Patents Represented by Attorney Rabin & Berdo, P.C.
  • Patent number: 7500395
    Abstract: The piezo-resistance type triaxial acceleration sensor includes a frame section, a mass section disposed in the frame section, beam elements which flexibly support the mass section, and piezo-resistors for X, Y and Z axes of the frame section, formed on the beam elements. The length of the Z-axis piezo-resistors is longer than the length of the X-axis piezo-resistors and the Y-axis piezo-resistors, so as to decrease the sensitivity.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: March 10, 2009
    Assignee: Oki Semiconductor Co., Ltd.
    Inventor: Hironari Mori
  • Patent number: 7500826
    Abstract: A centrifugal fan includes a spiral-shaped housing with a driving mechanism and multiple internally mounted centrifugal impellers. The driving mechanism is mounted on a circular base. At least two support brackets links the circular base to the spiral-shaped housing, wherein profiles of the support brackets are involute curves based upon the circular base. The multiple centrifugal impellers, driven by the driving mechanism, suck airflow into the spiral-shaped housing through void spaces among the support brackets. The centrifugal impellers are perpendicular to the support bracket profiles.
    Type: Grant
    Filed: June 28, 2006
    Date of Patent: March 10, 2009
    Assignee: Quanta Computer, Inc.
    Inventors: Chun-Fa Tseng, Yu-Nien Huang
  • Patent number: 7500288
    Abstract: A hinge has a barrel, a resilient positioning sleeve, a combination leaf-pivot pin and a fastener. The positioning sleeve is mounted rotatably in the barrel and has an inner surface, a stepped expansion slot and at least one flat surface. The expansion slot is formed longitudinally through the positioning sleeve. The flat surface is formed opposite to the expansion slot on the inner surface. The combination leaf-pivot pin has a distal end, a proximal end, a leaf and a pivot pin. The pivot pin protrudes longitudinally from the leaf and has a positioning ring and a connecting shaft. The positioning ring is mounted in the positioning sleeve and has an outer surface and two flat surfaces formed opposite to each other on the outer surface and selectively corresponding to and seating in the flat surface in the positioning ring. The fastener connects to the connecting shaft.
    Type: Grant
    Filed: September 26, 2006
    Date of Patent: March 10, 2009
    Assignee: Shin Zu Shing Co., Ltd.
    Inventors: Chia-Ko Chung, Jia-Yan Jian
  • Patent number: 7501454
    Abstract: The present invention relates to a compound of Antrodia camphorata used to treat autoimmune diseases, in particular to an extract, 4-hydroxy-2,3-dimethoxy-6-methyl-5(3,7,11-trimethyl-dodeca-2,6,10-trienyl)-cyclohex-2-enone, isolated from Antrodia camphorata, and its use in alleviating symptoms of autoimmune diseases such as systemic lupus erythematosus (SLE). The cyclohexenone compound according to the present invention helps to decrease proteinuria levels and antinuclear antibody titers in SLE mammals in order to alleviate kidney inflammation and disease, as well as the self-damage caused by antinuclear antibodies. The purpose for prevention and treatment of autoimmune diseases and kidney diseases by the natural, side-effect free substance can then be accomplished.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: March 10, 2009
    Assignee: Golden Biotechnology Corporation
    Inventors: Sheng-Yun Liu, Mao-Tien Kuo, Wu-Che Wen
  • Patent number: 7497712
    Abstract: A method for fabricating a microconnector and the shape of terminals of the microconnector is proposed, which combines a cover with a base as a female connector, inserts an inserting member as a male connector between the cover and the base, and the ends of the terminals at the base electrically connecting the inserting member undergoing plasma treatment for controlling the shape thereof. The terminals of the microconnector can be actuated with by a low voltage. By such arrangement, the inserting member can be firmly engaged and the intervals between terminals and the overall size of the microconnector can be reduced while providing low insertion force and electrostatic actuating force.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: March 3, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Ben-Hwa Jang, Shin-Way Lin, Wei-Leun Fang, Wang-Shen Su
  • Patent number: 7500122
    Abstract: An efficiency optimization method for hardware devices with adjustable clock frequencies is provided. The work current of the hardware device is measured and used to obtain the corresponding work level from a conversion table. The obtained work level is compared with the currently executing work level to make adjustments for various parameters for the hardware device and for the operation of the corresponding heat-dissipating device. Therefore, the hardware device can achieve a better performance.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: March 3, 2009
    Assignee: Micro-Star Int'l Co., Ltd.
    Inventors: Ming-Ting Won, Fu-Shun Wu, Po-Jen Cheng
  • Patent number: 7495421
    Abstract: A multi-phase buck converter comprising a first switch set, a second switch set, a capacitor, a first power storing and coupling unit, and a second power storing and coupling unit is provided. The first and the second switch sets are for providing an input voltage and a low voltage. One end of the capacitor is coupled to the low voltage, and the other end generates an output voltage. The first and the second power storing and coupling units are respectively coupled between the capacitor and the first switch set and between the capacitor and the second switch set. The first power storing and coupling unit comprises a primary coil and a first inductance. The second power storing and coupling unit comprises a secondary coil and a second inductance. During a first, a second and a third period, the first inductance and the second inductance respectively store, release, and store power.
    Type: Grant
    Filed: September 5, 2006
    Date of Patent: February 24, 2009
    Assignee: Asustek Computer Inc.
    Inventors: Hsiang-Chung Weng, Sun-Chen Yang
  • Patent number: 7494437
    Abstract: An impact power tool includes a motor, a first planetary gear set, a clutch having a sun gear, a second planetary gear set, a transmission shaft, an intermediate shaft, an impact seat and an output shaft. When the clutch moves to a first position, the transmission shaft engages with a second planet carrier of the second planetary gear set and the output shaft. The power of the motor is transmitted to the output shaft via the first planetary gear set, the second planetary gear set, and the transmission shaft in low-speed mode. When the clutch moves to a second position, the transmission shaft disengages from the second planet carrier and the output shaft. The power of the motor is output to the output shaft via the first planetary gear set, the second planetary gear set, the transmission shaft, the intermediate shaft, and the impact seat in high-speed-with-impact mode.
    Type: Grant
    Filed: January 4, 2007
    Date of Patent: February 24, 2009
    Inventor: Ting Kuang Chen
  • Patent number: 7495910
    Abstract: A heat-dissipating fan fixing device used for accommodating and fixing a fan and mounted on a case is provided, which includes a frame, a plurality of hooks and an elastic buckle piece. The frame has a first end and a second end being opposite to each other. Between the first end and the second end, an accommodating space through the frame is formed for accommodating and fixing the fan. The hooks extend from one side edge of the first end, and the elastic buckle pieces are formed by bending along another side wall of the first end. Thus, when the frame is joined with the case, firstly, each hook catches the case, and then, the elastic buckle piece is embedded into the case, thereby mounting the fixing device with the fan on the case.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: February 24, 2009
    Assignee: Inventec Corporation
    Inventor: Chun-Ying Yang
  • Patent number: 7494350
    Abstract: An electrical device with a retractable plug has a body and a plug-moving assembly. The body has a chamber, a partition and a plug. The partition is formed in the chamber, separates the chamber into a plug chamber and an electronics chamber. The plug chamber has a longitudinal sidewall, a slot and an opening. The longitudinal sidewall is disposed parallelly with the partition and has an inner surface. The slot is formed through the longitudinal sidewall. The opening is formed through the end wall. The plug-moving assembly is mounted in the plug chamber and connects to the plug to selectively retract the plug into the plug chamber. Therefore, the plug of the electrical device may be selectively retracted to prevent prong damage, improve safety and aesthetics of design.
    Type: Grant
    Filed: January 23, 2008
    Date of Patent: February 24, 2009
    Assignee: Hipro Electronics Co., Ltd.
    Inventor: Po-Sheng Lee
  • Patent number: 7495514
    Abstract: A low noise amplifier including a first-stage signal amplifier, a second-stage signal amplifier and a gain control unit is disclosed. The first-stage signal amplifier is for receiving an input signal and outputting a first output signal accordingly. The second-stage signal amplifier is coupled to the first-stage signal amplifier for outputting a second output signal according to the first output signal. The second-stage signal amplifier includes a first output transistor for outputting the second output signal. The gain control unit includes a first variable resistance device coupled to an input terminal of the first output transistor for adjusting voltage gain of the second output signal.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: February 24, 2009
    Assignees: Himax Technologies Limited, NCKU Research and Development Foundation
    Inventors: Da-Rong Huang, Huey-Ru Chuang, Yuan-Kai Chu
  • Patent number: 7493698
    Abstract: A clamp device for a reciprocating saw is disclosed herein, which does not require the use of a tool for saw blade replacement. The main feature of the device is that two clamping blocks are pivotally mounted on a bracket and each of the clamping blocks has a tooth portion and a cam portion formed on an outer surface thereof. An elastic member is located between the bracket and the clamping blocks. A button connected to a rod, which passes through a cover plate of the bracket and includes a tooth slot for engaging with the tooth portion of the clamping block. When the rod moves in an axial direction, the two clamping blocks are brought to rotate so that the cam portion can fasten or loosen the saw blade, and thereby the saw blade can be mounted and demounted conveniently and rapidly.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: February 24, 2009
    Inventor: Hsin-Chih Chung Lee
  • Patent number: 7495253
    Abstract: An organic thin-film transistor and a method for manufacturing the same are described. The method forms a gate layer on a substrate, an insulator layer on the substrate, forming a semiconductor layer on the insulator layer, and a strip for defining a channel length on the semiconductor layer. An electrode layer is screen printed on the semiconductor layer, and a passivation layer is coated on the electrode layer. The organic thin-film transistor manufactured by the method of the invention has a substrate, a gate layer formed on the substrate, an insulator layer formed on the substrate, a semiconductor layer formed on the insulator layer, a strip for defining a channel length formed on the semiconductor layer, an electrode layer screen-printed on the semiconductor layer, and a passivation layer coated on the electrode layer. Thereby, an organic thin-film transistor with a top-contact/bottom-gate structure is obtained.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: February 24, 2009
    Assignee: Industrial Technology Research Institute
    Inventors: Liang-Ying Huang, Jia-Chong Ho, Cheng-Chung Lee, Tarng-Shiang Hu, Wen-Kuei Huang, Wei-Ling Lin, Cheng-Chung Hsieh
  • Patent number: 7494250
    Abstract: A light emitting module includes a metal substrate, a bearing base, at least one LED, a printed circuit board, and at least one conductive wire. A first perforation is formed on the metal substrate and the bearing base is embedded into the first perforation of the metal substrate. According to an eutectic soldering method, the LED(s) is/are adhered on the bearing base by a compound metal. A second perforation is formed on the printed circuit board to expose the LED(s) which is/are adhered on the bearing base and further allows the printed circuit board to stick on the metal substrate. The conductive wires are used to connect electrically the LED(s) with the printed circuit board.
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: February 24, 2009
    Inventor: Chien Chung Chen
  • Patent number: 7492037
    Abstract: A package structure and a lead frame using the same are provided. The package structure includes a lead frame, a chip and an adhesive. The lead frame has a first surface and a second surface opposite to the first surface. The first surface has a chip adherent area. The lead frame includes a plurality of through holes and grooves. The through holes penetrate through the first surface and the second surface to be disposed around the chip adherent area. The grooves are disposed on the first surface. The grooves connect the neighboring through holes to form an annular trace disposed around the chip adherent area. The chip is disposed on the chip adherent area. The adhesive is disposed between the chip and the lead frame, and is diffused in the annular trace.
    Type: Grant
    Filed: November 8, 2006
    Date of Patent: February 17, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Pen-Chieh Chang
  • Patent number: 7489224
    Abstract: Ferrite cores are provided with rounded, convex head ends and complimentary rounded, concave tail ends. The configuration of the head and tail ends permits a reduction in gap width between adjacent cores when they are joined together into a core assembly that suppresses electromagnetic interference emitted from a cable.
    Type: Grant
    Filed: September 19, 2006
    Date of Patent: February 10, 2009
    Assignee: International Business Machines Corporation
    Inventors: Jessica Rose Berens, Don Allan Gilliland, Amanda Elisa Ennis Mikhail
  • Patent number: 7489043
    Abstract: A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes a plurality of first electrode pads, and a first sealing section. The first sealing section is a closed loop formed on the top face of the frame section surrounding the movable structure. The first semiconductor chip also includes a thin plate member for sealing the movable structure. The semiconductor chip package also includes a second semiconductor chip. The second semiconductor chip has a plurality of second electrode pads. The semiconductor chip package also includes a substrate. The substrate has third electrode pads. The first and second semiconductor chips are mounted on the substrate. First bonding wires connect the first electrode pads to the second electrode pads. Second bonding wires connect the second electrode pads to the third electrode pads.
    Type: Grant
    Filed: October 18, 2006
    Date of Patent: February 10, 2009
    Assignee: Oki Electric Industry Co., Ltd.
    Inventors: Akira Tokumitsu, Fumihiko Ooka, Hiroshi Kawano
  • Patent number: 7486919
    Abstract: A transfer unit transfers an image formed on an image bearing body (a photoconductive drum or an intermediate transfer belt) onto a medium by an electrostatic force. The transfer unit includes a transfer belt and a transfer roller. The transfer roller extends parallel to the image bearing body and transfers a toner image onto a medium. The transfer roller is pressed toward the image bearing body under a pressing force in a range of 28-112 gf/cm. The transfer belt is held between the transfer roller and the image bearing body in a sandwiched relation to define a transfer point between the transfer belt and the image bearing body. The transfer belt transports the medium through the transfer point.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: February 3, 2009
    Assignee: Oki Data Corporation
    Inventor: Satoru Furuya
  • Patent number: D586844
    Type: Grant
    Filed: November 29, 2007
    Date of Patent: February 17, 2009
    Inventor: Shiny Shih
  • Patent number: D587459
    Type: Grant
    Filed: October 9, 2008
    Date of Patent: March 3, 2009
    Assignee: Ching Fon Industrial Co., Ltd.
    Inventor: Yao-Tang Chiang