PFET circuit captures hole current. The sum of the currents is approximately double that of conventional active pixel sensor circuits using similarly sized photodiode regions.

Abstract: An apparatus for removing a casting comprising an electronic package substrate and an array of cast solder columns having a column pitch of less than 2 mm extending therefrom from the corresponding openings of a mold. The apparatus includes a removable mold containing a plurality of openings for casting a corresponding array of solder columns and bonding the columns to the underside of an electronic package substrate. A stripper plate for receiving the mold contains openings through a thickness thereof corresponding to at least some of the openings in the mold. An ejector assembly including ejector pins having a length at least as long as the sum of the thickness of the stripper plate at the stripper plate openings and the thickness of the mold at the column casting openings, and corresponding to openings in the mold and the stripper plate.

Abstract: A method of forming non-spherically shaped solder interconnects, preferably conical, for attachment of electronic components in an electronic module. Preferably, the solder interconnects of the present invention are cone shaped and comprise of depositing a first solder followed by a second solder having a lower reflow temperature than the first solder. Warm placement of the electronic component at a somewhat elevated temperature than room temperature but less than the solder reflow temperature reduces the force required during placement of a semiconductor chip to a substrate. After warm placement, reflow of the module occurs at the lower reflow temperature of the second solder. The conical shape of the solder interconnects are formed by a heated coining die which may also coin a portion of the interconnects with flat surfaces for stand-offs.