Abstract: A photoresist that is a mixture of the esterification product of an o-quinonediazide compound and a novolak resin and a high molecular weight phenol having from 2 to 5 phenolic groups and at least 4 diazo naphthoquinone groups. The extent of esterification of the novolak resin is up to 20 percent of the hydroxyl groups and the degree of esterification of the phenol is at least 50 percent of the phenolic hydroxyl groups. The preferred novolak resins are the aromatic novolak resin that are the condensation product of a reactive phenol with a bis(hydroxymethyl)phenol or an aromatic aldehyde, each alone or in the presence of a reactive phenol.

Abstract: A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

Abstract: The invention is for a process of removal of dissolved heavy metal cation contaminants from an organic solution. The process of the invention involves providing a chelating ion exchange resin modified by removal of sodium ions therefrom and contacting said organic solution with said modified exchange resin for a time sufficient to remove ionic metal impurities. The invention is useful for removal of ionic contaminants from organic solutions requiring high purity.

Abstract: An electronic detection system monitoring coolant level and/or temperature of an internal combustion engine. A unit installed within cab of a vehicle provides visual and audible warning if engine temperature rises above its normal hottest operating temperature and/or when coolant level drops below a selected level in the coolant reserve tank thereby preventing damage caused by overheating. The overheat detection system may comprise a heat sensor within a bolt which may be screwed directly into the engine head. An additional heat sensor positioned in the bottom radiator hose can be used in series with the engine head sensor. Associated circuitry is adjustable when installed to provide alarm activation when the temperature is a few degrees above the hottest normal engine operating temperature. If the engine starts to overheat, an LED lights up and an audible alarm sounds.

Abstract: The invention is for a process of removal of ionic contaminants from an organic solution. The process of the invention involves providing a mixed ion exchange resin modified by contact with an ammonium salt of a weak organic acid and contacting said organic solution with said modified exchange resin for a time sufficient to remove ionic impurities therefrom. The invention is useful for removal of ionic contaminants from organic solutions requiring high purity for use.

Abstract: A new photoactive compound for use in the formulation of a photoresist comprises a bisphenol compound having an alkyl linkage substituted with a heterocyclic group. The new photoactive compound may be admixed with an alkali soluble resin to formulate a photoresist composition. The new photoactive compounds exhibit enhanced long term solubility in conventional photoresist solvents.

Abstract: A photoresist composition consisting of an acid or base generator, a crosslinking agent activated in the presence of an acid or base and an alkali soluble resin, preferably a phenolic resin, having a portion of its phenolic hydroxyl groups reacted to form a blocking group inert to acid or base. The presence of the inert blocking group enables development of an exposed photoresist with a strong developer without formation of microbridges between fine line features.

Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.

Abstract: Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.

Abstract: A process for electroplating a substrate by coating the substrate with a porous coating of conductive particles having a reducing agent within its pores and electroplating over said coating. The reducing agent causes formation of an initial electroless metal deposit over the conductive particle coating thus enhancing its conductivity. The process is especially useful for the fabrication of printed circuit boards.

Abstract: A process for the purification of an organic solution containing an acid labile material. The process comprises contact of the organic solution with a combination of a cation exchange resin and an anion exchange resin. The cation exchange resin has weak acidic groups to reduce attack on the acid labile material within the organic solution. The anion exchange resin preferably has hydroxide exchange groups. The combination of exchange resins yields counter-ions that form water in the solution treated upon contact with the solution with the exchange resin mixture.

Abstract: A process for electroplating a substrate by coating the substrate with a liquid dispersion of conductive particles selected from the group of metals, metal oxides and metal sulfides, drying the substrate and electroplating over said dried coating. The process is especially useful for the fabrication of printed circuit boards.

Abstract: Methods and apparatus for controlling plating rates of electroless plating solutions. The invention provides for continuous monitoring and replenishment of a one or more components of an electroless plating solution on a real time basis. The invention can be characterized in part by use of a quartz crystal microbalance.

Abstract: The invention is for a process of removing anions from an organic solution, especially one having base labile components. The process comprises modifying an anion exchange resin by treatment with a solution of a source of anions less basic than the hydroxyl anion and contacting said modified ion exchange resin with an organic solution containing anions. The process is especially useful for treating photoresist compositions.

Abstract: The invention is directed to a process for patterning a substrate in a selective pattern. In one embodiment, the process comprises the steps of forming a patterned coating over a substrate surface whereby portions of the substrate are covered by the patterned coating and portions of the substrate remain uncoated. A layer of a ligating material is coated over at least those portions of the substrate free of the patterned coating. The ligating layer is one that is capable of ligating with an electroless metal plating catalyst. The article so formed is then contacted with an electroless metallization catalyst and then with an electroless plating solution to form a patterned metal deposit on the substrate.

Abstract: The invention is for a process of removing organic contaminants and multivalent metal ions from solution. The process comprises chelating multivalent metal ions in an organic solution to be purified and contacting the solution with activated carbon. The process is especially useful for removal of multivalent metal ions from a solution of photoresist components.

Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyetherimides. The improvement comprises conditioning the substrate by treating with an inorganic hydroxide solution prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of flexural strength of the substrate throughout subsequent processing steps.

Abstract: A process for electroplating a substrate having a surface comprising metallic and non-metallic regions. The process is characterized by selectively forming a protective film over the metallic regions of the substrate surface and forming a sulfide coating selectively over the remaining portions of said substrate. The protective film enables selective sulfide formation only on metallic sites without formation of a sulfide coating on metallic surface regions of the substrate which would otherwise interfere with metal-to-metal bond during electroplating. Following formation of the sulfide conversion coating, the protective film is removed and the surface of the substrate electroplated.

Abstract: A method for electroplating a nonconducting surface using a metal oxide colloid. The process comprises contacting the surface of the nonconductor to be plated with a preformed colloid of a metal oxide to adsorb the colloid onto the surface of the nonconductor and then electroplating metal over the surface having the adsorbed metal oxide colloid. The process may include a step of reducing the metal oxide to a lower valent state prior to the step of metal plating.

Abstract: A photoresist comprising a light sensitive component and an alternating copolymer resin formed by condensing a preformed bishydroxymethylated compound and a reactive phenol, in the absence of an aldehyde. Additional useful resins may be formed by further reacting the alternating copolymer with a second reactive phenol in the presence of an aldehyde to form substantially block copolymers. The use of these resins in photoresist formulations leads to improved thermal properties, etch resistance and photospeed.